SU CULBN1.VC 1 Version 1.7 | 2021-07-21 www.osram-os.com Applications SU CULBN1.VC OSLON ® UV 3636 This compact UV-C LED is part of the OSLON UV series. It allows a flexible design for any application which requires UV-C radiation for e.g. disinfection, purifica- tion, treatment or sensing. Equipment Illumination (e.g. Curing, Endo- scope) Smoke/Dust/Particle Sensing UV-C Air Disinfection UV-C Surface Disinfection UV-C Water Disinfection Features: Package: Ceramic package with integrated glass cover Chip technology: AlGaN based Flip chip Typ. Radiation: 120° (Lambertian emitter) Color: λ peak = 275 nm ( ● ultraviolet (UV-C)) ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM) Radiant Flux: typ. 4.7 mW Radiant Efficiency: typ. 2.6 %
Transcript
SU CULBN1.VC
1 Version 1.7 | 2021-07-21
Produktdatenblatt | Version 1.1 www.osram-os.com
Applications
SU CULBN1.VC
OSLON® UV 3636This compact UV-C LED is part of the OSLON UV series. It allows a flexible design for any application which requires UV-C radiation for e.g. disinfection, purifica-tion, treatment or sensing.
Features: Package: Ceramic package with integrated glass cover
Chip technology: AlGaN based Flip chip
Typ. Radiation: 120° (Lambertian emitter)
Color: λpeak = 275 nm (● ultraviolet (UV-C))
ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
Radiant Flux: typ. 4.7 mW
Radiant Efficiency: typ. 2.6 %
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Ordering Information
Type Total radiant flux 1) Ordering CodeIF = 30 mAΦE
SU CULBN1.VC-AGAM-67-4F4G 4.0 ... 7.0 mW Q65113A2463
SU CULBN1.VC-AGAY-67-4F4G 4.0 ... 12.0 mW Q65113A2366
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Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C 60 °C
Storage Temperature Tstg min. max.
-40 °C 100 °C
Junction Temperature Tj max. 85 °C
Forward current TS = 25 °C
IF min. max.
1 mA 40 mA
Surge Current TS = 25 °C
IFS max. 50 mA
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD 2 kV
Reverse voltage 2) VR Not designed for reverse operation
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CharacteristicsIF = 30 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength 3) λpeak min. typ. max.
270 nm 275 nm 280 nm
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) IF = 30 mA
VF min. typ. max.
5.50 V 6.00 V 6.50 V
Reverse current 2) IR Not designed for reverse
operation
Real thermal resistance junction/solderpoint 5) RthJS real typ. 25 K / W
Electrical thermal resistance junction/solderpoint with efficiency ηe = 2.6 %
RthJS elec. typ. 24 K / W
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Brightness Groups
Group Total radiant flux 1) Total radiant flux 1)
IF = 30 mA IF = 30 mAmin. max.Φe Φe
AG 4.0 mW 4.5 mW
AH 4.5 mW 5.0 mW
AJ 5.0 mW 5.5 mW
AK 5.5 mW 6.0 mW
AL 6.0 mW 6.5 mW
AM 6.5 mW 7.0 mW
AN 7.0 mW 7.5 mW
AP 7.5 mW 8.0 mW
AQ 8.0 mW 8.5 mW
AR 8.5 mW 9.0 mW
AS 9.0 mW 9.5 mW
AT 9.5 mW 10.0 mW
AU 10.0 mW 10.5 mW
AV 10.5 mW 11.0 mW
AW 11.0 mW 11.5 mW
AY 11.5 mW 12.0 mW
Forward Voltage Groups
Group Forward Voltage 4) Forward Voltage 4)
IF = 30 mA IF = 30 mAmin. max.VF VF
4F 5.50 V 6.00 V
4G 6.00 V 6.50 V
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Wavelength Groups
Group Peak Wavelength 3) Peak Wavelength 3)
min. max.λpeak λpeak
6 270 nm 275 nm
7 275 nm 280 nm
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Group Name on Label Example: AG-6-4FBrightness Wavelength Forward Voltage
AG 6 4F
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Relative Spectral Emission 6)
Irel = f (λ); IF = 30 mA; TS = 25 °C
SU CULBN1.VC
200 220 240 260 280 300 320 340 360 380 400λ / nm
0,0
0,2
0,4
0,6
0,8
1,0Irel
: ultra violet
Radiation Characteristics 6)
Irel = f (ϕ); TS = 25 °CSU CULBN1.VC
-100°
-90°
-80°
-70°
-60°
-50°
-40°
-30°-20°
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°ϕ / °
0,0
0,2
0,4
0,6
0,8
1,0Irel
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Forward current 6)
IF = f(VF); TS = 25 °C
SU CULBN1.VC
4,9 6,35,2 5,4 5,6 5,8 6,0VF / V
1
5
10
15
20
25
30
35
40IF / mA
Relative Radiant Power 6), 7)
ΦE/ΦE(30 mA) = f(IF); TS = 25 °C
SU CULBN1.VC
1 5 10 15 20 25 30 35 40
IF / mA
-0,2
0,0
0,2
0,4
0,6
0,8
1,0
1,2
1,4Φe
Φe(30mA)
Peak Wavelength 6)
λpeak = f(Tj); IF = 30 mASU CULBN1.VC
1 5 10 15 20 25 30 35 40
IF / mA
-4
-2
0
2
4
∆λ peak / nm
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Forward Voltage 6)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 30 mA
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-40 -20 0 20 40 60 80Tj / °C
-0,2
0,0
0,2
0,4∆VF / V
Relative Radiant Power 6)
ΦE/ΦE(25 °C) = f(Tj); IF = 30 mA
SU CULBN1.VC
-40 -20 0 20 40 60 80Tj / °C
0,0
0,2
0,4
0,6
0,8
1,0
1,2Φe
Φe (25°C)
Peak Wavelength 6)
λpeak = f(Tj); IF = 30 mA
SU CULBN1.VC
-40 -20 0 20 40 60 80Tj / °C
-6
-4
-2
0
2
4
6∆λ peak / nm
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Max. Permissible Forward CurrentIF = f(T)
0 10 20 30 40 50 60Ts / °C
0
5
10
15
20
25
30
35
40
45IF / mA
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Dimensional Drawing 8)
Further Information:
Approximate Weight: 82.6 mg
Package marking: Cathode
ESD advice: LED is protected by ESD device which is connected in parallel to LED-Chip.
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Recommended Solder Pad 8)
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further informa-tion can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further informa-tion can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.
E067. 0827. 01-01
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Reflow Soldering ProfileProduct complies to MSL Level 3 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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Taping 8)
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Tape and Reel 9)
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 500
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Barcode-Product-Label (BPL)
Dry Packing Process and Materials 8)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into high risk group – RG3. WARNING - UV emitted from this product. Avoid eye and skin contact to unshielded product.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
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Disclaimer
Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.
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Glossary1) Brightness: Brightness groups are tested at a current pulse duration of 10 ms and a tolerance of
±10 %.2) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause mi-
gration and damage of the device.3) Peak Wavelength: Wavelengths are tested at a current pulse duration of 10 ms and a tolerance of
±3 nm.4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of
±0.1 V.5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.
8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.
9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision HistoryVersion Date Change
1.0 2020-11-27 Initial Version
1.1 2020-12-07 Brightness Groups
1.2 2021-01-18 Ordering Information Brightness Groups Reflow Soldering Profile
1.3 2021-01-20 Ordering Information Brightness Groups
1.4 2021-01-29 Ordering Information Brightness Groups
1.5 2021-05-05 Maximum Ratings Electro - Optical Characteristics (Diagrams)
