01/06/2017 V5.01
Features:> High brightness surface mount LED.> Based on InGaN technology.> 120° viewing angle.> Small package outline (LxWxH) of 3.2 x 2.8 x 1.8mm.> Qualified according to JEDEC moisture sensitivity Level 2.> Compatible to IR reflow soldering.> Environmental friendly; RoHS compliance.> Compliance to automotive standard; AEC-Q101.
DomiLEDWith the intense colors that seem to glow with energy and its significant brightness, DomiLED white LED is a highly reliable design device. Its dynamic nature makes it perfect choice for lighthing applications, office and home applications and standard industrial applications.
DATA SHEET:
DomiLEDInGaN White : DDW-CJG-I1
© 2005 DomiLED is a trademark of DOMINANT Opto Technologies.All rights reserved. Product specifications are subject to change without notice.
Applications:> Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc.> Consumer appliances: LCD illumination as in PDAs, LCD TV.> Communication: mobile phone flash light, backlights in mobile phone display.> Display: full color display video notice board.> Industry: general lighting
DOMINANTOpto TechnologiesInnovating Illumination
TM
01/06/2017 V5.02
InGaN White: DDW-CJG-I1
Part OrderingNumber
Color ViewingAngle˚
Luminous Intensity @ 10mA IV (mcd) Appx 1.1
DDW-CJG-QR2-1-I1 White 120 112.5
Vr @ Ir = 10 µA
Electrical Characteristics at Ta=250CVf @ If =10 mA Appx 3.1
3.2 5.0
Part NumberMin. (V) Typ. (V) Max. (V) Min. (V)
DDW-CJG 2.7 3.8
Unit
Absolute Maximum RatingsMaximum Value
DC forward current
Peak pulse current; (tp ≤ 10µs, Duty cycle = 0.005)
Reverse voltage
ESD threshold (HBM)
LED junction temperature
Operating temperature
Storage temperature
Power dissipation (at room temperature)
Thermal resistance- Junction / ambient, Rth JA- Junction / solder point, Rth JS(Mounting on FR4 PCB, pad size >= 16 mm2 per pad)
20
200
5
2000
125
-40 … +100
-40 … +100
85
340180
mA
mA
V
V
˚C
˚C
˚C
mW
K/WK/W
DOMINANTOpto TechnologiesInnovating Illumination
TM
Optical Characteristics at Tj=250C
Min. Typ. Max.
71.5 180.0
01/06/2017 V5.03
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
CharacteristicsSymbol Part Number Value Unit
Temperature coefficient of VF (typ)IF = 10mA; 0 ˚C <= T <= 100˚C
Temperature coefficient of IV (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
Temperature coefficient of Cx (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
Temperature coefficient of Cy (typ)IF = 10mA; 0 ˚C <= T <= 100 ˚C
TCV
TCIV
TCCx
TCCy
DDW-CJG
DDW-CJG
DDW-CJG
DDW-CJG
-5.2
-0.19
-0.0002
0.00006
mV / K
% / K
InGaN White: DDW-CJG-I1
01/06/2017 V5.04
DOMINANTOpto TechnologiesInnovating Illumination
TM
DDW, Color Grouping Appx 2.1
Color Bin Structure
Bin0.29600.25900.291
0.26800.30450.27150.30050.28250.32880.30810.32880.32820.33860.32350.33860.34260.31000.29700.30700.31200.31970.31310.31890.33020.34840.33880.34840.3571
CxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCyCxCy
0.29100.26800.28500.27900.30050.28250.29600.29550.32880.32820.32880.34530.33860.34260.33860.35910.31970.31310.31890.33020.32880.32820.32880.34520.34840.35710.34840.3730
0.30050.28250.29600.29550.31000.29700.30700.31200.33860.34260.33860.35910.34840.35710.34840.37300.32050.29560.31970.31310.32880.30810.32880.32820.35820.37150.35820.3792
0.30450.27150.30050.28250.31300.28400.31000.29700.33860.32350.33860.34260.34840.33880.34840.35710.31300.28400.31000.29700.32050.29560.31970.31310.35820.35420.35820.3715
1 2 3 4
JK
JL
KK
KL
NK
NL
OK
OL
LK
LL
MK
ML
PK
PL
150 InGaN White: NAW-BHG
26/12/2012 V4.04
NAW-BHG, White Color Grouping
Chromaticity coordinate groups are measured with an accuracy of ± 0.01.
