Cardmati Bending & Torsion Tester ... Test Equipment for MasterCard CQM Program ... on providing...

Cardmati Card & RFID Automation

GLUE CAVITY MODULE DUAL CARD TESTING INLAY SIM COM TEST

TAPE MILLING EMBEDDING INTERFACE SOLUTIONS PRODUCTION PUNCH TOOLS

Product Catalogue

Table of Contents

ABOUT US

Cardmatix Company Profile Key Markets & Products

ARIES SERIES

An introduction to and overview of Cardmatix

Multi-Functional Milling & Embedding Machines

MME-04 Fully featured Milling and Embedding Machine

MERCURY SERIES Single Process High-Speed Milling & Embedding

MSM-124

MSE-124

GTL-03

MultiSIM Cavity Milling MultiSIM Module Embedding High-Speed Glue Tape Laminator

GEMINI SERIES Card Scoring & Punching Machines for SIM Cards & Other Formats.

GSM-124 MultiSIM Punch Machine GSM-7000 SIM Punch Machine IDSP-01 ID Slot Punching & Scoring Machine

DUET SERIES Dual Interface Card Production Machines

WirePRO

MPM-01

APM-01

CEM-01

Dual Interface Milling and Embedding Machine Dual Interface Module Preparation Dual Interface Antenna Preparation Dual Interface Module Embedding

APOLLO SERIES RF Inlay Production Line

WEM-01 Antenna Wire Embedding Machine

ARGO SERIES Utility Tools & Consumables

MTS-01

SCMB

CQM SERIES

COM

CTS-01

IMS-01

MCM-01

IST-01

TM-403

TM-404

TM-406

TM-408

TM-409

TM-410-C

TM-410-E

TM-411

TM-412-P

TM-412

TM-414

TM-416

Module Tape Splicer Solid Carbide Milling Bits

Test Equippment for MasterCard's CQM Program

Introduction Card Testing System Inlay Measurement System Module Counting Machine RF Inlay Sheet Tester Height & Width Gauge Thickness Gauge Corner Stencil Bending Stiffness Tester Clamping Fixtures for Durability Test Card Warpage Ramp Embossed Card Warpage Ramp Cantilever Fixture Peel Strength Preparation Tool Peel Strength Tester Dynamic Bending & Torsion Tester Impact Resistance Tester

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Table of Contents

CQMSERIES

TM-417

TM-421

TM-422

TM-423-P

TM-423

TM-427

Test Equipment for MasterCard CQM Program

Corner Impact Test Fixture

Three Wheel Tester

Mechanical Reliability Wrapping Tool

Preparation Tool for Module Spot Pressure Test

Back of Card Spot Pressure Test Fixture

Digital Three Wheel Tester

25

26

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About Us

Founding: Cardmatix was estab

lished in 2002 to focus on the manu

facturing of equipment for the produc

tion and testing of contact, contact

less, and dual interface smart cards

for the world market.

We are headquartered in a 4000m2

R&D and manufacturing facility with a

staff of about 100 employees, located

one hour from the Hong Kong border

in Dongguan China.

Our design goal is a balance of

speed, features, and reliability, at a

price you can afford backed up by

an experienced customer support

team.

Philosophy: We believe that satisfy

ing your end card customers should

guide our product design.

We know that your success depends

on providing cards at a good price,

with short lead times - while keeping

shipping dates firm, and not making

mistakes.

Reputation: Durable, high speed

machines engineered for easy main

tenance and years of reliable service.

With over a decade of of experience,

our engineers and technical support

staff are proud that they have earned

a reputation for reliable products and

strong ongoing technical support.

Service: Today, leading card makers

trust Cardmatix equipment to build

and maintain their reputations for

supplying high quality smart cards.

Cardmatix customers know that we

will do whatever it takes to make sure

their equipment performs when they

need it most.

1

lnnovation:The truth is, we owe

many of our innovations and improve

ments to our customers, who are

always looking for ways to improve -

and who have more knowledge of the

day to day process than any machine

maker ever could.

Developing close relationships with

maintenance and production manag

ers has given Cardmatix an edge - as

our best ideas are often thanks to

their generous input and collaborative

approach to R&D.

Manufacturing: To ensure tight

process control, Cardmatix maintains

extensive in-house engineering and

machine processing departments -

equipped with CNC's, vertical milling

machines, wire cutters, lathes,

precision grinders, sheet metal

bending and cutting, and a welding

shop.

Engineering, processing, assembly,

testing, and customer training are

all done in-house.

Dual Interface: Cardmatix is widely

known for its patented Direct Bond

Method for making dual interface

cards. It is the first choice of most

Chinese card manufacturers

The Cardmatix DUET Direct Bond

Method now easily accounts for the

issuance of over a billion dual inter

face cards in China and surrounding

Asia Pacific.

Milling & Embedding: Our most

popular production machine today is

the MME-04 Milling and Embedding

Machine, which sets a new standard

for price and reliability.

Developed with extensive input from

leading card makers, and available

with a wide variety of advanced

options, we feel there is no better

choice in the market for a all-in-one

solution for smart card milling and

embedding.

SIM Punching: SIM card production

has evolved very quickly over the last

five years to accommodate many

different form factors and Cardmatix

has kept up.

Multi-SIM Punching: Along side our

popular multi-SIM milling and embed

ding machines, Cardmatix has a very

strong line up of versatile punch

machines for making single, dual &

quad SIM cards.

