28
TABLE of CONTENTS
InChem Corp ...................................................................................... 3Introduction ......................................................................................... 5
Product Listings
Phenoxy Resin Products .............................................................. 6 - 13
Application Guidelines
Performance/Technology/Chemistry .................................................. 14Coatings & Inks Selection Guide .................................................. 5 - 16Adhesives Selection Guide ........................................................ 17 - 18Composites Selection Guide ..................................................... 19 - 20Plastics Selection Guide ............................................................ 21 - 22
Charts & Tables
Phenoxy Solution Viscosities ..................................................... 23 - 25Phenoxy Solvent Table ...................................................................... 26Phenoxy Physical Properties ...................................... inside back cover
PKFE, PKHC, PKHH, PKHJ, PKHM, PKHS and PKHW are registered trademarks of InChem Corp. We urgeyou to review prior to any use the Material Safety Data Sheets for any InChem Corp products mentionedherein. These documents are available from your InChem Corp Sales Representative or distributor. Thisinformation is not to be taken as a warranty or representation for which we assume legal responsibility nor aspermission or recommendation to practice any patented invention without a license. It is offered solely foryour consideration, investigation and verification. 2002 InChem Corp.
3
Company Description
InChem Corp is a global specialty resin andsurfactant manufacturer. Many of our resins havebeen used to enhance performance in coatings,inks, adhesives, and composites for over 35 yearsand they continue to offer unique chemistries toever-changing performance standards.
Our headquarters and ISO 9002 certified facility inRock Hill, South Carolina service customers world-wide along with additional production facilities inEurope. InChem surfactant facilities are located inPortugal, France, and South Africa.
Markets Served
The InChem resin product line services can andcontainer coatings, wire coatings, fiber sizings, inks,adhesives, composites and plastics manufactur-ing. We have direct sales and distribution through-out North America, Asia, Europe and the MiddleEast. At InChem new product development is thenorm, not the exception. We foster an environ-ment where creativity is encouraged.
Technologies
We have modified the Phenoxy molecule to offerits superior adhesion, flexibility and chemical re-sistance properties to water and solvent-borne,powder, UV, EB and cationic cure systems. Wealso offer very low viscosity epoxy acrylates andepoxy methacrylates.
Technical Services
We have extensive technical capabilities in ourR&D and QC/QA laboratories. Our technical staffare experts in their respective fields and are readilyavailable to help solve the most challenging appli-cation problems.
Major Products
InChem produces the following chemicals alongwith their derivatives:
Phenoxy (Polyhydroxyether)Epoxy Acrylates and MethacrylatesPolyesters
4
North America
Canada Colors & Chemicals Limited80 Scarsdale Road, Don MillsOntario M3B 2R7 Ph: 416-449-2600
Eastech Chemical Inc.5700 Tacony St.Philadelphia, PA 19135 Ph: 215-537-1000
E.T. Horn Company16141 Heron AvenueLa Mirada, CA 90638 Ph: 714-523-8050
Lintech International7705 N.E. Industrial Blvd.Macon, GA 31297 Ph: 800-652-9297
Maroon Inc.1390 Jaycox RoadAvon, OH 44011 Ph: 440-937-1000
Matteson-Ridolfi14450 King RoadRiverview, MI 48192 Ph: 734-479-4500
Mozel Incorporated1900 West Gate DriveColumbia, IL 62336 Ph: 618-281-2723
P.T. Hutchins (for Mexico)6055 E. Washington Blvd.Los Angeles, CA 90040 Ph: 323-887-8508
Europe
Brenntag Eurochem GmbHHumboldtring 15, D45472Mulheim an der RuhrGermany Ph: (49) 208-782-8144
Group Arnaud68 Av. du General Michel Bizot75012, Paris, France Ph: (33) 1-4473-1000
Hubron Specialty Products Ltd.Albion Street, Failsworth ManchesterM350FP, England Ph: (44) 161-681-2691
Europe cont.
Organa ChemplastVia Leonardo Da Vinci 4320090 Trezzano, sul NaviglicMilan, Italy Ph: (39) 02-4861-5352
Quimidroga S.A.Tuset, 26 08006Barcelona, Spain Ph: (34) 93-236-3636
Asia
Barrington ChemicalsRoom 13, 10/F New Commerce Center19 Sum StreetShatin, Hong Kong Ph: (852) 2547-5190
Kem Kote Ltd.100/78 Moo 4, Phuttamonthon 2North Bangkhae, Bangkhae, Bangkok10160 Thailand Ph: (66) 2-454-5100
Kingyorker EnterprisesNo. 58, 10th floor, Fu-Hsin North RoadTaipei, Taiwan Ph: (886) 2-2777-2369
Sine CorporationChoong Ang Royal Officetel, Room 14081355-8 Seocho-Dong, Seocho-KuSeoul, Korea Ph: (82) 2-3474-1188
Tomoe EngineeringDaini Maruzen Building, 9-2 Nihonbashi 3-Chome, Chuo-Ku, Tokyo103 Japan Ph: (81) 3-3274-0411
T.R. Chemicals Pty. Ltd.195 Briens Road, Northmead, N.S.W. 2152Australia Ph: (612) 9630-7655
InChem Corp Home Office800 Cel-River RoadRock Hill, South Carolina 29730
Customer Service: 803-329-8061Technical Service: 803-329-8050
also find us on the Web at: www.phenoxy.com
WORLD WIDE DISTRIBUTION
5
Introduction
InChemRez Phenoxy resins are tough and duc-tile thermoplastic materials having high cohesivestrength and good impact resistance. The back-bone ether linkages and pendant hydroxyl groupspromote wetting and bonding to polar substratesand fillers. Structurally, Phenoxy resin is apolyhydroxyether having terminal alpha-glycolgroups. Weight-average molecular weight rangefrom approximately 25,000 to above 60,000. Thehighest polymeric species exceed 250,000daltons.
