Geringer a-1 US_Software Manual

A-Series A-1

Software Manual

LynxOS is a registered trademark of the

„LynuxWorks“ company

(The reproduction, transmission or use of this document or its contents is not permitted without written authority. Offenders will be liable for damages. All rights, including rights created by patent grant or registration of a utility model or design, are reserved.)

(We have checked the contents of the printed documentation to ensure that it is in agreement with the hardware and software described therein. However, since discrepancies cannot be ruled out, we cannot assume responsibility for complete agreement. The information given in this printed documentation is however regularly reviewed and necessary corrections included in subsequent editions. We would appreciate any suggestions for improvements.)

Geringer Halbleitertechnik GmbH & Co KG

2012 All rights reserved Subject to change without prior notice

To be ordered from:

Geringer Halbleitertechnik GmbH &Co KG

Liebigstr. 1

93092 Barbing

Germany

Printed by Geringer

3

Software Manual A-1 Content

Content

1 Bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.1 Safety at work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.2 Hazards when bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.3 Safety device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.4 EBP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2 Backgroun d knowledge: bonding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.3 Backgroun d knowledge: software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.3.1 Setup Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.3.2 Screen layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1.3.3 Keyboard functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

1.3.4 Entering coordinates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

1.4 File menu (F)

1.4.1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Save As ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.4.2 Load application data... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.4.3 Load machine data... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.4.4 Delete File ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.4.5 Complete backup to DAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.4.6 Complete restore from DAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.4.7 Save a Program to Floppy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.4.8 Restore a Program from Floppy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.4.9 Import Program from

FTP-Server15

1.4.10 Export Program to FTP-Server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

1.4.11 Quit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

1.5 Mode menu

1.5.1

(O). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

DCL Camera Scale (O 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

1.5.2 DCL Tool Offset (O 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

1.5.3 DCL Camera <–> Tool Offset (O 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

1.5.4 EPO Camera <–> Dispenser Offset (O 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

1.5.5 Learn Substrate Positions (O 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

1.5.6 Learn Module Positions ( 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.5.7 Learn Wafer Radius (O 21) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

1.5.8 Camera-Needle Offset (O 25) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

1.5.9 WFS Learn Chip (O 30). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

1.5.10 WFS Learn Chip Index (O 31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

1.5.11 MWC Camera Scale (O 51) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

1.5.12 MWC Wafertable <–> DCL Trafo (O 52) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

1.5.13 MWC Camera <–> Tool Offset (O 53). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

1.5.14 Option Lookup Camera Scale (O 60) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4

Content Software Manual A-1

1.6 Application

1.6.1

Pages menu (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Substrate type (A6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

1.6.2 Substrate Position (A 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

1.6.3 Module Position (A 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

1.6.4 Bond Position (A 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

1.6.5 Epo Position (A 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

1.6.6 Alignment (A 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

1.6.7 Production Data (A 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

1.6.8 Wafer Data (A 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

1.6.9 Wafer Recognition (A 21) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

1.6.10 Option: Wafer Magazine (A 25) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

1.6.11 Lookup camera (A 40) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

1.6.12 Oven Profile (A 60) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

1.7 Machine Pages menu (M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

1.7.1 DCL Machine Data (M 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

1.7.2 EPO Machine Data (M 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

1.7.3 DCL Toolholder Positions (M 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

1.7.4 Corridor Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

1.7.5 DCL Tool Offset (M 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

1.7.6 DCL Limits (M 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

1.7.7 EPO Limits (M 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

1.7.8 Oven Settings (M 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

1.7.9 Wafer Machine Data (M 22) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

1.7.10 Die Ejector Rotor Position (M 24) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

1.8 Service men

1.8.1

u (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Reinit motors (S 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

1.8.2 Deinit motors (S 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

1.8.3 Wizard (S 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

1.8.4 Configuration (S 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

1.8.5 Machine Counter (S 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

1.8.6 Change Epoxy (S 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

1.8.7 Cycle Times (S 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.8 Tool hits (S 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.9 Diebonder I/O page (S 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.10 Indexer IO page (S 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.11 Indexer Settings (S 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.12 Inputlift Page (S 13). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.13 Outputlift Page (S 14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

1.8.14 Motor Service (S 15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

1.8.15 Get Versions (S 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

1.8.16 User Administration (S 90) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

1.8.17 Change User Level (S 91) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

1.8.18 Show Logfiles (Service 98) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

1.8.19 Set Printer Format (S 99) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

1.9 Preparation s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

1.9.1 Switching on the bonder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

1.9.2 Train the machine-specific parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

1.9.3 Setting up an application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

1.9.4 Indexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

5

Software Manual A-1 1 Bonding

1.1 Notes on safety

1 BO ND IN G

1.1 Notes on sa fety

1.1.1 Safety at work

GERINGER Halbleitertechnik bonding

machines are state of the art and comply with

safety-related rules and regulations.

R I S K O F D E A T H

Persons with cardiac pacemakers or

implanted medical devices must keep at

least one metre clear of bonding machi-

nes. Bonding machines operate with

strong electromagnetic fields. These

fields can affect cardiac pacemakers.

1.1.2 Hazards when bonding

D A N G E R

Keep well clear of the working zone of the

machine and indexer while the equipment

is in operation. Moving machinery hazard.

Operate the machine only with all covers

and doors closed. Do not remove covers

while the machine is in operation. Always

return the bond head to its home position

before penetrating the machine's working

zone. Moving machinery hazard.

Always comply with the manufacturer's

instructions when handling forming gas.

D A N G E R

Do not work on the machine at the same

time as other persons.

Use the bonder only

• in compliance with the manufacturer's

intended use

• in perfect safety-related working order.

Incorrect use means risk of fatal injury to

the user and others and can cause

damage to the machine and property.

Have safety-related defects repaired

immediately by trained, qualified specia-

lists.

C A U T I O N

Do not position the microscope and

microscope holder in the working zone of

the bond head. Crash hazard.

1.1.3 Safety device

You can stop the bonder at any time, regardless of

its operating status, by pressing the EMERGENCY

STOP switch. The switch latches in the depressed

position.

C A U T I O N

Faults must be rectified by trained, quali-

fied personnel working in compliance

with all safety precautions. To restart the bonder after an emergency stop:

ÆMake sure that the fault which lead to actuation

of the EMERGENCY STOP switch has been

rectified.

ÆReset the EMERGENCY STOP switch: turn the

knurled ring of the switch clockwise.

ÆSwitch on the bonder.

6

1 Bonding

1.2 Background knowledge: bonding

Software Manual A-1

1.1.4 EBP

The operator must have a conductive connection

to the machine in order to prevent electronic com-

ponents being damaged by electrostatic

discharge. This connection is made to the EBP

(Earth Bonding Point), which prevents the static

charge passing from the operator to the machine.

C A U T I O N

Components can be damaged if you work

without a connection to the EBP. Always

put on the earthing strap before touching

components.

ÆAlways wear the earthing strap in such a way

that it remains in contact with your skin.

ÆPlug the cable connected to the earthing strap

into the bonder's EBP.

1. 2 Back ground knowledge: bonding A die bonder is designed to pick up a small compo-

nent (the die or chip) from a carrier (wafer, waffle

pack, gel pack, bowl feeder, tape feeder) and bond

it onto a larger component (the substrate).

Bonder

The substrates enter the bonder from the left and

are carried clamping station by the indexer, before

exiting from the machine on the right. An input

system can be mounted on the left and/or an

output system on the right if the machine is not

integrated directly into a production line.

Bond process

The chips are bonded to the substrate by means of

an adhesive process or a thermal process (eutec-

tic process)

Adhesive process

The bond head (dispenser or stamp) applies the

adhesive to the substrate.

Stamp

A stamp dips into the epoxy adhesive in the squee-

gee unit and applies the adhesive to the substrate.

Dispenser

The dispenser applies the epoxy adhesive to the

substrate from a cartridge by means of a capillary

needle.

Moving wafer camera

The MWC is used to find the next chip on the wafer

clamped in position on the wafer frame.

Bonding process

When scanning is completed the bond head unit

(die collet) moves into position over the chip, the

chip ejector separates the chip from the wafer foil,

the DCL tool carries it (held by vacuum) to the

bond position. The chip is released at this position

and a slight pressure exerted to press it into the

epoxy adhesive applied beforehand.

The wafer frames are removed from the wafer

magazine in the chip-handling system and retur-

ned to the magazine once the chips have been

removed.

7


1.3 Background knowledge: software

1.3 Back ground knowledge: software

I M P O R T A N T

The subsections below contain descriptions of

all menus and their parameters. Read this sec-

tion carefully and familiarise yourself with its

contents before you start bonding.

1.3.1 Setup Tool

If you press any button during initialisation the boot

process is interrupted and the system displays the

Setup Tool screen (text prompt to press any but-

ton).

When you press Quit to shut down the bonder, the

Start menu shown below is displayed:

„ Restart Application: Starts the machine soft-

ware. Setup Tool is exited, the ordinary boot

process is resumed and a startup script is pro-

cessed. The machine powers up to the default

mode.

„ Reboot System: Reboots the operating system

and the machine software

„ Shutdown System: Shuts down the operating

system to a defined state for Power Off

„ Setup Tool: Starts the input masks for the custo-

mer-specific bonder configuration

Setup Tool

The Setup Tool window can only be accessed

through a login mechanism with two user levels.

