The Electronics Industry in Transition -Technologies in Focus

th 24 FED Conference15/16 September 2016 Bonn

CSK - CAD Systeme Kluwetaschwww.cskl.de

Kindly supported by:

Ladies and Gentlemen,

dear FED members!

The only constant is change. Our newly structured

Innovative developments in hard- presentation programme

and software, driven by the consisting of two conference days

digital transformation of our contains current topics,

society, keep creating new innovative technologies and

technologies. The focus of this management topics. Another

year's FED Conference lies on novelty is our Speakers' Corner

Embedded Components within the accompanying trade

Technology and 3D Technology. exhibition. Make use of these

Experts and professionals will various possibilities for your

speak about these from different personal training and for

perspectives. Presentations will maintaining and generating new

be accompanied by a facilitated contacts.

discussion to answer participants' In the name of my fellow Board questions and derive important members, the Advisory Council practical recommendations for and the team at our FED office, I action. am very pleased to invite you to

The keynote speech on Friday, attend our 24th FED Conference

“Enterprise 2020 – The Internet in Bonn.

was just the beginning” will also Yoursdraw our attention to the coming

change and all of its challenges

and opportunities.

For this speech, we have been

able to recruit the internationally

renowned expert and progressive Prof. Dr. Rainer Thüringer

thinker, Tim Cole.

Plenarvortrag

Focus Topics

3D Technologies

Our Focus Topic on Thursday, 15

September, will look at different 3D

techniques. These range from the

necessary design tools across

various printing technologies,

specific application examples in 3D

printing, and 3D MID technology up

to manufacturing and 3D assembly.

Furthermore, a process will be

presented to calculate and analyse

the clearance and creepage

distances of electronic 3D

assemblies.

The Electronics Industry in Transition - Technologies in Focus

Embedded Technology

On Friday, 16 September, we will information and data formats.

focus on presentations dealing Afterwards, a facilitated round-

with embedded devices and table discussion has been

embedded systems. These will planned including all speakers

cover different hands-on and the EDA suppliers of Altium,

examples of assemblies with FlowCAD, Mentor and Zuken.

embedded active and passive Users, speakers and audience will

components. At the same time, be able to ask the EDA suppliers

we will look at questions questions concerning the

regarding the illustration of practical implementation of the

embedded components in the embedded technology with their

CAD system, component library software.

Chairman of the FED

Prof. Dr. Rainer Thüringer

Conference Programme Thu 15/09/2016

from 8:00 am Registration at FED desk and exhibition attendance

Plenum

9:00 am

9:15 am

Opening of conference and welcome - Prof. Dr. Rainer Thüringer, Chairman of the FED

Words of welcome from the city of Bonn – Mayor Reinhard Limbach

Management Current Topics Innovative Topics Focus Topic

3D-Techniques

9:30 am

Business Outlook for Global & European Electronics Markets - World & European electronic

equipment, EMS, component & materials markets

Walter Custer (EIPC)

PCB-Design für Leistungselektronik - Isolationskoordination in

leistungselektronischen Baugruppen und Geräten

Peter Mauer (Semikron)

Intelligente Sensorik für elektronische Komponenten und Systeme - Vernetzung und umfassende

Nutzung von Maschinen- und Sensordaten für die Smart Factory

Franz Stieber (ifm electronic)

3D-Druck in der Elektronikfertigung Prof. Dr.-Ing. Claus Emmelmann, Leiter des Instituts für Laser- und Anlagensystemtechnik (iLAS) an der TU Hamburg-Harburg und CEO der LZN Laser Zentrum Nord GmbH

10:15 am

Gewährleistung, Untersuchungs- und Rügepflichten - Auswirkungen der aktuellen

Rechtsprechung und Gesetzgebung auf Ihre Lieferverträge

Dr. Kai-Oliver Giesa (CMS Hasche Sigle)

Lagenaufbau und Stromversorgungsdesign für Highspeed-Anwendungen Jennifer Vincenz (tecnotron)

Das neue Proportionale Berechnungsmodell Immer kleinere Bauteile erfordern optimierte Anschlussflächen auf Leiterplatten

Rainer Taube (TAUBE ELECTRONIC)

3D-Elektronik, neue generative Verfahren für die Elektronik Hanno Platz (GED)

11:00 am Coffee break - meeting and networking at the exhibition (Speakers’ Corner)

11:30 am

Aktuelle Änderungen und Ergänzungen in der Umweltgesetzgebung (EuP, RoHs, REACh, WEEE und ELV) Dr. Otmar Deubzer (Fraunhofer IZM)

