©2020 by System Plus Consulting | TDK-Chirp CH-101 1Report Ref.: SP20520
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
TDK-Chirp Ultrasonic ToF SensorThe first PMUT millimeter-accurate ultra-low power Time of Flight sensorSP20520 - MEMS report by Sylvain HALLEREAU
Physical Analysis by Nicolas RADUFEFebruary 2020 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | TDK-Chirp CH-101 2Report Ref.: SP20520
Table of Contents
Overview / Introduction 5
o Executive Summary
o Reverse Costing Methodology
Company Profile 9
o TDK Chirp
o CH-101
o STMicroelectonics
Physical Analysis 15
o Summary of the Physical Analysis 16
o Packaging 20
Package Views
Package Cross-Section
Package Patents
o Sensor Die 30
Sensor Die View & Dimensions
Sensor Die Process
Sensor Die Cross-Section
Sensor Die Process Characteristic
o ASIC Die 56
ASIC Die View & Dimensions
ASIC Delayering & main Blocs
ASIC Die Process
ASIC Die Cross-Section
ASIC Die Process Characteristic
TDK CH-101. vs Vesper VM1000 69
Sensor Manufacturing Process 73
o Sensor Die Front-End Process & Fabrication Unit
o ASIC Die Front-End Process & Fabrication Unit
o Final Test & Packaging Fabrication Unit
o Summary of the main Parts
Cost Analysis 82
o Summary of the cost analysis 83
o Yields Explanation & Hypotheses 85
o Sensor die 87
Sensor Die Front-End Cost
Sensor Die Probe Test, Thinning & Dicing
Sensor Die Wafer Cost
Sensor Die Cost
o ASIC Component 92
ASIC Die Front-End Cost
ASIC Die Probe Test, Thinning & Dicing
ASIC Component Cost
o Complete Module 97
Assembled Components Cost
Summary of the assembling
Module Component Cost
Selling price 104
Feedbacks 108
SystemPlus Consulting services 110
©2020 by System Plus Consulting | TDK-Chirp CH-101 3Report Ref.: SP20520
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the TDK-Chirp CH-101 Ultrasonic Sensor.
The PMUT ToF sensor market for consumer and automotive applications, which is still in its infancy, is expected to reach $22M in 2023 according to the “Ultrasound Sensing Technologies for Medical, Industrial, and Consumer Applications 2018” report from Yole Développement. The main applications are automotive in-cabin gesture recognition, localization for virtual reality (VR) headsets, home robotics, smart speakers, and drones.
TDK-Chirp has developed the first Piezoelectric Micromachined Ultrasonic Transducer (PMUT) technology for proximity sensing. It is a radical technology shift in the Time of Flight sensor world, thanks to the very small volume of the sensor, only 15mm3 it can be easily integrated in small systems like drones, mobile, smart home. These characteristics like the sun immunity, low consumption, large field of view and its low cost make it interesting for full applications today cover by more complex and expensive 3D optical ToFs.
The Piezoelectric Ultrasonic Transducer Die is manufactured by STMicroelectronics. STMicroelectronics has developed AlNtechnology to add to their MEMS portfolio technology. But the AlN transducer is not the only specific MEMS process. The transducer is manufactured on thin membranes etched by micromachining another speciality of STMicroelectronics.
The secret of the first MEMS ultrasonic transducer is not only in the piezoelectric material. The design and the manufacturing of the silicon membrane is very important because the resonance frequency is fixed by the physical dimension, mass and stiffness of the membrane. All the structure of the silicon is designed to obtain the good frequency as shown the cross-section and disassembly pictures. Even technological solutions developed for BAW filters are reused for this component.
This report is focused on the analysis of the ultrasonic ToF Sensor. It includes an ultrasonic MEMS transducer developed by Chirp (owner TDK) and one ASIC IC with all the function to drive the generation of pulse, measure the echo, runs Chirp’s DSP algorithms and I2C communication.
Along with the complete ultrasonic ToF Sensor MEMS teardown, this report goes with cost analysis and price estimation for the system. It also includes a physical and technical comparison with Vesper VM1000 microphone piezoelectric. The comparison focuses on package integration, the MEMS die and the ASIC die.
©2020 by System Plus Consulting | TDK-Chirp CH-101 4Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Views & Dimensions
CH-101 Back View©2020 by System Plus Consulting
CH-101 Front View©2020 by System Plus Consulting
Ø = 0.5mm
3.5mm
3.5
mm
3.5mm
3.5
mm
• Package: Holed LGA 8-pin
• Dimensions: 3.5 x 3.5 x 1.26 mm
• Pin Pitch: 0.8mm1.26mm
CH-101 Lateral View©2020 by System Plus Consulting
©2020 by System Plus Consulting | TDK-Chirp CH-101 5Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Cross-Section
©2020 by System Plus Consulting | TDK-Chirp CH-101 6Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Overview & Dimensions
Die Sensor - Overview©2020 by System Plus Consulting
©2020 by System Plus Consulting | TDK-Chirp CH-101 7Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Overview - Details
©2020 by System Plus Consulting | TDK-Chirp CH-101 8Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Sensor Process – Membrane Cross-Section
Membrane after doping revelation - SEM View©2020 by System Plus Consulting
Membrane after doping revelation - Optical View©2020 by System Plus Consulting
©2020 by System Plus Consulting | TDK-Chirp CH-101 9Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Module Disassemblyo Package Assembly
o Views & Dimensionso Cross-Section
o Sensor Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
o ASIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Overview & Dimensions
©2020 by System Plus Consulting | TDK-Chirp CH-101 10Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso Sensor Module Costo ASIC Component Costo Complete Module Cost
Cost Comparison
Selling Price Analysis
Feedbacks
Relate Reports
About System Plus
Sensor Front-End Cost
©2020 by System Plus Consulting | TDK-Chirp CH-101 11Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso Sensor Module Costo ASIC Component Costo Complete Module Cost
Cost Comparison
Selling Price Analysis
Feedbacks
Relate Reports
About System Plus
Component Cost
©2020 by System Plus Consulting | TDK-Chirp CH-101 12Report Ref.: SP20520
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
SENSING & ACTUATING• Status of the MEMS Industry 2019• Piezoelectric Devices: From Bulk to Thin-Film 2019• Ultrasound Sensing Technologies for Medical, Industrial and
Consumer Applications 2018
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMS • Panasonic’s 3D Time-of-Flight Depth Sensing Camera
Module• Sony’s 3D Time-of-Flight Depth Sensing Camera Module• Piezoelectric Material From Bulk to Thin Film – Comparison
2019• USound Achelous UT-P 2016 MEMS Speaker
©2020 by System Plus Consulting | TDK-Chirp CH-101 13Report Ref.: SP20520
COMPANYSERVICES
©2020 by System Plus Consulting | TDK-Chirp CH-101 14Report Ref.: SP20520
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | TDK-Chirp CH-101 15Report Ref.: SP20520
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
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www.systemplus.fr
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