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1PFP MSR, 03/16/2010
Particles and Fields PackageMonthly Status Review (MSR)
March 16, 2010
Dave Curtis, PFP PM
2PFP MSR, 03/16/2010
SSL Contracting Status
• Phase RR contract mod funding provided should carry us through March.
• Phase B/C/D Contract negotiations still pending
3PFP MSR, 03/16/2010
Schedule Status
• Scheduler now working MAVEN part time– Expected to transition to full time this month.– She has started extracting instrument level schedules from the
master schedule• PFDPU schedule delivered
• Next key schedule milestone is finalizing parts lists by 4/15
4PFP MSR, 03/16/2010
Manpower
• Continue ramping up– Closing in on new hires
• SEP EE• Power Converter support• SWIA/STATIC additional ME support
• QA team is short– Ron Jackson still out due to injuries
• Return now no sooner than June– Meanwhile SSL QA team is stretched thin with current work
• Jorg Fischer is taking the lead for now– A QA Audit of SSL is planed for April, further stretching the team– Looking for short term help – have feelers out to local institutions
(LBNL, Stanford, etc).
• Scheduler full time this month!
5PFP MSR, 03/16/2010
Manpower [2]
• Thermal Support is thin– Having trouble getting enough attention from the Thermal
Engineer• He got sucked into SPP proposal work, which will delay delivery of
thermal models.– SWEA modeling of thruster heating mitigations, instrument
preliminary models coming due– Requested GSFC support (for SWEA thermal)
6PFP MSR, 03/16/2010
Accomplishments
• Developed Descope list with potential savings ROM• Provided first MICDs (LPW, EUV, SEP)• Provided draft connector list and pinouts, interacted with
LM on details• Provided purge requirements after encapsulation• More in instrument sections…
7PFP MSR, 03/16/2010
Ongoing Work
• Supporting Project planning process• Supporting EMC, Payload, SDT working groups• Supporting ICD development
– MICD development in progress
• Instrument specifications in review• Flight Software Requirements in review with instrument
leads– Level 5 specification in work
• MAIP telecon with Project QA pending• Parts selection and redesign to replace commercial with
high rel parts (mostly STATIC)• Started work of PFP FTA• MICDs and Thermal Models in work• Working with LM on LPW relocation to avoid thruster
heating
8PFP MSR, 03/16/2010
Ongoing Trades
• Second STATIC still under consideration– Alternative of keeping STATIC non-redundant involves added
risk, significant extra reliability analysis work which will have to start soon
• PFDPU form factor, number of boards– Determining optimum board size to minimize mass within system
design constraints– So far existing design not broken, but work not yet complete– An increase is possible as a number of boards are constrained
for space – would have a mass impact
9PFP MSR, 03/16/2010
Issues
• SEP FOV Issue (APP impingement)– Working with LM – longer APP boom improves the situation, but
things are still changing• SWEA Thruster, Aero heating
– LM Rotated SWEA boom back to 45 degrees to Sun line to limit thruster heating of SWEA
– Need to modify thermal characteristics of surfaces in SWEA aperture to avoid excessive heating - candidate solutions in work
• MAG issues meeting requirements with proximity to solar array– Juno qual panel tests indicates we have a problem– LM Palo Alto layups even worse– Magnetics Working Group considering options
• LPW boom thruster heating– Working to model heating, find a cooler location
10PFP MSR, 03/16/2010
Issues [2]
• PFP SSL Parts costing at GSFC is significantly higher than planned– Most of the difference is in radiation testing– Need to decide on project policy for ELDRS (significant cost,
questionable value added)– We should consider moving some radiation testing back to SSL
• High rate TID for parts SSL has ability to perform adequate functional testing
• SEL testing @ LBNL• Significantly cheaper than current GSFC estimate
11PFP MSR, 03/16/2010
Top Risks
New: P10
MAVEN PFP RISK MANAGEMENT Chg RANK ID Approach TITLE
* 1 P-10 Watch Operational Heaters
55 10 15 20 25
2 P-04 Research Solar Array Magnetics
44 8 12 16 20
3 P-01 Watch SSL Manpower
33 8 9 12 15
4 P-03 Watch Technical Resource Margins
22 4 6 8 10
5 P-02 Watch SSL MAIP, SDP
11 2 3 4 5
* 6 P-09 Watch STATIC Reliability
1 2 3 4 5
Criticality Approach
High
Medium
Low
LIKELIHOOD
Improved
Worsening
Unchanged
New this month
Mitigate
Watch
Accept