Polydispersity is very narrow, typically less than4.0. An average molecule contains forty or moreregularly spaced hydroxyl groups suitable forcrosslinking for thermoset applications. These pen-dant hydroxyls are excellent sites for crosslink-ingin thermoset applications at elevated temperaturesand even at ambient conditions.
Phenoxy resins are compatible with many poly-mers and they are efficient flexibilizers forcrosslinked phenolic and epoxy formulations in ad-hesives, coatings, and composites. Phenoxy res-ins have shown utility in compatibilizing blends ofdiverse plastic materials. Phenoxy resin has asolubility parameter of 10.68 enabling excellent com-patibility with polar materials and sufaces like poly-urethanes, polyesters, and nylons. Generally, theresin is incompatible with acrylics, olefins, and vi-nyls. Phenoxy has excellent vapor barrier properies(water vapor, oxygen, carbon dioxide) and is com-pliant with 21CFR175.300 for direct and indirect food/beverage container coatings, as well as other para-graphs pertinent to adhesives used in multilayerpackaging and plastic components for containers.
InChemRez resins of Phenoxy type resins comb-ined with epoxies, polyethers, and polyesters pro-vide user friendly hybrids for formulation latitudeand novel properties.
Modification of the Phenoxy resin backbone bygrafting onto the aliphatic carbon segments gener-ates the family of anionically stabilized waterbornedispersions. These grades of Phenoxy (PKHW-series) allow formulators significant latitude in de-signing VOC compliant coatings and adhesives.Several are also FDA-compliant for use in packag-ing and container coatings (direct and indirect foodcontact).
Modification by esterification of the backbone hy-droxyls generates a new family of high molecularweight resins having pendant primary hydroxyls,vastly improved compatibility with ester-type sol-vents, and improved elasticity. Products of thistype are in the PKCP-series. These resins are notFDA-compliant however.
Phenoxy resins are soluble in a variety of materi-als including ketones, glycol ethers and glycol etheresters. Phenoxy resins prefer polar aprotic sol-vents, however many aliphatic and aromatic mate-rials will behave as diluents in conjunction withstrong solvents as above. Detailed solids/viscos-ity charts are illustrated in this guide for numeroussolvents and solvent combinations with differentgrades of Phenoxy.
Standard solutions of Phenoxy resin in methylethyl ketone and in PM acetate are commerciallyavailable from InChem Corp. InChem Corp. willconsider alternate solvents for customer specificneeds based on fit, volume, etc.
OHO C C C OH
OH HO C C C O
n
6
INCHEMREZ PHENOXY RESINSSTANDARD SOLID GRADES
ytisocsiV 1 Pc,52ta oC
sdiloS 2,%.tw
roloC 1,AHPA
ezaH 1,% mroFlacisyhP ,).va(nM
snotlad,).va(wM
snotlad
noitacificeps noitacificeps .ceps .ceps noitacificeps lacipyt lacipyt
BHKP 082-081 .nim99 .xam002 .xam51 stellep 005,9 000,23
+BHKP 904-182 .nim99 .xam002 .xam51 stellep 005,01 000,73
CHKP 425-014 .nim99 .xam002 .xam51 stellep 000,11 000,34
HHKP 517-525 .nim99 .xam002 .xam51 stellep 000,31 000,25
JHKP 577-006 .nim99 .xam002 .xam51 stellep 000,61 000,75
EFKP 598-006 .nim99 3 .xam002 .xam51 stellep 000,61 000,06
002-PHKP 517-574 .nim99 .xam002 .xam51 redwop 000,31 000,25
08-PHKP 517-574 .nim99 .xam002 .xam51 redwop 000,31 000,25
001-BHKP 904-081 .nim99 .xam002 .xam51 redwop 000,01 000,53
003-BHKP 904-081 .nim99 .xam002 .xam51 redwop 000,01 000,53
Pc,ytisocsiV52ta oC
,sdiloS%.tw
,roloCrendraG
,ezaH% mroFlacisyhP ).va(nM 4,
snotlad).va(wM 4,snotlad
noitacificeps noitacificeps .ceps .ceps noitacificeps lacipyt lacipyt
AMP03-SHKP 000,51-000,5 0.13-0.92 .xam1 .xam51 suocsivdiuqil 000,11 000,34
