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Located just an hour outside of the busiest container port on earth,
Sanmina’s Wuxi facility puts the world at your fingertips. This
500,000-square-foot facility specializes in high-mix, low- to medium-volume
production of doubled-sided and multi-layer PCBs. Technologies include
Buried Capacitance®, microvias, blind and buried vias, laser direct imaging
and sequential lamination.
Our Wuxi facility delivers reliable product life cycle services—from
design and value engineering to volume production—to such industries as
communications, enterprise computing and storage, medical, industrial
and automotive.
To learn more, visit our website at www.sanmina.com.
Specializing in low- to medium-volume, high mix printed circuit board manufacturing.
Manufacturing capabilities• Layers—up to 24• Board thickness—0.020” to 0.175”• 10:1 aspect ratios• Controlled impendence• Differential impendence• POFVengineering capabilities• Design for Manufacturability (DFx)• Front-end tooling• Value engineeringtesting capabilities• Electrical test by universal or dedicated fixture• Surface insulation resistance (SIR)• Liquid-to-liquid temperature cycling• Solvent extract conductivity• AOItechnologies• HASL• OSP (Entek plus HT)• Immersion tin• Immersion silver• Electrolytic nickel/goldlogistics services• Consignment
• Warehousing
• Customer service supportcertifications• ISO 14001• ISO 9001:2000• Telcordia compliance• TL 9000• TS 16949• UL approved• Telcordia GR-78-CORE
wuxi, china pcb fabrication
© 2013 Sanmina Corporation. Sanmina is a trademark or registered trademark in the U.S. and/or other jurisdictions of Sanmina Corporation. All trademarks and registered trademarks are the property of their respective owners.
