Performance Characterization of a
450mm Wafer handling System:
Test Methods & Analysis Ghulam Mustafa
January 23, 2013
Measurement Conditions
© 2011 Crossing Automation - CONFIDENTIAL 2
Today’ Agenda
System Description
Modular Approach for Characterization
Summary of Module Test Results
System Summary
General Approach for System Test
Measurement Conditions
© 2011 Crossing Automation - CONFIDENTIAL 3
Fan Filter Unit
Mini
Environment
Pre
Aligner Robot
Load Ports
450mm Wafer Handling System
Control System + Electronics
450mm Performance / Reliability
The Modular Approach
© 2011 Crossing Automation - CONFIDENTIAL 4
450mm System
Performance
FFU
Characteristics Mini
Environment
Wafer
Handling
Robot
Load
Port
Pre
Aligner
Vibration / Resonance
Noise / Acoustics
Air Flow Velocity Distribution
Static Pressure / Fan Speed
Airborne Particles
Recovery Time
Tuning
Vibration / Dynamics
Repeatability
Particle Contribution
Reliability
Reliability
Motion Time
Vibration
Particle Contribution
Tuning
Vibration / Dynamics
Repeatability
Particle Contribution
Reliability
System
Frame Vibration
PWP
Wafer Placement
Throughput
Reliability
Completed
Preliminary/ Need More Data
Planned
Example
© 2011 Crossing Automation - CONFIDENTIAL 5
Acoustics & Vibes
(Comparison, PWM=8)
Befo
re
Aft
er
FF
U
Ch
ara
cte
ris
tic
s
6
Befo
re
Aft
er
Fan Speed Vibration
Fan Speed
FF
U
Ch
ara
cte
ris
tic
s
© 2011 Crossing Automation - CONFIDENTIAL 7
Before After
Small Peaks at Higher RPM
Vibration Spectrum F
FU
Ch
ara
cte
ris
tic
s Resonant
Peaks
© 2011 Crossing Automation - CONFIDENTIAL 8
Acoustics v RPM *
* Data collected at inlet of the fan 50mm above inlet
Nominal
Operating
Range
(61-66dB)
Low Speed (61dB)
High Speed (68dB)
max
max
FF
U
Ch
ara
cte
ris
tic
s
Velocity Distribution
Top Plane*
© 2011 Crossing Automation - CONFIDENTIAL 9
Overall
Mean=81.2 ft/m
Std=13.9
Uniformity=82.9%
* Measurement done @ p=0.0128’’ H2O
Min
i
En
vir
on
me
nt
450 Spartan Mini Environment Pressure v Velocity
© 2011 Crossing Automation - CONFIDENTIAL 10
80
858585
85
85 85
85
85
8585
909090
9595
95
100100
100
90 90
105105
105
90
90
95
80
100
110
10 20 30 40 50 60
20
40
60
80
100
120
140
160
0.0182
0.0182
0.01820.0182
0.0184
0.0
18
4
0.01840.0184
0.0
18
4
0.0184
0.0184
0.0184
0.0184 0.01860.0186
0.0186
0.0186
0.01880.0188 0.0190.0192
10 20 30 40 50 60
20
40
60
80
100
120
140
160
Pressure (inch H2O) Velocity (ft/m)
Pressure Probe
Velocity Probe
Pressure versus Velocity M
ini
En
vir
on
me
nt
Particle Measurements
© 2011 Crossing Automation - CONFIDENTIAL 11
Initial Reading
(Wipe Down)
FFU On
(w/o Robot Cycling)
FFU On
(Robot Cycling)
(Opened port 1 time)
FFU On
(Stopped Cycling)
FFU On
(Robot Cycling)
Airborne Particles
Recovery
Min
i
En
vir
on
me
nt
Aligner
Robot
Tool Station
Location 1 Location 2
Airborne Particles
Recovery
© 2011 Crossing Automation - CONFIDENTIAL 12
Test#1
Clean System
Turn Probe on
Turn FFU @ full speed
Collect for 30min
Test#2
Stop FFU
Turn Probe on
Start FFU @ full speed
Collect for 15min
Test#3
Stop FFU
Turn Probe on
Turn FFU @ full speed
Start 25 Cycles (A,B,D,WE,Aligner)
Collect Data
Test#4
Repeat Test #3
Recovery Time
Min
i
En
vir
on
me
nt
Airborne ISO Class 1 Testing
Probe Locations
© 2011 Crossing Automation - CONFIDENTIAL 13
D C B A
1
2
34 5
6
7
9 10
8C1
C2
C3
C4
D C B A
1
2
34 5
6
7
9 10
8C1
C2
C3
C4
Front
Back
Locations 1, 2, 3, 4, 5, 8, 9, 10, C1, C3,C4 positioned 5 inches below the
bottom edge of the FOUP doors (when closed).
