International Students Enrollment in College of Engineering, National Tsing Hua University
Information for International Applicants
January 2008
College of Engineering, National Tsing Hua University
101, Section 2, Kuang-Fu Road, Hsinchu, Taiwan 30013, R. O. C.Tel: +886-3-5710521
Fax: +886-3-5712670Email address: [email protected]
Website URL: http://www.eng.nthu.edu.tw/engineering/english.htm
International Students Enrollment in College of Engineering
National Tsing Hua University
Information for International Applicants
The College of Engineering (CoE) was established in August, 1972. The College is currently
comprised of four departments (Chemical Engineering, Materials Science and Engineering, Power
Mechanical Engineering, and Industrial Engineering and Engineering Management) and one
graduate institute (NanoEngineering and MicroSystems; NEMS.) All departments confer master and
doctor degrees.
1. Departments & ProgramsDepartments &
Institutes
Degrees offered
Bachelor Master Ph. D.
CHE
PME
MSE
IEEM
NEMS
CHE: Chemical Engineering; PME: Power Mechanic Engineering; MSE: Material Science and Engineering; IEEM: Industrial Engineering and Engineering Management; NEMS: NanoEngineering and MicroSystems
2. Application Requirements
International applicants are those with foreign nationality, but not overseas Chinese or ROC
nationals. Applicants who have held R.O.C. citizenship in the past eight years are not eligible.
(1) Eligibility for Masters and Doctoral Program Applicants
International applicants must have bachelor degree or its equivalent to apply for master
programs; applicants for Doctoral Programs must have a Master degree or equivalent
degree. The standards required by individual institutes/department are intended to ensure
that the applicants admitted are qualified to study at this institution and have a reasonable
chance of completing the graduate program.
(2) Application Deadline: March 14 and December 1
The deadline on March 14 is for fall semester enrollment; December 1 is for spring
semester enrollment.
Date of Admissions Decisions:
For Fall Semester: by the end of May
For Spring Semester: by the middle of January
The notification will be sent by email and by airmail
(3) Application form
Please see Appendix I
(4) Application Requirements: Master & Doctoral Programs
a. A completed application form.
b. A notarized copy of diplomas/certificates in English or Chinese.
c. Official transcripts from each university.
d. Statement of goals and research interests. (No more than 2000 words or 3 pages).
e. Two recommendation letters from individuals, preferably faculty members, who can
evaluate academic qualifications and research potential.
f. Record of medical examination, including HIV test.
g. Financial Statement (i.e. bank deposit, scholarship)
h. For additional requirements of departments or institutes please visit their websites.
NOTE: For admission, you must have your highest level of diploma/certificate and transcripts
NOTARIZED by your country's Embassy or Taipei Economic and Cultural Office in the
country/place where you received your degree. THESE DOCUMENTS SHOULD REACH
THE DIVISION OF INTERNATIONAL AND CONTINUING EDUCATION NO LATER THAN
31st MAY. Admission letters will be mailed out by the end of June. Applicants will also be
informed via email.
Send completed applications to:
The Division of International and Continuing Education
National Tsing Hua University
101, Sec. 2, Kuang Fu Rd., Hsinchu, 30013, Taiwan, R.O.C.
Deadline for Fall semester: March 14
Deadline for Spring semester: December 1
(5) Notices
a. No materials will be returned.
b. If you plan to apply to more than one department or institute, you should submit a
complete application packet for EACH Department or Institute.
c. Students who are deemed to be not proficient in Mandarin might be required to enroll
in a Mandarin program at their own expense after arrival.
d. Credits taken in college or university may be transferred after evaluation by the
institute/department.
e. If you would defer your enrollment for one year, please submit a formal written
request as well as original notarized diplomas and transcripts to the Division Of
International & Continuing Education.
3. English Offered Courses
Please see Appendix III & IV for Undergraduate English Offered Courses and Appendix IV for
Graduate English Offered Courses.
4. Admission Fees and Tuition (per semester)
Undergraduate Programs:
Tuition (Including tuition, insurance): NTD$28,630
Credit fee: NTD$1,050 per credit
Graduate Programs:
Tuition (Including tuition, insurance): NTD$12,980
Housing (Including utility): NTD$4,800~11,500
Credit fee: NTD$1,580 per credit
※ Tuition, housing and credit fee will be adjusted every year.
5. Application Procedure
Please see Appendix V
※ Applicants are recommended to become well acquainted with the Chinese language,
culture, customs, etc. Knowledge of Chinese is useful for daily life.
6. Scholarships
A wide variety of financial-aid opportunities exist for individuals interested in pursuing their
studies at National Tsing Hua University. These include full scholarships, scholarships for the
first year of studies and scholarship assistance-ship programs. Scholarships opportunities are
available from three major sources: Government, Private Sector and Tsing Hua University. See
Appendix II for the applying form for NTHU scholarship.
(1) Scholarship Duration:
The Foreign Student Scholarship is awarded for every recipient for one year (Fall
semester: from August to next July; Spring semester: from February to next January).
(2) Eligibility:a. For attracting foreign students, the first year masters or doctoral students take priority.