Card Testing: With a customer list

that includes over 70% of the world

wide Visa/MasterCard certified card

makers, Cardmatix is the world's

leading supplier of bank card testing

equipment.

2

The ARIES Series All-In-One Milling & Embedding

ARIES MME-04

Smart Card Milling & Embedding Machine

• Single Cavity Milling• Module Embedding• Automatic Changing Magazines• Glue Tape Laminator• Card Orientation Monitoring• Cavity Depth Measurement• Module Height Measurement• lnline ATR Testing

Output: 3800+CPH Voltage: 380VAC 50/60Hz Power: 7.5kW Compressed Air: 6kg/cm2 150 L/min Dims: [L]2480mm [W]830mm [H]1950mm Multimedia: G Video link

ARIES MME-04

Stations

Perfect for a wide range of smart card production needs where speed, flexibility, and high efficiency are required.

The MME-04 sets the standard for value, speed, and reliability in a turn-key smart card solution

Four Auto-Changing Magazines:

Optional configuration with auto changing dual magazine input and dual magazine output for maximum runtime.

Card Orientation: An optional sensor that ensures cards are loaded in the correct orientation and are of the correct version - preventing costly mistakes during production.

Cavity Milling: Two high speed milling stations for accurate, clean, cavities. Mitsubishi servo control for peak performance, milling accuracy and yield.

Glue Tape Laminator: Optional station for punching and laminating glue tape to the module tape.

Cavity Cleaning: Powerful cleaning station with a powerful vacuum and rotating brushes ensure all cavities are free from milling debris.

Cavity Depth & Module Height Test:

Optional inline precision gauges from Keyence accurately measure cavity milling depth and/or module height, ensuring high-quality production output.

ARIES MME-04

Card Orientation Sensor

Embedding Stations: Three hot-presses and one cold-press, designed to swing open for easy maintenance and tooling changes.

The MME-04 can be delivered with optional fourth hot-press station. Manual adjustment of pressure or optional PLC-controlled pressure with digital force indication.

lnline ATR Testing: Installed to ensure proper operation of modules after embedding.

lnline ATS Testing: Option available for dual-inteface card production.

Vision Inspection: Optional station for checking of module positioning and blemishes .

3

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The MERCU MultiSIM Milling & Em

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High-S . ult1SIM -124

peed Milling & E b m edding

�SM MultiSIM-124Smgle-SIM

Cavity Milling

Dual-SIM

Cavity Milling

Quad-SIM

Cavity Milling

�SE MultiSIM-124Smgle-SIM

Module Embedding

Dual-SIM

Module Embedding

Quad-SIM

Module Embedding

4

The MERCURY Series Multi-SIM Cavity Milling

MERCURY MultiSIM MSM-124

MultiSIM Cavity Milling Machine

• Single SIM Cavity Milling

• Dual SIM Cavity Milling

• Quad SIM Milling

• Automatic Changing Magazines

• Cavity Depth Measurement

• Card Orientation Monitoring

Output: 6000 + Cavities Per Hour

Voltage: 380VAC 50/60Hz

Power: 5.5kW

Compressed Air: 6kg/cm2 130 L/min

Dims: [L]2700mm [W]980mm

[H]1930mm

Multimedia: GVideo link


Stations

Perfect for SIM card production -

where speed, flexibility, and high

efficiency are required.

The MSM-124 is the ideal solution for

high-speed cavity milling for Single,

Dual, and Quad SIM cards.

Fast setups for all form factors to

meet the ever changing needs of your

telco customers.

Four Auto-Changing Magazines:

Two input and two output magazines

reduce labor and ensure maximum

output.

Magazines are interchangeable with

the MSE-124 MultiSIM Embedding

Machine for fast loading between

processes.

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Card Orientation: An optional sensor

that ensures cards are loaded in the

correct orientation and are of the

correct version - preventing costly

mistakes during production.

Cavity Miling: Two high speed milling

stations for crisp, clean, cavities.

Easily configurable to mill single, dual

or quad SIM card formats. Mitsubishi

servo control for peak performance,

milling accuracy and yield.

MITSUBISHI PLC Interface:

Field-Proven stability and longterm

reliability are expected with the

Mitsubishi PLC. Quickly configured

with the use of pre-loaded milling

templates for all popular module

types.

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Cavity Cleaning Station

Cavity Cleaning: Powerful cleaning

stations with a powerful vacuum and

rotating brushes ensure all cavities

are free from milling debris.

Cavity Depth Test: Optional preci

sion inline measurement gauges from

Keyence accurately measure cavity

milling depth, ensuring the quality of

cards delivered for module embed

ding.

Heavy Duty Industrial Chiller: Quiet,

heavy duty cooling technology keeps

the milling stations cool and stable for

years to come.

5


The MERCURY Series Multi-SIM Module Embedding

MERCURY MultiSIM MSE-124

MultiSIM Module Embedding Machine

• Automatic Changing Magazines

• Card Orientation Monitoring

• Single SIM Module Embedding

• Dual SIM Module Embedding

• Quad SIM Module Embedding

• Module Height Measurement

• 1-2-4 Module ATR Testing

Output: 6000 + Modules Per Hour


Power: 4.5kW


Dims: [L]3320mm [W)980mm [H)1930mm



Stations

Perfect for SIM card production -

where speed, flexibility, and high

efficiency are required.

The MSE-124 is the ideal solution for

high-speed module embedding for

Single, Dual, and Quad SIM cards.

Fast setups for all form factors to

meet the ever changing needs of your

telco customers.