Research
CONSEQUENCES
L * C Trend
*
P1
P2
P4
P3
P10P9
12PFP MSR, 03/16/2010
Risk List [1]
ID Title Type P I Crit Risk Statement Impact Term Plan Approach Comments
P-01 SSL ManpowerProject
Execution3 3 M
Delays in RBSP leads to manpower conflicts at SSL
Schedule erosion, cost to recover
Mid Term
Hire new people to take routine tasks off key personnel
Watch Review in March 2010Add extra Power Converter person 1/2010Add extra ME 2/2010Ongoing QA problem
P-02 SSL MAIP, SDPProject
Execution4 2 M
Disconnects between MAR and SSL MAIP or Software Development Plan result in cost increases, potential technical risk due to distraction of key personnel
Cost Mid Term
SSL MAIP, SDP review by Project
Watch Pending Project Meeting to resolve review comments
P-03Technical Resource Margins
Project Execution
2 4 M
Requirements flowdown and preliminary design results in instrument resource growth
Mass, Power Mid Term
Proceed with specifications and design, watch resource requirements
Watch
P-04Solar Array Magnetics
Mission Performance
3 4 M
Proximity of MAG sensor to solar arrays results in not meeting the magnetics requriements
Magnetics [MRD84]
Near Term
Analyze Juno test panel performance. Consider ways to increase distance between MAG and cells
Research Magnetics Working Group working on options
P-05 Sun in SEP FOVMission
Performance2 3 L
Sunlight in SEP FOV can damage the detector
Loss of part of the SEP measurement
Far Term
Design sun safing into spacecraft and instrument
Mitigate Mitigation scheme not fully defined
P-06HV Arc during
deep dipMission
Performance2 3 L
HV discharge in SWEA, SWIA, or STATIC during deep dip
Potential loss of instrument
Far Term
Power off instrument HV for deep dip or when pressure exceeds threshold or in SAFE mode
Research Science justificastion for keeping STATIC on during deep dips. Schemes to automatically safe based on pressure measurement on board in review
P-07Delayed LPW
Boom Deployment
Mission Performance
2 3 L
Waiting till after MOI to deploy LPW booms results in them sitting undeployed for over a year, increasing the risk of deployment failure
Potential severe degradation of LPW measurement
Far Term
Investigate if LPW booms can be deployed early
Research Early deployment of LPW booms reduces this risk. If that is not possible, a test to verify the booms deploy after a year of soak might be considered, but is expensive and logistically difficult
13PFP MSR, 03/16/2010
Risks List [2]
ID Title Type P I Crit Risk Statement Impact Term Plan Approach Comments
P-08
EUV sensor damaged by exposure to atmosphere
Mission Performance
2 3 L
If EUV does not close its door before deep dips (or any periapsis where EUV points into the RAM direction) sensor can be damaged
Degradation of EUV Lyman Alpha sensor
Far Term
- Include EUV door close to instrument autonomy rules.- Add MOC/SOC flight rule to reduce risk that human error results in incorrect operational script
Mitigate
P-09STATIC
ReliabilityProject
Execution4 2 M
If a second STATIC is not implemented, STATIC becomes mission critical, requiring addional relaibility work and potential hardware changes not included in the SSL budget
Cost, Schedule Near Term
Put off starting work on STATIC reliability issues until decision made on second STATIC
Watch Some work should be done prior to PDR
P-10Operational
HeatersProject
Execution4 4 H
If operational heater reequirement to survive eclipse is significant, could impact power budget
Power Mid Term
Pending thermal analysis Watch Pending thermal models, spacecraft environments (after PDR)
P-11LPW Boom
Thruster Heating
Mission Performance
2 4 M
If thruster heating of LPW booms excessive, could damage boom harness
Potential loss of LPM measurement
Near Term
Thermal analysis, thruster plume analysis, boom relocation all in work
Mitigate
P-12SWEA Thruster
HeatingMission
Performance2 4 M
If thruster heating of SWEA is excessive, could damage instrument
Potential loss of SWEA measurement
Near Term
Thermal analysis and surface treatment selection in work
Mitigate Need thermal engineering help
14PFP MSR, 03/16/2010
PFP Mass
• No change from last month
• Liens:– Second STATIC, ~3.69Kg (plus a small increment to PFDPU for
additional interface), if approved– PFDPU possible increased board size, ~1kg (TBR)
Instrument QuantityCBE Each
[kg]CBE
Total [kg] Cont. (%)Total [kg] (CBE+cnt)
Particles and Fields 20.69 29% 26.59LPW Total 5.98 8% 6.48
LPW Booms 2 5.176 18% 6.120EUV Assembly 1 0.800 -55% 0.360