Bin
JK
JL
KK
KL
NK
NL
OK
OL
LK
LL
MK
ML
0.29600.25900.291
0.26800.30450.27150.30050.28250.32880.30810.32880.32820.33860.32350.33860.34260.31000.29700.30700.31200.31970.31310.31890.3302
Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy
0.29100.26800.28500.27900.30050.28250.29600.29550.32880.32820.32880.34530.33860.34260.33860.35910.31970.31310.31890.33020.32880.32820.32880.3452
0.30050.28250.29600.29550.31000.29700.30700.31200.33860.34260.33860.35910.34840.35710.34840.37300.32050.29560.31970.31310.32880.30810.32880.3282
0.30450.27150.30050.28250.31300.28400.31000.29700.33860.32350.33860.34260.34840.33880.34840.35710.31300.28400.31000.29700.32050.29560.31970.3131
1 2 3 4
White Bin Structure
DOMINANTOpto TechnologiesInnovating Illumination
TM
0.2300
0.2400
0.2500
0.2600
0.2700
0.2800
0.2900
0.3000
0.3100
0.3200
0.3300
0.3400
0.3500
0.3600
0.3700
0.3800
0.3900
0.2700 0.2800 0.2900 0.3000 0.3100 0.3200 0.3300 0.3400 0.3500 0.3600 0.3700
JL
JK
KL
KK
LL
LK
NK
NL
OL
ML
PL
PK
OK
MK
01/06/2017 V5.05
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
Q1Q2R1R2
71.5 ... 90.090.0 ... 112.5
112.5 ... 140.0140.0 ... 180.0
Brightness Group Luminous Intensity (mcd) Appx 1.1
Luminous Intensity Group at Tj=25˚C
Forward Voltage (V) Appx 3.1
Vf Bining (Optional)Vf Bin @ 10 mA
0A
00
01
02
03
2.45 ... 2.75
2.75 ... 3.05
3.05 ... 3.35
3.35 ... 3.65
3.65 ... 3.95
Please consult sales and marketing for special part number to incorporate Vf bining.
01/06/2017 V5.06
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
Forward Current, mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
AFo
rwar
d C
urre
nt, m
ARelative Intensity Vs Forward Current Forward Current Vs Forward Voltage
Maximum Current Vs Ambient Temperature Relative Intensity Vs Wavelength
Forward Current, mA Forward Voltage, V
Ambient Temperature Wavelength, nm
Forw
ard
Cur
rent
, mA
Rel
ativ
e In
tens
ity
16/10/2015 V4.06
InGaN White: DDW-CJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
DOMINANTOpto TechnologiesInnovating Illumination
TM
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 5 10 15 20 25 30 35 40 45 50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
DDW-CJG-RS2-A
≤
10
100
1000
0.1 1 10 100
All
ow
ab
le F
orw
ard
Cu
rre
nt
( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )
Forward Current, mA
0.0000
0.0100
0.0200
0.0300
0.0400
�C X
,����C
Y
Chromaticity Coordinate Shift
Delta CX
Delta CYCy
-0.0400
-0.0300
-0.0200
-0.0100
0 5 10 15 20
�
Forward current (mA)
Cx
16/10/2015 V4.06
InGaN White: DDW-CJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
DOMINANTOpto TechnologiesInnovating Illumination
TM
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 5 10 15 20 25 30 35 40 45 50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
DDW-CJG-RS2-A
≤
10
100
1000
0.1 1 10 100
All
ow
ab
le F
orw
ard
Cu
rre
nt
( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )
Forward Current, mA
0.0000
0.0100
0.0200
0.0300
0.0400
�C X
,����C
Y
Chromaticity Coordinate Shift
Delta CX
Delta CYCy
-0.0400
-0.0300
-0.0200
-0.0100
0 5 10 15 20
�
Forward current (mA)
Cx
16/10/2015 V4.06
InGaN White: DDW-CJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
DOMINANTOpto TechnologiesInnovating Illumination
TM
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 5 10 15 20 25 30 35 40 45 50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
DDW-CJG-RS2-A
≤
10
100
1000
0.1 1 10 100
All
ow
ab
le F
orw
ard
Cu
rre
nt
( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )
Forward Current, mA
0.0000
0.0100
0.0200
0.0300
0.0400
�C X
,����C
Y
Chromaticity Coordinate Shift
Delta CX
Delta CYCy
-0.0400
-0.0300
-0.0200
-0.0100
0 5 10 15 20
�
Forward current (mA)
Cx
16/10/2015 V4.06
InGaN White: DDW-CJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
DOMINANTOpto TechnologiesInnovating Illumination
TM
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 5 10 15 20 25 30 35 40 45 50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
DDW-CJG-RS2-A
≤
10
100
1000
0.1 1 10 100
All
ow
ab
le F
orw
ard
Cu
rre
nt
( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )
Forward Current, mA
0.0000
0.0100
0.0200
0.0300
0.0400
�C X
,����C
Y
Chromaticity Coordinate Shift
Delta CX
Delta CYCy
-0.0400
-0.0300
-0.0200
-0.0100
0 5 10 15 20
�
Forward current (mA)
Cx
16/10/2015 V4.06
InGaN White: DDW-CJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
DOMINANTOpto TechnologiesInnovating Illumination
TM
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 5 10 15 20 25 30 35 40 45 50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
DDW-CJG-RS2-A
≤
10
100
1000
0.1 1 10 100
All
ow
ab
le F
orw
ard
Cu
rre
nt
( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )
Forward Current, mA
0.0000
0.0100
0.0200
0.0300
0.0400
�C X
,����C
Y
Chromaticity Coordinate Shift
Delta CX
Delta CYCy
-0.0400
-0.0300
-0.0200
-0.0100
0 5 10 15 20
�
Forward current (mA)
Cx
16/10/2015 V4.06
InGaN White: DDW-CJG-I1
Relative Luminous Intensity Vs Forward Current
Forward Current, mA
Rel
ativ
e In
tens
ity
0 10 20 30 40 50
0
0.4
0.8
1.2
1.6
2
2.4
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
, mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient temperature
Forw
ard
Cur
rent
, If
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs. Wavelength
Wavelength, nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
DOMINANTOpto TechnologiesInnovating Illumination
TM
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 20m
ARelative Intensity Vs Forward Current
Forward Current; mA
Rel
ativ
e In
tens
ity; N
orm
aliz
ed a
t 10m
A
0 5 10 15 20 25 30 35 40 45 50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Current Vs Forward Voltage
Forward Voltage, V
Forw
ard
Cur
rent
; mA
2 2.5 3 3.5 4
0
10
20
30
40
50
Maximum Current Vs Ambient Temperature
Ambient Temperature
Forw
ard
Cur
rent
; mA
0 10 20 30 40 50 60 70 80 90 100
5
10
15
20
25
Relative Intensity Vs Wavelength
Wavelength; nm
Rel
ativ
e In
tens
ity
400 450 500 550 600 650 700 750 800
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp≤10uS )
Allo
wab
le F
orw
ard
Cur
rent
( m
A )
Duty Ratio, %
Chromaticity Coordinate Shift
ΔC
X ,
Δ C
Y
DDW-CJG-RS2-A
≤
10
100
1000
0.1 1 10 100
All
ow
ab
le F
orw
ard
Cu
rre
nt
( m
A )
Duty Ratio, %
Allowable Forward Current Vs Duty Ratio ( Ta=25 Deg C, tp 10uS )
Forward Current, mA
0.0000
0.0100
0.0200
0.0300
0.0400
�C X
,����C
Y
Chromaticity Coordinate Shift
Delta CX
Delta CYCy
-0.0400
-0.0300
-0.0200
-0.0100
0 5 10 15 20
�
Forward current (mA)
Cx
Radiation Pattern
01/06/2017 V5.07
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
08/12/2016 V7.09
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
Radiation Pattern
Junction Temperature Tj(°C)
Rela
tive
Forw
ard
Volta
ge ∆
V F (V)
Junction Temperature Tj(°C)
Rela
tive
Lum
inou
s In
tens
ity I re
l
Relative Luminous Intensity Vs Junction TemperatureIV/IV(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C)