User levels Meaning

operator The default is no password. Functions

marked black in the menu cannot be

accessed

User levels Meaning

admin All functions can be accessed, once

the correct password has been

entered

System Settings

The current system time and date are displayed

and can be corrected if necessary.

Networking

Settings for the network.

TCP IP Settings

„ Host name: computer name

„ IP Address: IP address

„ Network Mask: Network mask

If the bonder is disconnected from the network,

"0.0.0.0" should be entered in the "IP Address" and

"Network Mask" fields.

The computer has to be rebooted before it can be

initialised with a new IP address.

Routing

Settings for two network routes and a standard

gateway.

NTP Configuration

Time synchronisation with a server of your choice.

In order to avoid compilation errors when remote

maintenance is performed for the bonder, it has to be synchronised with the server on which the soft-

ware changes are implemented.

Hostdatabase

Setting for automatic configuration.

8

1 Bonding


Software Manual A-1

Dropdown menu Description

Graphics The graphics adapter card

installed in the system

ATI ATI graphics adapter card

MATROX M MATROX M graphics adapter

card

Monitor The monitor installed in the

system

Std_CRT Standard cathode-ray-tube

monitor

Std_LCD Liquid crystal display

LCD with Touch-sensitive liquid crystal

touchscreen display for interfacing with the

software

Mouse The mouse used in the system

default/Trackball Use the system's default poin-

ting device

Hardware Configuration

The Hardware Configuration item is for defining

the hardware elements that comprise the bonder.

Hardware Configuration > Graphics

Submenu for basic machine settings.

Dropdown menu


MS/serial Connect a serial mouse of your

choice

Keyboard Language settings for the key-

board

German German keyboard

English English keyboard

When you are satisfied that all the settings are cor-

rect:

ÆPress <F10> to update the configuration file

The system has to be rebooted before the new

configuration can be activated.

Hardware Configuration > Serial Interfaces

Submenu for configuring the serial interface for

special hardware.

Dropdown menu


Configuration Type of bonder

Die bonder Die bonder

Wire bonder Wire bonder with DFLEX/M500

hardware card

Wirebonder old Wire bonder with LONGSHINE

hardware card

When you are satisfied that all the settings are cor-

rect:

ÆPress <F10> to update the configuration file

The system has to be rebooted before the new

configuration can be activated.

9



Printer Configuration

net Printer

Installs a network printer

„ Format: Entry Format "Postscript" or "PCL"

„ IP: IP address

„ raw -queue

„ ascii - queue

Software Configuration

Implementations

„ Install setupTool Update: Software update of

Setup Tool and bond programs from floppy disk

drive and DAT drive

„ Full System Backup: Complete system backup

(operating system and user data)

„ User Data Backup: Backup of the user data

„ User Data Restore: Restore the user data from

backup medium

Change Password for User

Once the original password has been entered in

order to access the correct level, you can enter a

new password and must then repeat your entry by

way of confirmation. If you exit without entering a

new password, you deactivate the password

function for the user in question.

1.3.2 Screen layout

Main menu

The user interface is SAA-compliant. You can

choose one of four main menus from the menu bar:

„ File: Administration of the bond programs (see

"1.4 File menu (F)" on page 1-13)

„ Mode: Parameters and machine data for confi-

guring the bonding process for a particular appli-

cation (see "1.5 Mode menu (O)" on page 1-17).

This training mode has interactive support.

„ Application Pages: Application-specific parame-

ters. The trained parameters are displayed in

function groups and can be modified (see "1.6

Application Pages menu (A)" on page 1-32).

„ Machine Pages: Device parameters such as

speeds and delays, usually set for all applicati-

ons

(see "1.7 Machine Pages menu (M)" on page 1-

113). As a rule, these parameter settings do not

have to be changed unless modifications are

made to the mechanical or optical subsystems.

„ Service: Access to maintenance, service and

monitoring functions (see "1.8 Service menu

(S)" on page 1-136).

5

1 2

3

4

7 6

The standard screen displays the information of

relevance during the production process:

„ (1) The camera image currently being proces-

sed by the PRU (Pattern Recognition Unit)

„ (2) Processing status of function groups

„ (3) Warning and error messages (hide by

double-clicking on the message)

„ (4) Log documenting the most recent steps

initiated by the user or by the software

„ (5) Control elements, buttons for fast access to

various functions

10

1 Bonding


Software Manual A-1

„ (6) Status and barcode information

„ (7) The name of the bond program currently

loaded is displayed on the left-hand side above

the status line.

Camera image (1)

The bonder has the following cameras:

„ MWC camera: The high-resolution moving wafer

camera images the positions of small chips on

the wafer frame so that the PRU can compute

the exact position

„ DCL camera: The moving DCL camera (die col-

let camera) views the target area on the compo-

nent surface where the chip is to be placed. The

PRU uses this image to compute the exact bond

place

„ MWC camera (low res.): The low-resolution

moving wafer camera images the positions of

large chips on the wafer frame so that the PRU

can compute the exact position

„ Lookup camera (optional): The optional, fixed

lookup camera is used for alignment from

below, generally with the flip-chip unit

When the machine is at a standstill you can view

the image of each camera by clicking the corre-

sponding radio button. When production is in pro-

gress the camera image currently in use is dis-

played automatically.

Operating status (2)

The current processing status and the next status,

plus the number of application parameter records

defined.

Warnings and error messages (3)

Warnings

Warnings are displayed in orange in the centre

field on the right-hand side of the screen. Automa-

tic production does not stop if a warning is dis-

played.

Error messages

Error messages are displayed in red in the centre

field on the right-hand side of the screen (below the

warnings). Automatic production stops if an error

message is displayed.

11



Controls (5)

In addition to the radio buttons for camera selec-

tion, you also have on/off switches for machine

functions at your disposal:

Light On/Off

Master switch for switching all the lights off or on

together.

The lights are on if the button is grey and labelled

"Light Off".

The lights are off if the button is grey and labelled

"Light On".

Worklight

Switches the worklight on or off.

Air & Vacuum

Opens or closes the main valve, as applicable.

This applies to all the bonder's compressed-air and

vacuum functions.

Gas On

Switches the forming gas on or off (option for

eutectic bonding)

Next Die ==>

„ Shows the direction of processing on the wafer.

„ Reverses the direction of processing on the

wafer.

DE Block

Raise or lower the die eject block.

Wizard

Direct access to wizards (see "1.8.3 Wizard (S 4)"

on page 1-136)

Status and barcode information (6)

Current production information is displayed in the

line at the bottom of the screen:

„ Program status or mode currently selected.

Possible states:

\ READY: Ready to start production

\ PRODUCTION: Production in progress

\ STEP: Step mode

\ ERROR: Error has occurred

„ The numbers of the current substrate, module,

chip and tool in the DCL unit

„ Current wafer number

„ Barcode information (optional)

„ Status field for the DCL unit of the indexer. The

field is a colour indicator showing the status of

the corresponding station:

Colour Meaning

white undefined

green material available

blue station is ready for indexing

orange warning

red error (system stopped)

12

1 Bonding


Software Manual A-1

1.3.3 Keyboard functions

You will frequently have to use the function keys on

the keyboard when you program bonding

sequences.

The functions of the keys for controlling production

are as follows:

START

Press "start" to start automatic production. Produc-

tion resumes at the position shown in the status

line.

STOP

Press "stop" to terminate automatic production. A

step in progress is completed.

HOME

Press "home" to reset all axes to their home posi-

tions.

RESTART

Enables a restart

STEP

Press "step" to continue production in step-by-step

mode. Note that the steps do not correspond to full

production cycles (i.e. chip separation, transporta-

tion and placing). In each step, production advan-

ces to a pause point defined in the program.

F1 to F10

The software assigns functions to keys F1 through

F10; these functions vary, depending on which

menu is active and on the input field in which the

cursor is located. Additional functions can be

called for some input fields when you press the "fn"

key. The blue colouring indicates function keys

that have "fn" functions.

1.3.4 Entering coordinates

Broadly speaking, there are two ways of pro-

gramming coordinates:

Teach-in

Use the trackball to move the mechanical units to

the desired position and use the train-in method to

save the corresponding coordinates. This involves

the following steps:

ÆClick to move the cursor into one of the fields

defining the coordinates of the position you want

to train.

Æ<F10> Press the key or touch the "F10: Move"

button to activate the trackball.

ÆUse the trackball to move to the positions. Press

the <+> key to increase the speed of movement

or the <–> key to reduce speed over a range of

10 stages.

Æ<F6> Press the key or touch the "F6: Trace“ but-

ton to accept values in the numeric input fields.

Advantage: There is no risk of collision, because

the current position is saved.

Numeric entry

C A U T I O N

When entering coordinates for the DCL

unit and executing movements to positi-

ons defined by coordinates with the "F1:

Move to" function, make sure that the

DCL tool does not contact the wafer or

collide with other parts. Numeric input of the coordinates via the keyboard: ÆEnter the values in the numeric input fields.

ÆPress "enter" to confirm.

ÆClick the "F1:Move to" button or press <F1> on

the keyboard to move to the point defined by the

coordinates you entered. The input fields

directly related to the active field are also taken

into account. For example, if the cursor is in the

input field of the X component, the movement is

also executed for the corresponding Y compo-

nent and the Z component, if applicable.

13


1.4 File menu (F)

1 . 4 F il e m e nu (F) Commands for managing bonding programs.

1.4.1 Save As ...

Saves active application and machine data to the

database library. Use the keyboard to assign the

program a suitable, characteristic name.

