jet stream opening toward theconductive circuit opposite the jetstream opening for electroplatingto form the bump contact point onthe surface of the conductive cir­cuit.

UV-CUIIABU POWDER coan_u.s. Patent 6,017,593. Jan. 25, 2000A.T. Daly et al., assignors to MortonInternational Inc., Chicago

A method for producing a coatinghaving either a high or low glossappearance from a UV-curablepowder coating.

.DA' , "A'IIOII OPTHIID-DI......... MATERIALSU.S. Patent 6,017,613. Jan. 25, 2000T.R. Baum et al., assignors toInternational Business MachinesCorp., Armonk, N. Y.An electronic circuit package com­prising a three-dimensional sub­strate including a circuitized di­electric and one or more,selectively metallized three-di­mensional cone-shaped projec­tions disposed on the surface ofthe dielectric.

DUAL THEIIIIAL AND UV-CURABLEPOWDER COAnNGSU.S. Patent 6,017,640. Jan. 25, 2000J. Muthiah et al., assignors toMorton International Inc., Chicago

An opaquely pigmented dual ther­mal and ultraviolet-curable powdercoating composition, which is ablend of an unsaturated resin se­lected from unsaturated polyacry­lates, unsaturated polymethacry­lates, and mixtures thereof;between 0.1 and 10 phr of a photo­initiator selected from a photolyti­cally activated free radical generat­ing compound; between 0.1 and 10phr of a thermal initiator selectedfrom a thermally activated freeradical generating compound; and,between 1 and 100 phr of an opaci­fier selected from pigments, fillers,and mixtures thereof, in which thecomposition is essentially fully cur­able, both on the surface andthroughout, with combined ther­mal and UV radiation cure.

HOT-DIP ALU.INIZED STEEL SHEETU.S. Patent 6,017,643. Jan. 25, 2000M. Kobayashi et al., assignors to

Nisshin Steel Co. Ltd., Tokyo

A hot-dip aluminized steel sheetcomprising a base-metal steelsheet; an AI-Si coating-metallayer having an Si content of 3 to13%; and an Fe-AI-Si alloylayer, formed between the base­metal steel sheet and the Al-Sicoating-metal layer.

PLATED LEAD FRAMEU.S. Patent 6,017,777. Jan. 25, 2000J. Kim et al., assignors to SamsungAerospace Industries Ltd.,Kyongsangnam-do, Rep. of Korea

A method of forming a platinglayer of a lead frame having ananticorrosive property comprisingsequentially plating at least aportion of a lead frame with anickel or nickel alloy and a palla­dium or palladium alloy; firstheating the plated portion of thelead frame to a first temperaturefor a predetermined amount oftime; and second heating the firstheated plated portion of the leadframe to a second temperaturehigher than the first temperature.

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