04-SHKP 000,7-005,4 0.14-0.93 .xam1 .xam51 suocsivdiuqil 000,31 000,25
1 20% solution in cyclohexanone 2 gravimetric, 3 hours at 135oC3 gravimetric, 3 hours at 80oC, then 1 hour at 220oC
STANDARD SOLUTION GRADES
4 on polymeric portion (GPC, versus polystyrene)
7
,gT o ,C)CSD(
xednItleM002ta oC
ytisocsiVtleM 5,002taesioP oC
cificepSytivarg 6 stnemmoC
lacipyt lacipyt lacipyt lacipyt
48 .nim01/g06 211 81.1 elbaliavaedargthgiewralucelomtsewolehT
78 03< ----- 81.1 edargthgiewralucelomwol-muideM
98 51< ----- 81.1 edargthgiewralucelommuidemesopruplareneG
29 4 564 81.1 snoitacilppatsomrofedargdradnatS
59 4< ----- 81.1 edargthgiewralucelomhgih-muideM
89 4< ----- 81.1 noisurtxemlifrof;edargthgiewralucelomhgih-artlU
29 4 564 81.1 .vanorcim011;snorcim002<;edargHHKPdezinorciM
29 4 564 81.1 .vanorcim06;snorcim08<;edargHHKPdezinorciM
68 06-03 ----- 81.1 .vanorcim06;snorcim001<;edarg+B/BHKPdezinorciM
68 06-03 ----- 81.1 egnarnorcim003ot051;edarg+B/BHKPdezinorciM
,.tPgnilioBoC
,.tPhsalFo CCMP,F
tnevloS]#SAC[
cificepSytivarg stnemmoC
lacipyt lacipyt noitacificeps lacipyt
531 411 etatecaMP]6-56-081[ 30.1 yxonehPedargCHKPfonoituloS
08 12 KEM]3-39-87[ 569.0 edargHHKPfonoituloS
Phenoxy Resin Polymers shownbelow are TSCA listed
as CAS# 25068-38-6
Theoretical OH equivalent weight: 284
INCHEMREZ NOTES
5 at 1034 s-1 6 fused, at 25oC
Special solvent packages with Phenoxy resins available on request (drums and/or bulk)
INCHEMREZ NOTES
8
INCHEMREZ PHENOXY RESINS
ytisocsiV 1 Pc,52ta oC
sdiloS 2,%.tw Hp eziSelcitraP
snorcimlacisyhP
mroF,.oNdicA
)sdilos(
noitacificeps noitacificeps .ceps .lacipyt noitacificeps lacipyt
53-WHKP 000,4-005,1 0.23-0.03 8.7-8.6 5.1 noisrepsidladiolloc 75
43-WHKP 006,1-008 0.53-0.33 8.7-8.6 90.0 noisrepsidladiolloc 74
63-WHKP 005,6-005,3 3 0.43-0.23 8.7-8.6 11.0 noisrepsidladiolloc 05
ytisocsiV 4 Pc,52ta oC
sdiloS 5,%.tw
roloC 4,AHPA
ezaH 4,%
lacisyhPmroF
lyxordyHrebmun
noitacificeps noitacificeps .ceps .ceps noitacificeps lacipyt
03-MHKP 003-001 .nim99 .xam002 .xam51 stellep 751
103-MHKP 003-001 .nim99 .xam002 .xam51 stellep 261
58-MHKP -000,03 000,05 6 .nim99 .xam001 A/N diuqilsuocsiv 012
38-MHKP 000,55-000,53 6 .nim99 .xam001 A/N diuqilsuocsiv 771
Pc,ytisocsiV04ta oC
tnecrePyxonehP)sdilos(
,sdiloS%.tw EPW mroFlacisyhP ,roloC
rendraG
noitacificeps lacipyt lacipyt .ceps noitacificeps .ceps
BH-REL 000,05-000,02 01 001 412-202 diuqilsuocsiv .xam2
HH-REL .nim000,53 01 001 412-202 diuqilsuocsiv .xam2
BH-NEL 000,54-000,03 01 001 691-281 diuqilsuocsiv .xam2
VLBH-NEL 000,61-000,11 01 001 691-281 diuqilsuocsiv .xam2
WBH-REL 0007-0005 7 01 38 572-552 diuqilsuocsiv noisrepsid
PHENOXY/POLYESTER BLENDS
LIQUID EPOXY/PHENOXY BLENDS
1 Brookfield RVT, #4 at 50 rpm 2 gravimetric, 1 hours at 200oC3 Brookfield RVT, #4 at 20 rpm
4 20% solution in cyclohexanone 5 gravimetric, 3 hours at 135oC6 Brookfield RVT 7 (below) at 25oC
WATERBORNE DISPERSIONS
9
s'COV.lag/blni stnevlos-oC gnizilartueN
enima stnemmoC
lacipyt noitacificeps noitacificeps
0.2 rehtelytublocylgenelyhte AEMD 8 snoitalumroftesomrehtrofnoisrepsiddradnatS
0.2 PnP;HOuB-n 7 AEMD stnevlos-ocPAH-non;noisrepsideziselcitrapwol-artlU
0.2 PnP;HOuB-n AET 9 snoitalumrofgniructneibmarofgTwoL
s'COV.lag/blni
lyxordyH1(rebmun o)
).clac(
cificepSytivarg stnemmoC
lacipyt lacipyt lacipyt
0 9 91.1 loylopepyt-retseylophtiwyollaedarg-diloS
0 41 91.1 loylopepyt-retseylophtiwyollaedarg-diloS
0 081 01.1 loylopepyt-retseylophtiwerutximedarg-diuqiL
0 441 20.1 loylopepyt-rehteylophtiwerutximedarg-diuqiL
s'COV.lag/blni
ytilanoitcnuF)tnenopmocyxopE(
cificepSytivarg stnemmoC
lacipyt lacipyt lacipyt
0 2 81.1 BHKPyxonehPhtiwdeifidomniseryxopediuqilcisaB
0 2 81.1 edargHHKPhtiwdeifidomniseryxopediuqilcisaB
0 3.2 81.1 edargBHKPhtiwdeifidomnisercalovonyxopediuqiL
0 1.2 81.1 edargBHKPhtiwdeifidomNPEytisocsivwoL