∆Cx
, ∆Cy
Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA
0.270°
90°
80°
0
60°
50°
40°
30° 20°
0.6
0.4
1.0
0.8
10° 0°
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 1300.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130
Rela
tive
Forw
ard
Volta
ge ∆
V F (V
)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA
Rela
tive
Lum
inou
s In
tens
ity I r
el
-0.5
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-50 -30 -10 10 30 50 70 90 110 1300.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -30 -10 10 30 50 70 90 110 130
Rela
tive
Forw
ard
Volta
ge ∆
V F (V
)
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
Relative Luminous Intensity Vs Junction TemperatureIV /IV (25°C) = f(Tj); IV = 20mA
Rela
tive
Lum
inou
s In
tens
ity I r
el
Relative Forward Voltage Vs Junction Temperature∆VF = VF - VF(25°C) = f(Tj); IF =20mA
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
-50 -30 -10 10 30 50 70 90 110 130
∆Cx
∆Cy
-0.030
-0.025
-0.020
-0.015
-0.010
-0.005
0.000
0.005
0.010
0.015
0.020
0.025
0.030
-50 -30 -10 10 30 50 70 90 110 130
Rela
tive
Wav
elen
gth ∆λ
dom
(nm
)
Relative Wavelength Vs Junction Temperature∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA
∆Cx,
∆Cy
Chromaticity Coordinate Shift Vs Junction Temperature∆Cx, ∆Cy = f(Tj); IF = 20mA
Junction Temperature Tj(°C) Junction Temperature Tj(°C)
InGaN White: DDW-CJG-I1
01/06/2017 V5.08
DomiLED • InGaN White: DDW-CJG-I1 Package Outlines
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: Package is Pb-free.
Materials
Lead Frame
Housing
Encapsulant
Lead-finishing
Materials
Copper alloy
High temperature resistant plastic, PPA
Silicone resin
Pure tin plating, Sn
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
01/06/2017 V5.09
InGaN White: DDW-CJG-I1
Recommended Solder Pad
DOMINANTOpto TechnologiesInnovating Illumination
TM
08/12/2016 V7.011
InGaN Warm White: DDF-LJG
Recommended Solder Pad
DOMINANTOpto TechnologiesInnovating Illumination
TM
01/06/2017 V5.010
Taping and orientation
• Reels come in quantity of 2000 units.• Reel diameter is 180 mm.
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
08/12/2016 V7.012
Taping and orientation
• Reels come in quantity of 2000 units.• Reel diameter is 180 mm.
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
14/06/2016 V3.08
PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone Resin
Au Plating
Note: This product is Pb free
180 InGaN White: MBWW-KZHGDOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
12/10/
2016 V
3.07
Prima
xPlus
• 350
InGaN
Yellow
: MAZ
Y-YZH
G Pack
age Ou
tlines
Materi
al
Materi
al
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Au P
lating
High T
emper
ature R
esista
nt Plas
tic
Silicon
e
Au Pla
ting
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Note:
This p
roduct
is Pb
free
350 InG
aN Ye
llow: M
AZY-Y
ZHG
Note :
Prima
ry ther
mal pa
th is th
rough
Cathod
e lead
of LED
packa
ge.
DOMI
NANT
Opto
Techn
ologie
s
09/05/
14 Prim
axPlus
350 InG
aN Wh
ite MA
W-YZ
HG -pv
3.docx
Pag
e 1 of 9
PRELIM
INARY
UNDER
DEVELO
PMENT
Engine
ering r
eferen
ce dat
a are n
ot verif
ied. Th
e spec
ificatio
ns are
subje
ct to
change
witho
ut notic
e.
Sup
er high
bright
ness s
urface
mount
LED f
or auto
motive
applic
ations.
120
view
ing an
gle.
Co
mpact
packa
ge out
line (Lx
W) of
3.7 x 3
.5 mm.
Ultr
a low h
eight p
rofile –
0.8 mm
.
Low
therma
l resist
ance;
Sup
erior co
rrosio
n robus
tness.