You must comply with the following naming con-

ventions: Maximum 254 characters, no special

characters. File names are shown only to a maxi-

mum length of 16 characters, but you can spool

the name through the field.

ÆEnter the name of the file in the appropriate

field.

ÆPress "enter" (OK): Save the file under this

name.

1.4.2 Load application data...

Loads existing application data from the database

library. The application data comprises all parame-

ter settings entered in the "Application Pages"

menu.

ÆUse the cursor keys to select the bond program

or application data of your choice from the data-

base library.

ÆPress "enter" (OK): Load the application data

you selected.

ÆPress "escape" (Cancel): Exit the menu.

1.4.3 Load machine data...

C A U T I O N

Avoid using this function if possible. The-

re is a risk of a malfunction being caused

by outdated machine data. Loads current machine data from the database

library. The machine data comprises all parameter

settings entered in the "Machine Pages" menu.

ÆUse the cursor keys to select the current

machine data from the database library.

ÆPress "enter" (OK): Load the machine data you

selected.


14

1 Bonding

1.4 File menu (F)

Software Manual A-1

1.4.4 Delete File ...

Deletes files saved beforehand. The list of existing

bonding programs is displayed:

ÆUse the cursor keys to select the file of your

choice from the database library.

ÆPress "enter" (OK): Delete the bonding file.

1.4.5 Complete backup to DAT

Save all bonding files on DAT cartridge.

I M P O R T A N T

Only the bonding files are saved, not the sy-

stem program.

ÆInsert the DAT cartridge in the drive.

ÆPress "enter" to start the backup or press

"Ctrl - C" to return to the standard screen wit-

hout creating a backup.

ÆWhen the backup has been successfully crea-

ted, press "Ctrl - C" to return to the user-inter-

face screen.

1.4.6 Complete restore from DAT

Import files from DAT.

ÆInsert the DAT cartridge in the drive.

ÆPress "enter" to start the restore or press

"Ctrl - C" to return to the standard screen wit-

hout restoring.

ÆWhen the restore has been successfully com-

pleted, press "Ctrl - C" to return to the user-

interface screen.

15


1.4 File menu (F)

1.4.7 Save a Program to Floppy

ÆInsert the floppy disk in the drive.

ÆSelect the name of the file you want to save.

ÆPress "enter" to start the save or press "Ctrl - C"

to return to the standard screen without saving

the file.

ÆWhen the save has been successfully comple-


face screen.

1.4.8 Restore a Program from Floppy

Load a file from floppy disk.

ÆInsert the floppy disk in the drive.

ÆPress "enter" to save the bonding file under its

name in the database library, or press "Ctrl - C"

to return to the standard screen without loading

the file.

ÆWhen the load has been successfully comple-


face screen.

ÆUse "Save As" to save the bonding file under its

name in the database library.

1.4.9 Import Program from

FTP-Server

Loads an existing program from the local FTP ser-

ver.

ÆUse the cursor keys to select the program of

your choice from the list.


you selected.


1.4.10 Export Program to FTP-Server

Exports an existing program to the local FTP ser-

ver.

ÆUse the cursor keys to select the program of

your choice from the list.


you selected.


16

1 Bonding

1.4 File menu (F)

Software Manual A-1

1.4.11 Quit

Shuts down the program as a preliminary to swit

ching ollthe bonder without lass of data.

You may want to save the file in the bonder's main

memory before you call the Quit command

(see "1.4.1 Save As " on page 1-13)

17


1.5 Mode menu (O)

1.5 Mode menu (O ) All modes for defining machine data and applica-

tion data. The functions are executed in an interac-

tive dialog.

Machine data

The machine data has to be updated whenever

changes are made to the machine's hardware.

„ DCL camera scale (O 1): Perform this operation if

changes are made to the mechanical or optical

systems of the DCL camera (see "1.5.1 DCL

Camera Scale (O 1)" on page 1-18)

„ DCL Tool Offset (O 2): Perform this operation if

changes are made to the DCL unit (see "1.5.2

DCL Tool Offset (O 2)" on page 1-19)

„ DCL Camera < - > Tool Offset (O 3): Perform this

operation if changes are made to the DCL

camera or DCL unit(see "1.5.3 DCL Camera <–

> Tool Offset (O 3)" on page 1-24)

„ EPO Camera < - > Dispenser Offset

(O 7): Perform this operation if changes are

made to the DCL camera or EPO unit (see

"1.5.4 EPO Camera <–> Dispenser Offset

(O 7)" on page 1-25)

„ Wafer Camera Scale (O 22): No fixed wafer

camera installed

„ Camera-Needle Offset (O 23): Perform this opera-

tion if the needles are changed or changes

made to the wafer camera (see "1.5.8 Camera-

Needle Offset (O 25)" on page 1-27)

„ MWC Camera Scale (O 51): Perform this opera-

tion if changes are made to the mechanical or

optical systems of the moving wafer camera

(see "1.5.11 MWC Camera Scale (O 51)" on

page 1-29)

„ MWC Wafertable < - > DCL Trafo


made to the wafer table or DCL camera (see

"1.5.12 MWC Wafertable <–> DCL Trafo (O 52)"

on page 1-30)

„ MWC Camera < - > Tool Offset


made to the moving wafer cameras or DCL unit

(see "1.5.13 MWC Camera <–> Tool Offset

(O 53)" on page 1-31)

„ Lookup Camera Scale (O 60): Perform this opera-

tion if changes are made to the lookup camera

that views the chips from below

(see "1.5.14 Option Lookup Camera Scale

(O 60)" on page 1-31)

Application data

The application data has to be updated whenever

the bonder is reconfigured for a different product.

„ Learn Substrate Positions (O 9): Perform this

operation if changes are made to the indexer or

a different substrate is used (see "1.5.5 Learn

Substrate Positions (O 9)" on page 1-25)

„ Learn Module Positions (O 10): Perform this ope-

ration if the substrate is changed or the arrange-

ment of modules on the substrate is changed

(see "1.5.6 Learn Module Positions ( 10)" on

page 1-26)

„ Learn Wafer Radius (O 21): Perform this opera-

tion if a different wafer is used (see "1.5.7 Learn

Wafer Radius (O 21)" on page 1-26)

„ WFS Learn Chip (O 30): Perform this operation if

a different wafer is used or if the arrangement of

chips on the wafer is changed (see "1.5.9 WFS

Learn Chip (O 30)" on page 1-27)

„ WFS Learn Chip Index (O 31): Perform this ope-

ration if a different wafer is used or if the arran-

gement of chips on the wafer is changed (see

"1.5.10 WFS Learn Chip Index (O 31)" on page

1-28)

18

1 Bonding

1.5 Mode menu (O)

Software Manual A-1

1.5.1 DCL Camera Scale (O 1)

Trains the scaling factor for the DCL camera.

These settings have to be changed if modifications

are made to the mechanical or optical subsystems

of the DCL camera. You can perform scaling

manually or automatically.

When you call up the menu a prompt appears

asking whether you want to determine the scaling

factor automatically:

Automatic scaling

ÆClick on <Yes> if you want to have the scale fac-

tor calculated automatically.

ÆUse the trackball to select an unequivocally

recognisable pattern.

I M P O R T A N T

Observe the automatic scaling procedure, and

make sure that the system positions at this si-

gnificant point in each step. Repeat the proce-

dure if positioning is inaccurate.

ÆUse the trackball to define the size of the refe-

rence pattern window for the search.

ÆClick the left mouse button to confirm.

The program automatically determines the scaling

factors by moving defined distances in X and Y and

then relocating the reference pattern.

The factors previously active are shown along with

the new factors at the bottom right of the screen.

Click the "Yes" button to confirm the new factors or

click the "No" button to cancel the procedure:

Manual scaling

ÆClick on <No> if you want to calculate the scale

factor manually.

I M P O R T A N T

For manual scaling, select a sharply defined

point on the substrate so that positioning is as

accurate as possible.

ÆThe program expects you to move the cros-

shairs at the top left of the screen to a significant

point.

I M P O R T A N T

Always make sure that you position accurately

at the point you select, as otherwise the scaling

factor will not be computed correctly.

ÆClick "enter" to confirm that you have moved the

crosshairs to the point. The program moves the

camera a defined distance and expects that you

will again move the crosshairs (now at the top

right of the screen) to the significant point origi-

nally marked. Click "enter" to confirm that you

have moved the crosshairs to the point.

19


1.5 Mode menu (O)

ÆRepeat the procedure three times with the same

pattern; the crosshairs will reappear at a diffe-

rent corner for each repeat ÆPress "enter" to confirm (OK).



ÆClick the "Yes" button to confirm the new factors

or click the "No" button to cancel the procedure.

1.5.2 DCL Tool Offset (O 2)

Trains the P-axis offset (axis of rotation) of the DCL

unit.

When you call up the menu a prompt appears

asking whether you want to start the automatic pro-

cedure: ÆClick "Automatic" to start the procedure.

ÆSelect the appropriate option for a rectangular

or round DCL tool and click OK to confirm.

Rectangular DCL tool.

The procedure for a rectangular DCL unit is descri-

bed below.

1. 0° offset

ÆMove to the position and click the left mouse

button to confirm.


button to confirm.

20

1 Bonding

1.5 Mode menu (O)

Software Manual A-1


button to confirm.


button to confirm.


button to confirm.

ÆIf the crosshairs are not in the centre, click on

<No> and repeat the 0° offset process.

