©2018 by System Plus Consulting | Wolfspeed C2M0025120D 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Wolfspeed C2M0025120D1200V SiC MOSFETPOWER report by Elena BARBARINIJanuary 2018 – sample
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 2
Table of Contents
Introduction 4
o Executive Summary
o Reverse Costing Methodology
o Glossary
o SiC Power Device Market
Company Profile 10
o Wolfspeed
o Portfolio
o Supply Chain
Physical Analysis 14
o Summary of the Physical Analysis
o Package analysis
Package Opening
Package Cross-section
o MOSFET Die
MOSFET Die View & Dimensions
MOSFET Delayering & main Blocs
MOSFET Die Process
MOSFET Die Cross-Section
MOSFET Die Process Characteristic
Manufacturing Process 41
o MOSFET Die Front-End Process
o MOSFET Fabrication Unit
o Packaging Process & Fabrication unit
Cost Analysis 49
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o MOSFET die
MOSFET Die Front-End Cost
MOSFET Die Probe Test, Thinning & Dicing
MOSFET Die Wafer Cost
MOSFET Die Cost
o Complete Device
Assembled Components Cost
Summary of the assembling
Component Cost
Selling Price 61
Comparison between 1200V SiC MOSFETs 64
Company services 71
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Wolfspeed C2M0025120D 1200V SiC MOSFET.
The SiC C2M™ Platform is the latest 1200V SiC MOSFET platform, designed by Wolfspeed for high-power applications likerenewable energy, DC/DC converters, and battery charger.
The SiC C2M™ Platform includes a complete family of SiC MOSFETS at 1200V and 1700V and up to 90A of currents, assembledin molded package or sold as bare die.
This report presents a deep analysis of the C2M0025120D device assembled in a TO247 package. And it also includesproduction cost analysis and detailed comparison with Rohm and ST’s SiC MOSFETs and with 1200V silicon IGBTs. Thecomparison highlights differences in the electrical parameters, supply chain and production cost.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 4
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
SiC Power Device market - Projection
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 5
Overview / Introduction
Company Profile & Supply Chain o Wolfspeedo SiC Portfolioo Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Supply Chain
The following supply chain of Wolfspeed is an hypothesis base on public informations.
Wafer Packaging
Design Front End Back end 0Final package, Assembly
Calibration & Final test
Wolfspeed (USA) CREE (USA) CREE (USA) Wolfspeed (USA) Cree (China)
Epitaxy
Die
Substrate
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Package:
o Discrete
o Dimensions: xxx mm xxxxmm xxxxmm
o Number of Pins: 3 pin
o Pitch: xxx
Wire bonding
SiC Die
Cu baseplate
Wolfspeed C2M0025120D©2017 by System Plus Consulting
Summary of the Physical Analysis
MOSFET:
o Dimension: xxx mm2 (xxx)
o Electrical Connection: Aluminumwire bonding
o Placement in the package: solderedon copper lead frame.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Datasheet
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
o The package type is a TO-247-3
o Package size : xxxmm x xxxmm x xxxmm
o Pin pitch : xxxmm
o The package markings include the following markings :
CREE Logo
C2M0025120
W12215
Package Views & Dimensions
Package Front view Package Back view
Reference of component
Packaging made in China
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Package opening
Gate Wire Bonding:
o xxx xxx wire.
o Diameter: xxx µm.
o Medium length: xxxmm
Source Wire Bonding:
o Xxxx wire.
o Diameter: xxx µm.
o Medium length: xxxmm
Package
SiC MOSFET
Package opening
Gate
Drain
Source
Wire bonding EDX Al wire
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Package Cross-Section
Plastic molding
Package cross section
xxx leadframe
xxx mm
xxx mm
EDX Packaging
The packaging is standard plastic molding xxxxxx
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Package Cross-Section
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
MOSFET die Dimensions
MOSFET : Optical view
xxx
µm
o Die dimensions: xxx mm2 (xxxxxxx)
o There is no marking on the die.