Co
mpatib
le to IR
reflow
solde
ring.
Prima
xPlus
350mA
White:
MAW-Y
ZHG 31/
05/201
3 V1.0
7
Prima
x • 175
InGaN
White:
MBWW
-FSC P
ackage
Outlin
es
Materi
al
Mater
ial
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic
Silicon
e Resi
n
Ag Pla
ting
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Note:
This p
roduct
is Pb
free
175 InG
aN Wh
ite: MB
WW-FS
C
18/04/
2016 V
1.08
Prima
xPlus
100 InG
aN Wh
ite: PQ
W-SS
G Pack
age Ou
tlines
InGaN
White:
PQW-
SSG
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Materi
al
Mater
ial
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic
Silicon
e Resi
n
Sn Pla
ting
Note:
This p
roduct
is Pb
free
DOMI
NANT
Opto
Techn
ologie
s
24/09/
13 Prim
axPlus
100 InG
aN Wa
rm Wh
ite MA
F-PSC
-pv3.d
ocx
Page 1
of 14
PRELIM
INARY
UNDER
DEVELO
PMENT
Engine
ering r
eferen
ce dat
a are n
ot verif
ied. Th
e spec
ificatio
ns are
subje
ct to
change
witho
ut notic
e.
Sup
er high
bright
ness s
urface
mount
LED.
120
view
ing an
gle.
Co
mpact
packa
ge out
line (Lx
W) of
3.7 x 3
.5 mm.
Ultr
a low h
eight p
rofile –
0.8 mm
.
Low
therma
l resist
ance.
Co
mpatib
le to IR
reflow
solde
ring.
Prima
xPlus
100mA
Warm
White:
MAF-P
SC
Note :
Prima
ry ther
mal pa
th is th
rough
Catho
de lea
d of LE
D pack
age
InGaN
Warm
White:
DDF-L
JG
08/12/
2016 V
7.010
Domi
LED •
InGaN
Warm
White:
DDF-L
JG Pa
ckage
Outlin
es
Materi
al
Materi
al
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic, PP
A
Silicon
e Resi
n
Sn-Sn
Plating
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Note :
Prima
ry ther
mal pa
th is th
rough
Cathod
e lead
of LED
packa
ge.
07/07/
2011 V
4.06
SPNo
vaTM • In
GaN W
hite : N
PW-RS
Z Pack
age Ou
tlines
InGaN
White
: NPW
-RSZ
Materi
al
Mater
ial
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic, PP
A
Silicon
e Resi
n
Sn-Sn
Plating
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
07/07/2011 V4.0
6
SPNova
TM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating Illumination TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/
2016 V
3.07
Prima
xPlus
• 350
InGaN
Yellow
: MAZ
Y-YZH
G Pack
age Ou
tlines
Materi
al
Materi
al
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Au P
lating
High T
emper
ature R
esista
nt Plas
tic
Silicon
e
Au Pla
ting
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Note:
This p
roduct
is Pb
free
350 InG
aN Ye
llow: M
AZY-Y
ZHG
Note :
Prima
ry ther
mal pa
th is th
rough
Cathod
e lead
of LED
packa
ge.
DOMI
NANT
Opto
Techn
ologie
s
09/05/
14 Prim
axPlus
350 InG
aN Wh
ite MA
W-YZ
HG -pv
3.docx
Pag
e 1 of 9
PRELIM
INARY
UNDER
DEVELO
PMENT
Engine
ering r
eferen
ce dat
a are n
ot verif
ied. Th
e spec
ificatio
ns are
subje
ct to
change
witho
ut notic
e.
Sup
er high
bright
ness s
urface
mount
LED f
or auto
motive
applic
ations.
120
view
ing an
gle.
Co
mpact
packa
ge out
line (Lx
W) of
3.7 x 3
.5 mm.
Ultr
a low h
eight p
rofile –
0.8 mm
.
Low
therma
l resist
ance;
Sup
erior co
rrosio
n robus
tness.
Co
mpatib
le to IR
reflow
solde
ring.
