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jet stream opening toward the conductive circuit opposite the jet stream opening for electroplating to form the bump contact point on the surface of the conductive cir- cuit. UV-CUIIABU POWDER coan_ u.s. Patent 6,017,593. Jan. 25, 2000 A. T. Daly et al., assignors to Morton International Inc., Chicago A method for producing a coating having either a high or low gloss appearance from a UV-curable powder coating. .DA' , "A'IIOII OP THIID-DI......... MATERIALS U.S. Patent 6,017,613. Jan. 25, 2000 T.R. Baum et al., assignors to International Business Machines Corp., Armonk, N. Y. An electronic circuit package com- prising a three-dimensional sub- strate including a circuitized di- electric and one or more, selectively metallized three-di- mensional cone-shaped projec- tions disposed on the surface of the dielectric. DUAL THEIIIIAL AND UV-CURABLE POWDER COAnNGS U.S. Patent 6,017,640. Jan. 25, 2000 J. Muthiah et al., assignors to Morton International Inc., Chicago An opaquely pigmented dual ther- mal and ultraviolet-curable powder coating composition, which is a blend of an unsaturated resin se- lected from unsaturated polyacry- lates, unsaturated polymethacry- lates, and mixtures thereof; between 0.1 and 10 phr of a photo- initiator selected from a photolyti- cally activated free radical generat- ing compound; between 0.1 and 10 phr of a thermal initiator selected from a thermally activated free radical generating compound; and, between 1 and 100 phr of an opaci- fier selected from pigments, fillers, and mixtures thereof, in which the composition is essentially fully cur- able, both on the surface and throughout, with combined ther- mal and UV radiation cure. HOT-DIP ALU.INIZED STEEL SHEET U.S. Patent 6,017,643. Jan. 25, 2000 M. Kobayashi et al., assignors to Nisshin Steel Co. Ltd., Tokyo A hot-dip aluminized steel sheet comprising a base-metal steel sheet; an AI-Si coating-metal layer having an Si content of 3 to 13%; and an Fe-AI-Si alloy layer, formed between the base- metal steel sheet and the Al-Si coating-metal layer. PLATED LEAD FRAME U.S. Patent 6,017,777. Jan. 25, 2000 J. Kim et al., assignors to Samsung Aerospace Industries Ltd., Kyongsangnam-do, Rep. of Korea A method of forming a plating layer of a lead frame having an anticorrosive property comprising sequentially plating at least a portion of a lead frame with a nickel or nickel alloy and a palla- dium or palladium alloy; first heating the plated portion of the lead frame to a first temperature for a predetermined amount of time; and second heating the first heated plated portion of the lead frame to a second temperature higher than the first temperature. The Advanced Advantage ... -.act • 1.Iw cost • .., ..... • Syst. 1IMlrs • FIIJ .... • __ EIistilI SJs'- ·GIInIteed CUIIIIla [. ADVANCED CHEMICAL SYSTEMS INC. 2612 South Greeley. Milwaukee, WI 53207 14141 486-0528 Fax 14141 486-0529 E-mail: tOfT1Oadvancedchemsys.com Website: www.advancedchemsys.com Mention Ad • Rec:eItIe Free T1Ntment Anatvsls Circle 092 on reader information card 114 Hundreds of Finishes in Stock for Immediate Delivery! Prompt Service Wme or Call for FREE Brocnure Il.fI!!l!tlleft CARLSTADT, NJ 07072 Phone: 201·438·3700 •F.. : 201-438·4231 Circle 056 on reader information card Metal Finishing
