Xiamen Bolion Tech. Co., Ltdprokcssmedia.blob.core.windows.net/sys-master... · 2 •Main Product 3...

Xiamen Bolion Tech. Co., Ltd Professional Flexible Printed Circuit Manufacturer

No.198,Houxiang Road, Haicang District, Xiamen, Fujian, China [email protected] www.flexfpc.com +86-0592-6207-953

ISO/TS-16949 ISO-13485 ISO-9001 ISO-14001 UL:E228871



• About us 1

• Main Product 2

• In-House Processes 3

• Capacity Data 4

• Welcome 5



About us

Shanghai Office

Shenzhen Office

Xiamen Factory

One of first 6 special economic zones in China,1980. One of first 3 free trade areas in Fujian province,2015. 3.5 hr. to Shenzhen / 6.5 hr. to Shanghai by train.

Based in Xiamen City, Fujian province, CHINA



About us

2003

2008

2009

2014

2020 •Plans for Construction of New Plant

Production of new plant will begin in the year 2020.

•ISO 13485 / New Sales Record

Passed ISO13485 and reached a new sales record

of $15 M.

•TS16949 / New ERP system

Passed ISO/TS16949 for production of FPC for Automotive applications and started a

new ERP system to track company operations.

•Founded as “New Flex / 厦门市新福莱克斯有限公司”

Started our FPC business with 20 employees.

•24,000 sq. m new plant / ISO 9001,14001

After increased consumer electronics sales, our workforce grew to 350 employees and

we completed the production of our main plant in Haicang economic zone.



About us

AA- Credit Grade CPCA

National enterprise brand High-tech enterprise award



Annual Sales

0

2

4

6

8

10

12

14

16

2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015

2

4

6

9 9 8

10

12 11

13

14 15 15

0.2 0.4 0.6 0.8 1.3 1.6

2.0 2.6 2.9

3.3 3.7 4.0 4.0

0.2 0.2 0.2 0.2 0.5 0.3 0.4 0.6 0.3 0.4 0.4 0.4 0.4

Sales Fix-assets R&DMillion USD



Annual turnover

Production Category Types

Customer Market Segment

70% S/D layer

20% Rigid Flex

10% Multilayer Flex

50% Medical Devices

20% Automotive

10% Consumer

5% Wearable Tech

15% Aerospace/ Military



Certifications

ISO 9001 2008

ISO/TS 16949

ISO 14001

UL E228871

ISO 13485



ISO 13485

Audited and qualified supplier



ISO/TS 16949

Audited and qualified supplier (VDA 6.3)



• About us 1

• Main Product 2


• Capacity Data 4

• Welcome 5


Main Products

Main

Product

Single Layer Flex Double Layer Flex

Multilayer Flex Rigid-Flex



Main Products

Single-layer Flex

Unsupported fingers Finger sculpture

Single side Double across

Double-layer Flex Multilayers

Rigid-Flex



Main Products

ENIG

Tin Plating

Hard gold plating

Immersion Tin

Gold plating

Solder mask



Main Products

Black shield layer

Ag ink shield layer

Silver shield layer

Carbon shield layer

FR4 stiffener with curd adhesive

PI belt

LED flexible strip

Kapton coil heater



Main Products

Black PI cover layer

White PI Cover layer

Ag ink circuit

Nickel coil circuit

2 OZ copper circuit

Transparent PET FLEX

PET FLEX



• About us 1

• Main Product 2


• Capacity Data 4

• Welcome 5



Full in-house production

Prompt lead time Dependable quality Competitive price



Equipment show

Drilling & Routing

AOI


http://photo.blog.sina.com.cn/photo/71d028d6x9a42a7f84037#pic


Equipment show

Film plotter Exposure

D.E.S. and Lamination



Equipment show

Plasma & P.T.H. line

Testing and Measurement



• About us 1

• Main Product 2

• In-Housing Process 3

• Capacity Data 4

• Welcome 5



Capability – Technical data

Description Standard Special

Min. Line 0.07mm 0.05mm

Min. Spacing 0.07mm 0.05mm

Min. Hole Size φ 0.15mm φ 0.1mm

Outline tolerance +/- 0.1mm +/-0.05mm

Panel Size 250mm X 340mm 550mm X 630mm

Impedance Control +/- 10%

Max Layer Capability 12 layers

Aspect Ratio

2:1 (min φ0.1mm)

5:1 (min φ0.2mm)

8:1 (min φ0.3mm)

Monthly Production 16,000 m²



Capability – Lead time

Description Prototyping Mass Production

Single-Side FPC 2-4 days 6-7 days

Double-Side FPC 3-5 days 7-9 days

Multilayer FPC 4-6 days 8-10 days

Rigid-Flex PCB 5-8 days 10-12 days

*Working days



Capability-Surface treatment

Surface Treatment Thickness

Gold Plating Ni:3-9um; Au: 0.03-0.09um

ENIG Ni:3-9um; Au: 0.03-0.09um

Hard Gold Plating Ni:3-9um; Au:0.1-0.3um

Tin Plating Sn: 3-7um

Immersion Tin

OSP



Capability – Material

Material

Base film Polyimide (0.5mil、1mil、2mil) ,Polyester(0.5mil、1mil、 )

Conductive Material

Copper Foil( 1/3 OZ、1/2 OZ、1 OZ、2 OZ )

Constantan

Sliver Ink

Carbon Ink

Adhesive Epoxy、Acrylic、Adhesiveness

Insulating Material

Polyimide (0.5mil、1mil、2mil) (Yellow、White、Black)

Polyester (1 mil 、2 mil)

Solder Mask (Green、Yellow、Black……)

PSA 3M467、3M468、3M9077、TESA8853……

Stiffener PI、FR4、PET、Steel、Aluminum……



Main Material Partners

Polyimide film Polyester film Copper foil

PSA Adhesives Stiffeners Solder mask ink AGCL ink ……

Polyester supplier

Solder mask ink supplier Solder mask ink supplier


http://www.3m.com/

http://www.dupont.com/products-and-services/membranes-films/polyimide-films/brands/kapton-polyimide-film.html

http://www.dupont.com/products-and-services/membranes-films/polyimide-films/brands/kapton-polyimide-film.html

http://www.taiflex.com.tw/html/index.php

http://www.jjflex.com.cn/index.php?lang=en

http://www.nichieikako.co.jp/index.html

http://www.aemg.com.tw/index_e.php

http://www.conductivecompounds.com/index.html

http://www.henkel.com/

http://www.taiyoink.com.tw/index.html

http://www.szrd.com/


Thank you, we welcome you to visit our company !


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