Bleifreie Lötverbindungen für hochzuverlässige Baugruppen - Hochtemperatur-Anwendungen - Niedrigtemperatur-Anwendungen Jan-Henryk Serzisko (Alpha Assembly Solutions)

CAD-systemunabhängige Erstellung von SMD Anschlussflächen nach IPC-7351C - Courtyard Outline - Namenskonvention - PCB Library Expert - CAD-Formate Karl-Heinz Kluwetasch (csk)

Luft- und Kriechstreckenanalyse von elektromechanischen BG´n - Luft- und Kriechstreckenanalyse

für 3D-Leiterplattensysteme Dr. Thomas Krebs (Mecadtron)

12:15 pm

Produkthaftungsrecht im Rahmen der Umweltgesetzgebung Dr. Jens Nusser, (KOPP-ASSENMACHER Rechtsanwälte)

Dampfphasenlöten – pro / contra Vakuum - Lötverfahren (Vergleich) - Vorteile/Nachteile Andreas Kraus (Kraus Hardware)

3D-Technologien und 3D Druck - 3D Druck vom Prototyp zur

Großserie Sebastian Bechmann (Christian Koenen)

1:00 pm Lunch break - meeting and networking at the exhibition

Reliability Current Topics Innovative Topics Current Topics

2:15 pm

In-Situ Röntgenuntersuchungen an Lötstellen der Leistungselektronik - Echtzeituntersuchung der

Porenbildung Alexander Klemm (TU Dresden)

Entwurfswerkzeug zur Adaption kritischer Teilschaltungen im Entwurfsprozess kompakter Baugruppen Bernd Stube (Fraunhofer IZM)

The New Age of PCB-Documentation - Integrierte Dokumentation Damien Kirscher (Altium)

Verschließen von Vias mit Lötstopplack - Vor- und Nachteile - Designbedingungen Martin Sachs (db electronic)

3:00 pm

Zuverlässige Netzteile -Reine Glückssache? Konkrete Analysen für aussagefähige Ergebnisse Marcus Rehm (IBR)

Selbst- und Zeitmanagement in der Projektarbeit -mehr Zeit für das Wesentliche Reinhard Greim (Organisations-Entwicklung)

If every single mesh counts – an innovative qualification technique for printing screens Jürgen Brag (Technologieberatung)

Sonderapplikationen mit dem selektiven Heißgaslötprozess - Reworkprozesse für die Reparatur

und Modifikation von hoch komplexen Baugruppen

Jörg Brand (Kraus Hardware)

3:45 pm Coffee break - meeting and networking at the exhibition (Speakers’ Corner)

4:15 pm

ends 5:00 pm

Zuverlässigkeitsbetrachtungen mit Hilfe thermomechanischer FEM-Simulation Lester Pena Gomez (CADFEM GmbH)

An Investigation into Parallel Conductor Heating in PWBs - Conductor Temperature Rise Due

to Current Changes in Conductors Mike Jouppi (Thermal Management LLC)

Automatisierte Analyse von Leiterplattenlayouts zur Vermeidung von SI, PI und EMV Problemen Joe Krolla (Mentor Graphics)

Smart Manufacturing Systems Pave the Way for Embedded Technologies Sven Lamprecht (Atotech)

6:30 pm doors open

Evening event - awarding of the PCB Design Award - starts: 7:00 pm

Conference Programme Fri 16/09/2016

8:30 am Registration at the FED desk and exhibition attendance

Plenum

9:30 am

9:45 am

Welcoming of the participants – Prof. Dr. Rainer Thüringer, Chairman of the FED

Unternehmen 2020 – Das Internet war erst der Anfang Tim Cole – Internet publisher and bestselling author

Management Current Topics Innovative Topics Focus Topic

Embedded Technology

11:00 am

Kostenoptimiertes Leiterplattendesign - Kostenoptimiertes

Leiterplattendesign aus Sicht der Elektronikfertigung - Brückenschlag zwischen Design und Fertigung

Helge Schimanski (Fraunhofer ISIT)

Designmethodik zur Miniaturisierung elektrischer Schaltungen bei steigender Qualität und Zuverlässigkeit Dirk Müller (FlowCAD)

Drahtlose, effiziente Energieübertragung mit loser Kopplung Marcus Rehm (IBR)

Subkutan implantierbarer Receiver zur Übertragung von Energie zu einem Implantat - Embedded Multilayerinduktivität

mit integrierten Bauteilen Michael Matthes (Wittenstein) Anatol Schwersenz (Würth)

11:45 am

Point of no Return ? Rückstrompfadauslegungen (flächig, GND-Hatch, GND-Balls) und ihr Einfluss auf das Übertragungsverhalten schneller digitaler Signale Ralf Brüning (Zuken)

