Company Profile & Capabilities

Major History Mile stones

1966 – Micro Swiss joins K&S Industries

1990 – Micro Swiss Wedge and Die Attach products lines is consolidated into one business unit.

1994 – EDM process was introduce1994 EDM process was introduce

2000 – Micro Swiss in now K&S Bonding Tools

2010 K&S edge Die Attached tools and Probe2010 – K&S wedge, Die Attached tools, and Probe head had acquired by Micro Point Pro.

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Customized Micro Tools [CMT]f fLarge Variety of Tools for Most Semiconductor Process

Die Pick‐up TAB Bonding

Die‐attach (Eutectic or

p(Flat or Collet)

g(Ribbon; Waffle)

HDD –Dispensers(

Adhesive methods)

Dispensers (Solder jet ball)

Wedge Bonding Ceramic nozzles g

(Aluminum or Gold wire)

for SMT

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Offering & CapabilitiesMPP Customized Micro Tools [CMT]

Offering & Capabilities

CMT product line relays on K&S proven knowledge, experience & p y p g pstate-of-the-art technology

Provides the key to a more robust , reliable and reproducible processImproves operational results & Ease of UseImproves operational results & Ease of Use

Materialsate a s

CeramicsAlumina (Al2O3)

Toughed Alumina (TA)TAAlumina

CarbidesTungsten Carbide (WC)

Titanium Carbide

Cermet

PlasticVespel

Torlon

Delrin

Other

WC Cermet

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MetalsStainless Steel

High Speed Steel

Brass

Copper

Aluminum

Wedge Bonding : Aluminum and Gold Wire

Micro Point Pro is number 1 wedge supplier ‐ 40% WW market share

Micro Point Pro manufactures a complete line of standard and custom wedge tools to fit all

Applications down to 40um and all types of wedge bonding machines

Unlimited Capacity to support customer demand

Short Lead Time – short lead time that fulfill customers demand

High Quality Wedges that will bring the best performance and bonding results

Wedge Family offering :

4WF – Fine Pitch4WC – COB4WA ‐ Standard Automatic4WN ‐ Notched tip wedge for manual bonding4WD – Deep access4WR – Ribbon

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4WV ‐ Notched tip for deep access applications

Die Bonding: Collet & Pick‐up Tools

Die Collet Die Collet Pick Up Tool Pick Up Tool

ApplicationApplication

Eutectic die bonding – provide Strongdie grip Support - High positioning accuracy Minimal contact between Die and Tool

Thermo- compression or Epoxy Die Attach

Easy to use

Full surface contact

Less positioning acc racApplication Application complicated for use Less positioning accuracy

Chipping prevention is essential

Tools Material Tools Material Tungsten Carbide Stainless Steel Combination – 2 parts

Metal - Tungsten Carbide, Stainless Steel Plastic – Vespel, Torlon, (high temp.) DelrinCeramic – TA , Zr, Al

Manufacturing Manufacturing Capabilities Capabilities

Flexible capabilities to support all types Flexible capabilities to support all types

6Close colletsOpen collets WCHigh Temp

ApplicationVespel Tip

TAB Bonding Tools

Increases surface hardness (more than 30%)

Main Advantages

Improves tool tip wear resistance (more than 50%)

Most stable pull strength results

Reduces lead material build‐up rate

Proven results in customer sites CSP memory application common use

K&S µBGA tab tool TAB Bond Shape

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Hard Disk Drive Assembly : SJBB Capillaries

Within the HDD assembly process, verity of tool types and materials are used:Capillaries, Wedges, TAB Tools and SJBB Capillaries

The newest development technology in the HDD industry is

Solder Jet Bonding Tools (SJB):

• HGA: Head Gimbel assembly

• HSA: Head Stuck assembly

By using dispensers (Tungsten Carbide), in which reflow Solder balls and by usingexternal heat source are melted and reshape. Looks similar to corner bumps

HSA: Head Stuck assembly

p p

Laser Beam SJB enable to:Smaller connection – size reductionBetter accuracy Solder Jet ToolBetter accuracy Productivity improvements

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Solder Ball

Surface Mount Technology: Ceramic Nozzle

Better Process PerformanceUnique material combination and accurate design enables:Unique material combination and accurate design enables: Less vacuum detection errorsReduced components dropsBetter optical recognition with non reflective ceramicBetter optical recognition with non reflective ceramic High geometrical accuracy and repeatability apply with a strict semiconductor industryrequirementsGeometry customization capability that meet various applications challengesGeometry customization capability that meet various applications challengesUnique ceramic Tip can be combined with a wide range of materials (i.e. plastic,

metal) that improves tool's performance and increases productivity

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MPP Quality & Safety Management

Quality System

Document Control System

World recognitionCertification

Internal Auditing system

• ISO 9001:2000 • Quality Manual• Constant Internal

Change Control System

• Product Change Notice

Customer Satisfaction

•Customer Complaints

• ISO 14001:2004

• OHSAS 18001

• Procedures

• Certified Drawings

• TECN

auditing system

• Corrective Actions

Procedures &

t

• Drawing

• Engineering Change

Notice

system

•Analysis Request

Calibration

management

CalibrationSystemIQA

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Micro Point Pro Vision

To Supply best in class Tools for Various Industries

Tools for Semiconductor

Medical –Dental

implants BioOtherMPP is a

Technology Base Company ‐ EDM,

Fine grinding

implants, Bio medical tools,

etc

Other

Fine grinding, Pressing, etc.

SMT Tools –Pick & Place

Industrial Tools – spray nozzles, etc

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I t ti l C tifi tiQuality & Safety Management

International Certifications

Quality /Environment / Occupational Health & Safety Management

ISO 9001:2000

ISO 14001:2004

OHSAS 18001OHSAS 18001

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Stock ManagementAdded Value Services

Stock Management

• Inventory options available:

Buffer stock / Safety stock– Buffer stock / Safety stock

– Other inventory options (Consignment upon agreement)

• Recommendations of inventory stocking levels

• Contingency plansContingency plans

• Minimized exposure to dead stock occurrences

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