CYCLONE - CARTRIDGE - ELECTROSTATICSOD mS800 CFM's

DUST - SMOKE - FUME - MISTCOLLECTORS

conditioning means includesmake up means for adding elec­troless plating ingredients to keepthe plating ingredients in the so­lution properly in balance.

CLlANING IUCTIIONIC HAIIDWARtCOMPONINTSu.s. Patent 5,865,902. Feb. 2, 1999B.S. Yam and K.S. CoLbert,assiJ(nors to Church & Dwight Co.Inc., Princeton, N.J.

A blast medium for cleaning elec­tronic hardware comprising wa­ter-soluble alkaline metal saltabrasive particles having a parti­cle size of at least 20 microns butnot more than 300 microns and aMohs hardness of no greater than5.0; a chloride content of no morethan 100 ppm; a chemical oxygen

demand orno more than 100 ppm;and a moisture content of no morethan 0.20% by weight, whereinthe blast medium is free of silicaand organic-containing flow aids.

...GNIITIION SPUnIRINtIAPPARATUSU.S. Patent 5,865,961. Feb. 2, 1999M. Yokoyama et aL., assignors toMatsushita ELectric Industrial Co.Ltd.• Kadoma, Japan

A method of magnetron sputter­ing comprising generating plasmain a vicinity of a plurality of an­nular flat targets; supplying elec­tric power to the targets; and gen­erating magnetic fields that formapproximately parallel to thefront surfaces of the targets andthat have approximately uniform

intensities with the magnets thatare located along the inner andouter circumferential edges of thetargets so as to distribute theplasma approximately uniformly.

~..APPARATUSU.S. Patent 5,865,969. Feb. 2, 1999P.J. Clarke, assignor to SputteredFilms Inc., Santa Barbara, Calif.

An apparatus for providing a con­trolled deposition on a substrateincluding means for providing arotation of the substrate on a par­ticular axis; a pair of anodes dis­posed on opposite sides of the par­ticular axis; a pair of targets eachassociated with an individual oneofthe anodes; means for introduc­ing inert gas; means for applyingan alternating voltage betweeneach individual one of the anodesand the associated one of the tar­gets to establish an electrical fieldfor a flow of electrons; and meansdisposed relative to the anodesand the targets for providing amovement of the electrons be­tween each anode and the associ­ated target through other than astraight line path to enhance theionization of the atoms of the in­ert gas and the emission of thesputtered atoms from such targetfor movement toward the sub­strate.

...GNIT S'IIIUC'IU. POll ... INSPUn'IIII_U.S. Patent 5,865,970. Feb. 2, 1999R.E. SteLter, assignor to PermagCorp., Fremont, CaLif.

A permanent magnet structure ina magnetron utilized in sputterdepositing of a target materialonto a substrate comprising a baseplate; and a central magnet struc­ture having a magnetic field orien­tation substantially parallel to thebase plate and target material.

~~ 1600 Douglas· Kalamazoo, MI· (616) 345·7151

Circle 029 on reader Information card

90

PLATING MITIIODU.S. Patent 5,865,976. Feb. 2, 1999H. Takeuchi et al., assignors to

Metal Finishing

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DeFe's'(o

the center of the workpiece whilesimultaneously causing theetchant to impinge upon the ro­tated workpiece so as to cause andvary the electrochemical etchingof the workpiece while moving thenozzle to obtain a predeterminedsurface profile.

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.....ACTAIIfSU.S. Patellt 5,866,005. Feb. 2. 1999J.M. DeSimone et al., assignors toThe University of North Carolina atChapel Hill, Chapel Hill. S.C.

A process for separating a con­taminant from a substrate thatcarries the contaminant compris­ing contacting with a carbon di­oxide fluid containing an am-

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• Rugged, tUlly electronic gagesnon-destructively measure coating thick·ness on Ferrous and Non·Ferrous metals

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IUCTIIOCHIIIICAI. DCII.NGAPPAIIA......U.S. Patent 5,865,984. Feb. 2, 1999W.E. Corbin Jr. et al., assignors toIBM Corp., Armonk, N. Y.

A method ofelectrochemically spi­ral etching a workpiece with anapparatus comprising a fixturefor holding a workpiece, a nozzlefor supplying an etchant, and anelectrode for applying a voltage tothe workpiece, the method com­prising rotating one of the work­piece and nozzle; applying a volt­age to the workpiece; and variablymoving the nozzle radially out­wardly from a position opposite

PosiTector'6000Series

Coating ThicknessGages for AI.l.Metal Substrates

through the electroplating bath toimpart rotation to another work­piece.

TOYoda Gosel Co. Inc., Aichi·ken,Japan

A method of making a structurecomprising a composite platingfilm disposed on a substrate com­Prising providing a substrate hav­ing at least a surface portionformed from at least one metallicbase material having at least onerecess therein; discharging a com­posite plating solution comprisingfirst ions of at least one metal,second ions of at least one memober selected from the group con­sisting ofat least one metal and atleast one metalloid, and insolubleparticles dispersed in the compos­ite plating solution from at leastone discharging device and im­pacting the discharged compositeplating solution to at least a bot­tom portion of the recess at a setflow rate; applying a voltage be­tween the substrate and the dis­charging device; and controllingthe flow rate of the dischargedcomposite plating solution duringat least a portion of the applyingstep to change the composition ofthe composite plating film.

"PIt.......... fOR IUCTIIOPLAn••U.S. Patent 5,865,979. Feb. 2,1999AL. Collins Jr. et al., assignors toThomas & Betts Corp., Memphis,Tenn.In a method of electroplating lon­gitudinally elongated workpiecesincluding the step of moving aworkpiece longitudinally and ro­tatably through an electroplatingbath, the improvement compris­ing positioning a plurality ofworkpieces in abutting uncon­nected end-to-end relationship toform a workpiece string; applyinglongitudinal pushing force on aninitial workpiece of the workpiecestring for continuously movingthe workpiece string longitudi­nally through the electroplatingbath; and longitudinally movinganother workpiece of the plurality

November 1991 91