The recipients should take Chinese courses with totally 4 credits and should not apply for any other scholarships at NTHU.
b. The second or above year students are eligible.c. The recipients of Taiwan Scholarship, IMBA scholarship, Taiwan International
Graduate Program from SINICA and any other scholarships offered by government are not eligible.
(3) Assessing Procedure:a. The first year masters or doctoral students can apply for the scholarship while applying
for admission.b. The second or above year students should submit their application between June 1 to
June 15 .c. The second or above year students are required to submit the application form
(available on the Office of the Overseas Chinese and Foreign Students, OCFS, website), the academic transcript, the proposal and the advisor’s recommendation letter, to OCFS.
7. Research Groups & Interests: See Appendix VI
8. Contact Information
If you have any questions, please send your inquiry to [email protected] or call the
College Secretary Ms. Peng at 886-3-5710521
Appendix I Application Forms
NATIONAL TSING HUA UNIVERSITYApplication Form For International Applicants
The field with * must be completed.
Please complete a separate application form for each proposed area of study. Forms must be completed in triplicate.
Part I. Personal Information
*English Name (Last Middle First)Chinese
Name
*Nationality *Sex □ Male □ Female
*Place of birth *Date of Birth
Passport number
Resident Visa
Martial status □ married □ single □ other
*Home address
*Mailing address
Address in Taiwan
*Home Telephone
Mobile Phone (Country Code)-(Area code)-(Phone Number)
*Email address
*Emergency
contact
*Name: Email:
*Relationship: * Phone:
*Address:
*Family *Father’s
Name
*Mother’s
name
*Place of birth *Place of birth
Occupation Occupation
Attach recent bust photograph here
*Nationality *Nationality
Study Plan *Proposed area of study
*Department
*Expected enrollment date (Year) (Semester : Fall or Spring)
Part II. Complete Section(s) applicable to you
Education Background
*Secondary School *Date of enrollment
*Date of Graduation
*College/University
*Date of enrollment
*Date of Graduation
*Department/
Institute*Degree
Major
*GPAMinor
*Graduate School
*Date of enrollment
*Date of Graduation
*Department/
Institute*Degree
*Thesis Topic
*Have you ever studied in Taiwan? □ Yes □ No
If yes, which university ___________________________, which department_____________________
Testing Information (Optional)
Test date
(yyyy/mm/dd)
Test Score
TOEFL
GMAT
Evidence of Management Study
Aptitude
Other Evidence of English
Proficiency
Other Evidence of Chinese
Proficiency
Others
Part III.
Financial Plan
*How will you finance your education in Taiwan?
□ Personal savings
□ Apply for Taiwan Scholarship □ Received Taiwan Scholarship
□ Apply for ICDF scholarship □ Received ICDF scholarship
□ Recommended for the scholarship provided by Agreement between NTHU and applicant’s
current university, please specify ________________
□ I want to apply for scholarship from National Tsing Hua University
□ Other, please specify ________________
Health Condition
*Health condition □ Excellence □ Good □ Average □ Poor
Employment History
Employer
Job Title Date to
Responsibilities
Accomplishments
Reason(s) for leaving
Employer
Job Title Date to
Responsibilities
Accomplishments
Reason(s) for leaving
Chinese Proficiency:
*Have you studied Chinese
before?
Where?
For how long?
With whom?
*How do you rate your knowledge of Chinese?
(Please use one of these words: Excellence, good, average, poor)
Speaking Listening Reading Writing
Other Information
Extracurricular activities
Publication(s)
*Do you need to apply for
housing □ Yes □ No
*How did you learn about
NTHU?
Certification
I certify that all the information given by me in this application is correct and complete, and
understand that any misrepresentation will result in the termination of admission.
Signature: __________________ Date: _______________________
Study plan (2000 words about your dedication to your chosen program)
Name of Applicant:
Appendix II Application Form for NTHU Scholarship
國立清華大學 年外國學生獎學金申請表APPLICATION FORM FOR FOREIGN STUDENT
SCHOLARSHIP請詳實填寫,如有需要,可自行以同款紙張加說明,填寫後,請繳至僑外組。Please complete this form and submit to the Division of Foreign Students. Additional pages of the same size can be attached if necessary.
中 文 姓 名Chinese Name
相片Photo
英 文 姓 名English Name學 號
Student No.系 級
Department國 籍
Nationality性 別
Sex出 生 地
Place of Birth出 生 日 期Date of Birth
護 照 號 碼Passport No.
居 留 證 號 碼Resident No.