Prima
xPlus
350mA
White:
MAW-Y
ZHG 31/
05/201
3 V1.0
7
Prima
x • 175
InGaN
White:
MBWW
-FSC P
ackage
Outlin
es
Materi
al
Mater
ial
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic
Silicon
e Resi
n
Ag Pla
ting
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Note:
This p
roduct
is Pb
free
175 InG
aN Wh
ite: MB
WW-FS
C
18/04/
2016 V
1.08
Prima
xPlus
100 InG
aN Wh
ite: PQ
W-SS
G Pack
age Ou
tlines
InGaN
White:
PQW-
SSG
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Materi
al
Mater
ial
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic
Silicon
e Resi
n
Sn Pla
ting
Note:
This p
roduct
is Pb
free
DOMI
NANT
Opto
Techn
ologie
s
24/09/
13 Prim
axPlus
100 InG
aN Wa
rm Wh
ite MA
F-PSC
-pv3.d
ocx
Page 1
of 14
PRELIM
INARY
UNDER
DEVELO
PMENT
Engine
ering r
eferen
ce dat
a are n
ot verif
ied. Th
e spec
ificatio
ns are
subje
ct to
change
witho
ut notic
e.
Sup
er high
bright
ness s
urface
mount
LED.
120
view
ing an
gle.
Co
mpact
packa
ge out
line (Lx
W) of
3.7 x 3
.5 mm.
Ultr
a low h
eight p
rofile –
0.8 mm
.
Low
therma
l resist
ance.
Co
mpatib
le to IR
reflow
solde
ring.
Prima
xPlus
100mA
Warm
White:
MAF-P
SC
Note :
Prima
ry ther
mal pa
th is th
rough
Catho
de lea
d of LE
D pack
age
InGaN
Warm
White:
DDF-L
JG
08/12/
2016 V
7.010
Domi
LED •
InGaN
Warm
White:
DDF-L
JG Pa
ckage
Outlin
es
Materi
al
Materi
al
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic, PP
A
Silicon
e Resi
n
Sn-Sn
Plating
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
Note :
Prima
ry ther
mal pa
th is th
rough
Cathod
e lead
of LED
packa
ge.
07/07/
2011 V
4.06
SPNo
vaTM • In
GaN W
hite : N
PW-RS
Z Pack
age Ou
tlines
InGaN
White
: NPW
-RSZ
Materi
al
Mater
ial
Lead-fr
ame
Packa
ge
Encap
sulant
Solde
ring Le
ads
Cu All
oy Wit
h Ag P
lating
High T
emper
ature R
esista
nt Plas
tic, PP
A
Silicon
e Resi
n
Sn-Sn
Plating
DOMI
NANT
Opto T
echnol
ogies
Innova
ting Il
lumina
tionTM
07/07/2011 V4.0
6
SPNova
TM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant
Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANT
Opto Technologies
Innovating Illumination TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
12/10/2016 V3.07
PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Au Plating
High Temperature Resistant Plastic
Silicone
Au Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
350 InGaN Yellow: MAZY-YZHG
Note : Primary thermal path is through Cathode lead of LED package.
DOMINANT Opto Technologies
09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED for automotive applications.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance;
Superior corrosion robustness.
Compatible to IR reflow soldering.
PrimaxPlus 350mA White: MAW-YZHG
31/05/2013 V1.07
Primax • 175 InGaN White: MBWW-FSC Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Ag Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note: This product is Pb free
175 InGaN White: MBWW-FSC
18/04/2016 V1.08
PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines
InGaN White: PQW-SSGDOMINANTOpto TechnologiesInnovating Illumination
TM
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic
Silicone Resin
Sn Plating
Note: This product is Pb free
DOMINANT Opto Technologies
24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14
PRELIMINARY UNDER DEVELOPMENT
Engineering reference data are not verified. The specifications are subject to change without notice.
Super high brightness surface mount LED.
120 viewing angle.
Compact package outline (LxW) of 3.7 x 3.5 mm.
Ultra low height profile – 0.8 mm.
Low thermal resistance.
Compatible to IR reflow soldering.
PrimaxPlus 100mA Warm White: MAF-PSC
Note : Primary thermal path is through Cathode lead of LED package
InGaN Warm White: DDF-LJG
08/12/2016 V7.010
DomiLED • InGaN Warm White: DDF-LJG Package Outlines
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
Note : Primary thermal path is through Cathode lead of LED package.