Locations 6 ,7 positioned ¼ inch below the top cover of the pre-aligner.
Location C2 positioned 1 inch below the top cover of the pre-aligner.
1
7Min
i
En
vir
on
me
nt
© 2011 Crossing Automation - CONFIDENTIAL 14
Airborne ISO Class 1 Testing
100nm
0.0
0.1
0.2
0.3
0.4
0.5
0 1 2 3 4 5 6 7 8 9 10
Pa
rtic
les ≥
100
nm
pe
r C
ub
ic M
ete
r of
Air
0.0
3.5
7.1
10.6
14.1
17.7
10.0 0.283
Pa
rtic
les ≥
100
nm
pe
r C
ub
ic F
oo
t of
Air
ISO 14644 Class 1 (at 100 nm) Limit
Measurement Location (See Section V.A.)
Figure 1. Particles ≥ 100 nm per Unit Volume Versus Measurement Location, Compared to the
ISO 14644 Class 1 Limit.
Robot movement is shown
in Section V.D.
Plotted points are means
taken from Table 1
= main test at 0.012 inches of water. Sample
volumes met the minimum sampling volume
requirement of ISO 14644. See Appendix A.
= confirming test. Sample volumes were
either 3 or 6 cubic feet.
0.0
0.1
0.2
0.3
0.4
0.5
0 1 2 3 4 5 6 7 8 9 10
Pa
rtic
les ≥
100
nm
pe
r C
ub
ic M
ete
r of
Air
0.0
3.5
7.1
10.6
14.1
17.7
10.0 0.2830.283
Pa
rtic
les ≥
100
nm
pe
r C
ub
ic F
oo
t of
Air
Pa
rtic
les ≥
100
nm
pe
r C
ub
ic F
oo
t of
Air
ISO 14644 Class 1 (at 100 nm) LimitISO 14644 Class 1 (at 100 nm) Limit
Measurement Location (See Section V.A.)
Figure 1. Particles ≥ 100 nm per Unit Volume Versus Measurement Location, Compared to the
ISO 14644 Class 1 Limit.
Robot movement is shown
in Section V.D.
Plotted points are means
taken from Table 1
Plotted points are means
taken from Table 1
= main test at 0.012 inches of water. Sample
volumes met the minimum sampling volume
requirement of ISO 14644. See Appendix A.
= confirming test. Sample volumes were
either 3 or 6 cubic feet.
= main test at 0.012 inches of water. Sample
volumes met the minimum sampling volume
requirement of ISO 14644. See Appendix A.
= confirming test. Sample volumes were
either 3 or 6 cubic feet.
Min
i
En
vir
on
me
nt
© 2011 Crossing Automation - CONFIDENTIAL 15
Airborne ISO Class 1 Testing
10nm (Extended)
0
5
10
15
20
25
30
35
40
C1 C2 C3 C4
0
177
353
530
707
883
1060
1236
1413
Pa
rtic
les
≥10
nm
pe
r C
ub
ic M
ete
r of
Air
Pa
rtic
les
≥10
nm
pe
r C
ub
ic F
oo
t of
Air Extended ISO Class 1 (at 10 nm) limit1200 34
Robot movement is shown
in Section V.D.