Four Auto-Charging Magazines:

Two input and two output magazines

reduce labor and ensure maximum

output. Magazines are interchange

able with the MSE-124 MultiSIM

Milling Machine for fast loading

between processes.


that ensures cards are loaded in the

correct orientation and are of the

correct version - preventing costly

mistakes during production.

Module Punch: HSS Tool Steel is

used for precision module punching.

Easy changeover with M2 and M3

module size tooling integrated into

one tool/punching station.

Module Pick & Place: Unique new

dual pick and place stations. Engi

neered for flexibility to quickly change

from single, dual, or quad sim module

placement.


Pick & Place Station

Hot & Cold Pressers: To ensure the

best bond and highest yields across

all form factors, the MSE-124 features

twelve hot-pressing stations and four

cold-pressing stations. The new

hinged design allows for easy mainte

nance and setups of embedding

tooling.

Module Height Measurement:

Optional precision inline measure

ment gauges from Keyence accurate

ly measure module height after

embedding.

MultiSIM ATR Test: Custom

designed station for ATR testing on

single, double, and quad SIM cards.

6


The MERCURY Series High-Speed Glue Tape Lamination

MERCURY GTL-03

High-Speed Glue Tape Laminator

• Glue Tape Punch• Glue Tape Lamination

Output: 22,000 M3 Modules/Hr 15,000 M4 Modules/Hr Voltage: 220VAC 50/60Hz Power: 0.8 kW Compressed Air: 6kg/cm2 80 Umin Dims: [L]2010mm [W]730mm [H]1830mmMultimedia: (!)Video link

MERCURY GTL-03

Glue Tape Punching Station

The MERCURY high-speed series includes separate machines for cavity milling, module embedding, and glue tape application. These machines are engineered to work independently at a a market dominating pace.

The GTL-03 is a heavy-duty high speed glue tape laminator with an economical price point. It will give you the speed and reliability required for those large projects where every efficiency counts.

Glue Tape Punch: For trimming glue tape and paper carrier to match the module tape profile. Japanese HSS tool steel is used to make customized tooling for virtually any type of module tape - from SIM to Dual Interface modules.

MERCURY GTL-03

Module Reel

Dual Format Tooling (for example, M2 and M3) so changing between module types is fast and easy, requiring only a manual switch and a touch screen selection.

Adjustable Heat & Cycle Time:

Programmable temperature and lamination time to ensure maximum compatibility with a wide variety of glue tape suppliers.

Heating Elements: T he GTL-03 is equipped with an dual ceramic heating elements and an Omron PIO temperature controller for precise temperature control and long life.

MERCURY GTL-03

Glue Tape Lamination Station

Heat is applied to the top and bottom of the module tape to achieve the consistent application of glue tape.

Tape Detection Sensors: Sensors detect both the presence of glue tape and modules to ensure optimal production control.

PLC Control: Mitsubishi PLC for reliable field proven machine control.

7


The GEMINI Series Multi-SIM Punch & Scoring - SIM Cards

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Quad SIM

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Half Card

Re-pluggable SIM

8

The GEMINI Series MultiSIM Punching & Separation

GEMINI GSM-124

MultiSIM Punching Machine

• SIM Punch• Single SIM Cards• Dual SIM Cards• Quad SIM Cards• Quad SIM Separation Station

Output: 6000 + Cavities Per Hour Voltage: 380VAC 50/60Hz Power: 5.SkW Compressed Air: 6kg/cm2 130 L/min Dims: [L]2700mm [W]980mm [H]1930mm Multimedia: (!>Video link

GEMINI GSM-124

Stations

The GSM-124 MultiSIM Punch is designed for GSM cards - a single machine engineered to be flexible enough to handle today's challenges -but also adapt to the ones we don't know about yet. This is a massive machine, equipped with six inline 1.SkW electrical servo motors for punching and scoring any card job you throw at it. One look and you will know it has the power and speed to get the toughest card punching jobs done. It's a machine we are proud to offer - and you will be proud to own.

Set Up: Our new design allows for punch tooling to be removed and replaced with four screws, allowing for lightning-speed reconfiguration.

Speed: All speeds indicated are for re-pluggable type, Cambi SIM: (2FF, 3FF, 4FF):

Format

Single SIM Card Dual SIM Card Quad Card Half Card Quarter SIM Card

SIMs/Hr

6,000 10,000 20,000

8,000 11,000

Punch Stations: Equipped with six Mitsubishi 1.SkW servos with heavy duty gear box. Suitable for punching or scoring.

Card Check: lnline sensor checks for card orientation.

GEMINI GSM-124

SIM Punching Stations

Input: Comes with 500 card removable magazine with the option to double up with dual auto changing magazine configuration.

Output:Two horizontal trays holding 1000 cards for manual unloading, and also, two separate and removable magazines for Quad Cards.

Punch Waste: Each punch station's waste is collected into a central collection point.

Independent Stations: Each punch station can be used for both punching or scoring and can be individually turned on or off from the user interface.

9


The GEMINI Series SIM Punching & Scoring

GEMINI GSM-7000

SIM Punching Machine

• SIM Punch• Single Sim Punch• DualSim Punch• Dual Electrical Cutting Heads• Card Orientation Error Detection

Output: 7000 Cards/Hr Voltage: 220VAC 50/60Hz Power: 2.6kW Compressed Air: 6kg/cm2 11 O Umin Multimedia: (!)Video link

GEMINI GSM-7000

SIM Punching Station

The GEMINI Series features flexible configurations for single or multiSIM production while still maintaining the precise tolerances and high throughput needed.