現 在 住 址Current Address
電 話Telephone
電 子 郵 件E-Mail
@ 行 動 電 話Cell Phone
研究計劃Research Plan
Appendix III English Offered Courses for Undergraduate Programs
Dept. Course no. Course Title Credit Note
CHE CHE 211000 Engineering Math (I) 3 2007-2008 Fall & Spring, Sophomore Required Course
CHE CHE 309002 Instrumental Analysis and Lab. (I) 3 2006-2007 Fall, Junior Required Course
CHE CHE 455200 Introduction to Biotechnology 3 2003-2007 Fall, Senior Elective Course
CHE CHE 455300 Fundamentals of Cell Biology 3 2005-2008 Spring, Senior Elective Course
CHE CHE 497000 Synthesis of Nanoparticles 2 2006 Spring
IEEM IEEM 203000 Engineering Statistics (I) 3 2005-2007 Fall, Sophomore Required Course
IEEM IEEM 303000 Quality Control 3 2006-2007 Fall, Junior Required Course
IEEM IEEM 306000 Human Factors (II) 3 2006 Spring, Junior Elective Course
IEEM IEEM 202100 Discrete Mathematics 3 2006 Fall
IEEM IEEM 443200 Marketing Management 3 2005 Fall
IEEM IEEM 307100 Industrial Accounting 3 2005 Spring
MSE MS 403100 Introduction to Solid State Physics (I) 3 2005-2007 Fall & Spring, Senior Elective Course
MSE MS 403200 Introduction to Solid State Physics (II) 3 2005-2006 Fall & Spring, Senior Elective Course
MSE MS 203102 Thermodynamics of Materials (I) 3 2003 Fall
PME PME 312002 Heat Transfer 3 2003 Spring
PME PME 443200 Computer Aided Design and Manufacturing 3 2008 Spring
Appendix IV English Offered Courses for Graduate Programs
Dept. Course no. Course Title Credit NoteCHE CHE 507000 Chemical Engineering Principle (I) 3 2008 Fall, Required CourseCHE CHE 501000 Advanced Chem. Engineering Thermodynamics 3 2006-2007 Fall, Elective CourseCHE CHE 514000 Mold Design and CAE for Plastics Processing 3 2007 FallCHE CHE 556000 Polymer Composite Materials 3 2006-2007 Fall, Elective CourseCHE CHE 568000 Processing and Characterization of Composite Materials and Lab. 3 2006-2008 Spring, Elective CourseCHE CHE 575000 Phase Equilibria of Materials 2 2002-2008 Spring, Elective CourseCHE CHE 592000 Pharmaceutical Microbiology 2 2006 Spring, Elective CourseCHE CHE 581000 Applications of Electron Microscopy in softy Matter 3 2007-2008 Spring, Elective CourseCHE CHE 523000 Phase Diagram Calculation 1 2006 FallCHE CHE 543000 Electrochemical Engineering 3 2006 Fall, 2008 Spring, Elective CourseCHE CHE 592000 Pharmacokinetics 2 2006 SpringCHE CHE 592100 Drug Delivery 2 2004 SpringIEEM IEEM 538000 Operations Management 3 2008 SpringIEEM IEEM 514100 Stimulation Analsis 3 2007 Fall, Elective CourseIEEM IEEM 510500 Statistic Methods 3 2006-2007 Fall, Required CourseIEEM IEEM 511800 Fuzzy Set Theory & Applications 3 2007 Fall, Elective CourseIEEM IEEM 535200 Electronic Enterprise Integration 3 2007 Fall, Required CourseIEEM IEEM 536600 Manufacturing Systems and Automation 3 2006 Spring, Elective CourseIEEM IEEM 510900 Design and analysis of Algorithms 3 2006 Spring, Elective CourseIEEM IEEM 517000 Operations Research Applications 3 2006 Spring, Elective CourseIEEM IEEM 710300 Special Topics in Human Factor 3 2006 Spring, Required CourseIEEM IEEM 523500 Work Physiology 3 2006 Spring, Elective CourseIEEM IEEM 549100 Mass Customization 3 2007 Spring, Elective CourseIEEM IEEM 512700 Reliability Engineering 3 2006 Fall, Elective CourseIEEM IEEM 523700 Human Information Processing 3 2006 Fall, Required CourseIEEM IEEM 523900 Biomechanics 3 2006 Fall, Required CourseIEEM IEEM 545100 Project Management 3 2005Fall, 2006 Fall, Required CourseIEEM IEEM 545200 Product and Technology Development Management 3 2006 Fall, Elective Course
Dept. Course no. Course Title Credit NoteIEEM IEEM 537200 Customer Relationship Management 3 2005 SpringIEEM IEEM 540100 Innovation and R & D Management 3 2005 SpringIEEM IEEM 541300 Organization and Management 3 2005 SpringIEEM IEEM 543200 Marketing Management 3 2005 SpringIEEM IEEM 535200 Enterprise Integration 3 2004 FallIEEM IEEM 552300 Decision Analysis 3 2004 FallIEEM IEEM 511700 Multiobjective Optimization 3 2004 Spring, 2008 SpringIEEM IEEM 537200 Strategic Management 3 2004 SpringIEEM IEEM 512000 Special Topics on Soft Computing 3 2005 FallIEEM IEEM 546100 Manufacturing Management 3 2005 FallNEMS NEMS 510401 Microsystem Technology and Experiment 4 2006-2007 Fall, Elective CourseNEMS MEMS 560000 English for Science and Technology 3 2006 Spring, Elective Course
PME PME 519000 Advanced Computational Numerical Analysis of Partial Differential Equations 3 2008 Spring
PME PME 523000 Sensing and Actuation in Miniaturized Systems 3 2008 SpringPME PME 600200 English for Science and Technology 3 2003-2007 Fall & Spring, Elective CoursePME PME 550300 Infrared Systems Engineering 3 2007 Spring, Elective CoursePME PME 511300 Computation Fluid Dynamics 3 2005 FallPME PME 543500 Precision Machine Design 3 2005 FallPME PME 511100 Laminar Flow Theory 3 2004 FallPME PME 523000 Micro-Electro-Mechanical Transducers 3 2004 FallPME PME 543100 Special Topics in Computer-Aided Manufacturing 3 2003 SpringMSE MS 535100 Epitary-Materials Science in its Nano Regime 3 2002-2007 Fall, Elective CourseMSE MS 536200 Molecular Biology Engineering 3 2004 Spring-2006 Spring, Elective CourseMSE MS 625000 Special Topics of the Highend Electron Microscopy 3 2006 Spring, Elective CourseMSE MS 544200 Selected Topics on Condensed Matter Science 3 2005 SpringMSE MS 606200 Advanced Devices and Their Related Materials 3 2005 SpringMSE MS 613200 Nano Mechanical Property Evaluation 3 2005 SpringMSE MS 528200 Thin Film Material Science 3 2004 SpringMSE MS 536200 Molecular Biology Engineering 3 2004 Spring
Appendix V Application Procedure
1. To complete an application for undergraduate or graduate admission, choose one of the following:← Apply through on-line international application →http://my.nthu.edu.tw/~exten/english/PS_online_application.htm←← Or complete the application form showed in Appendix I and send to
← The Division of International and Continuing EducationNational Tsing Hua University101, Sec. 2, Kuang Fu Rd., Hsinchu, 30013, Taiwan, R.O.C.
