© 2010 LFoundry GmbH. All rights reserved.
LFoundry
… the customer-specific manufacturer of choice for analog, mixed-signal and
specialized technologies
© 2010 LFoundry GmbH. All rights reserved.2
Outline
Company & Business Update
Foundry Service
Manufacturing
Technology
© 2010 LFoundry GmbH. All rights reserved.3
LFoundry Facts
Business Model
Providing dedicated foundry capacity and
services for
Specialized analog, mixed signal designs
Customer specific technologies
Joint technology developments
Offering worldwide customers advanced
process technologies and a robust portfolio
of IP, innovative technology extensions and
certifications.
LFoundry “Sicherheit” for
Reliable supply and delivery
Superior-price performance
Protection of Customer Design and IP
Stay leading-edge in analog mixed signal and customized technologies
Sustainable, dedicated technology and foundry partner
© 2010 LFoundry GmbH. All rights reserved.4
LFoundry Profile… the customer-specific manufacturer of choice
… ensuring “Sicherheit”
reliability, security and
protection for customers,
their designs and their IP
… offering worldwide customers advanced process technologies and a robust portfolio of
IP, innovative technology extensions and certifications
… featuring unparalleled flexibility,
speed and
reliability to meet
aggressive on-time
delivery demands
© 2010 LFoundry GmbH. All rights reserved.55
LFoundry Organisation
CEOM. Lehnert
CFODr. H.- M.
Dudenhausen
CTOG. Spitzlsperger
President FranceJean-Pierre Delesse
Operations
Purchasing I.T.
V.P. QualityGerhard Weindl
Finance
V.P. Sales&MarketingMichael Hösl
H.R.
LFoundryRoussetS.A.S.
LandshutSilicon
Foundry GmbH
T.D. / R&D
COOG. Ernst
© 2010 LFoundry GmbH. All rights reserved.6
LFoundry Worldwide Organization
HeadquarterFabs
Sales
UK 2
Germany 4
France 2
USA 4
Korea/Taiwan 1
Israel 1
Japan 1
SalesForce
Fabs
Landshut 330 employees
Rousset 750 employees
© 2010 LFoundry GmbH. All rights reserved.7
LFoundry Corporate Headquarter
Landshut Silicon Foundry
wafer size: 200 mm
capacity 8“: up to 12k wspm
cleanroom area (CR): 5000 m²
330 employees, >18y experience
Technology
0.35µm, 0.15µm PDK, 0.11µm i.D.
0.35µm … 0.13µm customer specific
MEMS, Opto processes
7
Landshut, Germany
LFoundry Rousset
wafer size: 200 mm
capacity 8“: >20k wspm
cleanroom area: 11000 m²
750 employees, >10y experience
Technology
0.15µm/0.11µm PDK i.D.
0.18/ 0.15/ 0.13/ 0.11µm customer specific
Path to 0.08µm (tools available)
Rousset, France
LFoundry at a Glance
© 2010 LFoundry GmbH. All rights reserved.8
LFoundry Milestones
1H 20111H 2009 1H 20102H 2009 2H 20102H 2008LFoundry
Foundation
Development of open access based PDK
Development cooperation with IHP Microelectronics
150nm CMOS PDKrelease and MPW start
Open UK office
Join IPL Alliance to develop iPDK
SST Flash in 150nm
Start manufacturing of Automotive design for MAS Oy
Acquisition of Atmel’s Fab in Rousset (F)
Ramp RF MEMS for EPCOS
Collaboration with TESAT Spacecom
Development start of 110nm
© 2010 LFoundry GmbH. All rights reserved.9
LIFE (LFoundry integrated Foundry Ecosystem)
LFoundry wants to interact with the customer
© 2010 LFoundry GmbH. All rights reserved.10
LFoundry Revenue Share
by Region
LFoundry Customers Target Market [%]
European market dominated by
Germany and France
Overall healthy worldwide share
Our Customers serve the global market
Worldwide Market [%]
Europe
USA
Asia
Germany 32,2%
France 12,0%
United Kingdom 3,4%
Israel 3,0%
Europe 4,1%
USA 30,0%
Asia 15,2%
© 2010 LFoundry GmbH. All rights reserved.1111
LFoundry Revenue by Market
