1 11Santa Clara Valley Chapter, Components, Packaging and Manufacturing Technology
www.cpmt.org/scv
• •
• •
602604
608
606
610
612
518
522
520
516
502504
506
508
510
302304
310
312
314
306
308
202204
208
212
210
214
102104
108
112
110
114
106
3 Core Layers 10 Mask Layers Au Diaphragm Material
Non-Flow PrePreg gap material 2um Diaphragm Thickness 40um Condenser Plate Gap
X-Ray Cross-Section
Frequency (Hz)
Rela
tive
sig
nal (
dB)
Electronics Image sensor
Large diaphragms
Sensors -Active & Passive -Electrodes -Metals
Electronics -Thin Film -Organic
Power -Production -Storage -Management
Telemetry -Coupling to skin - Acoustic - Wireless
Materials -Substances -Packaging
Image credit: Adrienne Ho, Eugene Lee, Xiaolong Qiu