STATIC Total 2.35 57% 3.69SWEA Total 1.62 20% 1.94SWIA Total 2.06 3% 2.12SEP Total 1.23 20% 1.47MAG Total 0.65 20% 0.78PFDPU Total 4.78 20% 5.74PF Intra-Instrument Harness Total 2.03 115% 4.37
15PFP MSR, 03/16/2010
Mass Tracking Chart
PFP Mass Trend
15.00
20.00
25.00
30.00
35.00
10/1/2009 10/21/2009 11/10/2009 11/30/2009 12/20/2009 1/9/2010 1/29/2010 2/18/2010
Date
kg
15%
20%
25%
30%
35%
Mass CBE, kg
Mass NTE, kg
Mass Margin %
16PFP MSR, 03/16/2010
PFP Power
• No change since last month• Liens:
– Second STATIC: 5.75W– Expect to need operational heat during eclipse
• None allocated, amount needed pending thermal analysis
Instrument CBE [W] Cont. (%)Total [W]
(CBE+cnt)Particles and Fields
Off (heater only) 8.03 23% 9.90Standby 11.69 22% 14.27Nominal 19.46 19% 23.23
Peak 30.04 20% 36.10Orbit Average 19.56 19% 23.35
Orbit Average:LPW/EUV 4.66 12% 5.24STATIC 4.42 30% 5.75SWEA 0.96 20% 1.16SWIA 1.64 7% 1.76SEP 1.88 20% 2.26MAG 3.03 20% 3.63PFDPU 2.96 20% 3.56
17PFP MSR, 03/16/2010
PFP Power Trend
PFP Power Trend
15
20
25
30
10/1/2009 10/21/2009 11/10/2009 11/30/2009 12/20/2009 1/9/2010 1/29/2010 2/18/2010
Date
W
15%
20%
25%
30%
Power CBE, W
Power NTE, W
Power Margin %
18PFP MSR, 03/16/2010
PFP Data Rate
• Per 2009-6-9 allocations from Bruce
Rate [bps]Particles and FieldsLPW/EUV 717.0STATIC 2000.0SWEA 600.0SWIA 604.0SEP 160.0MAG 660.0PFDPU 30.0
Total 4771.0
Instrument
19PFP MSR, 03/16/2010
MAVEN Magnetometer Status
March 10, 2010
Connerney, Schnurr, Sheppard, etc.
20PFP MSR, 03/16/2010
GSFC/MAG - Accomplishments in February
• MAG instrument definition
• Instrument specification – first draft (Rev 0) sent to SSL
• MAG instrument block diagram completed (Rev 0)
• MAG logic block diagram completed (Rev 0)
• MAG digital interface agreed upon with SSL
• MAG voltage requirements defined and power distribution block
diagram completed (Rev 0)
• MAG schematics and board area study started, including the
possibility of partitioning the AC heater circuit on a separate
PCB from the analog sensor circuitry (like STEREO)
• Parts selection started, including identification of long lead time
items.
21PFP MSR, 03/16/2010
Near Term Plans & Open Issues
• MAG pre-PDR Peer Review planning in progress– Working dates availability with reviewers Steve Battel and
Jeremy Karsch– Looking at May 25 and possibly May 28 (Battel availability)
• No Open Issues
22PFP MSR, 03/16/2010
MAVEN PFP SWIA Status
March 2010
Jasper Halekas, SWIA Lead
23PFP MSR, 03/16/2010
SWIA Progress
• Fifth revision of instrument specifications– Updated outer grid and post design– Updated baseline anode and MCP mounting scheme
• Agreed on preliminary packaging, harnessing, and interconnect schemes
• Reviewed FSW specifications• Reviewed third revision of block diagram• Reviewed first draft schematics for digital board• Got additional part time mechanical help for
SWIA/STATIC (Greg Dalton)• Started Bill Elliott working on mechanical details of
anode/MCP mounting (biggest outstanding issue in mechanical design)• Should be ready with currents/voltages for power
supply design
24PFP MSR, 03/16/2010
SWIA Issues
• Staffing– Still light on mechanical engineer time, but should be ready for
PDR if we can progress quickly on anode/MCP mounting• New hire ME job posted to augment team
– Thermal modeling not started yet• Chris Smith overloaded with other work• Important issues regarding deflector coating and need for heater
power to resolve
• Long Lead Parts– Probably need to start thinking about ordering A121 preamps
• Can take up to a year to get• Hardly any spares from previous missions to use in testing
– MCPs
25PFP MSR, 03/16/2010
MAVEN PFP STATIC Status
March 2010
Jim McFadden, STATIC Lead
26PFP MSR, 03/16/2010
STATIC STATUS
• Instrument specification documents iterated twice and delivered• Flight software requirements reviewed handed off to Flight software
engineer• FPGA requirements reviewed, recommended changes provided to
systems engineer• New ME (1/2 time) has been brought up to speed to take over from
Bill Elliott. Additional ME (new hire) pending• Prototype grids for carbon foils evaluated and new fabrication
instructions developed.• Radii for aperture housing and angle separation of dual-posts
finalized (optics simulation)• Carbon foil mounting scheme being developed (Marckwordt)• Parts list being re-evaluated to reduce qualification costs• Testing on Digital board and HV SWP board continuing.