ÆIf the crosshairs are in the exact centre, click on

<Yes> and move on to the 360° offset process.

2. 360° offset


button to confirm.


button to confirm. ÆMove to the position and click the left mouse

button to confirm.

21


1.5 Mode menu (O)


button to confirm.



button to confirm.


button to confirm.


button to confirm.



button to confirm.


button to confirm.

22

1 Bonding

1.5 Mode menu (O)

Software Manual A-1


button to confirm.

Round DCL tool.

The procedure for a round DCL unit is described

below.

DCL tool offset can be computed with the aid of the

centre of the circle or three points on the circumfe-

rence of the circle.

1. Circle centre (0° offset)

ÆMove to the positions and click the left mouse

button to confirm.


button to confirm.


button to confirm.


<No> and repeat the DCL tool offset process.


<Yes> to confirm the DCL tool offset and move

on to the 360° offset process.

2. 360° offset


button to confirm.

23


1.5 Mode menu (O)



button to confirm.


button to confirm.


button to confirm.




button to confirm.

Three points on circumference of circle


button to confirm.

24

1 Bonding

1.5 Mode menu (O)

Software Manual A-1


button to confirm.


button to confirm.


<No> and repeat the DCL tool offset process.


<Yes> to confirm the DCL tool offset and move

on to the 360° offset process (same as the pro-

cedure using the centre of the circle, See " 2.

360° offset" on page 1-20)

1.5.3 DCL Camera <–> Tool Offset (O 3)

Trains the distance between the optical axis of the

DCL camera and the axis of the DCL unit.

When you select this menu item the program

expects you to move the DCL unit to a significant point.

ÆMove the tool to the positions and click the left

mouse button to confirm.

ÆMove the moving wafer camera (MWC) to the

positions and click the left mouse button to con-

firm.

ÆClick the left mouse button to confirm that you

have selected a point. The new offset is saved.

25


1.5 Mode menu (O)

Parameter Description /

Value range, unit

Columns Number of columns

Rows Number of rows

Substrates The number of substrate positi-

ons

Modules The number of modules

1.5.4 EPO Camera <–> Dispenser Offset

(O 7)

Trains the distance between the axis of the camera

and the Z-axis of the bond head.

A single spot of epoxy is set so that you can move

the crosshairs to it and the program can compute

the distance.

ÆMove the axes, set a single epoxy spot and click

"OK". The program expects you to move the

crosshairs to a significant point.

ÆClick a mouse button to confirm that you have

selected a point. The new offset is saved.

1.5.5 Learn Substrate Positions (O 9)

Trains the substrate positions. The substrate is the

set of modules on a carrier. A substrate can have

one or more modules of a single type. Substrates

are arranged in rows and columns in a block. The

example below has 2 rows and 3 columns.

+ + +

+ + +

I M P O R T A N T

If there are multiple blocks with the same con-

figuration, you can minimise the work involved

in programming simply by adding blocks. (Use

the "Add Block" function in the "job" dropdown

menu)

Parameter

The parameters refer to the substrate type selec-

ted in the "Substrate Type" dropdown menu.

26

1 Bonding

1.5 Mode menu (O)

Software Manual A-1


job

Create Block Deletes all the substrates of the

current type and creates a new

substrate with the current num-

ber of rows and columns.

Not implemented until you select

<OK>.

Add Block Adds a new substrate to an exi-

sting substrate

Not implemented until you select

<OK>

Substrate Type Select the substrate type

Dropdown menu 1.5.6 Learn Module Positions ( 10)

The procedure for training module positions is ana-

logous to O 9

(see "1.5.5 Learn Substrate Positions (O 9)" on

page 1-25)

1.5.7 Learn Wafer Radius (O 21)

Trains the radius of the wafers.


expects you to enter any three distinct points on

the edge of the wafer, which you enter with the aid

of the trackball.

I M P O R T A N T

Select the three points in accordance with the

sketch below, in order to ensure that the wafer

radius is computed correctly.

ÆMove to a significant point of the top left sub-

strate and click the left mouse button to confirm.

ÆMove to the identical point on the top right sub-

strate and click the left mouse button to confirm.

ÆMove to the identical point on the bottom right

substrate and click the left mouse button to con-

firm.

The position of the first substrate is shown in Sub-

strate Position (A1).

1 2

WAFER

3

ÆConfirm each point in turn by clicking the "OK"

button, or click the "Cancel" button to cancel the

operation.

27


1.5 Mode menu (O)

1.5.8 Camera-Needle Offset (O 25)

Determines the offset of the needle position rela-

tive to the centre of the wafer camera. This offset

is used to correct positioning of the wafer table and

the DCL unit. You should compute the offset if

chips are not stamped out correctly or if needles

have been replaced.

ÆCall up mode 13, "Camera Needle Offset".

ÆExtend the needles and adjust the lighting so

that the needles are visible.


expects you to enter three points on the chip, using

the cursor keys to move to each point in turn:

bottom right, bottom left and top left. 3

DIE

ÆUse the trackball to align the crosshairs with the

needle centre: 2 1

ÆClick the left mouse button to register the offset.

ÆClick on <Ok> to accept the camera needle off-

set.

1.5.9 WFS Learn Chip (O 30)

Train the chip positions. Once you have trained the

chip position, you can continue right away with the

dialog and define the chip index and the position of

the inkdot.

I M P O R T A N T

Precision is essential at this stage, because

the accuracy of the entire pick&place operation

depends on it.


have selected each point in turn.

Once you have trained the third point the program

calculates the centre of the chip and the system

moves to this position.

28

1 Bonding

1.5 Mode menu (O)

Software Manual A-1

1.5.10 WFS Learn Chip Index (O 31)

You can train the chip index (spacing in X and Y

between chips) manually or automatically.

Training the chip position automatically

The starting point for indexing is the chip centre

trained with mode 30 (WFS Learn Chip). The refe-

rence patterns stored in memory are used along

with the chip dimensions to move to each neigh-

bouring chip in turn (in the sequence 1 to 4), so that

the distances in X and Y can be calculated.

1 2

Training the chip position automatically

You must move the crosshairs to significant points

on neighbouring chips, so that the program can

calculate the chip index.

ÆMove the crosshairs to the bottom right edge of

the first chip and click the left mouse button.

ÆMove to the next chip on the left, move the cros-

shairs to the bottom right edge of this chip and

click the left mouse button.

ÆMove to the chip above the second chip, move

the crosshairs to the bottom right edge of this

chip and click the left mouse button. The chip

4 3 index is calculated.

ÆClick "Yes" to save the index pitches as calcula-

ted, or click "Cancel" to repeat the process:

ÆClick "Yes" to save the index pitches as calcula-

ted, or click "Cancel" to repeat the process:

29


1.5 Mode menu (O)

1.5.11 MWC Camera Scale (O 51)

Scaling of the optical system, the moving wafer

camera and the fixed wafer table.

Determines the ratio between the resolution of the

camera and the measuring system of the coordina-

tes table. The correlation between one pixel in the

camera's image and µm of travel is computed.

You can perform scaling manually or automati-

cally.

The procedure is the same as that for Mode 1 (see

"1.5.1 DCL Camera Scale (O 1)" on page 1-18)

Select the moving wafer camera

ÆSelect the "High Resolution" option if you want

to use the high-resolution camera.

ÆSelect the "Low Resolution" option if you want to

use the low-resolution camera.

Automatic scaling

ÆClick on "Yes" in the "Automatic camera scale?"

window.


rence pattern window for the search and click

the left mouse button to confirm.

I M P O R T A N T

For automatic scaling, select a sharply defi-

ned, uniquely identifiable point.

ÆUse the trackball to define the size of the search

window and click the left mouse button to con-

firm.







or click the "No" button to cancel the procedure:

Manual scaling

ÆClick on "No" in the "Automatic camera scale?"

window.

I M P O R T A N T

For manual scaling, select a unique, sharply

defined point on the substrate so that posi-

tioning is as accurate as possible.


shairs at the top left of the screen to the signifi-

cant point.

I M P O R T A N T








right of the screen) to the significant pattern ori-

ginally marked.


crosshairs to the point.

ÆRepeat the procedure three times with the same

pattern; the crosshairs will reappear at a diffe-

rent corner for each repeat.

The program now calculates the scaling factors.



Æ Click the "Yes" button to confirm the new factors


I M P O R T A N T





30

1 Bonding

1.5 Mode menu (O)

Software Manual A-1

1.5.12 MWC Wafertable <–> DCL Trafo

(O 52)

Scaling of the system by moving the wafer table

with the DCL tool at a standstill.

You must use this method of scaling for wafers and

gel packs, but not for waffle packs, because in the

latter case the wafer table is not used for posi-

tioning the chips.


cally.

The procedure is similar to that for Mode 1 (see

"1.5.1 DCL Camera Scale (O 1)" on page 1-18)

Automatic scaling

ÆClick on "Yes" in the "Automatic camera scale?"

window.




I M P O R T A N T

For automatic scaling, select a sharply defi-

ned, uniquely identifiable point.

ÆUse the trackball to define the size of the search

window and click the left mouse button to con-

firm.

I M P O R T A N T












Manual scaling

ÆClick on "No" in the "Automatic camera scale?"

window.

I M P O R T A N T

For manual scaling, select a unique, sharply

defined point on the substrate so that posi-

tioning is as accurate as possible.


shairs at the top left of the screen to the signifi-

cant point.