←← For multiple applications, please file applications individually.
2. Application requirements for admission include following items:← □ A photocopy of diplomas/certificates in English or Chinese.
← □ Official transcripts for each school attended previously
← □ Study plan (2000 words about your dedication to your chosen program)
← □ Medical report including HIV Test
← □ Two recommendation letters
← □ Financial statement (bank deposit, scholarship)
3. Deadline for Fall semester: March 14; Deadline for Spring semester: December 1← NOTE: For admission, you must have your highest level of diploma/certificate and transcripts NOTARIZED by your country's Embassy or Taipei
Economic and Cultural Office in the country/place where you received your degree. THESE DOCUMENTS SHOULD REACH THE DIVISION OF
INTERNATIONAL AND CONTINUING EDUCATION NO LATER THAN 31ST July. Admission letters will be mailed out by the end of June. Applicants
will also be informed via email.
Appendix VI Faculty & Major Research
Department of Industrial Engineering and Engineering Management
Professor Major ResearchChen, Fei-Long Enterprise Integration, Enterprise Resource Planning, Global Logistics Management, Computer Integrated
Manufacturing, Total Quality Management, and Engineering Data AnalysisChen, Kuang-Chen JIT, TQC, TMC, KAIZENChern, Maw-Sheng Combinatorial Optimization, Inventory Management and Production Scheduling, Modern Heuristic TechniquesChien, Chen-Fu Modeling and Analysis for Semiconductor Manufacturing, Decision Analysis, Data Mining, Manufacturing
Strategy, Decision Support SystemsChu, Chih-Hsing New Product Development, Collaborative Design, Design Chain Management, CAD/CAM, and Human-Centric
DesignChu, Yee-Yeen Engineering and Technology Management, Product and Process Innovation, Agile Manufacturing and Supply Chain
Management, Strategic Technology Management and Systems of InnovationHou, Jiang-Liang Knowledge Management, Logistics ManagementHung, Yi-Feng Management of Semiconductor Manufacturing, Supply Chain Management, Production Planning and Scheduling,
Computer Integrated Manufacturing, Heuristic AlgorithmsHwang, Sheue-Ling Human-Computer Interaction and Human-Machine StudiesLiao, Shinn-Ruey Manufacturing Engineering, Non-traditional Machining Processes, Manufacturing System Management,
Engineering Management, Industrial Education, Industrial Safety, Human Factor in Human Machine InteractionLin, James T. Computer Integrated Manufacturing (CIM), Supply Chain Management, Simulation Modeling of Manufacturing
Systems, Advanced Planning and Scheduling (APS)Sheu, Dongliang Daniel Systematic Innovation (TRIZ), Design & Manufacturing Management, Equipment Management, Factory DiagnosisSong, Wheyming Tina Statistical Aspects of Stochastic Simulation, Applied Operations Research, Probability and StatisticsSu, Chao-Ton Quality Engineering, Quality Management, Production Management, Neural Network ApplicationsSu, Che-Pyng Operations Management, New Product Development, Mass Customization, Supply Chain Management, Economic
Evaluation of Medical TechnologyTrappey, Amy J. C. E-Business, E-Automation, Product Lifecycle Management, Knowledge EngineeringWang, Eric Min-yang Human Factors/Ergonomics, Human-Computer Interaction, System Usability, Web-based Consumer Behaviors,
Aviation Ergonomics, Industrial Safety and Health, and AnthropometryWang, Hsiao-Fan Multicriteria Decision Making, Fuzzy Set Theory, Green Value Chain Management.Wang, Mao-Jiun Ergonomics, Digital Human Modeling, Occupational Safety and Health, Fuzzy Set Applications
Professor Major ResearchWen, Ue-Pyng Multi-criteria Decision Making, Production Management, Applied Operations ResearchYu, Chi-Yung Occupational Biomechanics, 3D Anthropometry, Color VisionYuan, John Queuing Theory, Network Analysis, Human System Diagnosis, System Reliability and SafetyYeh, Wei-Chang Graph Theory, Soft Computing, Production Scheduling
.