Figure 2. Particles ≥ 10 nm per Unit Volume Versus Measurement Location, Compared to the
Extended ISO Class 1 Limit (at 10 nm).
Plotted points are means
taken from Table 2
Measurement Location (See Section V.A.)
= pressure at +0.012 inches of water
= pressure at +0.017 inches of water
0
5
10
15
20
25
30
35
40
C1 C2 C3 C4
0
177
353
530
707
883
1060
1236
1413
Pa
rtic
les
≥10
nm
pe
r C
ub
ic M
ete
r of
Air
Pa
rtic
les
≥10
nm
pe
r C
ub
ic F
oo
t of
Air
Pa
rtic
les
≥10
nm
pe
r C
ub
ic F
oo
t of
Air Extended ISO Class 1 (at 10 nm) limitExtended ISO Class 1 (at 10 nm) limit1200 3434
Robot movement is shown
in Section V.D.
Figure 2. Particles ≥ 10 nm per Unit Volume Versus Measurement Location, Compared to the
Extended ISO Class 1 Limit (at 10 nm).
Plotted points are means
taken from Table 2
Plotted points are means
taken from Table 2
Measurement Location (See Section V.A.)
= pressure at +0.012 inches of water
= pressure at +0.017 inches of water
Min
i
En
vir
on
me
nt
Robot Tuning
© 2011 Crossing Automation - CONFIDENTIAL 16
Tuned all axes of the 450 Wafer Engine with Elmo Controller
Upper End Effector Lower End Effector Wa
fer
Ha
nd
lin
g R
ob
ot
End Effector Modal Test (Impact Test)
© 2011 Crossing Automation - CONFIDENTIAL 17
Bending
Mode
The Other
Two Modes
Wa
fer
Ha
nd
lin
g R
ob
ot
End Effector Vibration Test (Cycle Test)
© 2011 Crossing Automation - CONFIDENTIAL 18
Wa
fer
Ha
nd
lin
g R
ob
ot
Definition of Repeatability
Repeatability is calculated by measuring the robot position
error when returning to a taught point. This error is the radial
distance from the previous point to the current point at which
the end effector settles
Taught Position
Good Bad
0
1
2
3
4
5
0 5 10 15 20 25 30
N
R
0
1
2
3
4
5
0 5 10 15 20 25 30
N
R
© 2011 Crossing Automation - CONFIDENTIAL 19
Wa
fer
Ha
nd
lin
g R
ob
ot
Measurement and Analysis
Image Recognition/ Data Display / Storage
Robot Target
Camera
XY Coordinates Repeatability Histogram
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
9.9449441
7.2752085
0.3905537
10.713102
9.176786
347
Moments
© 2011 Crossing Automation - CONFIDENTIAL 20
6s=+/- 21.8 m
(99.99966%)
Wa
fer
Ha
nd
lin
g R
ob
ot
Axis Repeatability (EE1 / EE2)
© 2011 Crossing Automation - CONFIDENTIAL 21
6s=+/- 25 m 6s=+/- 16 m
EE
1
EE
2
Wa
fer
Ha
nd
lin
g R
ob
ot
Axis Repeatability (Z / Theta)
© 2011 Crossing Automation - CONFIDENTIAL 22
6s=+/- 21 m 6s=+/- 22 m
Z
Th
eta
Wa
fer
Ha
nd
lin
g R
ob
ot
450mm Load Port System
450 Load Port
500,000 MCBF
Horizontal
Drive
3.57M
Vertical
Drive
2.50M
FOUP
Advance
3.57M
APHD
2.27M
Latch
Keys
5.55M
PCB
Assembly
25M
Control
System
8.33M
Flex Cable
Motor
PCBA
Cam Followers
Lead Screw
Linear Bearing
Flex Cable
Motor
Belt
Brake
PCBA
Linear Bearing
Protrusion
Sensors
FOUP
Placement
Switch
Motor Rack
Drive
Presence
Receiver
Brake
Flex Cable
PCB (K-Plate)
Motor
Sensors
Cam
Cam Bearing
Spring
Motors
Sensors
PCB Door
Node
Arm Alignment
Motor
Sensors
PCB Door Node
Twist and Pull
Latch Key
Alignment
Wafer
Mapper
3.84M
LEDs
Protrusion
Sensor
PCB LED
Presence
Sensor/Emitter