I M P O R T A N T








right of the screen) to the significant pattern ori-

ginally marked.


crosshairs to the point.

ÆRepeat the procedure three times; the cros-

shairs will reappear at a different corner for each

repeat.

The program now calculates the scaling factors.



Æ Click the "Yes" button to confirm the new factors


31


1.5 Mode menu (O)

1.5.13 MWC Camera <–> Tool Offset (O 53)

Trains the distance between the optical axis of one

of the two moving wafer cameras and the axis of

the DCL unit.


expects you to move the DCL unit to a significant

point.


have selected a point.

The program expects you to move the current

moving wafer camera to a significant point.


have selected a point.

The new offset is saved.

1.5.14 Option Lookup Camera Scale (O 60)

Scaling of the optical system of the optional fixed

lookup camera.

Determines the ratio between the resolution of the

camera and the measuring system of the coordina-

tes table. The correlation between one pixel in the

camera's image and µm of travel is computed.

You must train the base position (see " Lookup

Camera (option)" on page 1-117) and tool centre

(see " Data" on page 1-93) beforehand.


cally.

Automatic scaling

ÆUse the trackball to select a point that is as

uniquely identifiable and sharply focused as

possible and click the left mouse button to con-

firm.




Manual scaling

I M P O R T A N T

For manual scaling, select a sharply defined

point on the substrate so that positioning is as

accurate as possible.


shairs at the top left of the screen to a significant

point.

I M P O R T A N T








right of the screen) to the significant point origi-

nally marked. Click "enter" to confirm that you

have moved the crosshairs to the point.

ÆRepeat the procedure three times; the cros-

shairs will reappear at a different corner for each

repeat.

ÆPress "enter" to confirm (OK).





I M P O R T A N T










Click the "Yes" button to confirm the new factors or

click the "No" button to cancel the procedure:

32

1 Bonding

1.6 Application Pages menu (A)

Software Manual A-1


Value range, unit

Name of the substrate type

S Index for current

substrate position

M Index for current

module position

1.6 Application Pages menu (A )

The "Application Pages" menu is for accessing

parameters affecting a particular application.

These include, for example, wafer-specific data,

substrate-specific data and the settings for pattern

recognition.

"Substrate Types (A 6)" also provides access to

the first five menu items, which are used creating

and configuring substrates.

"Production Data (A 9)" is for controlling the pro-

duction flow.

1.6.1 Substrate type (A6)

Menu for creating and configuring substrate types.

The register tabs take you to input masks that you

an also access from the "Application Pages" main

menu.

You can use the <PAGE UP> and <PAGE

DOWN> keys to switch from tab to tab.

„ Overview: See “Overview” on page 33.

„ Substrate Positions:

See “Substrate Position (A 1)” on page 35.

„ Module Positions: See “Module Position (A 2)”

on page 36.

„ Bond Positions:

See “Bond Position (A 3)” on page 37.

„ Epoxy Positions:

See “Epo Position (A 4)” on page 38.

„ Alignment:

See “Alignment (A 5)” on page 52.

Example for clarification of terms

Substrate type 1 Substrate type 2

Substrate type 1 consists of 4 substrates. The sub-

strate position is always the top left corner, marked

"°". Each pair of alignment points are marked "+".

Each substrate has 2 modules. The module posi-

tion is always the top left corner of the module.

Each module has 2 bond/EPO positions (indicated

by the black squares).

Substrate type 2 consists of 2 substrates. The sub-

strate position is always the top left corner, marked

"°". Each pair of alignment points are marked "+".

Each substrate has 1 module. The module position

is always the top left corner of the module. Each

module has 3 bond/EPO positions (indicated by

the black squares).

Parameters above the register tab

33



Button Description

F5: Cancel Adj. Cancels adjustment

F9: MWC L. Off Switches off the light of the

moving wafer camera

fn+F7: Ins./Del.

insert: Insert the new data

record at the position of the cur-

rent data record

append: Append the new data

record after the current data

record

delete: Delete the current data

record


Value range, unit

B Index for current

bond position

E Index for current

epoxy position

A Index for current

alignment

Overview

Use the <PREVIOUS> and <NEXT> keys to

browse between substrate types.

Parameter


Value range, unit

Substrate type Name of the currently selected

name: substrate type

Number: Number of the currently selected

substrate type

Substrate Substrate

positions:

max: Number

current: Current index

Module positions: Modules on a substrate

max: Number


Bond positions: Bond positions

max: Number


Epo positions: Epoxy positions

max: Number


Alignments: Substrate alignments

max: Number


Checkbuttons

Checkbutton Description

Use Pickup Activates the pickup option for

transporting the substrate to/

from the oven

Buttons

Button Description

Pickup Data Accesses the parameters for

pickup (active only if the "Use

Pickup" check box is activated)

F4: Adjust Perform adjustment: scan and

centre the chip and save the

directional information.

34

1 Bonding


Software Manual A-1


Value range, unit

Pickup Data

Pickup pos: X Coordinates of the pickup posi-

tion

µm

Y

Z

P Rotation of the pickup position

0,10 °

Pickup rampheight: Height as of which the speed of

Z the DCL unit is reduced as it

moves in the Z direction.

µm

Speeds Speeds

Ramp up speed Speed of the Z-axis for upward

ramp (ramp: range in which only

the Z-axis moves).

% of normal speed of the Z-axis

Ramp down speed Speed of the Z-axis for down-

ward ramp (ramp: range in

which only the Z-axis moves).

% of normal speed of the Z-axis.

Pickup delay Delay between pickup and the

start of the Z movement of the

DCL unit.

ms

Substrate Pickup Settings

Substrate types settings (A6) > Overview > Pickup


Value range, unit

Data

Parameters for pickup of the substrate, e.g. for

transport to/from the oven or from the indexer.

DCL (after pickup

delay)

Maximum time allowed for appli-

cation of DCL vacuum after the

"pickup delay". If overshot: Error

message

0: Function is inactive.

ms

Pickup


Pickup DCL Tool

Select

Parameter

Chip Control

Define how control is implemented for whether the

tool is carrying a chip.

C A U T I O N

In order to avoid malfunctions, chip con-

trol should be implemented with at least

the infrared sensor and/or a vacuum sen-

sor.


Use IR Use the infrared sensor


No vac. check No check with vacuum sensor

Use Vacuum 1 Use vacuum level 1

Use Vacuum 2 Use vacuum level 2

Alignment


Use Alignment Decision as to whether align-

ment is used for pickup

35



Button Description

Bond Data Call up bond parameters.

F5: DCL Vacuum Switch the vacuum at the DCL

unit on or off.

F7: Pickup Pos Move to the pickup position

F9: ChipCntrl Move the DCL unit to the chip

control position.

F10: Move DCL Switch to trackball control for

moving the DCL unit using the

trackball. Press the "+" key to

increase the speed of move-

ment, or press the "–" key to

reduce the speed. Press "Shift"

to activate a higher speed

directly.

Press "F10" again to toggle back

to the mouse function.

Buttons 1.6.2 Substrate Position (A 1)

View and modify the position of a substrate.


browse between substrates.

Parameter


Value range, unit

Substrate number Number of the currently selected

substrate

Position X View the position trained for the

selected substrate.

µm

Y

DCL bondpos.

offset: dX

Offset for all bond positions for

this particular substrate (calibra-

tion) dY

Checkbuttons


Skip If the check box for the selected

substrate is activated the sub-

strate in question is not proces-

sed, in other words epoxy

adhesive is not applied and no

chip is inserted.

fn+F1: Move To Move to the position

36

1 Bonding


Software Manual A-1

Buttons 1.6.3 Module Position (A 2)

Button Description

fn+F7: Ins./Del.



rent data record



record


record

A substrate can consist of multiple modules. The

position is defined for each module.


browse between modules.

Parameter


Value range, unit

Module number Number of the currently selected

module.

Position X Position of the selected module.

µm Y

Checkbuttons


Skip If the checkbutton for the selec-

ted module is activated the

module in question is not pro-

cessed, in other words epoxy

adhesive is not applied and no

chip is inserted.

Buttons

Button Description

F2: Next Sub. Select next substrate, respec-

tively, and show values.

F3: Prev. Sub. Select previous substrate,

respectively, and show values.

37



Button Description

F6: Trace Automatic transfer to the pro-

gram of the position to which the

system has moved and repre-

sented by the coordinates in the

input field which contains the

cursor and the linked fields (see

"1.3.4 Entering coordinates" on

page 1-12).


fn+F7: Ins./Del.



rent data record



record


record

1.6.4 Bond Position (A 3)

Bond parameters are displayed and can be modi-

fied.


browse between bond positions.

Parameter


Value range, unit

Bond pos Number of the currently selected

number bond position.

Component Select the number of the wafer/

component that carries the

requisite chips.

Position X The X and Y coordinates of the

selected bond position.

µm

Y

Rotation° The P coordinate (rotation) of

the selected bond position.

°

Bond height Z The Z coordinate (height) of the

selected bond position.

µm

Ramp height Z Height above the touchdown

point (bond position), as of

which speed of the Z axis is

reduced.

µm

38

1 Bonding


Software Manual A-1

Button Description

Adjust Perform adjustment: scan and



F1: Move To. Move to the selected position.

F2: Next Sub. Select next substrate , respec-


F3: Prev. Sub. Select previous substrate,

respectively, and show values.

F4: Next Mod. Select next module, respec-


F5: Prev. Mod. Select revious module, respec-









page 1-12).