The GEMINI GSM-7000 sets the standard for value, speed, and reliability. It is perfect for companies looking to enter the market or add capacity.

Optional customized tooling is reasonably priced and designed for quick changeovers from one SIM plug configuration to the next.

GEMINI GSM-7000

SIM Scoring Station

Punch Stations: Four Mitsubishi electrical punch stations drive dual cutting heads to ensure a cleanly cut SIM plug with precise scoring cuts for an easy release.

Capable of producing single, double and quad SIM plug cards in a wide array of shapes and sizes.

GSM-7000 is efficiently designed for small footprint that delivers high output.

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GEMINI GSM-7000

Single & Dual SIM Card

10


The GEMINI Series ID Card Slot Hole Scoring & Punching

GEMINI IDSP-01

• ID Card Slot Punch

• Full Face Punching

• Full Face Scoring

• 1000 Card Shingling Output

Output: 3000 Cards per Hour


Power: 0.8kW

Weight: 320kg

Compressed Air: 6kg/cm2 150 Umin

Dims: [L)1145mm [W]693mm

[H]1475mm

Multimedia: G Video link

GEMINI IDSP-01

Input Magazine

Designed for customers needing a

heavy-duty professional solution for

slot punching ID cards. The IDSP-01

can be run as hard as you need.

Input: Manually fed 500 card hopper

or optional removable magazines that

can be loaded off-line.

Tooling Design: The tooling is based

on long lasting tool steel and can

punch or score the full face area of

the card.

Heavy Duty Punch Station: The

punch station is powered by a

heavy-duty 750W servo motor that

with built-in capacity for larger punch

ing requirements.

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GEMINI IDSP-01

Scoring & Punching Station

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Scoring or Punching: The tooling

and punch station design can be

used to punch or score cards ac

curately.

Output: Extended high-capacity

shingling output with a capacity for

1000 cards allows one operator to run

several machines. Shingling output

also allows for many non-standard

card shapes to be managed.

Custom Tooling: Order customized

tooling to meet the needs of your

project. Punch tooling is easily and

quickly changed.

GEMINI IDSP-01

Output

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11


I I I I I I l

The DUET Wire PRO Direct Solder™ Dual Interface Process

In the last five years, over 1.5 billion

bank cards were made with the

Direct-SolderTM method.

Wire PRO Dual Interface Process

Cavity Milling

The Wire PRO is equipped with three

cavity milling stations to accurately

expose the antenna for removal and

then forming the final module cavity.

Antenna Preparation

Using vision controlled robotics, the

antenna leeds are QC checked and

their location is sent to a robot picking

device that pulls them from the

module cavity in preparation for the

bonding station.

Direct-Solder

Antenna leads are direct-soldered to

the dual interface module using

thermal compression method. Module

antenna pads are pre-soldered in a

separate process ..

Wire Dressing

The antenna leeds are folded under

the module in preparation for the

embedding station

Module Embedding

The traditional process of embedding

the module into the card body with a

standard glue tape lamination

process.

12

The DUET Series Dual Interface Milling & Embedding

DUET Wire PRO™

Dual Interface Milling & Embedding

• Direct Solder Process

• Cavity Milling

• Module Embedding

• ATR & ATS Testing

Output: 2500-3000 CPH

Voltage: 380VAC 50/60 Hz

Power: 11kW

Compressed Air: 6kg/cm2 220 Umin


[H]1950mm

Multimedia: G Video Link

DUET Wire PRO

Stations

Developed by Cardmatix, the patent

ed Direct-Solder Process drives the

production of over 500 million dual

interface banking cards a year.

No other process offers the RF

performance, longevity, or durability of

a solder connection. A direct-solder

connection does not impair RF

performance, and will not decay or

change with time.

The Direct-Solder Method is the

process of soldering a copper wire

antenna embedded within the card

body directly to wire antenna pads on

the back of the dual interface module.

Consumables: There are no hidden

costs or complicated logistics associ

ated with sourcing proprietary glues,

inlays, or special module designs.

DUET Wire PRO

Antena Preparation

Removable Magazines: Attach or

detach magazines for easy loading

and unloading of cards.

Cavity Milling: The WirePRO is

equipped with three cavity milling

stations to expose the antenna and

then form the final module cavity.

Antenna Preparation: Using vision

controlled robotics, the antenna leeds

are located, QC checked, and pulled

from the cavity.

Direct-Solder: Antenna leeds are

soldered to the dual interface module

using thermal compression method.

Wire Dressing: The antenna leeds

are folded under the module.

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DUET Wire PRO

Module Embedding

DUET Wire PRO

HD Vision Inspection

-

Module Embedding - is the process

of embedding the module into the

card body with the hot-melt glue tape

lamination process with three

hot-pressers and one cold presser.

Glue Tape: The WirePRO uses

traditional hot-melt glue tape com

monly available on the market.

ATS: Contactless interface function

ing is tested first after antenna

connection, and again after module

embedding.

ATR: Contact interface functioning is

tested after embedding.

13


The DUET Series Dual Interface Milling & Embedding

Module Antenna

Preparation Preparation

DUET MPM-01

Direct

Solder

Dual Interface Module Preparation

• Pre-Solder

• Leveling Solder Bump

• Glue Tape

Output: 2400 Modules/Hr


Power: 5.1 kW


The fully automatic MPM-01 prepares

modules while they are still in tape

form by first 'tinning' or pre-soldering

the antenna connection pads.

