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X-Strata980

Rapid, non-destructive coating thicknessmeasurement and elemental analysis

Robust/Easy to Use/Total Reliability

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X-Strata980: Improving quality and process control

X-Strata980 X-Strata980

Electronics Metal Finishing Compliance Testing Alternative Energy

Electrical and electronic components

Increase productivity with better process control

Component reliability assurance Simultaneous solder alloy composition

and thickness measurement

Lifetime product assurance throughoptimised quality control

Analysis of gold and palladium

thickness of electrical contacts

Coating thickness of NiP layer on

computer hard disc

Analysis of very thin coatings(e.g. Au/Pd coatings of < 0.1 m)

Metal Finishing

Minimise production cost of the plating

process and maximise production output

Speed and simplicity of analysis Simultaneous single or multi elements

coating thickness analysis and coating

composition

Analysis of up to 4 layers (plus substrate)

Plating bath analysis

Metal Alloy

Metal alloy composition

and identification

Rapid, non-destructive analysis of

jewellery and other alloys

Precious metal alloy assay Karat analysis Material identification Quantification of impurities

RoHS/WEEE/ELV*

compliance testing

Improve quality control to ensure

products meet specifications

Determination of hazardoussubstances from parts per million

to high percent levels

Quantification of toxic elementse.g. Cd, Hg, Pb etc. to verify

compliance

* Restriction of Hazardous Substances/

Waste Electrical and Electronics

Equipment/End of Life vehicles (directives)

Solar panels and fuel cells

Ensure product efficiency and

uniformity

Composition analysis of thethin-film absorber layer

(e.g. CIS, CIGS, CdTe) in

thin-film photovoltaic cells

Optimise electricalconductivity through layer

thickness analysis

Solderability

ElectricalContact

Surface Finish

CorrosionResistance

Wear/HeatResistance

CosmeticFinish

HazardousMaterials

High Reliability

Assay and ID Photovoltaic Cells

Au

Ni

Cu

Epoxy

Ag

Cu

Epoxy

Au

Ni

Cu-alloy

Au/Ag

PdNi

Ni

CuNi

Cu

NiP

Al

ZnFe

Fe

Cr

Zn

Fe

NiP

Fe

TiN

Tool-steel

TiAlN

W-carbide

Cr

Fe

ZrCN

Brass

Cr

Ni

Cu

Al

AuCuCd

Ni

Cu

ppm Pbppm Hgppm Cdppm Crppm Br ppm Pb

Au

Ni

Cu

SnPb

Ni

Cu

Au

NiPPb

Cu

% Au% Ni% Cu% Zn

% Cr% Fe% Ni% Mo

% Au% Ag% Cu% Zn

% Cu% In% Ga% Se

% Cu% In% Ga

% Cd% Te

Glass Ceramic Glass

Mo

SAC

Ni

Ag

Ceramic

Top layer:SAC (SnAgCu) alloycomposition andcoating thickness

Second layer:Ni coating thickness

Third layer:Ag coating thickness

Fourth layer:Substrate

Ni

Ag

Ceramic

SAC

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ro-XRF Analysis As easy as... Comprehensive analysis

ta980 X-Stra

Non-destructive analysis: no sample preparation Easysample introduction/presentation: large door Safeand secure operation: closed chamber Sample chamber size: 580mm x 510mm x230mm wdh

ce samples in large analysis chamber

No operator-to-operator resultsvariability:point- and-click laser focus

Clear, pin-point analysis: high-resolution colourvideo camera with high magnification

Unattended operation: single or multiple analysisusing the programmable XY stage and Z axis

Simple and quick m ulti-point analysis:customer pre-defined analysispatterns

ptimise camera focus at the click of a button

Resultsdisplayed within seconds Rapid compliance assessment: user-defined

colour-coded Pass/Failresults

Save, print or send results Pre-defined or customised reportsfor totalflexibility

ess Go

Rugged and robust design:

Fastand precise analysis:high sensitivitywithOxford Instruments 100 WX-ray tube

Simple identification and differentiation ofelements:high resolution, Peltier-cooled silicon

PINdetector

Optimised performance acrossa wide rangeofelements: multiple primarybeam filters

Measure samplesassmall as 150 m in size:multiple collimators

Low limitsof detection, even in matricessuch asplastics:Oxford Instruments unique

low-background measurement plate

Samplescanbe measuredatvariablefocal distances(0.5to4 inches):methodssetup forsampleshape andsize

Distance independent measurement: with thisoption,one universalcalibration isused to measureirregular-

shapesamples, regardlessof focal distance (measurable

range 0.5 to 4 inches)

Quick,precisesamplealignmentwithAutoRangeFinder(ARF)

Simple calibration setup for optimised elemental compositionand thickness analysis

Focusin

ut

Results

Stand-alone spectrometer:onlyone mainsplug needed

Compactwo rkstation:excellent ergonomicsand smallfootprint

Operationinalaborby theproductionline

Sturdy, industrial design

Outstanding precision, accuracy,

and long-term stability:

Analysis of large, oddly-shaped samples

4

C U C L LI U

C I LL

L

Advanced Data Export Option

Complete statisticaldata function including average,standard deviation, histogramsand controlcharts

Real-time data export or export to Microsoft Excel TMfor rapid statisticalreport generation

Shortcut keysallow user to choose correct calibrationfor a particular sample with oneclick

User interface availablein nine languages

Sample mapping for identification of problem areas on sample

Flexible results reports:

Analysequalitativelythesample areaof interest in onemeasurement cycleusing theMapping function Generate an imageof the samplewith superimposed element maps Using thecolour-coded element maps, identifythe problem area(s) on thesample Carryout a full quantitative analysisof the areato confirm non-compliance

Select the best analytical method for

your application:

Whenfewor nostandardsareavailable,FundamentalParameters(FP) methodsprovidereliablequantitativeresults.

Theseusea comprehensivespectrumdatabase,andcover a

widerangeofconcentrationsandthicknesses.Itonly takesa

fewminutestosetupa workingmethod

Whenstandardsmatchingyoursamples(i.e.matrix,analytes,rangeofconcentrations)areavailable,empiricalcalibrations

providethebestaccuracy.Thereagain,theintuitive,step-

by-stepmethodbrowserenablesusersto developtheirown

calibrationmethodsafterminimumtraining)

Cu

Pb

Br

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