27PFP MSR, 03/16/2010
STATIC Schedule Status
• Completed Schedule Items– Instrument Specification / Flowdown– STATIC software requirement for PFDPU– STATIC harness specification– ESA Deflector Optics Design
• Incomplete Schedule Items– STATIC Preliminary Thermal design. Reason - Thermal design engineer still unavailable.
Expected start date is 1-2 weeks. – STATIC packaging / interconnect design. Reason - Haven't settled on TDC to Digital board
connectors. Not time critical and should get decided in the next couple weeks.– STATIC MCP specification and order. Reason - No immediate need since we have prototype
MCPs.– Anode, Preamp, TDC EM Design update and parts selection. Reason - High parts
qualification costs led to re-evaluation of the parts list. Selections are waiting on design engineer currently on travel. Selection is expected to complete in a couple weeks. Delays are not critical layout and fab are not scheduled until after PDR.
– Update TOF 15kV/MCP HVPS Reason - HVPS engineer unavailable. This was on the fast track and the design/development need only be completed by PDR.
• Started Schedule Items– Sweep HVPS - prototype testing is continuing– Digital board prototype testing and design are continuing– LVPC - Specification provided to LVPS engineer – ESA Mechanical Design - new ME taking over aperture closer mechanism. This is behind
schedule for a March 17 completion. Required completion date is prior to PDR.– Anode, Preamp, TDC EM Layout Mods - These are due in a couple weeks and are behind
schedule, but really not needed until after PDR. Layout changes are waiting on part finalization.
28PFP MSR, 03/16/2010
STATIC Issues
• Second STATIC issue needs to be resolved soon– Impacts Reliability analyses
29PFP MSR, 03/16/2010
MAVEN PFP SWEA Status
March 2010
Dave Mitchell, SWEA Lead
30PFP MSR, 03/16/2010
SWEA Status
• SWEA Design– Instrument Specification – draft complete, under revision
– SSL/CESR ICD – done
– Identify changes to STEREO SWEA – done
– Software Requirements – draft complete, under revision
– Harness Specification - done
– Packaging/Interconnect Design - done
• SWEA Digital– Digital Design – done
– Parts Selection and Digital Schematic• draft nearly complete (due 3/17)
• SWEA SSL Mechanical Design– Electronics box mechanical design – done
31PFP MSR, 03/16/2010
• Minor changes to the STEREO SWEA design are under study:– S
– Simulations are underway to determine if a slight shift of the deflectors along the symmetry axis improves the angular response.
– Rough calculations show that high emissivity coatings for the deflectors and toroidal grids are needed. Candidates have been identified (e.g., black chrome). More detailed thermal calculations are needed.
• SWEA Preliminary Thermal Design (due 2/3/10)– Behind schedule because of lack of thermal engineering support, which
should become available later this month.
SWEA Work in Progress
Simulations show that scalloping the inner and outer hemispheres improves the scattered electron suppression. The optimal type of scalloping (rounded or saw tooth) is under study.
32PFP MSR, 03/16/2010
MAVEN PFP SEP Status
March 2010
Davin Larson, SEP Lead
33PFP MSR, 03/16/2010
SEP Accomplishments
• Began modification of FPGA specs-– Reconfiguration to 2 identical actels – Baseline burst mode developed– Learned that DAP board must measure it own analog housekeeping
• Mechanical discussions– Explored change of connectors appears that 15 pin cannon may be to tight to fit.