F10: Move Switch to trackball control for

moving along the X and Y axes

using the trackball. Press the "+"

key to increase the speed of

movement, or press the "–" key

to reduce the speed. Press

"Shift" to activate a higher speed

directly.



fn+F7: Ins./Del.



rent data record

append Append the new data


record

delete Delete the current data

record

Buttons 1.6.5 Epo Position (A 4)

Define parameters for epoxy application.


browse between EPO positions.

Parameter


Value range, unit

Epo pos number Number of the chip position cur-

rently selected for epoxy dispen-

sing.

Combined to DCL not active

pos

Offset to DCL pos

dX

Offset in X and Y of the pattern

for epoxy dispensing relative to

the DCL position

µm

dY

Ramp settings:

Ramp height up: Z Height above the point at which

the stamp dips into the squee-

gee unit, as of which the upward

speed of the Z axis is increased.

µm

Ramp height down: Height above the point at which

Z the stamp dips into the squee-

gee unit, as of which the down-

ward speed of the Z axis is

reduced.

µm

Ramp speed up Speed of the stamp from the

V [%] immersion point to the "Ramp

height up".

% of normal speed.

39



Button Description

Adjust Perform adjustment: scan and



Stamp Parameter for epoxy application

with stamp

Dispense Parameter for epoxy application

with dispenser

F1: Move To. Move to the selected position.



F3: Prev. Sub. Select previous substrate and

show values.

F4: Next Mod. Select next module and show

values.

F5: Prev. Mod. Select previous module and

show values.

F8: Squeegee Switch squeegee on and off.

fn+F1: Move To Move dispenser or tool, as appli-

cable, to the position.

fn+F7: Ins./Del.



rent data record



record


record


Value range, unit

Stamp Parameters

Epo Position (A4) > Stamp

Ramp speed down

V [%]:

Buttons

Speed of the stamp from the

"Ramp height down" to the

immersion point.

% of normal speed.

Parameters for epoxy application with stamp

Use the <NEXT> button on the keyboard module

to select the next epoxy position or the

<PREVIOUS> button to select the previous posi-

tion.

The sketch illustrates the epoxy process in sche-

matic form.

Workheight

Ramp down Ramp up

Speed

ramp down

Position Z

Speed ramp up

Substrate

Delay

Parameter


Value range, unit

Stamp settings

Position: Z Height of the stamp position

µm

Rotation: P Defined rotation of the pattern to

be stamped

0,01°

Delays

40

1 Bonding


Software Manual A-1


Value range, unit

Stamp delay Dwell time of the stamp on the

pattern

Ramp up delay Delay between arrival at the

"Ramp height up" position and

resumption of stamp movement.

The "Ramp up delay" prevents

strings of adhesive forming.

ms

Squeegee settings

Offset: Z Offset from squeegee position Z

in EPO Mach Data

µm

Button Description

F1: Cam. Pos Move crosshairs to the epoxy

position.




show values.


values.


show values.








page 1-12)









directly.



Dispenser Parameters

Epo Position (A4) > Dispenser

Parameters for epoxy application with dispenser

Buttons

Use the <NEXT> button on the keyboard module

to select the next epoxy position or the

<PREVIOUS> button to select the previous posi-

tion.

The sketch illustrates the epoxy process in sche-

matic form.

Workheight delay

Epoxy work height

Epoxy ramp down

Speed ramp down

Epoxy position Z

Substrate

Speed to workheight

Steps after dispensing

Epoxy ramp up

Speed ramp up

1 Dispenser steps

at start 2 Start delay 3 Dispense start

Point o line I line -

1 Dispense end 2 Dispenser steps

at end 3 End delay

Parameter


Value range, unit

Dispenser

settings

Position: Z Height of the dispenser position

µm

41




Value range, unit

Workheight

settings

Epoxy Workheight: Height above the epoxy position,

Z as of which speed of the Z axis is

reduced on the downward

stroke.

µm

Workheight speed Speed on the upward stroke

until the „Ramp height up“ to

„Epoxy Workheight“

% of normal speed

Workheight delay Delay on the „Epoxy Work-

height“ position and resumption

of stamp movement.

The "Workheight delay" pre-

vents strings of adhesive for-

ming.

ms

Button Description

Type settings Parameters that are dependent

on the type of dispenser

Pattern settings Parameters for defining a dis-

pensing pattern (see " Pattern

settings" on page 1-45)


position.




show values.


values.


show values.

Button Description








page 1-12)








directly.



Dropdown menu


Dispense time Definition of the type of dispen-

ser used (see " Type settings" on

page 1-41)

Dispense pattern Select a dispense pattern (see "

Pattern settings" on page 1-45)

Buttons

Type settings

Epo Position (A4) > Dispenser > Type settings

Parameters that are dependent on the "Dispenser

Type" dropdown menu

Possible dispenser types are

„ Spindle (see " Settings for the "Spindle" dispen-

ser type" on page 1-42)

„ Spindle (Air) (see " Settings for the "Spindle

(Air)" dispenser type" on page 1-43)

„ Needle Valve (see " Dispenser type "Needle

Valve" settings" on page 1-43)

„ Air Pressure (see " Settings for the "Air Pres-

sure" dispenser type" on page 1-44)

„ GL2A (see " Settings for the "GL2A" dispenser

type" on page 1-45)

42

1 Bonding


Software Manual A-1

Button Description

Adjust Initiates an adjustment.

F1:Move Disp. Move the dispenser to its origi-

nal position.

F2: Next Sub. Select next substrate and show

values.


show values.


values.


show values.








directly.



fn+F1: Real Pos Move dispenser to the epoxy

position

fn+F7: Dispense Perform a dispensing cycle.

Settings for the "Spindle" dispenser type



Type" dropdown menu

Parameter


Value range, unit

Middle delay Shutdown time for the compres-

sed after travel through the

"Steps at start".

ms

End delay Shutdown time for the compres-

sed air at the end of the row,

before travel through the "Steps

at end" commences.

ms

Buttons


Value range, unit

Steps Number of steps through which

the spindle is rotated during dis-

pensing.

Steps at start / end Number of steps through which

the spindle is rotated at the start

and end, respectively, to apply

more epoxy adhesive at the cor-

responding positions.

Air-Spindle delay Delay for start of spindle move-

ment after the compressed air is

applied.

ms

Tear off steps Number of steps through which

the spindle is rotated back at the

end of each row, in order to keep

thin adhesives from dripping.

Tear off offset Distance travelled back at the

end of the row.

% of the distance travelled along

the row

Delays

Start delay Delay preceding application of

the compressed air at the start of

the row, before travel through

the "Steps at start" commences.

ms

43



Button Description








directly.




position


Settings for the "Spindle (Air)" dispenser type



Type" dropdown menu

Parameter


Value range, unit

Steps with air Number of steps with compres-

sed air ON through which the

spindle is rotated during dispen-

sing.

Steps without air Number of steps with compres-

sed air OFF through which the

spindle is rotated during dispen-

sing.

Air-Spindle delay Delay for start of spindle move-

ment after the compressed air is

applied.

ms

Buttons

Dispenser type "Needle Valve" settings

Similar to the dispenser type "Air Pressure" set-

tings.

This dispenser type has only one valve. The adhe-

sive is continuously under the pressure of the com-

pressed air.

Button Description



nal position.


values.


show values.


values.


show values.

44

1 Bonding


Software Manual A-1

Button Description



nal position.


values.


show values.


values.


show values.








directly.




position


Settings for the "Air Pressure" dispenser type



Type" dropdown menu

Dispenser with compressed air valve upstream of

the adhesive and a valve that opens and closes the

dispenser.

The meanings of the parameters vary, depending

on whether "Rectangle" was selected in the "Dis-

pense pattern" dropdown menu.

Parameters (rectangle selected)


Value range, unit

Delays

Start delay Idle time with valve ON at the

start

ms

End delay Idle time with valve OFF at the

end

ms

Edge delay Time for travelling along one

edge of the rectangle

ms

Parameters (rectangle not selected)

Buttons


Value range, unit

Delays

Start delay Compressed-air time

ms

End delay Idle time with valve OFF at the

end

ms

Edge delay No meaning

ms

45



Button Description








directly.




position


Button Description



nal position.


values.


show values.


values.


show values.

Settings for the "GL2A" dispenser type



Type" dropdown menu

This dispenser can dispense only spots with a uni-

form quantity of adhesive. The adhesive is conti-

nuously under the pressure of the compressed air.

A metering chamber is alternately filled with adhe-

sive and emptied in the metered application pro-

cess.