LFoundry markets reflects worldwide analog/mixed signal market
Security
Utilisation of
security and IP
protection strength
Medical
New CMOS
applications
CMOS Opto
Automotive
Automotive Certified
High Voltage LDMOS
Communication
RF applications
with high integration
Customer specific
processes
Consumer
Customer specific processes SoC, Technology Extensions
Various fabless companies
Industry/Energy
CMOS Opto
Power management
Aerospace
Radiation hard
150nm
Communication 26,6%
Consumer 51,6%
Industry/ Energy 1,7%
Automotive 2,1%
Medical 6,3%
Security 11,4%
Aerospace 0,3%
© 2010 LFoundry GmbH. All rights reserved.12
Outline
Company & Business Update
Foundry Service
Manufacturing
Technology
© 2010 LFoundry GmbH. All rights reserved.13
Prototyping Services
Full Mask Set
Full flexibility in timing and volume
Reasonable NRE cost
MLM (Multi Layer Mask)
Full flexibility in timing for small
volume production
Significantly reduced NRE costs
MPW (Multi Project Wafer)
Ideal solution for prototyping and low
volume production
Lowest NRE costs
Monthly MPW runs for every PDK technology
Flexible Manufacturing options with superior price performance
© 2010 LFoundry GmbH. All rights reserved.14
LFoundry Customer's Timing
Advantage
© 2010 LFoundry GmbH. All rights reserved.15
LFoundry EDA
© 2010 LFoundry GmbH. All rights reserved.16
Outline
Company & Business Update
Foundry Service
Manufacturing
Technology
© 2010 LFoundry GmbH. All rights reserved.17
Manufacturing Facts
16000 m² class 1 clean-room
32000 wafer starts per month
Automatic transportation system
Automatic Recipe Download
EDP Lot Dispatch System
98% yield performance
fast cycle time: 1.2dpm
© 2010 LFoundry GmbH. All rights reserved.18
Key Performance Data
Benchmark line speed as key
enabler for time to market
Excellent process yield performanceas key enabler for cost efficiency
© 2010 LFoundry GmbH. All rights reserved.19
Quality Assurance
Certification:
QMS & Automotive QS9000 (TS 16949)
Environment (ISO 14001)
Smart Card Security ISO15408
Standard:
JEDEC JP001.01 Level 1 wafer level reliability performed by LFoundry
(<10ppm fails; 10 years; max. temp. 125°C) Level 2 device level reliability performed by our customers
AEC Automotive Electronics Council Q100 Ref-FGrade 0 -40°C to 150°C under preparationGrade 1 -40°C to 125°C preparedGrade 2 -40°C to 105°C
Initially LFoundry developed the LF150 (0.15µm) technology, which is again based on the long time experienced similar RENESAS process (Secure MCU / Automotive).
© 2010 LFoundry GmbH. All rights reserved.20
Outline
Company & Business Update
Foundry Service
Manufacturing
Technology
© 2010 LFoundry GmbH. All rights reserved.21
Foundry Technology Roadmap
Strong development force for innovative technology applications
© 2010 LFoundry GmbH. All rights reserved.22
Voltage domains
Core MOS
Common voltage1.8V low leak
HVMOS – LDMOS
1.8V high speed3.3V
5V
8V
40V
60V
80V
>100V
•Home Entertainment
•Medical appliances
•Power devices
•Automotive Electronics
•Energy Harvesting
•Consumer Electronics
•Mobile Systems
•Aerospace
•Industrial
characterised
at 1.2V
ultra low leak
digital lib
(in discussion)
1.2V core
2.5V
3.3V
5V
1.2V low Vt
1.2V high Vt
© 2010 LFoundry GmbH. All rights reserved.23
LF150 Modularisation
© 2010 LFoundry GmbH. All rights reserved.24
0.15µm Foundry Technology
Poly-, Metal- and Diffusion Resistors
MIM Capacitors
Diodes
NPN-Bipolartransistor (within the standard CMOS
Process), PNP with C on ground
RF-Devices like Transistors, Resistors,
Capacitors, Inductors and Varactors