0 2 01.1 dnelbyxonehP/yxopefonoisrepsidsuoeuqA
7 propyleneglycol n-propyl ether 8 dimethyl ethanolamine9 triethylamine
Reduced viscosity versions of InChemRez LER-HB with epoxy diluents available on request
INCHEMREZ NOTES
10
ytisocsiV 1 Pc,571ta oC
tnecrePyxonehP
,roloCrendraG EPW lacisyhP
mroF,gT oC
)CSD(
lacipyt lacipyt .ceps .ceps noitacificeps lacipyt
01-RES 0054 01 .xam2 568-577 elunarg/ekalf 05
P01-RES 0054 01 .xam2 568-577 redwop 05
52-RES 0081 2 52 .xam2 525-574 elunarg/ekalf 03<
ytisocsiV 3 Pc,52ta oC
sdiloS 4,%.tw
roloC 3,AHPA
ezaH 3,%
lacisyhPmroF
lyxordyHrebmun
).clac(
lacipyt noitacificeps .ceps .ceps noitacificeps lacipyt
08-PCKP 021 .nim79 .xam002 .xam51 stellep 061-551
76-PCKP 011 .nim79 .xam002 .xam51 dilos-imes 531-031
Pc,ytisocsiV52ta oC
,sdiloS%.tW
,roloCrendraG
tnelaviuqEthgiew
)sdilosno(mroFlacisyhP cificepS
ytivarG
lacipyt lacipyt .ceps lacipyt noitacificeps lacipyt
697-PE 000,64 06 .xam2 0012 diuqilsuocsiv 40.1
53-SE 000,6 53 .nim1 A/N diuqilsuocsiv A/N
05-SE .nim000,53 05 .xam2 0053 diuqilsuocsiv 30.1
56-RP 0002 07 .xam5 061 diuqilytisocsivwol 0.1
SOLID EPOXY/PHENOXY BLENDS
CAPROLACTONE-MODIFIED PHENOXY RESINS
EPOXY RESIN SOLUTIONS & CROSSLINKERS
1 ICI cone/plate 2 ICI cone/plate at 200oC
3 20% solution in cyclohexanone 4 gravimetric, 2 hours at 200oC
11
Pc,ytisocsiV041ta oC stnemmoC
lacipyt
000,11 sgnitaocredwopevitaroceddnalanoitcnufroF
000,11 foedargdezinorciM 01-RESzeRmehCnI
----- yollaniseryxopetnetnocyxonehPhgiH
,gT o ,C)CSD( stnemmoC
lacipyt
03 niseryxonehPdetfarg-enotcalorpacgTwol-muideM
2 yxonehPdetfarg-enotcalorpacgTwoL
tnevloS stnemmoC
noitacificeps
BE 5 KEMdna noitulosnidnelbyxonehP/yxopethgiewralucelomhgiH
AMPdnaKEM 6 noitulosnidnelbyxope/yxonehPthgiewralucelomhgiH
001-AdnaBE 7 noitulosniseryxopethgiewralucelomhgiH
lonatub-n slemanegnikabrofnisercilonehP
Caprolactone-modified Phenoxy resins have pendant branches with terminalprimary hydroxyls resulting from random grafting of e-caprolactone monomeronto the Phenoxy backbone. The esterification also results in lower glasstransition temperatures and lower product viscosities. (See page 12)
INCHEMREZ NOTES
5 ethyleneglycol butylether 6 propyleneglycol n-propylether acetate 7 Aromatic 100 solvent
12
Pc,ytisocsiV52ta oC
yxonehP%.tw EPW ,sdiloS
%.tw mroFlacisyhP ,roloCrendraG
lacipyt lacipyt .ceps .ceps noitacificeps .ceps
BH-REC 000,51-000,8 01 951-541 .nim99 diuqilsuocsiv .xam2
76PC-REC 008,4 01 951-541 .nim79 diuqilsuocsiv.dem .xam2
CYCLOALIPHATIC EPOXY /PHENOXY RESIN BLENDS
The PKCP-series of caprolactone modified Phenoxy resin are structurally represented below and modeled on page13. The random branches (typically x is about 2) produce resins with lower glass transitions than unmodified Phe-noxy, and enhance the compatibility with alkyl esters and polyesters.
INCHEMREZ NOTES
PHENOXY PKCP-series STRUCTURE
Phenoxy with e-Caprolactone Side Chain Grafting
13
ytilanoitcnuF)remogilO(
cificepSytivarG
HOrebmun stnemmoC
lacipyt lacipyt lacipyt
2 81.1 02 sniseryxonehPdnayxopecitahpilaolcycfodnelB
2 71.1 31 dnelbyxonehPdeifidom-enotcalorpac/yxopecitahpilaolcyC
The structural models below illustrate the comb-like structure of the caprolactone-modified Phenoxy resin whereinrandom secondary hydroxyls are converted to primary hydroxyls pendant on relatively short side chains comparedto the longer Phenoxy backbone
INCHEMREZ NOTES
CAPROLACTONE MODIFIED PHENOXY
14
The next sections of this guide show the diver-sity of applications of the InChemRez family ofproducts and the expected performance features& benefits that may be realized with their use incoatings, adhesives, plastics, and composites.Additionally, the many possible chemistries inwhich the InChemRez line can be incorporated issuggested.