Parameter


Value range, unit

Delays

Start delay time

ms

Middle delay Not yet used

ms

End delay Idle time

ms

Buttons

Pattern settings

Epo Position (A4) > Dispenser > Pattern settings

Parameters that are dependent on the "Dispense

Pattern" selected

„ Point: Single spot (see " Dispenser Pattern

Point Settings" on page 1-46)

„ Point Matrix: Spots arranged in a matrix (see "

Settings for the "Point Matrix" dispenser pattern"

on page 1-46)

„ Horizontal Line: Dispense along a line parallel to

the X-axis (see " Settings for the "Horizontal/

Vertical Line" dispenser pattern" on page 1-47)

„ Vertical Line: Dispense along a line parallel to

the Y-axis (see " Settings for the "Horizontal/

Vertical Line" dispenser pattern" on page 1-47)

„ General Lines: Dispense a freely selectable

number of lines with any angle of rotation (see "

Settings for the "General Lines" dispenser pat-

tern" on page 1-48)

„ Cross: Dispense in two lines intersecting to form

a cross (see " Settings for the "Cross Settings"

dispenser pattern" on page 1-49)

„ 5 points: Dispense 5 spots arranged like the

spots on the face of a die (see " Settings for the

"5Dots (GL2A" dispenser pattern" on page 1-50)

„ Circle: Dispense along the arc of a circle (see "

Settings for the "Circle" dispenser pattern" on

page 1-51)

„ Rectangle: Dispense along a rectangle (see "

Settings for the "Rectangle" dispenser pattern"

on page 1-52)

46

1 Bonding


Software Manual A-1


Value range, unit

Length / Width Length in X and width in Y of the

dispensing pattern

µm

Angle Rotational angle of the pattern

0,01°

Lines / Columns Number of and columns

Speed Speed

% of normal speed

Acceleration Acceleration

% of normal acceleration

Button Description



position


values.


show values.


values.


show values.








directly.




position


Dispenser Pattern Point Settings


Parameters for dispensing a point

Parameter


Value range, unit

Speed Speed

set this value to 100%

% of normal speed


set this value to 100%.


Settings for the "Point Matrix" dispenser pat-

tern


Parameters for dispensing points in a matrix pat-

tern

Parameter

Buttons

Buttons

Button Description

Adjust Perform adjustment


position


values.


show values.


values.


show values.

47



Button Description








directly.




position


Settings for the "Horizontal/Vertical Line" dis-

penser pattern


Parameters for dispensing along a horizontal or

vertical line.

Parameter


Value range, unit

Length / Width Length and height of the dispen-

sing pattern

µm

Speed Speed


% of normal speed




Buttons

Button Description



position


values.


show values.


values.


show values.

48

1 Bonding


Software Manual A-1

Button Description








directly.




position


Button Description



position


values.


show values.


values.


show values.








directly.




position


Buttons

Settings for the "General Lines" dispenser pat-

tern


Parameters for dispensing a freely selectable

number of lines with any angle of rotation

Parameter


Value range, unit


dispensing pattern

µm

Angle Rotational angle of the dispen-

sing pattern

0,01°

Lines Number of lines

Speed Speed


% of normal speed




49



Button Description


show values.


values.


show values.








directly.




position


Settings for the "Cross Settings" dispenser

pattern


Parameters for dispensing in two lines intersecting

to form a cross.

Parameter


Value range, unit


dispensing pattern

µm


sing pattern

0,01°

Diameter Diameter of the centre that

remains clear of adhesive.

µm

Speed Speed


% of normal speed




Dropdown menu


Dispense pattern Broken: The lines are interrup-

ted in the middle

Solid: Unbroken lines

Buttons

Button Description



position


values.

50

1 Bonding


Software Manual A-1

Button Description


values.


show values.


values.


show values.








directly.




position


Settings for the "5Dots (GL2A" dispenser pat-

tern


Parameters for dispensing 5 spots arranged like

the spots on the face of a die

Parameter


Value range, unit


dispensing pattern.

µm


sing pattern.

0,01°

Repetitions Repeats of the central point

(GL2A only)

Offset Z moves this offset further from

the substrate for each repeat

(GL2A only)

Factor Use a start delay multiplied by

this factor instead of the ordinary

start delay (GL2A only)

%

Speed Speed


% of normal speed




Buttons

Button Description



position

51



Button Description








directly.




position


Settings for the "Circle" dispenser pattern


Parameters for dispensing a circle

Parameter


Value range, unit

Radius Radius of the circle

µm

Start Angle Starting angle of the dispensing

pattern

0,01°

Curve Angle Angle of movement

0,01°

Speed Speed

Set this value to 100%.

% of normal speed


Set this value to 100%.


Buttons

Button Description


position


values.


show values.


values.


show values.

52

1 Bonding


Software Manual A-1


Value range, unit


dispensing pattern.

µm

Duration horiz. / Duration of the horizontal or ver-

vert. tical movement.

ms

Acceleration Duration of acceleration

duration ms

Settings for the "Rectangle" dispenser pattern


Parameters for dispensing a rectangle

Parameter

1.6.6 Alignment (A 5)

Settings for substrate adjustment.


browse between alignments.

Adjustment at two substrate positions is necessary

in order to achieve unambiguous definition of the

substrate's position and orientation.

You can use any combination of the four possible

search modes. Use the Dropdown-Menüs behind

"Characteristic 1" and "Characteristic 2" to select any

of the following search modes:

„ Ordinary Alignment: structure search, see

page 1-56

„ Edge Search: edge search, see page 1-59

„ Circle Center Finder: find circle center using

three user-defined points, see page 1-66

„ Hole Finder: find hole, see page 1-70

„ No Operation: Characteristic is not active

Use the Dropdown-Menü behind "Transformation"

to select one of the following transformations:

„ Standard: standard transformation

„ Shift+Rotate (1st): An offset is calculated from

the position of the first point. The position of the

second point is obtained as a rotational offset

described around the first point as the centre.

„ Shift+Rotate (2nd): An offset is calculated from

the position of the second point. The position of

the first point is obtained as a rotational offset

described around the second point as the cen-

tre.

„ Single Edge Search: Transformation with only

one adjust point for the edge search.

53



Button Description

Align Data 1/2 Parameters for substrate align-

ment characteristic 1/2 see

page 1-55

Ink Dot Parameters for inkdot searchsee

page 1-53

Focus/Light/Skip/ The parameters defined in the

Pos.transfer Global Data apply to alignment

and the inkdot search only if the

"Global Focus / Light" checkbut-

ton is activated in the configura-

tion settings (basic setting, see

page 1-140). If this precondition

is not satisfied alignment is sub-

ject to the focus and light set-

tings defined in the submenus of

the applicable search mode.

Irrespective of the configuration

settings, the settings defined

here are always active for

viewing the bond points with the

EPO or DCL camera see

page 1-54.

fn+F7: Ins./Del.



rent data record



record


record

Parameter


Value range, unit

Alignment The number of the alignment

Buttons

Substrate Adjustment Ink Dot

Alignment (A 5) > Ink Dot

Parameters for inkdot search.

Parameter


Value range, unit

Ink Date

Task Id The number of the task

Position X Coordinates of the position

pixels Y

Window size DX Size of the area for the search to

locate the inkdot on the sub-

strate.

pixels

DY

Threshold Greyscale threshold as of which

a pixel is identified as white or

black. The lower the value, the

more dark pixels will be assi-

gned to the white range.

0..255 (black..white)

Limit Limit for the proportion of white

pixels in the ink window. A value

lower than this threshold is inter-

preted as indicating that the chip

is inked. A value higher than this

threshold is interpreted as indi-

cating that the chip is OK.

0..100 % white.

Focus Height DCL Focusing height of the DCL unit.

µm

54

1 Bonding


Software Manual A-1

Button Description

F1: Move To Move to the coordinates corre-

sponding to the values in the

input field (see "1.3.4 Entering

coordinates" on page 1-12)

F4: Search Perform pattern recognition for

substrate recognition. You can

use this function to check whe-

ther the parameter settings per-

mit correct pattern recognition.








page 1-12)

F8: Show ink Show the inkdot








directly.




Value range, unit

Light DCL 1 Brightness of the vertical direct

light for illuminating the sub-

strate at the DCL unit.

0..255

Light DCL 2 Brightness of the LED ring obli-

que light for illuminating the sub-


0..255

Checkbuttons


Inkpoint color If this checkbutton is activated

the search is for a white instead

of a black inkdot.

Use module ink If this checkbutton is activated

an inkdot search can be used.

Buttons

Global Data:

Alignment (A 5) > Global Data

The parameters defined for focus height and light

in the Global Data apply to alignment and the

inkdot search only if the "Global Focus / Light"

checkbutton is activated in the configuration set-

tings ((Service 5, PRU Settings), See "1.8.4 Confi-

guration (S 5)" on page 1-140). If this precondition

is not satisfied alignment is subject to the focus

and light settings defined in the submenus of the

applicable search mode. Irrespective of the confi-

guration settings, the settings defined here are

always active for viewing the bond points with the

DCL camera.

Parameter


Value range, unit


µm




0..255




0..255

Position

Transfer Data

Substrate Number

Point 1

Numbers of the three substrates

whose characteristic 1 will be

used for coordinate transfer from

the EPO unit to the DCL unit.

Select substrates that come as

close as possible to forming a

right-angled Isosceles triangle.

Point 2

Point 3

55



Button Description





F5: Cancel Adj. Discard the alignment data








page 1-12)

F7: Adjust Perform adjustment: scan and










directly.




Value range, unit

Align Data 1/2

Alignment (A5) > Align Data 1/2

Auto skip counter

consecutive/total

Buttons

Number of maximum permitted/

consecutive failed alignment

attempts. An error message is

issued if this limit is overshot.

0: Function is inactive

The input mask displayed varies, depending on

which search mode is selected.

„ Ordinary Alignment,

See " Alignment data for the Ordinary Alignment

search mode" on page 1-56

„ Single Edge Search,

See " Alignment data for Edge Search search

mode" on page 1-59

„ Circle Center Finder,

See " Alignment data for the Circle Center Fin-

der search mode" on page 1-66

„ Hole Finder,

See " Alignment data for the Hole Finder search

mode" on page 1-70

56

1 Bonding


Software Manual A-1


Value range, unit

Search area

width / height DX

Width and height of the area for

the search to locate the pattern.