The tinning process leaves a solder

bump on the antenna pads which is

milled to a consistent height for

precise attachment of the antenna

leads on the CEM-01. Traditional

hot-melt glue tape is applied in the

same production pass.

Wire

Dressing

DUET APM-01

Module

Embedding

Dual Interface Antenna Preparation

• Cavity Milling

• Antenna Preparation

• Antenna Pulling

Output: 1200 Cards/Hr


Power: 10.2kW


The semi-automatic DUET APM-01

mills the module cavity and prepares

the antenna for soldering to the dual

interface module.

This machine was designed specifi

cally to be added as an upgrade to

existing CEM-01 's to fully automate

the DUET direct-solder process.

DUET Direct-Solder Technology

from Cardmatix drives the most

reliable method for manufacturing

dual interface cards in the industry.

The DUET Series of dual interface

production lines are offered in both

fully automatic and semi-automatic

versions.

Both require the use of the MPM-01

automatic module preparation

machine.

DUET CEM-01

Dual Interface Module Embedding

• Antenna Soldering

• Module Embedding

Output: 1200 Cards/Hr


Power: 3.7kW


The semi-automatic DUET CEM-01 is

used to attach the antenna wires to

the pads on the back of the dual

interface smart card module.

Antenna soldering is done with TC

bonding technology to ensure a high

quality physical connection between

antenna and module.

14

The APOLLO Series Contactless Wire Embedding

APOLLO WEM-01

Wire Embedding Machine

• Ultrasonic Wire Embedding

• Contactless Inlay Production

• PC Programmable

Output: Up to 2,400 Standard

Mifare Coils/Hr


Power: 3kW

Compressed Air: 6kg/cm2

Dims: [L]16000mm [W)1100mm

[H]1800mm

APOLLO WEM-01

WEM-01 Configured for Ten Wire Embedding Heads

The WEM-01 Wire Embedding

Machine is the ideal solution for

making your own RF inlays for cards,

passports, and tokens.

Formats: The WEM-01 is user

configurable, (depending on the

number of embedding heads ordered)

for any inlay format from 1 to 50

antennae per sheet - with up to a

500mm x 610mm sheet size.

Speed: Wire embedding speed best

referenced as the cycle time to

embed a standard five coil antenna

as would be used for a standard ISO

Mifare card. The WEM-01 will com

plete a single cycle in 15 seconds.

WEM-01 with a 10 head configuration

outputs 2,400 antennae per hour.

Note that antenna shape and size can

vary the cycle time.

Embedding Plates: Heavy duty,

10mm thick, stainless steel with

registration pins, magnets, or an

optional vacuum system to register

and hold sheets in position.

Accuracy: Using Mitsubishi servos

and HIWIN screw drives and rails the

WEM-01 maintains an accuracy of +/-

10 microns.

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Inlay Sheet Formats

PC Control: Antenna design specifi

cations are imported via a USS stick

into a PC control system for easy to

manage control of unlimited projects.

Sheet Materials: Compatible with all

standard inlay materials such as PVC,

PEG, ABS. Sheet thickness from 130

µm to 300µm can be accommodated.

Antenna Wire: Compatible with all

industry standard copper and copper

alloy wire types ranging in thickness

from 1 00µm to 160µm.

15

The ARGO Series Module Tape Cutting & Splicing

ARGO MTS-01

Module Tape Splicer

• Precision Cutter

• Tape Splicer

The MTS-01 is small mechanical

device tailor-made to maximize your

module tape inventory.

Designed for accurate, fast and easy

splicing of module tape, this tool

makes a quick job is of connecting

two pieces of module tape together or

attaching module tape to leader tape.

ARGO MTS-01

Cut

The MTS-01 accuracy maximizes

the potential of existing module stock

and its ergonomic portable design

makes module splicing accessible

anywhere on the factory floor.

ARGO MTS-01

Place

High quality tooling aligns modules,

punches sprocket wholes in splicing

tape, and punches reject wholes in

the modules located at the splice

point.

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Available for standard M2 or M3

modules. Specify module type when

ordering.

16


The CQM Series

Market Leader: Building a reputation

for quality smart card production

means having the right measurement

tools at a price that makes sense.

Today we are proud to count most of

the wold's Visa/MasterCard certified

facilities as our customers, making

Cardmatix the leading supplier of

COM testing equipment.

Cardmatix designed the COM series

to meet testing requirements of

third-party certification authorities

using standards derived from

1S0/IEC, ANSI/INCITS, and Master

Card COM.

Custom Designs: Share your ideas

with Cardmatix. We welcome the

opportunity to make customized

versions of the products you see here

based on your unique requirements.

Special Requests: Upon special

request, we have supplied equipment

for tests that exceed standards as

well as for other products such as

card RF inlays, passports, powered

cards, and GSM cards.

Audit-Proven Confidence: Our

product designs have been proven

through hundreds of quality audits

around the world. You can be confi

dent that Cardmatix will meet your

requirements.

18

The CQM Series Card Testing System

COM CTS-01

Card Testing System

• Bending / Module Adhesion

• RF Frequency & Q Factor

• Module Height Measurement

• ATR & ATS Testing

Output: 5000-6000 Cards/Hr


Power: 2.SkW



[H]1950mm


COM CTS-01

ATR & ATS Stations

Protect your reputation for quality

assurance with the CTS-01, the ideal

solution for high-speed, automated

testing of dual-interface, contact, and

contactless smart cards.

It tests module bonding, antenna

connections, RF stability, and func

tionality of contact and contactless

interfaces.