HOW TO USE TABLES
The following tables are arranged in two fash-ions: product selections (in bold for best recom-mendation) are listed for performance attribute ver-sus application technology, followed by productselections for numerous chemical approaches ver-sus application technology.
The Phenoxy line of products find many usesas modifiers to other chemistries as well as utilityas the sole resinous vehicles in coatings, adhe-sives, etc. Compatibilty with urethanes and epoxyresins is excellent. In many cases modificationwith Phenoxy resin and its many derivatives issufficient to upgrade the properties of the formula-tion. In those cases where crosslinking can occurwith hydroxyl functionality the Phenoxy resins willfurther enhance properties like hardness, abrasionresistance, and chemical resistance.
SOLVENTS and DILUENTS
Phenoxy resins favor polar, aprotic type sol-vents in solventborne applications although incor-poration into formulations having hydrocarbon oraromatic solvents is quite possible if sufficient po-lar solvents can also be used. The preparation ofmost solventborne solutions of Phenoxy resins isusually straightforward given adequate agitation.For faster results some heating is required com-mensurate with the solvent choice.
APPLICATION GUIDELINES: Performance/Technology/Chemistry
WATERBORNE RESINS
Waterborne Phenoxy resins are colloidal dis-persions dependant on pH maintenance above 6.5.Generally they are compatible with colloidal dis-persions of other polmers stabilized in the samemanner such as polyurethanes, polyesters, acryl-ics, and epoxy esters. With waterborne epoxiespoor shelf stability is observed due to gellingtendencies of the contained epoxy species becauseof the slightly basic nature of the Phenoxydispersions.
TABLE SUMMARY
Coatings & Inks: pages 15 - 16Adhesives: pages 17 - 18Composites: pages 19 - 20Plastics: pages 21 - 22
TYPICAL PHENOXY APPLICATIONS
- Zinc-rich primers- Food & beverage can coatings- Maintenance coatings (metal & concrete)- Coil coatings- Marine coatings- Automotive refinish- Powder coatings- Cationic & UV cure- Tielayers- Heatseal adhesives- Structural adhesives
15
In coatings applications InChemRezPhenoxy resins, polyester modifiedPhenoxy resins, epoxy/Phenoxy hybridresins, and InChemRez caprolactonemodified resins offer a wide selectionfor your chosen technology. Phenoxyresins find use in can and container coat-ings, drum linings, zinc-rich coatings andmaintenance primers, shop primers, glassand plastic coatings, wood coatings, andcoatings for flexible substrates includingPET, metal foils, paper and cloth.
Water-borne grades of Phenoxy permitformulations to low VOC’s and select solidgrade Phenoxy resins are useful inthermoplastic and thermoset powdercoatings.
Solvent-borne
Water-borneair drythermoset
Powder
High Solids
serutaeFenrobtnevloS enrobretaW redwoP sdiloShgiH
noisehdAnoitomorp
HHKP04-SHKP
AMP03-SHKP
53-WHKP43-WHKPWBH-REL
08-PHKP001-BHKP
01-RES
76PC-REC52-RES
&ytilibixelFssenhguot
JHKP03-MHKP103-MHKP
52-RES
53-WHKP43-WHKP
08-PHKP001-BHKP
HH-REL
noisorroCecnatsiser
JHKP697-PE
53-WHKPWBH-REL
002-PHKP BH-RECBH-NEL
roloCwoL03-MHKP04-SHKP
43-WHKP 002-PHKP BH-REL
ssendraHEFKPJHKP
43-WHKPWBH-REL
01-RESP01-RES
BH-RECBH-NEL
ssolGAMP03-SHKP
HHKP43-WHKP 01-RES BH-REL
tnemgiPgnidaol
04-SHKPAMP03-SHKP
53-WHKP 001-BHKP08-PHKP
VLBH-NEL
Coatings & Inks Selection Guide
APPLICATION GUIDE: COATINGS FEATURE & TECHNOLOGY
16
yrtsimehCenrobtnevloS enrobretaW redwoP sdiloShgiH
enimA/yxopEtneibmaK2
HHKP04-SHKP
WBH-REL 76PC-RECBH-RECBH-NEL
VLBH-NEL
reknil-X/yxopEtnetalK1
002-PHKP001-BHKP
BH-RELBH-NEL
WBH-REL 08-PHKP001-BHKP
01-RES
BH-NELVLBH-NEL
OCN/retseyloPtneibmaK2
AMP03-SHKP103-MHKP
03-MHKP
63-WHKP43-WHKP
58-MHKP38-MHKP
OCN/retseyloPdekcolbK1
AMP03-SHKP103-MHKP
03-MHKP
43-WHKP63-WHKP
08-PHKP001-BHKP
76-PCKP58-MHKP38-MHKP
enimaleMtesomreht
HHKP04-SHKP103-MHKP
53-WHKP43-WHKP63-WHKP
08-PHKP001-BHKP
03-MHKP103-MHKP
58-MHKP
cilonehPtesomreht
HHKP04-SHKP
56-RP
53-WHKP43-WHKP
56-RP
01-RESP01-RES
03-MHKP103-MHKP
58-MHKP
yxopEcinoitaC
BH-REC76PC-REC
BH-REL
BH-REC76PC-REC
BH-NEL
enidirizAdeknilssorc
63-WHKP43-WHKP
/sdyklAsretseyxopE
43-WHKP63-WHKP
scilyrcA 43-WHKP63-WHKP
enahteruyloPsnoisrepsid
43-WHKP63-WHKP
/yxopEedirdyhna
BH-RELBH-NEL01-RES
BH-REC76PC-REC
InChemRez Phenoxy resins can be used as thesole resin vehicle in coatings formulations. Forcrosslinked systems using the pendant secondaryhydroxyls on the Phenoxy backbone it is recom-mended to empirically determine the best level ofcrosslinker for a balance of coatings properties such
as hardness and flexibility. Usually the level ofcrosslinker or hardener is about 10 to 15 phr (partsper hundred) on a solids basis. Typical crosslinkersused in thermoset applications are melamine-form-aldehyde resins, phenolics, blocked isocyanates,and polycarboxylic acids.