Must either:• Use MDM connectors• Extend length of box.
• Decision on Bias supply circuitry (mostly) made:– Strongly leaning toward capacitor diode stack instead of magnetics.
• Considered radiation problem for preamps: – Baseline is now A250F for preamp but using +/- 5 volts – Rough estimate of increase in power is small
• IDPU Board dimensions – Quick comparison of THEMIS vs STEREO board dimensions suggests it will not
be a problem.• EE job application listed
– two candidates chosen to interview next Friday• Specs sheet turned in.• Discussion of nano-muscle took place:
– see no need for change will probably stick with old design.• Software requirements discussed on 3-12
– added 2.5 requirements. (one requirement turned into requirement on FPGA)
34PFP MSR, 03/16/2010
SEP Open issues
• FOV issues no longer resolved.• SPEC sheet still needs a review• Finish modifying FPGA spec• Have not decided on connector for sensors
– Trade study MDM vs high density cannon.• Better power estimate required. (must include power for shaping
chain.)• IDPU Board dimensions – More accurate area estimate must await
board layout.• EE job interview ahead
35PFP MSR, 03/16/2010
MAVEN PFP PFDPU/GSE Status
March 2010
Dorothy Gordon, Peter Berg, Tim Quinn, Harvey
36PFP MSR, 03/16/2010
PFDPU Status
• Processor Board (DCB) specification in progress– ColdFire IP Core incorporated in an Actel FPGA– ProASIC FLASH part planned for Engineering Units (ETU)– RTAX2000S (Fused FPGA) planned for flight
• ColdFire Core Utilization (including mult, div. and BDM debug module):– SEQUENTIAL (R-cells) Used: 2930 Total: 10752 (27.25%)– COMB (C-cells) Used: 8492 Total: 21504 (39.49%)– LOGIC (R+C cells) Used: 11422 Total: 32256 (35.41%)– RAM/FIFO Used: 0 Total: 64
– FPGA daughter board facilitates testing of either FLASH or Fused FPGAs
– PFDPU FPGA also includes Instrument Interfaces, Processor-Memory Bus Control/Registers, FLASH Memory Control, Timing Subsystem and Spacecraft Interface
– Memory sizing in progress by the Software Lead.
• Software development tools– Freescale CodeWarrior Development suite is undergoing evaluation by
the Software Lead. The initial results are promising.
37PFP MSR, 03/16/2010
Flight Software Status
• Updated Software Development Plan in progress– Responding to Tom Jackson comments
• Flight Software Requirements (Level 4) reviewed with Instrument Leads
• Level 5 flow-down in progress• Memory Sizing task in progress• Development tools evaluated
– Code size strongly dependent on usage of local vs global memory access
• Requirements Review planned for mid April• Peer Review planned for May 12
38PFP MSR, 03/16/2010
GSE Status (1)
• The MISG* Ethernet I/F Board (ZestET1) is being exercised with test code– Ethernet controller with user configurable FPGA
• Host Interface verified with pattern generator utility
– FPGA to emulate MAVEN PFDPU and Instrument
• The MISG Specification first release and preliminary schematics for the Base (Interface) Board are being reviewed.
Base (Interface) Board
ZEST-ET1 Module
Ethernet EngineDDR SDRAM (32 MBytes)
Instrument Interface(when MISG is
configured in PFDPUMode)
PFDPU Interface (when MISG is configured in
Instrument Mode)
Xilinx FPGAProgrammable Clock
DDR SDRAM (64 MBytes)
CLK, CMD(from PFDPU)TLM (to PFDPU)
Ethernet (RJ45) to Host Computer
CLK, CMD(from PFDPU)
TLM (to PFDPU)
Per Instrument
Actuator Control ACTLP(1:0)ARTN
ACTPwr(28VDC)
Instrument PwrSwitch
InstPwr (28VDC)
IPWRRTNINSTSWPWR
PSSYNCHCLK8M
*MAVEN Instrument Simulator / PFDPU Simulator
39PFP MSR, 03/16/2010
GSE Status (2)
• GSE application development work continues– Receiving test data from the ZestET1 (Ethernet Data reception) – GSEOS data parsing has begun using data generated by the
STATIC Prototype Board
• Next Steps– Layout/fabrication of Base GSE board– MISG FPGA development– Further testing with Host Code and integration with GSEOS