Laminate für Hochtemperatur Anwendungen – eine Alternative zu Keramik? Anna Graf (Isola)

Integration von 3D-Bauteilen in Embedded Printed Circuit Boards - Abbildung der Bauteile im CADSystem - Informationen, Datenformate, Schnittstellen (IEC 62878-2) Michael Schleicher (Semikron)

12:30 pm Lunch break - meeting and networking at the exhibition

Reliability Current Topics UL-Forum Focus Topic

Embedded Technology

1:30 pm

Backdrill Failure Hierarchy and Stub Length Analysis - Design of IST reliability coupons - 6 x 260° C reflow simulation Alun Morgan (EIPC)

Evaluation Kabelkonfektion - Einschätzung/Bewertung - Abstimmung mit dem Kunden - Qualitäts-Anforderungen Stephan-Johannes Paul (spe Paul Kabelkonfektion)

UL PCB Recognition – What does it really mean? Emma Hudson UL International (UK) Ltd

Next Generation PCB and panel-based Packages using Embedding Technologies Lars Böttcher (Fraunhofer IZM)

2:15 pm

Interconnect Stress Test - Messmethode nach IPC-TM-650 - Messen und Bewerten - Analyse der Messergebnisse Hermann Reischer (Polar Instruments)

Fehlervermeidung - Fehlerursachen und Hinweise zu

deren Vermeidung Stephan-Johannes Paul (spe Paul Kabelkonfektion)

Wärmestabilität und UL-Zertifizierung aus Sicht eines Basismaterialherstellers Roland Schönholz (Isola)

Embedded Power Electronics on the way to be launched Mike Morianz (AT&S)

3:00 pm Coffee break - meeting and networking at the exhibition (Speakers’ Corner)

Reliability Current Topics UL-Forum Focus Topic

Embedded Technology

3:30 pm

Qualitätsregelung mit automatischer inline Inspektion - Inline-Prüfung - Qualitätskennzahlen erfassen - Qualitätsregelschleifen Michael Mügge (Viscom)

Qualifizierte Lötprofilerstellung für Reflow-, Wellen- und Selektivwellenlötprozesse - von den Vorgaben durch

Temperaturmessung zu belastbaren Profilen

Helge Schimanski (Fraunhofer (Fraunhofer ISIT)

UL recognition in the view of a PCB manufacturer Jürgen Deutschmann (AT&S)

Roundtable-Diskussion Moderation: Sven Nehrdich Teilnehmer: Emma Hudson, Roland Schönholz, Jürgen Deutschmann

Embedded Technology Roundtable-Diskussion

Realisierung von Embedded Technologies im CAD-System - Anwenderfragen an die EDA-

Anbieter - Lösungen der EDA-Anbieter Moderation: Prof. Rainer Thüringer und Rainer Taube Michael Matthes, Michael Schleicher, Lars Böttcher, Michael Morianz, Altium, FlowCad, Mentor, Zuken

4:15 pm

ends 5:00 pm

Optimierung der Zuverlässigkeit von bestückten Leiterplatten durch Simulation – QFN und BGA Bauelemente Dr. Victor Tiederle (RELNETyX)

Kleine Ursache, große Wirkung Auswirkungen des Leiterplattendesigns auf die Qualität und Zuverlässigkeit Sven Nehrdich (Jenaer Leiterplatten)

5:15 pm Farewell of the conference participants and outlook on the 25th FED Conference 2017 in Berlin Prof. Dr. Rainer Thüringer, Chairman of the FED

Why do some companies find it His thesis: the next five to ten “Digital Transformation“ is a term

so hard to handle the changes of years will decide who is part of Cole would like to be understood

the digital age, and why do others the winners and who is part of the as a wake-up call. To him,

succeed? Why is Apple today losers of the digital transfor- Germany is standing at a digital

worth more than GE, Wal-Mart, mation. Companies need to crossroads today: there is an

GM and McDonald's together? reinvent themselves, give up well- actual risk of other countries,

And, above all, why is there not a known habits and ways of especially the so-called

single German enterprise that can thinking, and adapt internal developing countries, to catch up

compete with the ”Big 4“ – Apple, processes to the pressure of the with Germany or even start to

Google, Facebook and Amazon? new. This concerns all company overtake. It is about time to set

areas, from sales to purchasing, the course for the digital future – Internet publisher and bestselling

from marketing to logistics, from and time is short.author Tim Cole will address these

manufacturing to human and other questions in his speech.

resources.

Enterprise 2020 - The Internet was just the beginning

Fri 16/09/2016Keynote Speech 09:45 am

Internet publisher and bestselling author

Tim Cole

FED General Meeting Wed, 14/09/2016 06:00 pm

Use your opportunity to shape Please note! our association! Contrary to former We are pleased to invite all of practice, the General our members to attend our FED Meeting will already General Meeting 2016 on be held on 14 September 2016 at Maritim Wednesday evening Hotel Bonn. and not on Thursday.