APPLICATION GUIDE: COATINGS CHEMISTRY TYPE & TECHNOLOGY
17
serutaeFenrobtnevloS enrobretaW tlemtoH sdiloshgiH
noisehdAnoitomorp
dilosllAsedargtellep
53-WHKP43-WHKPWBH-REL
dilosllAsedargtellep
76PC-RECBHKP
VLBH-NEL
&ytilibixelFssenhguot
JHKP03-MHKP103-MHKP
52-RES
53-WHKP43-WHKP EFKP
BH-REC
evisehoChtgnerts
JHKP697-PE
53-WHKP dilosllAsedargtellep
BHKP52-RES
taeHecnatsiser
EFKPJHKP
53-WHKP EFKP BH-REC
reirrabropaVseitreporp
dilosllAsedargtellep
53-WHKP dilosllAsedargtellep
BHKP
neerGhtgnerts
dilosllAsedargtellep
WBH-REL BHKP 01-RES
leePhtgnerts
EFKPJHKP
53-WHKP EFKPJHKP
52-RESVLBH-NEL
erutsioMecnatsiser
EFKP WBH-REL53-WHKP
dilosllAsedargtellep
HH-REL
Adhesives Selection Guide
Solventborne
Water-borneair drythermoset
Hot melt
High solidsthermosetair-dry 2k
In adhesives applications InChemRez Phenoxybased resins offer a wide selection for your chosentechnology.Phenoxy resins are used to add superior adhe-sion promotion to a wide variety of substrates. Thelarge number of secondary hydroxyls give Phenoxythe “bite” that many systems require. The linearthermoplastic nature of Phenoxy provides flexibil-ity to rigid crosslinked systems.Phenoxy resins find use in aerospace and auto-motive latent cure and hotmelt adhesives byimproving adhesion and flexibility of epoxy-basedcompounds, and circuit board laminating adhesivesby increasing bond strength to the boards.
APPLICATION GUIDE: ADHESIVES FEATURE & TECHNOLOGY
18
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enimA/yxopEtneibmaK2
HHKP04-SHKP
WBH-REL 76PC-RECBH-RECBH-NEL
76PC-REC
reknil-X/yxopEtnetalK1
002-PHKP001-BHKP
BH-RELBH-NEL
WBH-REL 01-RES52-RES08-PHKP
BH-REL
BH-NEL
OCN/retseyloPtneibmaK2
AMP03-SHKP 63-WHKP 58-MHKP38-MHKP
OCN/retseyloPdekcolbK1
AMP03-SHKP 43-WHKP63-WHKP
103-MHKPBHKP
08-PCKP
76-PCKP58-MHKP38-MHKP
enimaleMtesomreht
HHKP04-SHKP
53-WHKP43-WHKP63-WHKP
03-MHKP103-MHKP
58-MHKP
cilonehPtesomreht
HHKP04-SHKP
56-RP
53-WHKP43-WHKP
56-RP
03-MHKP103-MHKP
58-MHKP
yxopEcinoitaC
BH-REC76PC-REC
BH-REL
BH-REC76PC-REC
BH-NEL
AVEtlemtoh
BHKP103-MHKP
08-PCKP
BHKP001-BHKP
08-PHKP
UPTtlemtoh
08-PHKP08-PCKP
BHKP
002-PHKPHHKPBHKP
InChemRez Phenoxy resins can be used as thesole resin vehicle in adhesives formulations. Forcrosslinked systems using the pendant second-ary hydroxyls on the Phenoxy backbone it is rec-ommended to empirically determine the best levelof crosslinker for a balance of coatings propertiessuch as hardness and flexibility. Usually the levelof crosslinker or hardener is about 10 to 15 phr(parts per hundred) on a solids basis. Typicalcrosslinkers used in thermoset applications aremelamine-formaldehyde resins, phenolics, blockedisocyanates, and polycarboxylic acids. InChemnow provides a phenolic crosslinker calledInChemRez PR-65 (see page 10) useful for ther-moset coatings and adhesives based on hydroxylfunctional vehicles like solid grade epoxies, OH-functional polyesters, and Phenoxy resins.
In hot melt applications with thermoplastic ure-thanes (TPU’s) and copolyethylene vinyl acetateresins (EVA’s) Phenoxy resins can be incorpor-
ated at levels as low as 10% to act as antiplastizersimparting properties such as stiffness and cohe-sive strength.