Department of Materials Science and Engineering
Professor Major ResearchChang, Shih-Ching Metallic materials for mechanical and electronic applications, Deformation and fracture of materials, Corrosion and
stress corrosion cracking, Bulk nanostructure materials, Carbon NanotubesChang, Yee-Shyi Surface technology and analysis, Wireless Chip, IC fabrication and package, Ink jet, Large Scale FED, Thin Film
Color Cell Technology, High Definition DisplayChen, Jiann-Ruey Hydrogen storage materials, BiosensorChen, Lih-Juann Synthesis and Applications of Low-Dimensional Nanomaterials, Thin Film Materials in Integrated Circuits Devices,
Atomic Resolution MicroscopyChou, Lih-Hsin Phase Change Memory Materia (Memory Optical Disk), Thin Film Materials, Solid State NMRChou, L. J. Nanoelectronics and Photonics, Advanced Transmission Electron Microscopy Techniques, Solar Energy and
Materials, Light Emitting Materials and DevicesDuh, Jenq-Gong Ceramic coating and surface modification of materials, Metallization and solder joint reliability in microelectronic
package, Structure ceramics, Dental materials, Electroscope microanalysis, Development of lead-free solder, Nanopower synthesis
Gan, Jon-Yiew Non-volatile Memory and Material, Photovoltaic Device and Material, One-dimensional Nanostructured MaterialHong, Minghwei New materials through novel Epitaxy for new science and next generation nano-electronic devices beyond Si
CMOS, III-V and GaN MOSFET-design growth, Device Fabrication, and Electrical Characteristics, Interfatial Studies Using X-ray and Electron
Hu, Chen-Ti Superalloys, Vacuum Induction Melting, Vacuum Investment Casting, Ceramic Cores, Dual Phases Fe-Mn-Al Steels, Shape Memory Alloys, Cu-Zn-Al, Cu-AI-Ni, Fe-Mn-Si, Ti-Ni, Positive Temperature Coefficient Resistors (PTCR), PbTi 03, V-shape Positive
Huang, J. –H. Molecular Bean Epitaxy, III-V Compounds, Carbon Nanotubes, Biosensors, SupercapacitorsHuang, Tsung-Shiew Optoelectronics Semiconductor, Semiconductor/Metal Interface, Thin Film TechnologyHwang, Jenn-Chang Plasma Thin Film, Nano-device Fabrication, Surface AnalysisHsu, Tung Surface Structure, Electron Diffraction, Electron Microscopy, Technical WritingHsu, Wen-Kuang Synthesis and Application of Carbon NanotubesJean, Jau-Ho Ceramics for Wireless Communication, Surface Chemistry for Nano-PowersJou, Jwo-Huei Polymer, Organic Light-Emitting Diodes, Nano-Thin Film, Thin Film Stress Analysis, Expert System ApplicationsLai, Chih-Huang Magnetic Thin Film, Spintronic Devices (MRAM) Storage Materials, Magnetic Nanoparticles and Nanostructure
Lee, San-Boh The elastic interaction between dislocations and crack, Mechanical and optical properties of ionics single crystals,
Professor Major ResearchDiffusion-induced and thermal stresses, Solvent transport, phase separation, optional and mechanical properties of polymer
Liao, Chien-Neng Thermoelectric Materials, Micro-cooling Devices, IC Interconnect ReliabilityLin, Heh-Nan Scanning Probe Microscopy, Nanomaterials, Nanodevices, NanolithographyLin, Su-Jien Superhard Thin Films, Nanowires, Metal Matrix CompositesPerng, Tsong-Ping Processing, Characterization, and Applications of NanomaterialsTai, Nyan-Hwa Synthesis of carbon nanotubes and its applications in field emission light, Soft Panel Light, Nanocomposites, Solar
Cell, Ultra Nanocrystalline Diamond (UNCD), CNT BiocompatibilityTsai, Cho-Jen Stress Effects on the Kinetics of General Materials Phenomena, Surface Stress Modification in Nanometer Scale,
Growth of Epitaxial SilicidesWu, Hsin-Tien Metallization of IC and GaAs by Sputtering, Amorphous Alloys, Process and Microstructure, Diamond or Carbon
Film making, Computer aided materials processingWu, Jenn-Ming Processing and Characterization of Ferroelectric Thin Films, Nano Ceramic Materials, Low Temperature Cofired
Ceramics, Development of Materials for Wireless Communication Devices, Solid Oxide Fuel CellWu, Tai-Bor Ferroelectric thin films, High-dielectric constant thin films for nano-CMOS, Nanostructure materials, Ceramic thin
films devices for microwave, Oxide electrodes and diffusion barrier for IC applicationsYang, Amold C. M. Nano-scale-polymer Mechanical Property and Physical Property, Physics and Materials of Laser Printing,
Photoluminesceut Polymer, AFM, MEMS, Inject technology, Plasma Polymerize, Laser Print Technique—Physics Property and Material Application
Yeh, Jien-Wei High-entropy Alloys, Reciprocating Extrusion Process, Light Alloys, Superplasticity, Metal Matrix Composites, Composites