Afterwards, participants will get

together for a snack and an

evening of networking.

Germany at a digital crossroads

Tim Cole is an expert on topics regarding the Internet, eBusiness, Social Web and IT Security. Born in Washington in 1950, he lived for more than 40 years in Germany, working as a journalist, book author, TV host and speaker at congresses and corporate events. As a columnist and commentator, he is well appreciated for his clear and neutral analyses and his critical assessment of technological developments in Germany and in the world, as well as their consequences for the economy.

Plenarvortrag

The event area has been perfectly tions at the Speakers' Corner as opportunity to present your

integrated into the Maritim Hotel well as hard- and software demos. company to a broad professional

Bonn. Its generous foyer with an audience!Take part in our trade exhibition

exhibition area of approx. 1,000 as an exhibitor and use the

sq. offers an excellent open-space

setting for the accompanying

trade exhibition.

Presentations will be held at the

various seminar rooms directly

connected to the foyer. As usual,

coffee breaks will take place

directly inside the exhibition area.

During session breaks, you can

look forward to short presenta-

Trade Exhibition

Plenarvortrag

PCB and assembly designers The start of the evening event of disclose the best-kept secret of

represent the bridge between elec- the 24th FED Conference in Bonn the industry – the winners of the

tronics development and manu- has for the third time been reser- PCB Design Award.

facturing. They are the interface ved for those PCB designers who The PCB Design Award 2016 will

for all people involved in the deve- have submitted a sample of their be awarded in four categories:

lopment process, where all requi- work.Ÿ3D/Spacerements merge.

The judging panel will finally ŸHigh-Power

ŸHigh Wiring Density, High Transfer Rates, HDI

ŸSpecial Creativity

Three candidates are nominated

as per category and invited to our

evening event, and one of each

will win the PCB Design Award

2016 in the chosen category. Fur-

thermore, one of the competiti-

on's participants can look forward

to winning an Apple iPad in our

lottery. We would like to thank

the sponsoring companies who

have supported the FED in this

call.

Awarding of the PCB Design Award 2016

PCB Design Award 20:00 Uhr

Accompanying exhibition – a cross-section of the field of electronics

Thu 15/09/2016 07:00 pm

Thu 15/09/2016 - Fri 16/09/2016

FED e.V.Frankfurter Allee 73c10247 BerlinTel.: +49 (0) 30 340 60 30 50Fax: +49 (0) 30 340 60 30 61

www.fed.deinfo@fed.dewww.facebook.com/fachverbandelektronikdesign

PlenarvortragEvent Venue

PlenarvortragYour Contact

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The 24th FED Conference will be held at the Upon request, we will be glad to provide you with

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number of Fraunhofer Institutes, the German Aero- overview at our conference website. Please book

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until 03 August 2016.

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PlenarvortragRegistration for 24th FED Conference

Conference attendance

01 Conference 1 Day on Thu (15/09/2016) incl. evening event

02 Conference 1 Day on Fri (16/09/2016)

03 Conference 2 Days (15 and 16/09/2016) incl. evening event

04 Additional person evening event (15/09 from 6:30 pm)

05 Student (fee per day)

Members Non-Members

490 EUR 710 EUR

490 EUR 710 EUR

850 EUR 1,200 EUR

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Trade exhibition

A1 Premium Partner exhibitor package 2 days (15 - 16/09/2016)incl. 2 booth staffs, incl. advertising package (logo at website, conference

programme and advert, slot at Speakers' Corner), free choice of place

A2 Standard exhibitor package 2 days (15 -16/09/2016) incl. 1 booth staff

A3 additional booth staff 2 days (15 -16/09/2016)*

Members Non-Members

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690 EUR 990 EUR

A1 - A3 plus VAT

* max. 2 booth staffs per exhibition booth incl. conference attendance and evening event

Participation fees (01, 02, 03, 05, A1, A2, A3) include: confer- start of the event at a charge of 10 % of the total invoice

ence participation (incl. attendance of all presentations and amount. Upon expiry of this deadline, the full amount of the

the trade exhibition), conference transcript, lunch, snacks dur- invoice has to be paid in any case. The legal right of with-

ing breaks, refreshments during breaks, as well as (for 01, 03, drawal according to paragraph 6 will remain unaffected by

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incl. champagne reception. evidenced by postmark), E-Mail or fax. In case of non-

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No. 01-03: Early booking discount of 10% before 15 July 2016

Online registration: http://j.mp/konf2016

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