For modifying epoxy systems, the powder gradesof Phenoxy are easy to incorporate. Alternatively,the liquid and solid blends offered by InChem pro-vide a “user friendly” avenue. Phenoxy behaves asa “hard plasticizer” in many epoxy matrices usedas adhesives by interpenetration. In acid curedand anhydride-cured systems Phenoxy may par-tially tie into the cured matrix.
APPLICATION GUIDE: ADHESIVES CHEMISTRY TYPE & TECHNOLOGY
19
Solventborne
Water-borne
High solids
Composites Selection Guide
InChemRez Phenoxy resins havespecific uses in composites applica-tions both in fiber sizing and in matrixresin compostions. Phenoxy resinshave excellent adhesion to glass andcarbon fibers. Phenoxy sizings enableexellent compatibilty with epoxy-basedmatrix resins, and with viny ester basedresins.
Because of the pendant backbone hy-droxyls, Phenoxy can be thermosetwith select crosslinkers to provide maxi-mum strength, heat resistance, andchemical resistance.
Phenoxy can also be formulated intoepoxy and urethane based compositeformulations to provide toughness andadhesion to the reinforcement.
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tuoteWdilosllA
sedargtellep53-WHKP43-WHKP
&ytilibixelFssenhguot
JHKP52-RES
53-WHKP43-WHKP
BH-RELVLBH-NEL
elisneThtgnerts
JHKPEFKP
53-WHKP BHKP52-RES
eruCdeeps
01-RESBH-REL
63-WHKP BH-REC58-MHKP
taeHecnatsiser
dilosllAsedargtellep
53-WHKP BHKP
scinoiwoLdilosllA
sedargtellep BH-NELVLBH-NEL
erutsioMecnatsiser
EFKP56-RP
53-WHKP BH-NEL
APPLICATION GUIDE: COMPOSITE FEATURE & TECHNOLOGY
20
yrtsimehCenrobtnevloS enrobretaW sdiloShgiH
enimA/yxopEtneibmaK2
HHKP04-SHKP
52-RES01-RES
WBH-REL VLBH-NELBH-RECBH-NEL52-RES
reknil-X/yxopEtnetalK1
002-PHKP52-RES01-RESBH-NEL
WBH-REL BH-NELVLBH-NEL
52-RES01-RES
OCN/retseyloPtneibmaK2
AMP03-SHKP 63-WHKP43-WHKP
58-MHKP38-MHKP
OCN/retseyloPdekcolbK1
AMP03-SHKP 43-WHKP63-WHKP
76-PCKP58-MHKP38-MHKP
etalyrcAerucedixorep
BHKP
cilonehPtesomreht
HHKP04-SHKP
56-RP
53-WHKP43-WHKP
56-RP
03-MHKP103-MHKP
58-MHKP
yxopEcinoitaC
BH-REC76PC-REC
BH-REL
BH-REC76PC-REC
BH-NEL
enimaleMtesomreht
HHKP04-SHKP76-PCKP
43-WHKP53-WHKP
BHKP001-BHKP
08-PHKP
APPLICATION GUIDE: COMPOSITE CHEMISTRY TYPE & TECHNOLOGY
21
Plastics Selection Guide
In plastics applications InChemRezPhenoxy resins offer a wide selection foryour chosen technology. Phenoxy resinsfind use in blends of PBT, PET, PPO,nylon, and polycarbonate resins for modi-fying physical properties such as tensile,flexural, and impact strengths. The additionof Phenoxy improves pigment/filler wettingfor appearance and rheology control.Additionally Phenoxy resins are useful ascompatibilizing agents for dissimilarplastics like polyolefins and polyesters.
Because of transesterification reactionsPhenoxy resin can behave as processingaids with polyesters such as polyethyleneterephthalate during extrusion.
Processing Aid
Blends
Compatibilizer
Tie-layer
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elisneThtgnerts
dilosllAsedargtellep
EFKP HHKP HHKPJHKP
elisneTsuludom
JHKPEFKP
EFKPJHKP
HHKP JHKPEFKP
laruxelFhtgnerts
JHKP EFKP HHKPEFKP
EFKP
laruxelFsuludom
EFKP EFKP HHKPJHKP
JHKPEFKP
tcapmIhtgnerts
EFKP EFKP08-PCKP
BHKPEFKP
HHKP
tnemgiPgnittew
dilosllAsedargtellep
EFKP HHKPEFKP
ytiralCrolocdna
HHKP HHKPHHKP HHKP
ropaVreirrab
dilosllAsedargtellep
EFKPHHKP EFKP
HHKP
APPLICATION GUIDE: PLASTICS FEATURE & TECHNOLOGY
22
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TEP/TBPHHKPEFKP
BHKPEFKP
BHKPEFKP
HHKP
-lynehpyloPedixoene
HHKPEFKP
EFKP EFKP HHKP
nolyNEFKP EFKP EFKP EFKP
HHKP
etanobracyloPEFKP EFKP HHKP
snifeloyloPEFKP
-lynivyloPlarytub
EFKPEFKPHHKP
lynivyloPenodilorryp
EFKPHHKPBHKP
s'UPT HHKPEFKP
HHKPCHKPBHKP
enelyklayloPsedixo
EFKPHHKP
HHKP
-orpacyloPenotcal
HHKPEFKP EFKP
HHKP HHKPHHKP
Because of its unique structure and propertiesPhenoxy resins, when used as additives in plas-tics applications, can greatly improve not only theprocessability of these materials but also improvethe quality and performance of the finishedproduct.
