Summer trainingin MEMS at CSIR-CEERI

SUMMER TRAINING AT CSIR-CEERI

A presentation on

Micro electro-mechanical systems - A way to miniaturize our life style

IN

Submitted by :-MANISH KUMAR KASWAN

B-tech Final year ECE UCE, RTU, KOTA (Raj.)

04/15/2023Department of electronics engineering

INTRODUCTION TO CEERI

• It stands for “COUNSIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH – CENTRAL ELECTRONICS ENGINEERING AND RESEARCH INSTITUTE”.

• It is only CSIR center in RAJASTHAN.

• The first Indian Prime Minister Pt. Jawaharlal Nehru laid the foundation stone of the institute on 21st September 1953.

• Major research areas are Electronics Systems, Semiconductor Devices and Microwave Tubes.

• There are over 12 groups working on the various R&D sectors.


ELECTRONICS SYSTEMS DIVISION

• MEMS and Nano-sensors Group (MNG)

• Industrial Electronics Group (IEG)

• Agro Electronics Group (AEG)

• Digital System Group (DSG)

• IC Design Group (IDG)


WHAT IS MEMS ?• Mems is a technology of very small devices. It is a combination of mechanical

functions and electrical functions on the same chip using micro fabrication technology.

• MEMS are made up of components between 1 to 100 micrometers in size

• MEMS devices generally range in size from 20 micrometers to a millimeter


Deposition Patterning Etching

Physical Chemical Lithography Dry Wet

Design process of mems


DEPOSITION

• Physical

Physical vapor deposition

Electrodeposition Epatixial growth Thermal oxidation

• Chemical

Chemical vapor deposition

Evaporation Sputtering


PATTERENING

Pattern Transfer

Alignment

Exposure


ETCHING

WET etching

This is the simplest etching technology.

Wet etching works very well for etching thin films on substrates.

It have two basic types anisotropic and isotropic.

Dry etching

The dry etching technology can split in three separate classes called reactive ion etching (RIE), sputter etching, and vapor phase etching.


FABRICATION TECHNOLOGIES

• Ic fabrication technology• Bulk Micromachining • Surface Micromachining• Micro molding


DESIGN PROCESS CYCLE


APPLICATIONS OF MEMS

In medicines In smartphones

In sensors In satalites

In automotives In boimems

As gyroscopes In military products


ADVANTAGES AND DISADVANTAGES

Advantages

Improved reproducibility. Improved accuracy and reliability. Increased selectivity and

sensitivity. Minimize energy and materials.

Disadvantages

Farm establishment requires huge investments.

Micro-components are costly compared to macro components.

Design includes very much complex procedures


VM-ADS

• Vehicle mounted-Active denial systems

• This is an non-lethal, directed-energy weapon.

• This is designed for area denial, perimeter security and crowd control.

• Still only U.S. army used it.


SMART SPOON

• The “smart” spoon allows Parkinson’s sufferers to feed themselves.

• It contains an ultra thin rechargeable battery, gyroscopes, motion-sensors and actuators.

• It has multiple attachments for different foods.


Conclusion

• This enabling technology promises to create entirely new categories of products.

• Mems will be the indispensible factor in advancing technology

• As with all emerging technologies had been predicted to revolutionize technology and our lives


REFERENCES

Online Resources

• IEEE Explore http://ieeexplore.ieee.org/Xplore/DynWel.jsp

• MEMS Clearinghouse http://www.memsnet.org/

• MOSIS http://www.mosis.org/

• Trimmer http://www.trimmer.net/

Journals

• •Journal of Micromechanical

Systems .

• Journal of Micromechanics

and Microengineering.

• Sensors Magazine.

http://ieeexplore.ieee.org/Xplore/DynWel.jsp





http://www.mosis.org/

http://www.mosis.org/

http://www.trimmer.net/


QUERIES???


Date post:	15-Aug-2015
Category:	Engineering
Upload:	manish-choudhary
View:	55 times
Download:	11 times

Summer trainingin MEMS at CSIR-CEERI

Engineering