Date post: | 12-Apr-2017 |
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Engineering |
Upload: | bob-wettermann |
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BGA Rework-Big Challenges
I. Drivers for Soldering Challenges-Pitch, Thin Packages, Small Packages, Higher Density, Higher Temps
II. Top “7” Soldering Errors Engineers Make
Incorrectly-Sized Soldering Tips
Use bottom side heaters
You can do this-BGAs
You can do this QFNs
Proper wicking-don’t pull up pads!
Liquid flux-better wetting, cleaning the soldering area
Get in get out, don’t hang out!
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#1 Tip size selection
As large as possible
without overhanging pad area
no damage to PCB
Apply to maximum mass point of solder joint
Rapid thermal elevation
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#2 -Use bottom side heaters for lead free rework
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StencilQuik™-How Does It Work?
Step 1-Prepare site
Step 3-Squeegee
paste or flux though aperatures
Step 4.Place device & Reflow
Step 2-Place StencilQuik™ into
position
#3 You can do this-Place a BGA
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StencilQuik™-Prototype Shop Value
Proposition
•StencilQuick™ allows developers and technicians to reliably hand place
BGAs when prototyping
•StencilQuick™ acts as a mask for damaged solder mask areas
underneath a BGA eliminating the need to repair damaged mask found
many times on “fast turn around” PCBs
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Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
“Bump” part with one stencil, place “bumped” part into second stencil on board
#4 You can do this-Place a QFN
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Step #1
Align and apply stencil to
device. Roll solder paste
through apertures.
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Step #2
Reflow per solder mfr’s profile
recommendations
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Step #3
Remove stencil and
clean. Surface now is “bumped”
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Inspection of “bumped” device
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Step #4
Prep land area on PCB where device
is to be placed
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
Step #5
Align and adhere board
stencil on PCB. Roll
solder paste into apertures and clean off
residue.
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Step #6
Place “bumped” QFN into stencil
apertures. Feel the
“bumps” fit into the
apertures
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Step #7
Reflow as per solder paste
manufacturers’ profile
recommendations. Perform visual
inspection. Perform X-ray
inspection.
Part Bumping Using a Polyimide Peel-n-Stick Stencil(s)
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Wicking • Soldering station • Proper soldering iron tip • Soldering wick • Cleaning media • Soft brush • Flux paste
#5 Proper Wicking Procedure
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Damaged/Lifted Pads Post Removal
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Damaged/Lifted Pads Post Removal
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Damaged/Lifted Pads Post Removal
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#6 Apply (and clean off) Flux
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#7 Get In, Get Out, Don’t Hang Out!
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Lurking Challenges
0.3mm pitch
Lower temp solders
01005 components