Yen, Ta-Jen Metamaterials, Nano-photonics, Bio-detection/materials, M/NEMSYew, Tri-Rung Advanced Semiconductor Processing & Integration, Nanoelectronics, Flexible Electronics, Nano/Bio-materials,
Bio-Sensing/Imaging, Nano/Bio-materials applications
Department of Power Mechanic Engineering
Professor Major ResearchChen, Cheng-Huan Micro Optics, Liquid Crystals Optics, Projection Display, 3D Imaging TechnologyChen, Jian-Shiang Servo Control, Sliding Mode Control, Embedded DSP/FPGA ApplicationsChen, Li-Ting Thermodynamics, Cryogenics, Simulation of Refrigeration EquipmentChen, Rong-shun MEMS, Integration of Control and MicrosystemsChen, Wen-Hwa Fracture Mechanics, Contact Mechanics, Nano/Micro Mechanics, Electronic Packaging, Meshless Method,
Acoustics ControlChen, Wen-Liang Control System Theory, Signal Processing in Communication SystemChiang, Chun-Ron Micromechanics, Mechanics of Composite Materials, Fracture MechanicsChiang, Hsiao-Wei D. Gas Turbine, Turbojet & Microturbine, Aeromechanics & Aeroacoustics, Turbomachinery, TurbogeneratorChiang, Kuo-Ning Nano and Bio-Mechanics, Advanced Electronic and MEMS Packaging Technology, NEMS/MEMS Design,
Computer-Aided Engineering, Fracture and Reliability AssessmentFang, Weileun MOEMS, CMOS MEMS Sensors, Systems on Chip (SoC), Systems in packaging (SiP), Micro Actuators,
Mechanical Testing of Micro DevicesFu, Chien-Chung HARMST based on LIGA, UV-LIGA Processes, Bio-MEMS, Optical MEMS, Micro Fluidic Systems, Bio-
Mimetics and Artificial Muscles Hocheng, Hong Nontraditional Machining, Micro/Nano-Manufacturing, Fatigue of MEMS, Machining of CompositesHong, Che-Wun Fuel Cell Science, Solar Cells, Molecular Engineering, Combustion Engines, Automotive Engineering, Intelligent
Vehicles, Multi-scale Simulation on Quantum Molecular Dynamics, Boltzmann Dynamics and System DynamicsHong, Chien-Chong Point-of-Care Lab-on-a-Chip, Polymer Nanoactuators, Biological Target Sensing and ControlLai, M. F. Spintronics, MRAM, Magnetic MEMS/NEMS, Bio-chip, Bio-Mimetic Systems, Micro Droplet, Nano Mechanics,
BiophysicsLee, Shong-Leih Computational Fluid Dynamics, Free Surface Flow, Bubble Dynamics, Liquid LensLei, Wei-Tai CNC Controller, Five-Axis CNC Machine Tools, Laser Scanning, Real-Time Mechatronic Control System,Lin, Chao-An Turbulence and Flow Physics, Numerical Methods, Bio-Fluid, Parallel ProcessingLin, Shih-Chieh Machine Vision, Metrology, Inspection System Design, Maufacturing Process Liou, Tong-Miin Combustion, Laser-Based Diagnostics, Heat Transfer Enhancement, Rotating/Reciprocating Machinery, Biomedical
Flows/Biomechanical Engineering, Micro-deposition Using Inkjet Printing Technology, Electroosmotic FlowLiu, Cheng-Hsien Microsystems, BioMEMS/Lab on a chip, Optical
Microsystems, Nano Technology for biomedical applications, Bio-Engineering, System Dynamics and ControlPerng, Ming-Hwei Machine Vision, Automatic Optical Inspection, Control
Professor Major ResearchShaw, Dein Mechanical system Design, Optical device Design, Tolerance Design, CAD/CAMSheu, Wen-Jenn Nanofluid, Electronic Cooling, CombustionSung, Cheng-Kuo Precision Machine Design, Machine Dynamics, Nanoimprint TechnologyTsai, Hung-Yin Nano/Micro Structures Fabrication and Optical/Electro-Mechanical Applications, Advanced Materials Processing,
Diamond Film Deposition and ProcessingTso, Pei-Lum Abrasive Machining, Mechanism Design, CAD/CAMWang, J. H. Vibration, Engineering Acoustics, Psychoacoustics, Sound qualityWang, Pei-Jen Intelligent Manufacturing Systems, Optical Components and Systems, Advanced Electromechanical Systems.Wang, Wei-Chung Experimental Mechanics, Fracture Mechanics, Thermal Stresses, Precision Optical MeasurementWei, Zung-Hang Nano Engineering, Spintronics, Nano Optotronics, Biomedical System, Nano BiomechanicsWong, Shwin-Chung Electronics Cooling, Combustion, Fuel CellsWu, Long-Iong Mechanism DesignYang, Jing-Tang Energy and Environment, Microsystems, Bio-medical Engineering, Biomimetic Engineering and Biomechanics,
Combustion, Jet Propulsion, Self-Assembly Manufacturing using Nanoparticles and DNAYao, Da-Jeng Bio-MEMS, Microscale Thermo-Fluids, MEME Packaging, Thin Film Properties ManagementYeh, J. Andrew Solar Energy, Optofluids, Ambient SensorsYeh, Meng-Kao Mechanics of Composite Materials, Nanocomposites, Mechanics of Electronic Packaging, Structural StabilityYeh, Ting-Jen Control Theories and Implementation, Mechatronics, System Modeling and IdentificationYip, Ming-Chuen Mechanical Properties of Nanocomposite Materials and Electronic Packaging, Plasticity, Experimental Mechanics