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
07/07/2011 V4.06
SPNovaTM • InGaN White : NPW-RSZ Package Outlines
InGaN White : NPW-RSZ
Material
Material
Lead-frame
Package
Encapsulant Soldering Leads
Cu Alloy With Ag Plating
High Temperature Resistant Plastic, PPA
Silicone Resin
Sn-Sn Plating
DOMINANTOpto TechnologiesInnovating Illumination
TM
C
A
08/12/2016 V7.012
Taping and orientation
• Reels come in quantity of 2000 units.• Reel diameter is 180 mm.
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
01/06/2017 V5.011
Packaging Specification
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
08/12/2016 V7.013
Packaging Specification
InGaN Warm White: DDF-LJGDOMINANTOpto TechnologiesInnovating Illumination
TM
01/06/2017 V5.012
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
Packaging Specification
Average 1pc DomiLED/Multi DomiLED 1 completed bag (2000pcs)
0.034 190 ± 10Weight (gram)
CardboardBox
Dimensions (mm) Empty BoxWeight (kg)
Super Small
Small
Medium
Large
For DomiLED
Reel / BoxCardboard BoxSize
Weight (gram) 0.034 240 ± 10
DOMINANT TM
Moisture sensitivity level
Moisture absorbent material +Moisture indicator
The reel, moisture absorbent material and moisture indicator aresealed inside the moisture proof foil bag
Reel
Barcode label
Label
(L) Lot No : lotno
(P) Part No : partno
(C) Cust No : partno
(G) Grouping : group
(Q) Quantity : quantity
(D) D/C : date code
(S) S/N : serial no
DOMINANT Opto TechnologiesML TEMP2 260˚CRoHS Compliant
Made in Malaysia
325 x 225 x 190
325 x 225 x 280
570 x 440 x 230
570 x 440 x 460
0.38
0.54
1.46
1.92
9 reels MAX
15 reels MAX
60 reels MAX
120 reels MAX
01/06/2017 V5.013
Time (sec)0 50 100 150 200
300
250
225
200
175
150
125
100
75
50
25
275
Tem
pera
ture
(˚C
)Classification Reflow Profile (JEDEC J-STD-020C)
Ramp-up3˚C/sec max.
255-260˚C10-30s
60-150s
Ramp-down
6˚C/secmax.
Preheat 60-180s
480s max
217˚C
Recommended Pb-free Soldering Profile
InGaN White: DDW-CJG-I1DOMINANTOpto TechnologiesInnovating Illumination
TM
InGaN White: DDW-CJG-I1
01/06/2017 V5.014
DOMINANTOpto TechnologiesInnovating Illumination
TM
Appendix
1) Brightness:1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3).
2) Color:2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3).2.2 DOMINANT wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3).
3) Voltage:3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).
Revision History
Page
-
2
3, 6
1, 12
1, 14
Subjects
Initial release
Add Thermal Resistance
Add CharacteristicsAdd graph: Allowable Forward Current Vs Duty Ratio
Add graph: Chromaticity Coordinate Shift
Add FeaturesUpdate Packaging Specification
Update Product PhotoAdd Appendix
Date of Modification
01 Mar 2012
02 Apr 2013
06 Jun 2014
16 Oct 2015
01 Jun 2017
InGaN White: DDW-CJG-I1
01/06/2017 V5.015
DOMINANTOpto TechnologiesInnovating Illumination
TM
NOTE
All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT
Opto Technologies does not assume any liability arising out of the application or use of any product described herein.
DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function
or design.
DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or systems
without the express written approval from the Managing Director of DOMINANT Opto Technologies.
InGaN White: DDW-CJG-I1
About Us
DOMINANTOpto TechnologiesInnovating Illumination
TM
DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manufac-turers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manu-facturing and development capabilities have become a trusted and reliable brand across the globe. More information about DOMINANT Opto Technologies, a ISO/TS 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com.
Please contact us for more information:
DOMINANT Opto Technologies Sdn. BhdLot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia.Tel: +606 283 3566 Fax: +606 283 0566E-mail: [email protected]