CPU
Link Manager
Home Sensors
Protrusion
Sensor
RFID
SEN Board
Lo
ad
Po
rt
450mm Load Port System – Simulated
Population Statistics*
450 Load Port
500,000 MCBF
Horizontal
Drive
3.57M Vertical
Drive
2.50M FOUP
Advance
3.57M
APHD
2.27M
Latch
Keys
5.55M
PCB
Assembly
25M
Control
System
8.33M
Wafer
Mapper
3.84M
MCBF>500k
MCBF<500k
MCBF=500k
* Based on exponentially distributed time to failure
Lo
ad
Po
rt
System Reliability Demonstration Plan*
476k-606k
3 units 2+ units
• Based on exponentially distributed time to failure
• 2,500 cycles / day / unit +/- 10% variability
• Zero failures
831k-976k Lo
ad
Po
rt
450 Load Port Reliability Test Update L
oa
d P
ort
Wafer Placement Repeatability
© 2011 Crossing Automation - CONFIDENTIAL 27
Total Repeatability (um)
XY-Coordinates 100um
Sys
tem
x
y
Wafer Placement Repeatability
Statistics
© 2011 Crossing Automation - CONFIDENTIAL 28
Sys
tem
6s=+/- 62 m
Wafer Placement: Patterns in Data
100um
Ext
PRE Theta
-4
-3
-2
-1
0
1
2
3
Pri
n 2
1
23
4
5
6
xy
-10 -8 -6 -4 -2 0 2 4
Prin 1
25
35
45
55
65
75
Mean o
f r
33 66 99 132 165 198 231 264 297 330 363 396 429 462
Sample
Extension
Pre-aligner
Theta
Theta
Wafer Placement
“Potential” of the System
40 50 60
© 2011 Crossing Automation - CONFIDENTIAL 29
© 2011 Crossing Automation - CONFIDENTIAL 30
Frame Vibration
RMS=0.0007g Load Port D
RMS=0.0006g On Frame
(near ground)
Sys
tem
Throughput Measurement Test Setup
© 2011 Crossing Automation - CONFIDENTIAL 31
Tool
Station
Aligner
Load Port
A
Load Port
B
Load Port
C
Load Port
D
Wafer Cycle
Definition
25
20
15
10
5
1
Wafer Slot Allocation
Wafer Cycle
1) Each wafer was cycled 100 times
2) Each wafer was picked / placed at the same slot
3) Time for each wafer was recorded from pick from the FOUP
to put in the same FOUP (this resulted in a time distribution for each slot)
4) Single Wafer Pick and Place
Sys
tem
Wafer cycle Time : Slot v Load Port (A/B)
© 2011 Crossing Automation - CONFIDENTIAL 32
Time distribution
for each slot
Sys
tem
Wafer cycle Time : Slot v Load Port (C\D)
© 2011 Crossing Automation - CONFIDENTIAL 33
Sys
tem
Load Port Time Distribution : Load Port A
© 2011 Crossing Automation - CONFIDENTIAL 34
Seconds
Sys
tem
Cycle Time v Throughput: Port A v B
© 2011 Crossing Automation - CONFIDENTIAL 35
Sys
tem
Cycle Time v Throughput: Port C v D
© 2011 Crossing Automation - CONFIDENTIAL 36
Sys
tem
System Throughput / Statistics*
© 2011 Crossing Automation - CONFIDENTIAL 37
Wafer Cycle
D
C Throughput=125+/-8 wph
FOUP D
FOUP C
FOUP D
FOUP C
Sys
tem
* Data collected during marathon
Throughput v Cycle Time
© 2011 Crossing Automation - CONFIDENTIAL 38
Sys
tem
Particle / Wafer Pass - PWP
© 2011 Crossing Automation - CONFIDENTIAL 39
1 cycle = 3 minutes and 31 seconds
(300mm wafer will not be aligned or placed on the 450mm aligner)
Send “Open” Command 300mm Falcon Load Port (This will remain open until cycle is test is
complete)
Cy
cle
1. Open 450mm Load Port D
2. Wafer Engine Transfers All 300mm Wafers in Falcon LP to aligner then to
450mm Spartan Load port D. Wafer is not aligned.