Card Flexing: The card body is

flexed 30° across the module embed

ding area. Laser sensors detect

separation between module and

cavity - rejecting cards with poor

adhesion.

Flexing prior to RF testing also helps

to ensure that the connection

between antenna and module is

secure.

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COM CTS-01

Card Flexing Stations

RF Testing: Build customer confi

dence with guaranteed delivery of

cards within a set RF range. Two

Rigel spectrum analyzers provide

accurate frequency and Q-Factor test

results. Custom Smartware<TMJ testers

for additional analysis are available.

Removable Magazines: Input and

output magazines are interchange

able and can be used with other

Cardmatix machines for easier

loading with less handling.

Module Height Test: lnline gauges

from Keyence accurately measure

embedded module height, ensuring

that only good cards make it to the

shipping department.

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COM CTS-01

Card Orientation Sensor

ATR & ATS Testing : Ensure that

contact and/or contactless interfaces

are functioning properly after flex

testing by communicating with the IC

chip. For contactless cards, this may

be the only point during production

when these tests can be performed

economically and at high speed.

Vision Inspection System: An option

that will detect and eliminate anoma

lies related to module alignment and

placement within the cavity; it identi

fies and rejects modules with visible

surface defects such as scratches,

smudges, or fingerprints.


that separates cards loaded in the

wrong orientation or version prior to

testing, shipping & personalization.

19


The CQM Series Inlay Measurement

COM IMS-01

Inlay Measurement System

• Inlay Measurement

• Printed Sheet Measurement

Voltage: 220VAC, 50/60Hz

Accuracy: +/- 1 Oµm

Power: 0.3kW


[H]1720mm

Printed Sheet Size: Maximum sheet

size 600mm x 600mm.

Inlay Sheet Size: Best for and up to

5 x 10 and 7 x 8 formats

COM IMS-01

Stations

The CQM IMS-01 is a heavy-duty

precision linear measurement system

for measuring flat surfaces such as

inlays and printed sheets.

Perfect for inlay production lines

where the positioning of registration

holes, guide marks and embedded

antennas are critical for process

control and general quality control

management.

Vision Inspection: HD Vision

Inspection Camera with 20x

magnification lens.

•

COM IMS-01

Vision Inspection Processing

Camera Control: Rods and rails from

HIWIN (Taiwan) with joystick and

manual control inputs.

Measurement Controller: SOXIN

SX2088-2V measurement controller.

Sheet Size: Maximum sheet size is

600mm x 600mm. Best for and up to

5 x10 and 7 x 8 inlay sheet formats.

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COM IMS-01

•

SOXIN SX2088-2V Controller

20

The CQM Series Module Counting & Testing

COM MCM-01

Module Counting Machine

• Reel-to-Reel Module Tape Counter

• Automatic Module Tape Rewind

• Real-Time Reports on Module Viability

• Marks Tape at Programable Quantity Intervals

Output: 8 Pin Modules -70,000 Units/Hr

6 Pin Modules -100,000 Units/Hr

Voltage: 220VAC, 50Hz

Power: 1.5kW

Weight: 128 kg


[H]1760mm

Multimedia: G Video link

COM MCM-01

Stations

Automate your module tape inventory

with vision inspection technology. The

MCM-01 makes counting and rewind

ing module tape fast and easy.

It is designed to:

Generate Reports showing good,

rejected & total quantity for each

module tape reel.

Confirm Incoming Inventory on

modules received from suppliers -

prior to entry into your inventory.

Program Reel Splicing: Program

the splicing of module tape reels into

smaller designated quantities to be

issued from warehouse to production

by project or work group.

COM MCM-01

Ink Stamping Station

Partial Auditing partial module tape

reels returned into inventory from

production.

Split Reels: Splitting module tape

reels into smaller programmable

quantities to be sold separately.

Security Auditing module tape use

for bank cards.

Instant Replay quickly rewinds

module tape reels to reverse module

orientation after counting or after glue

tape application.

Ink Stamping: MCM-01 ink stamping

system marks module tape in

programmable quantity intervals

allowing for easy splitting of reels.

_____ ____,

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COM MCM-01

HD Vision Inspection

Vision Inspection: MCM-01 uses

vision inspection technology to

accurately count modules on tape

using pattern recognition. Good and

rejected modules are identified and

recorded separately (with the hole

punch).

User Programmable Templates:

MCM-01 is compatible with most

30mm module tapes and suppliers.

User-programable templates are

designed to be compatible with the

next generation of module tape

technology.

21


COM IST-01

RF Inlay Sheet Tester

COM TM-403

Height & Width Gauge

COM TM-404

Thickness Gauge

COM TM-406

Corner Stencil

The corner stencil is used to quickly

and accurately evaluate the card

body corner radius as well as the

location of card features like IC

module, magstripe, hologram, signa

ture panel, or personalization.

A reference template is included, but

this tool is specifically designed for

customers that want to create and

mount their own templates to the

fixture. This can be easily done in any

pre-press department.

The IST-01 is perfect for incoming

material conformance testing

programs as well as helping to avoid

costly mistakes related to mixed up

inlay inventories and improper

lamination settings.

Each unit is custom configured to

your sheet format. A matrix of bi-col

ored red/green LEDs quickly indicate

the Pass-Fail test results of each

transponder location on the inlay.

A quick and accurate method to

measure card body width and height

according to CQM test requirements.

Two digital indicator gauges are

integrated within a solid stainless

steel fixture designed to conveniently

hold a card body in place for precise

measurements. One gauge is dedi

cated for measuring height and the

other width.

