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© 2020 Amkor Technology, Inc. 1 © 2020 Amkor Technology, Inc. 1 John Stone l EVP and Chief Sales Officer September 29, 2020 Trends and Challenges in Semiconductor Advanced Packaging
© 2020 Amkor Technology, Inc. 1© 2020 Amkor Technology, Inc. 1
John Stone l EVP and Chief Sales Officer
September 29, 2020
Trends and Challenges in
Semiconductor Advanced
Packaging
© 2020 Amkor Technology, Inc. 2
Agenda
Amkor Introduction1
Advanced Packaging Trends2
Advanced Packaging Challenges3
© 2020 Amkor Technology, Inc. 3© 2020 Amkor Technology, Inc. 3
Amkor Introduction
© 2020 Amkor Technology, Inc. 4
Amkor by the Numbers
Footprint in
11 countries
11,000,000Square Feet of
Manufacturing Space
30,000Employees
End Markets
Automotive Communications Industrial
Computing Consumer
$475MCapEx*
Founded in
1968$4.1BNet Sales*
*2019 results
© 2020 Amkor Technology, Inc. 5
Amkor in the Supply Chain
SiP
HDFO
2.5D
H.I.Materials EMSWafer Fab
A/T
New OSAT TAM
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Broad Geographic Footprint11 million square feet of manufacturing space
3.9M sf
Japan2.0M sf
Portugal0.5M sf
Amkor Headquarters Sales/Customer Support Center Advanced MainstreamGlobal Principal Entity
Taiwan1.1M sf
Malaysia0.4M sf
Philippines1.3M sf
Singapore
Shanghai1.3M sf
United States
© 2020 Amkor Technology, Inc. 7
▶ 2.3M ft2 on 46 acres
▶ >6,000 employees
▶ R&D Center
▶ Advanced packaging
▶ Green building
Flagship Factory – Incheon Korea
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Advanced Packaging Trends
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Key Growth Catalysts
5G
Mobile Communications
Connected Devices
Automotive
Speed, Streaming
IoT
“Smart Everything”
Connected Home
Wearables
Industrial Automation
Automotive
Autonomous Driving
Infotainment
Electrification
Safety
Networking
Data Center
Analytics
High Performance Computing
Artificial Intelligence
© 2020 Amkor Technology, Inc. 10
Advanced Packaging in Your Smartphone
Requirements
▶ Smaller footprint, minimum height
▶ Wafer level packaging
▶ 3D structures
▶ Multi-die packages
▶ Signal integrity
MEMS
Sensors
Camera
Application
ProcessorTouch Screen
Controller
Transceiver
Peripherals
Memory
SCSPRF-Front
End
SiP
fcCSP
WLCSP
CABGA
MLF®
fcPoP
© 2020 Amkor Technology, Inc. 11
Enabling New Applications in the Car
Environment
▶ Zero defect mindset
▶ High reliability requirements
▶ Reduced time to market
▶ New package configurations
▶ Advanced packaging adoption
Infotainment
Body
Electronics
EV/HEV
ADAS
Powertrain
Chassis
Wirebond PackagesAdvanced Packages
SOIC
QFP
QFN
WLFO
SiP FCBGA
Power
© 2020 Amkor Technology, Inc. 12© 2020 Amkor Technology, Inc. 12
IoT Made Possible
Amkor ships
billions of IoT
devices per
year!
Scale
Power
Bandwidth
Integration
Security
Diverse
Requirements
Connectivity
Sensing
Computing
Storage
Multiple
Applications
© 2020 Amkor Technology, Inc. 13
Big Data Requirements
Data Center
HPC, AI, ML
Thermal Management
FCBGA, HDFO, SiP
Networking
High-Speed Switch
Logic + Memory Integration
SiP, HDFO, 2,5D
StorageSolid State Drive
Memory Die Stacking
Stack CSP, WBBGA, SiP
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Advanced Packaging Challenges
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Advanced Packaging Platforms
WaferLaminate, LF
& WaferLaminate
Laminate or
WaferLaminate
Chip Scale to
Fan-OutMEMS Flip Chip
Heterogeneous
Integration
System in
Package
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MEMS
▶ IoT, wearables & industrial
▷ Sensor fusion
▷ Low power, form factor & cost
▷ System & functional integration⨠ Many die, broad packaging
toolkit required
Laminate, LF
& Wafer
MEMS
© 2020 Amkor Technology, Inc. 17
Amkor’s 3D & 5G Packaging InnovationPackaged Embedded Die: Large complex modular systems
Multi-level
Packaged Embedded Die
Partial Mold with
Partial Shield
Antenna
in Package
Antenna Layer
RFICConnector
Multi-die +
Package Stacking
Compartmental/Conformal
Shield & Dual Side Mold
BB
SWIFT®
Advanced System Integration
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▶ Outstanding engineers
▶ Localized design services
▶ Dedicated assembly lines
▶ Complete toolbox of engineering
services
▶ Continuous innovation
Significant R&D Investment
© 2020 Amkor Technology, Inc. 19
Supply Chain: Globalization to Localization?
Source: “COVID-19 impact – A Yole Perspective”. Yole Développement. www.yole.fr.
Before▶ Global production networks
▶ Global supply chain networks
▶ Minimized stock strategies
▶ Global delivery footprint
▶ Customer-specific variant
▶ Limited risk management
After▶ Localized production networks
▶ Local supply chain networks
▶ Local warehouse and reserve strategies
▶ Build where you sell
▶ Variant reduction
▶ Expect the unexpected
© 2020 Amkor Technology, Inc. 20
▶ Innovation milestones
▷ Multi-sided assemblies
▷ Advanced materials
▷ Electrical microsystems
▷ Extreme density
▶ High capital outlays
▶ Pace of change is accelerating
▶ Time to market is critical
▶ Heterogeneous packaging will
extend Moore’s Law
The Future of Advanced Packaging
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Enabling the Future
amkor.com
© 2020 Amkor Technology, Inc.