3. Closes 450mm Spartan Load port D
4. Open 450mm Spartan Load port D
5. Wafer Engine Transfers All 300mm Wafers in 450mm Load port D to
aligner then to Falcon LP. Repeat steps one through five until ready to scan
wafers
Send “Close” Command 300mm Falcon Load Port. This will complete cycling and will be taken
to SP1 for particle analysis.
Setup
Cycle Definition Scan
Sys
tem
Summary of Data
Test 1 Test 2 Test 3 Test 4 Test 5
Cumulative
0 Cycles 1 Cycles 239 cycles 406 cycles 1515 cycles
Total
Particles
Particles
Added
Total
Particles
Particles
Added
Total
Particles
Particles
Added
Total
Particles
Particles
Added
Total
Particles
Particles
Added Total Particles PWP
Wafer 1 3 0 3 0 4 1 6 2 19 13 16 0.01056
Wafer 2 12 0 12 0 14 2 19 5 26 7 14 0.00924
Wafer 3 11 0 11 0 13 2 14 1 16 2 5 0.0033
Wafer 4 8 0 9 1 9 0 9 0 82 73 74 0.04884
Total
Particles 34 0 35 1 40 5 48 8 143 95 109 0.07195
Min 3 0 3 0 4 0 6 0 16 2 5 0.0033
Max 12 0 12 1 14 2 19 5 82 73 74 0.04884
Average 432.8 0 8.75 0.25 10 1.25 12 2 35.75 23.75 27.25 0.01799
© 2011 Crossing Automation - CONFIDENTIAL 40
Particle / Wafer Pass – PWP Result S
ys
tem
Wafer Engine Repeatability E1/E1 +/-25um (6 sigma)
Z +/-21um (6 sigma)
Theta +/-22um (6 sigma)
Wafer Placement +/-62um (6 sigma)
Mini Environment ISO Class 1 Met
Extended Class 1 Met
Recovery Time <5min
Air Velocity 82fpm @ 0.012”H2O
FFU Noise <68dB (full speed)
Static Pressure 0.018”H2O @ 85% full speed
Load Port Reliability 500k MCBF @ 80% CL
System Frame Vibration <0.0007g RMS
PWP <0.02 @ 0.12um
[Throughput]* 128 wph (EFEM Single Wafer Transfer)
Performance Summary
© 2011 Crossing Automation - CONFIDENTIAL 41
System Performance Characterization
General Approach
© 2011 Crossing Automation - CONFIDENTIAL 42
System
Performance
Functional
Module #1
System
Completed
Preliminary/ Need More Data
Planned
Functional
Module #2
Functional
Module #n
Module
Characteristics
Vibration
Dynamics
Tuning
Repeatability
Cycle Time
Particle Contribution
Reliability
Status
Module Test Plan
Measurement / Analysis
Summary of Results
System
Characteristics
Wafer Placement
PWP
Throughput
Reliability
System Test Plan
Measurement / Analysis
System Spec Validation
Module
DVT Plan /
Results
System EDS
End