A quick and accurate way to measure

card body thickness and embossed

character relief height according to

CQM test requirements.

This fixture is designed with a digital

indicator gauge with a low-force

probe, integrated into a fixture that

conveniently holds a card body in

place during the measurement of

thickness and embossed relief.

Standard Reference: Med

COM Test Reference: 13.2.1 .15

COM Test Method: TM-406

RF Transponder Compatibility:

ISO 14443 Type A and B [proximity]

Mifare Ultralight C, Classic 1 K,

Classic 4K, Plus, Desfire EV1,

AT888SCxxxxCRF, ICODE1

SL 1 ICS30, ICODE SLI SL2 ICS20.

Power: 110/220VAC 50/60 Hz.

Supplied with stainless steel calibra

tion block (85,595 mm x 53,975 mm).

Fixture is milled from stainless steel

bar stock for durability and a long

lasting finish.

Standard Reference: ISO 7810

-10373-1

COM Test Method:13.2.1.12

TM-403: Width and Height

The fixture is milled from stainless

steel bar stock for durability and a

long lasting finish.

Standard Reference: ISO 7810

-10373-1, ISO 7816.

COM Test Method:13.2.1.13

TM-401 : Relative Height of Contacts;

TM-404: Card Thickness; TM-405:

Thickness Within Add-on Areas.

22

COM TM-408

Bending Stiffness Tester

COM TM-409-2

Clamping Fixtures for Durability Test

COM TM-410

Card Warpage Ramp (TM-410-C)

Embossed Card Warpage Ramp

(TM-410-E)

COM TM-411

Cantilever Fixture

This fixture holds 3 cards in a cantile

vered position during high tempera

ture storage in an oven. Card mount

ing is exactly according to the specifi

cation and placement is a snap with

two large tensioning knobs.

It includes a sliding steel ruler for

measuring deformation after testing.

Crafted from aircraft grade 6061

aluminum alloy bar stock, electrostati

cally coated for a long-lasting finish.

This fixture is designed to hold a test

card in a cantilevered position. Card

placement is a snap with a large

tensioning knob.

Once clamped in the test position, a

stainless steel weight - calibrated to

apply a force of 0,7N - is applied on

the opposite edge of the card body.

The resulting deformation is mea

sured using the integrated ruler.

A set of two fixtures recommended for

holding a card body in a stressed

position during durability testing

within a climate chamber.

One fixture is designed to hold a card

stressed at its horizontal axis ( 15 +/-

1 mm), while the other holds a card

with the stress on the vertical axis (30

+/- 1 mm).

This fixture is a gravity-fed ramp with

defined gaps for the quick in-produc

tion Pass/Fail testing of overall card

warpage.

The ramp gap is calibrated to quickly

identify unembossed cards with an

overall warpage exceeding 1,5mm. A

secondary gap identifies cards with

warpage exceeding 1,3mm.


aluminum alloy bar stock and and

electrostatically coated for a durable

long-lasting finish.


aluminum alloy bar stock and electro

statically coated for a durable

long-lasting finish. Fittings and test

weight are made of stainless steel.

Standard Reference: ISO 7810 -

10373-1

COM Test Reference: TM-408

COM Test Method: 13.2.1 .17

TM-408: Bending Stiffness

Crafted from solid blocks of aircraft

grade 6061 aluminum alloy bar stock

and electrostatically coated for a

durable long-lasting finish.

Standard Reference: ISO 781 O

-10373-1

COM Test Reference:TM-409-2

COM Test Method: 8.1.1 TM-409-2:

Stability under temperature and

humidity


aluminum alloy bar stock and and

electrostatically coated for a durable



10373-1

COM Test Reference: TM-41 O

COM Test Method: 13.2.1 .20

TM-410: Overall Card Warpage


10373-1


COM Test Method: 13.2.1.21

TM-411 : Resistance to Heat

23

COM TM-412-P

Peel Strength Test Preparation Tool

COM TM-412

Peel Strength Tester

T his newly designed peel strength

tester has been built specifically for

testing the peel strength bond

between overlay and card body

according to ISO 10373 in a compact

footprint to save desk space.

T he fixture controls are simple and

have been placed on a remote control

for easy testing of many sample strips

from a comfortable seated position.

T he vertical movement of the test

gauge is set once and will move to the

the force gauge to the upper and

lower limits of the test without having

to monitor or make further adjustment.

T he test grip has been redesigned to

make it fast and easy to mount and

remove test strips quickly without

force.

COM TM-413

Adhesion & Blocking Test Fixture

T his test fixture is designed to hold a

stack of cards under a calibrated

weight to measure their resistance to

adhesion and blocking.

Milled from stainless steel bar stock

for durable long-lasting finish.

Fittings and test weight are stainless

steel.

The Peel Strength Preparation Tool is

designed to prepare card bodies for

the TM-412 Peel Strength Test. It will

make precise, easily repeatable cuts,

safely and quickly.

Simply place the test card on the

positioning plate and use horizontal

and vertical cutting heads to prepare

four test strips 10 mm wide +/- 0.2

mm. It also makes the vertical scoring

cut 10 mm from the vertical edge of

the card as required by the standard.

Test rollers are optimized for easy

loading and unloading of test strips.

A precision force gauge provides

accurate measurements of the force

required to pull the overlay from the

card body. It is supplied with

software that will track your test

results and produce a printout

according to COM requirements.