Department of Chemical Engineering
Professor Major ResearchChang, Rong-Yeu Development of micro-element of plastic technology in MEMS process, Predications in the design of color ink-jet
head and the behavior of micro-fluid flow…..Chen, Hsin-Lung Self-assembly and crystallization of block copolymers, Supramolecular structures of conjugated semiconducting
polymers, Self-assembly of DNA complexes for non-viral gene deliveryChen, Show-An Semiconducting polymers and related devices: molecular design and synthesis, opto-electronic properties
characterization, device physics and fabrication (light emitting diode, field effect transistor, memory device, solar cell)
Chen, Sinn-Wen Phase Equilibria and Thermodynamics, Microelectronic Soldering, Diffusion and Phase Transformation of Inorganic Materials, Aluminum Alloys
Chin, Wei-Kuo Synthesis, thermal and flame properties of resins with phosphorylated compounds, Conductive epoxy film adhesives and positive temperature coefficient polymer resistors, Epoxy based polymer dispersed liquid crystal film, Inorganic/organic nanocomposites with electrical and optical functionalities
Chou, Kan-Sen Nano-material Processing, Ceramic Processing, Metallic core-porous ceramic shell particles as catalyst; nano-iron for Ni-Fe battery
Chu, I-Ming Animal cell cultivation, Stem cell expansion and applications, Liposomal drug delivery system, Biomedical application of poly (anhydride)
Ho, Rong-Ming Self-assembly Behavior of Block Copolymers and Supramolecules, Nanomaterials from Block Copolymers and Supramolecules, Organic Nanopatterning Technology, Crystallization Behavior of Crystallizable Block Copolymers
Hsiue, Ging-Ho Biomaterials, Smart Hydrogels, Nano Micelles, Drug/ Gene Delivery system, Tissue Engineering, Regenerative Medicine.
Hsu, John. T.-A. Anti-viral Drug Development, Gene therapy/Vector Design, Protein Engineering/Post-Translational Modifications, Biosynthesis and Metabolic Engineering of Medicinal Nature Products
Huang, Ta-Jen Catalysis and Kinetics, Solid-state Electrochemistry and Fuel Cell, Analysis and Characterization of the Properties of Solid Surface, Bio-ceramics
Hu, Chi-Chang Design of Nanostructured Materials for Energy Storage/Conversion Systems, Synthesis, Characterization, and Applications of Novel Materials, Plating & Surface Finishing, Experiment Design Strategy and Quality Engineering
Hu, Yu-Chen Bioprocess Engineering, Vaccine Development, Development and Modification of Viral Vectors, Gene Therapy, Tissue Engineering
Hwang, Shyh-Jye Fundamentals and Applications of Two Phase and Three Phase Fluidized Bed Reactors, Environmental Pollution Control Technologies, and Biofuels
Jang, Shi-Shang Semiconductor Process Control, Biological Network Reconstruction, Meta Model Driven Optimization of MINLP,
Professor Major ResearchArtificial Neural Network Model Predictive Control
Lee, Yu-Der Synthesis and Characterization of Novel Polyimides, Artificial Extracellular Matrix research, Molecular Imprinting Sensor
Liu, Ta-Jo The Development of Light-Diffusing Films, Pattern Coating for Advanced Electronic Packaging Industry, Ultra-Thin Coating
Lu, Shih-Yuan Preparation, Characterization, and Applications of Nanomaterials and Nanostructures in Solar Cells, Hydrogen Storage, CO2 Capture, Field Emission, Sensors
Ma, Chen-Chi M. Nanomaterials and Ecomaterials-Preparation and Characterization, Advanced Composite Materials (ACM)—Processing and Evaluation, Processing of Key Components for Fuel cell and Solar Cell, Recycling and Reuse of Polymer Materials
Su, An-Chung Phase Transformation, Molecular Packing, and Luminescence Behavior of Semiconducting PolymersSung, Hsing-Wen Biomaterials, Tissue Engineering, Nanobiotechnology, Drug Delivery System, Gene Delivery SystemTan, Chung-Sung Separation and Reaction in Supercritical Fluid, Precipitation and Dispersion of Nanoparticles by Compressed Anti-
solvent, CO2 Capture by Absorption and Adsorption.Tang, Shiue-Cheng Cellular Engineering, Gene Transfer, Confocal MicroscopyTuan, Hsing-Yu Synthesis, Characterization and Self-Assembly of Nanomaterials; Nanomaterial-based Device Application;
Nanomaterial Application in Energy Area.Wan, Chi-Chao Surface Treatment of IC Fabrication, Surface Treatment of PCB, Direct Plating, Development of Micro-Element of