xxx µm
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Die cross section
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Die process – line contact
Transistor after delayering – Optical View
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Transistor after delayering – SEM View
Die process
Transistor after delayering – SEM View
• Transistor pitch: xxxx µm
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Transistor cross section – Optical View
xxxx µm
• Die thickness: xxxx µm
Die cross section
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Detail die edge: SEM view
Thick oxideOxide 1
Die cross section
Detail die edge: SEM view
• Polyimide thickness: xxx µm
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Die cross section
Cross-Section SEM view
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Gate Cross-Section
Cross-Section SEM view
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Die designo Die Cross section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Die cross section
Cross-Section SEM view
Cross-Section SEM view
• SiO passivation thickness: xxxµm
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Process flowo Front End Fab Unito Back End Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
0 00 000
0 00 000
MOSFET Process Flow (2/4)
Implantation
• SiO2 deposition
•Pattern SiO2
•P+ source implantation
Field Oxide
• Field Oxide deposition and pattern
Gate oxide
•Thin Gate Oxide growth and pattern
Drawing not to Scale
00 00 000
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Process flowo Front End Fab Unito Back End Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
MOSFET Process Flow (4/4)
Drawing not to Scale
Metalcontact
•Ti and Aluminum deposition, pattern and annealing
Backside
•Backgrinding
•Ti/Ni Backside deposition and annealing
Polyimide
•Polyimide deposition and pattern
0 0 0
0 0 0
00 0 0
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Process flowo Front End Fab Unito Back End Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Description of the Wafer Fabrication Units - MOSFET
In our calculation, we simulate a production unit using xxxmm wafers.
MOSFET wafer fab unit:
Name: Cree RTP
Wafer diameter: 4H SiC xxxmm
Capacity: xxx wafers / month
Year of start: xxx
Most advanced process: xxxx
Products: Discrete/Power - RF transistors, SiC MESFET, GaN-based HEMT MMIC, SiC substrate
Location: xxxxxx
The clean room is supposed to be totally depreciated in xxxx. We estimate a depreciation rate of xxx% for the clean room.
Equipment are supposed to be totally depreciated in xxxx. We estimate a depreciation rate of xxxx% for the equipment. The main part of the equipment are standard and used for the silicon die manufacturing.
For epitaxy process we consider that the machines are new and thus we estimate a depreciation rate of xxxx%.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso MOSFET Wafer Costo MOSFET Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
About System Plus
MOSFET - Yields Hypotheses
In our simulation, we assume a development and a production ramp up without important technical problem.
The Yields are assumed by general information, they could be not precise.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso MOSFET Wafer Costo MOSFET Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
About System Plus
MOSFET Wafer Cost
The epitaxy structure represents xxx% of the cost.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso MOSFET Wafer Costo MOSFET Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
About System Plus
MOSFET Wafer Cost per process steps
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso MOSFET Wafer Costo MOSFET Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
About System Plus
MOSFET Die Cost
The MOSFET die cost ranges from $xxx to $xxx accordingto yield variations.
The Front end manufacturing represents xxxof thecomponent cost, medium yield.
Probe test, dicing and scrap account for xxxof thecomponent cost.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso MOSFET Wafer Costo MOSFET Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Packaging Cost
Packaging
The packaging cost (TO-347) is estimated to xxx percomponent.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso MOSFET Wafer Costo MOSFET Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Component Cost
The component cost ranges from $xxx to $xxx accordingto yield variations.
The MOSFET die manufacturing represents xxxx of thecomponent cost.
The packaging represents xxxx of the component cost.
Final test and yield losses account for xxxx of thecomponent cost.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 30
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Plus
Estimated Manufacturer Price
The component manufacturing cost rangesfrom $xxx to $xxx according to yield variations.
With a gross margin estimated to 30%, thecomponent selling price ranges from $xxx to$xxx according to yield variations.
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 31
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparisono ST, Cree and Rohm
1200V SiC MOSFETo 1200V Si IGBT Vs SiC
MOSFET
About System Plus
Comparison between ST, Cree and Rohm 1200V SiC MOSFET
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 32
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparisono ST, Cree and Rohm
1200V SiC MOSFETo 1200V Si IGBT Vs SiC
MOSFET
About System Plus
Comparison between ST, Cree and Rohm 1200V SiC MOSFET
©2018 by System Plus Consulting | Wolfspeed C2M0025120D 33
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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Overview / Introduction
Company Profile & Supply Chain
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Cost Analysis
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Feedbacks
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Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
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Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
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