Voltage: 110 or 220VAC 50/60 Hz;

Software: Windows XP & Windows 7

compatible


10373-1



TM-412: Peel Strength; TM-424:

Advanced Peel Strength Test.

This tool is made of heavy duty

aluminum bar stock and stainless

steel. It will last a life-time. Circular

cutting blades are high quality and

can be easily replaced.

Standard Reference:

ISO/IEC10373-1 :2006(E) Section

5.3.2.

COM Test Reference:TM-412

COM Test Method: TM-412

©


10373-1



TM-413: Adhesion & Blocking

24

COM TM-414

Dynamic Bending and Torsion Tester

This "Four-In-One" unit was rede

signed to meet new shortened

bending requirements for IC cards set

forth in COM Requirements Ver 2.2,

2013.

It performs the horizontal, vertical,

shortened and the torsional bending

tests simultaneously. One to five

cards can be tested in each station

for a total of twenty cards in a test

cycle.

COM TM-416

Impact Resistance Tester

Traditional manual test tool designed

according to industry specifications

for card body impact testing.

The TM-416 is configured to quickly

set two drop heights to generate an

impact force of 2000mmN and

10.000mmN.

COM TM-417

Corner Impact Test Fixture

This manual test tool is designed to

measure card's resistance to delami

nation and cracking when subjected

to corner impact.

Safety Feature: Requires two hands

to drop test weight - assuring safe

operation. T he card is secured in the

weighted fixture and released from

the height of 305 mm (12 in).

COM TM-421

Three Wheel Tester

T his completely automated machine

performs the three-wheel test as

outlined in MasterCard's COM

program.

A card is positioned in the machine

such that the the rollers will cycle 100

times over the front (50) and then

back (50) of the IC with a cycle

frequency of 0,5 Hz and a downward

force of 8N.

The TM-414 can be set to stop after

any user-defined number of test

cycles; speed of the bending or

torsion cycles can also be adjusted

by the user, depending on require

ments and calibration.

Power: 110 or 220 VAC 50-60HZ

Standard Reference: ISO 7810,

7816, 10373-1, ISO 24789-2.

COM Test Reference: TM 414, 415

COM Test Method: 13.2.1.24,

13.2.1 .25 Dynamic Bending and

Torsional Stress

Standard Reference: ANSI NCIT S

322 5.7 [ISO 7811-1]

COM Test Reference: TM-416 COM

Test Method: 13.2.1.26 TM-416:

Impact Resistance

Impact weight is calibrated to create

an impact force of 13.3 ± 0.5 N (3.0 ±

0.1 lbf).

TM-417 is made of stainless steel bar

stock for a long-lasting finish. Fittings

and test weights are stainless steel.

Standard Reference: [ANSI NCITS

322 5.20]



TM-417: Corner Impact Test

After the test, the IC card should be

intact and function electronically.

An additional weight, for a recom

mended second test, with a force of

15N is also included.

Power: 110 or 220 VAC 50/60 Hz.




TM-421 : Three Wheel Test

C.

-

25

COM TM-422

Mechanical Reliability Wrapping Tool

(Set of Three)

A set of three fixtures designed to

apply local bending stress to an IC

module embedded within a card

body.

The set is supplied with one fixture

each for three different bending

diameter: 50mm, 40mm, and 30mm.

COM TM-423-P

Preparation Tool for Module Spot

Pressure Test

The Back of Card Spot Pressure Test

Preparation Tool is designed to

quickly and easily prepare card

bodies for the TM-423 Spot Pressure

Test. Mount the card body on the

positioning plate and turn the handle

to create a precise hole in the card

body - directly behind the center of

the IC module.

COM TM-423

Back of Card Spot Pressure Test

Fixture

The TM-423 measures the amount of

force required to push a smart card

module from its card body by apply

ing pressure to the back of the

module.

This is done by drilling a 6mm diame

ter cavity in the card body directly

behind the IC module, and using

TM-423-P to apply the force probe

directly to the back of the module until

it detaches from the card body.

COM TM-427

Digital Three Wheel Tester

This digital Three Wheel Tester has

been built specifically to test the

surface of Interactive Cards, which

can contain built in devices like push

buttons, displays, LEDs, but not

necessarily containing a battery.

The test is designed to determine the

mechanical robustness of interactive

This fixture can also be used for the

TM-B02 Embossed Character Relief

Height Retention test. It's manual

design and analog gauge were

specifically chosen to best meet the

requirements of COM and day to day

lab testing.




TM-423: Solidity: Back of Card Spot

Pressure Test TM-423-P Test Cavity

Preparation Tool

cards by moving the IC cyclically

between three steel wheels rolling

over mechanically sensitive areas.

Power: 110 or 220 VAC 50/60 Hz.



COM Test Method 13.2.1.37

TM-427: Advanced Three Wheel Test


aluminum alloy bar stock and electro

statically coated for a durable





TM-422: Mechanical Reliability:

Wrapping Test

The TM-423-P comes with two

positioning plates - one for M2 and

one for M3 modules.



TM-423: Solidity: Back of Card Spot

Pressure Test TM-423-P Test Cavity

Preparation Tool

- I

• •

26

Factory HQ:

Cardmatix Ltd. Dongguan China

No.: 109D, Luyuan Road, Tangxia

Dongguan, China

Tel: +86-769-8685-5889

[email protected]

Office:

Cardmatix Ltd. Hong Kong

Unit 1103, 11/F., Trendy Centre

682-684 Castle Peak Road

Kowloon, Hong Kong

[email protected] Website: cardmatix.com

www.cardmatix.com

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