GPIO library 3.3V, 1.8V and 5V
Full Analog PDK for Cadence Virtuoso 6.1.x
Full Analog PDK for Tanner including >20 digital
standard cells
Digital standard cells library (>400 cells for low
power and high performance applications)
prepared for Cadence, Mentor and Synopsys
Gate-Density 110 kGates/mm²
Variety of memory options: SRAM, OTP, NVM
Constantly incrasing IP Portfolio: µController,
ADC, LDO, POR, OTA, Bandgap, Charge Pump,
Interface buses, …
… integrated into the user-friendly, all-in-one Process Design Kit (PDK)
LF150 is a 0.15µm modular CMOS process:
- 19 Mask for standard Process
- shallow trench isolation (STI)
- deep N-Well (NISO)
- 1-2 Poly layers
- gate oxide thickn.[nm]: 2.8/6.8/16.0
- cobalt salicidation
- up to 6 level of Al (330nm, 800nm)
- extra Thick Top Metal (2-6µm Al)
intermetal dielectric: HDP
Core voltage: 1.8V
Design rules:
- Physical Gate length: 150nm
- Contact/Via size: 180/240nm
- Metal pitch: 0.48µm
MOS Transistors:
- 1.8V low leakage NMOS/PMOS
- 1.8V high speed NMOS/PMOS
- 3.3V NMOS/PMOS
- 5V NMOS/PMOS
© 2010 LFoundry GmbH. All rights reserved.25
0.15µm Foundry Technology
© 2010 LFoundry GmbH. All rights reserved.26
IP Portfolio
LFoundry and our worldwide partners offer a top class Intellectual Property (IP) Portfolio to
support the design needs of our customers. With our long time experience we offer on the one
side proven IP to accelerate customers time-to-market, on the other side LFoundry support by
creating customised IP in time with outstanding quality.
Memory IPSRAM (Mobile Semi)
EEPROM (LFoundry)
Flash (SST)
OTP (NSCore)
MTP (NSCore)
Cell Librarylow leak standard library
high speed standard library
elements such as Buffer,
Latches, Flip-Flop, Physical
Delay, Tristate, ...
Mixed-signal IPsADC, DAC, LDO, PLL, Bandgap,
Bias Generator, Charge Pump,
Oscillator, OP Amps, OTA, POR, ... Cores8051 until high end
8b to 32b also as RISC
low leak to high performance
well known partners as
COrtus, Ensilica, Evatronix,
Innopower, ...
InterfacesGPIO library, Serial,
SPI Interface bus, I2C,
USB, ...
Detectors / Securitytemperature sensor, AES/DES, ...
... whatever you need for your SOC,
we have it
© 2010 LFoundry GmbH. All rights reserved.27
aSi
LFoundry Technology Extensions -CMOS-based MEMS Processing
Tapered processing
5µm
Thick metalThick layer processing (AlCu up to 7µm, resist up to10µm)
Special Polymer processing (IVD, PBO, …)
Stress engineering (for various materials: nitrides, …)
Strongly tapered processing / etching profiles
Sacrificial layer process (oxide, a-silicon)
Backside processing (PVD, PECVD, Implant, …)
© 2010 LFoundry GmbH. All rights reserved.28
LFoundry Technology Extensions -Opto CMOS Processing
High sensitivity photosensors, integrated in CMOS
light exposure from backside, enabled
through LFoundry backside
& thin wafer processing
CMOS based Optofilter
customized wavelenth filter thru modified
structured layers integrated in CMOS
for i.e. multi spectral cameras,
ambient light sensors, …
CMOS Imager for special applications
MBPD (modified buried photo-diode)
for l = 450-1100nm
Focus on spezialized applications,
i.e. large image sensors with
stitching requirementsStandard, high volume
Light sensors
© 2010 LFoundry GmbH. All rights reserved.29
Conclusion
LFoundry is
the reliable, fast and flexible customer-specific manufacturer of choice,
providing leading-edge specialized technology capacity,
advanced analog and mixed-signal process technologies and
“Sicherheit” reliability, security and protection for customers, their designs and IP.