During processing the addition of Phenoxy canhelp to control process rheology as well as the heatdistortion temperatures in extrusion, molding andfilm formation operations. The amorphous nature ofPhenoxy resin can also be helpful in controllingthe crystallization kinetics of thermoplasticmaterials.
Alloys made with Phenoxy have been shown topossess improved thermal stability. The tough-ness of Phenoxy resins also imparts improvedmechanical performance to finished products. Asa result, the addition of Phenoxy resins can re-sult in cost reductions as less material (thinnercross sections) is required to achieve the desiredperformance. The excellect vapor barrier proper-ties of Phenoxy resins can be beneficial in plasticfilm applications where protection against mois-ture or oxygen is required.
APPLICATION GUIDE: PLASTIC CHEMISTRY TYPE & TECHNOLOGY
23
VISCOSITY PROFILES FOR PHENOXY RESINS IN CYCLOHEXANONE AND METHYL ETHYL KETONE
10
100
1000
10000
100000
1000000
10000000
0 10 20 30 40 50
Percent solids
Visc
osity
, cP
at 2
5o C
PKHB
PKHJ
PKHH
Cyclohexanone
Methyl ethyl ketone
Viscosity/solids relationships for standard grades of Phenoxyresins in common solvents and solvent mixtures are shownon pages 23-25. On page 26 a list of common solvents anddiluents for standard Phenoxy resin is tabulated. Wherenoted, the solubility of Phenoxy resins may be limited, es-pecially in situations where the solvent is in high excess (lowsolids region). For example, with methyl ethyl ketone, phaseout will occur with Phenoxy resin (PKHH, PKHB) below about22% solids. Interestingly, the phase out can be rectified witha small addition of water (about 1%).
24
VISCOSITY PROFILES FOR PHENOXY RESINS IN BINARY SOLVENT BLEND: MEK AND AROMATIC 100
10
100
1000
10000
100000
0 10 20 30 40 50
Percent Solids
Visc
osity
, in
cP a
t 25o C
PKHB
SOLVENT BLEND IS: 3:2 by weight MEK Aromatic 100 PKHH
VISCOSITY PROFILES FOR PHENOXY RESINS IN PM SOLVENT AND PM ACETATE
10
100
1000
10000
100000
1000000
0 5 10 15 20 25 30 35 40 45
Percent Solids
Visc
osity
, cP
at 2
5o C
PM Acetate
PM Solvent
PKHJ
PKHH
PKHB
25
VISCOSITY PROFILES FOR PHENOXY RESINS IN LOW VOC TERNARY SOLVENT BLENDS
10
100
1000
10000
100000
0 10 20 30 40 50 60
Percent Solids
Visc
osity
, in
cP a
t 25o C
SOLVENT BLEND IS: 1:1:1 by weight cyclohexanone acetone (VOC exempt) methyl acetate (VOC exempt)
PKHH
PKHB
VISCOSITY PROFILES FOR PHENOXY RESINS IN PM ACETATE/AROMATIC 100 (3/2)
1000
10000
100000
1000000
0 10 20 30 40 50 60
Percent Solids
Visc
osity
, in
cP a
t 25o C
PKHH
PKHB
Insoluble mixtures below this pointat 25oC
Weight ratio of PM Acetateto Aromatic 100 solventsis 3 parts to 2 parts
26
Phenoxy Resin CommentsSolubility
Solvent Type:
Ketones:cyclohexanone Excellent
methy ethyl ketone (MEK) Good Phase separation below 22% solidsmethyl isobutyl ketone (MIBK) Insoluble (at 25% NV)
methyl amyl ketone (MAK) Insoluble (at 25% NV)acetone Insoluble (at 25% NV) Soluble at > 45% NV
Alcohols:methanol, ethanol, butanol Insoluble
isopropanol Insolublebenzyl alcohol Good
Glycol ethers:ethyleneglycol alkyl ethers Excellent Cellosolve, butyl Cellosolve, etc. (Dow)
diethyleneglycol alkyl ethers Excellent Carbitol, butyl Carbitol, etc. (Dow)propyleneglycol alkyl ethers Excellent
dipropyleneglycol al kyl ethers Excellentphenoxypropanol Excellent Dowanol PPh (Dow)
Esters:alkyl acetates Insoluble methyl , or ethyl , or butyl acetate, etc.
ethyl lactate Gooddibasic esters Good DBE (DuPont)
ethyleneglycol ethylether acetate Gooddiethyleneglycol ethylether acetate Good
propyleneglycol methylether acetate Goodethoxyethyl propionate Good Ektapro EEP (Eastman)phenoxyethyl acrylate Good
tripropyleneglycol diacrylate Goodhexanediol diacrylate Poor
Hydrocarbons:toluene Insoluble These materials are useful diluentsxylene Insoluble for Phenoxy when combined with
Aromatic 100 Insoluble polar, aprotic solvents; use at 40%hexane Insoluble maximum on solvent basis
Miscellaneous:tetrahydrofuran Excellent
N-methyl pyrrolidone Excellentp-chloro benzotrifluoride Insoluble
diacetone alcohol Goodcresyl glycidylether Goodbutyl glycidylether Insoluble
methylene chloride Good
PHENOXY SOLVENT TABLE
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PROPERTIES OF INCHEMREZ PHENOXY PKFE SOLID GRADE