Plastic Technology of in MEMS Process, Predications in the Design of Color Ink-Jet Head and the Behavior of Micro-fluid Flow
Wang, I-Kai Preparation and Characterization of Catalysts, The Correlation of Catalyst Properties with Catalyst Behaviors, the Kinetic and Mechanism Analysis of Reactions, the Analysis and Design of Chemical Reactors
Wang, Yung-Yun Fabrication of Barrier for Cu interconnection in VLSI, Synthesis and Catalytic Property of Nanoparticle, Lithium Battery
Wong, David Shan-Hill Thermodynamics, Process System Engineering: Advanced Process Control in Semiconductor Manufacturing, Energy Efficient Design and Control of Advanced Separation Processes, Modeling and Applications of Ionic Liquids
Wu, Wen-Teng Fermentation Application of a Modified Airlift Reactor, Design and Analysis of Fermentation Systems, Structure Lipid and Biodiesel Production
Institute of NanoEngineering and MicroSystems
Professor Major ResearchChieng, Ching-Chang Micro System, Heat Transfer, Turbulence Theory and Experiment, Engineering ComputingChang, Hwan-You Phosphorelay Signal Transduction in Pseudomonas aeruginosa, How a Large Cell Surface Anchored Protein
Regulates Colony Morphology , Fimbriae Synthesis and Biofilm Formation in Klebsiella pneumoniae, 3D Cell Culture System for Tissue Engineering and Disease Research, Biochemistry and Biophysics of Nucleotide Sugar Biosynthesis Enzymes
Chu, I-Ming Animal Cell Cultivation, Stem Cell Expansion and Applications, Liposomal Drug Delivery System, Biomedical Application of Poly (anhydride)
Chou, Pai H. Low-power and Power-aware System Designs, Design Tools, System Designs
Chen, Rong-Shun MicrosystemsChang, Yen-Chung Molecular Mechanisms Underlying the Formation and Function of Excitatory Synapses in the CNS, Multielectrode
Array Recording Systems, Nanodepth Tagging Methodology and Patterned Neuronal CulturesFang, Wei-Leun Micro Fabrication/Packaging Technologies, The characterization of the Mechanical Properties of Thin Films.,
Microactuators, Micro Fabrication/Packaging Technologies, Micro Optical Systems,Fu, Chien-Chung HARMST based on LIGA, UV-LIGA Processes, Bio-MEMS, Optical MEMS, MicroFluidic SystemsFan, Long-Sheng Microsystems, Bio-MEMS, RF-MEMS, IT-MEMSGwo, Shangir Scanning Probe Microscopy/Spectroscopy, Nanostructure Physics, Surface Physics, Molecular beam epitaxy of
nitride semiconductors Hsu, Chih-Ian Biochip, DNA Chip, Nano-biotechnology, BioPhotonicsHo, Rong-Ming Self-assembly Behavior of Block Copolymers and Supramolecules, Nanomaterials from Block Copolymers and
Supramoleucles, Organic Nanopatterning Technology, Crystallization Behavior of Crystallizable Block Copolymers
Hsu, Shawn S. H. MMIC/RFIC Design, High-frequency Device Modeling, High-frequency Device Characterization, Design and Fabrication of High-speed Devices
Lai, Mei-Feng ` Spintronics, MRAM, Magnetic MEMS/NEMS, Bio-chip, Bio-Mimetic Systems, Micro Droplet, Nano Mechanics, Biophysics
Lee, Ming-Chang Photonic Microelectromechanical Systems, Silicon Micro/Nano Photonic devices, Highly Sensitive Bio-detection, Flexible Photonic Circuit Boards, Flexible Organic Lighting
Ling, Yong-Chien Analytical Chemistry, Green ChemistryLiu, Cheng-Hsien Micro Electro Mechanical Systems specially in optical MEMS (MOEMS) for optical
Professor Major Researchcommunication/microphotonics applications and BioMEMS/Lab-chip/Micro-Total-Analysis-Systems for Biomedical Applications, System Dynamics, Modeling, Identification, and Control, Specially in Optimal and Robust Designs of MEMS, and both Macro and Nano-scale Electro-Mechanical System, Nano Technology and its applications, specially for biomedical applications
Lu, Shiang-Cheng Bio CMOS-MEMS, CMOS-MEMS Scanning Probe Array/Data Storage, COMS-MEMS Physical Sensors/Actuators/ Microsystems
Lyu, Ping-Chiang Structure, Folding and Function of Lipid Transfer Proteins (LTPs), Design of Glycosaminoglycans (GAGs) Binding Peptides, Structural Genomics Project of Helicobacter Pylori, Bioinformatics Approaches to Structural Biology
Tseng, Fan-Gang BioMEMS, Nano-biotechnology, Nano/Micro Fluidic Systems, MEMS IC/package Yao, Da-Jeng Bio-MEMS, Thermo-fluidics MEMS, Micro science and thin film property measurement, MEMS PackagingYeh, Jer-Liang Solar energy, Optofluids, Ambient SensorsYen, Ta-Jen Metamaterials, One-dimensional Nanomaterials, Bio-sensing and Bio-imagingYew, Tri-Rung Nanoelectronics, Flexible Electronics, Bio/Nano- Sensing, Characterization, and Imaging, Green Materials for
Energy