Always make sure that the ent-

ries are higher than those for

"Search model width / height".

pixels

DY

Acceptance DCL Quality of the search.

Defines the accuracy of the

match required for acceptance

of the search outcome.

[0..999] = 0..99.9 %

Confusion DCL If the acceptance requirements

are satisfied by more than one

search result, the match repre-

sented by the value entered

here must be achieved or bette-

red for the pattern to be identi-

fied. Always make sure that the

entry is higher than that for

"Acceptance".

[0..999] = 0..99.9 %


Effective only when the "Global

Focus / Light" checkbutton is not

activated in the configuration

settings (See "1.8.4 Configura-

tion (S 5)" on page 1-140).

µm



strate at the DCL unit. Effective

only when the "Global Focus /

Light" checkbutton is not activa-

ted in the configuration settings

(See "1.8.4 Configuration (S 5)"

on page 1-140).

0..255








on page 1-140).

0..255

Alignment data for the Ordinary Alignment

search mode


Parameters for structure search.

You can use the <PAGE UP>/

<PAGE DOWN>buttons to toggle between cha-

racteristics.

Parameter


Value range, unit

Adjustment charac-

teristics:

No.: The number of the characteristic

1..2


Alignment point X X and Y coordinates for the

search for the position moved to.

To train:

-Click in the X field

-<F10> to activate the trackball

for moving the wafer camera

-Move to the point

-<F10> -<F6>

µm

Y

Search model

width / height DX

Area in X and Y in which the

search for the hole edges will

take place. Size the area in such

a way that the edges of the hole

are just inside it.

pixels

DY

57



Buttons

Button Description

DCL parameters Call up DCL parameters for the

alignment point in question.

EPO parameters Call up EPO parameters for the






F3: Train Train the selected search pat-

terns.













page 1-12)








directly.



58

1 Bonding


Software Manual A-1

Button Description

F7: Show Model Show ordinary alignment model

("Optional search feature" must

be activated in "Flags").

F8: Small Model Show the search model in the

size originally trained.

F9: Cleanup Show the original image.

F10: Adj. Value Change the position or size of

the area marks on the screen,

using the trackball or the cursor

keys.



DCL parameters for "Ordinary Alignment"

search mode

Alignment (A5) > Align Data 1/2 > DCL-Parameter

Parameter


Value range, unit

General:

Angle range: Permissible rotation of the

search models by comparison

with the reference image.

0.1 °, 0 = deactivated.

Angle increment: Distance between two search

models within Angle range.

0,1 °

Freemask area X Position and size of a range,

which is excluded from the

search

µm

Y

Dx

Dy

Checkbuttons


Rotation Should always be activated.

Permits search models to be

rotated for the structure search

Invers If this checkbox is marked, the

structure search takes place

inside the mask.

Buttons


Mask edges: Multiple marks are possible.

None No masking

North Top half of the screen.

East Right half of the screen.

South Bottom half of the screen.

West Left half of the screen.

Freemask The mask is defined by coordi-

nates (freemask area).

Mask options

59




Value range, unit

Confusion If the acceptance requirements








"Acceptance".

[0..999] = 0..99.9 %

Focus Height DCL Focusing height of the DCL/EPO

unit. Effective only when the

"Global Focus / Light" checkbut-

ton is not activated in the confi-

guration settings (See "1.8.4

Configuration (S 5)" on page 1-

140).

µm








on page 1-140)

0..255








on page 1-140)

0..255


Value range, unit

Adjustment charac-

teristics:


1..2

Task Id: DCL The number of the task



To train:




-Move to the point

-<F10> -<F6>

µm

Y

Acceptance Quality of the search.




[0..999] = 0..99.9 %

Alignment data for Edge Search search mode


An edge search is performed in two steps:

„ Structure search for approximate positioning

„ Edge search

Parameters for edge search

Parameter

Buttons

Button Description






coordinates" on page 1-12).


terns.

60

1 Bonding


Software Manual A-1

Button Description













page 1-12)








directly.



Edge search parameters for the alignment point


Parameter


Value range, unit

Edge window:

Upper left corner

X0

Top left corner of the search win-

dow for the edge search.

pixels Y0

width / height DX Size (width/height) of the search

window for the edge search.

pixels

DY

Angle P Skew of the search window for

the edge search.

Search Model: Used for approximating the posi-

tions of the edges.

Upper left corner

X0

Top left corner of the search

area for the initial search.

pixels Y0



pixels

DY

Search Area:

Upper left corner

X0



pixels Y0



pixels

DY

61




Value range, unit

Trained Point

X Coordinates of a trained point.

(Display only)

µm/ °

Y

P

Reference Point

X Coordinates of a reference

point. (Display only)

µm

Y

Free Point

X Coordinates of a freely selecta-

ble point inside or on the edges

(only if, in the "Flags for Edge

Search" window, "Result type"

"Free Point" is activated).

µm

Y

Button Description

Flags Show the window for defining

the edge search (see " Flags for

edge search" on page 1-61)

Caliper Call up caliper parameters see

page 1-64

Mask Settings Call up mask parameters for

hiding error sources see page 1-

65


terns.






F7: Show Model Show the model (zoomed to

camera-image size).

F8: Small Model Show a small model.

F9: Cleanup Clear the screen.




keys.



Buttons

Flags for edge search


> Flags

Checkbuttons


Calipers type

Search from inside The direction of the edge search

to outside along the caliper is from the

inside to the outside (otherwise,

the search is from the outside

toward the inside).

Testable edges

Top Position of the edge to be detec-

Right ted. If, for example, the top left

Bottom corner is to be detected, mark

Left the Top and Left checkbuttons.

Edge type Expected contrast transition.

dark to light Dark-to-light edge transition.

light to dark Light-to-dark edge transition.

don’t care Any edge transition

Score criteria:

Contrast edge Use the strongest edge transi-

tion for edge identification.

62

1 Bonding


Software Manual A-1


Position Use the contrast transition that is

nearest to the defined point and

crosses the contour threshold.

Absolute position Use the contrast transition that is

furthest from the start of the cali-

per and crosses the contour

threshold.

Calc line by

extreme value:

None The extreme value to be used to

Top calculate an edge.

Right

Bottom

Left

General search

mode

Optional search Initial structure search (should

feature always be activated)

old style line impro- Cease usage as of now

vement (compatibility)

Result type Possible results

(corner)

Upper left The corresponding corners

Upper right

Lower right

Lower left

Center Middle point

Free point Freely definable point on the

boundary or inside the edges

Free point at corner If an edge is not found, the result

is interpolated from the edges

found.

Result options

90° corners The corners found must be 90°

corners, or they will be rejected

(set permissible deviation in the

"Calipers for Edge Search" win-

dow with the "90° Error" parame-

ter).

Calc missing If at least two edges are found,

corners all corners are extrapolated from

these edges.

Use max. extreme

value:

Upper Left Use the maximum extreme

Upper Right value

Lower Right

Lower Left

Buttons Button Description

Optional

Parameters

Call up optional parameters for

vertical corners

63




Search from inside Perform edge search from the

to outside inside toward the outside.

Edge type

dark to light Detect dark-to-light edge transi-

tion.

light to dark Detect light-to-dark edge transi-

tion.

don’t care Detect any transition.

Score criteria:

Contrast edge If there are two or more edge

transitions, use the strongest for

edge identification.







threshold.

Optional Parameters


> Flags > Optional Parameters

Separate the properties of the two horizontal

edges from the properties of the two vertical

edges.

Parameter


Value range, unit

Settings:

Found pt: The minimum percentage of

points that has to be found

before an edge is accepted as

valid.

%

Error dist.: If the distance from the point to

the line found in the search is

greater than this, the point is

marked as not found.

Cntr.threshold: Difference in contrast with the

surrounding area at which an

edge is recognised.

The higher the value, the more

unequivocal the result.

%

Checkbuttons


Flags:

Calipers type: Two or more checkbuttons can

be activated

Use optional para- The parameters defined in this

meter screen will be used.

64

1 Bonding


Software Manual A-1


Value range, unit

Filtersize X Width of the filter in X/Y direc-

tion. Points further away from

the centre of the filter are taken

into consideration to a lesser

extent. The wider the filter the

less sensitive it is to noise, but

the edge search, too, becomes

progressively less sensitive.

[0..5] pixel

Y

Filtercenter X Width of the centre of the filter.

[0..2] pixels Y




valid.

%





Cntr.threshold: Threshold as of which a diffe-

rence in contrast along a caliper

becomes a candidate for the

edge.

The higher the value the smaller

the number of candidates per

caliper for an edge.

see page 1-61 "Score criteria"

90° Error: Permissible deviation for a 90°

corner (only if the "90° Corner"

parameter is activated in the

"Flags for Edge Search" win-

dow).

0,1°

Calipers for edge search


> Flags > Calipers

Calipers (search lines) are lines normal to an edge

along which a search is conducted for a significant

brightness transition in order to identify the position

of the edge.

The entire measuring area is divided up uniformly

by the number of calipers defined in the "total"

field.

The entries in the "start" and "end" fields restrict

the measuring area. If the value of "start" is lower

than the value of "end", the area between the two

is the restricted measuring area. If the value of

"start" is greater than the value of "end", the two

outside areas are used as the restricted measuring

area.

Parameter


Value range, unit

Calipers Ranges:

Left Line: Restrict the measuring area for

the left edge

Upper Line: Restrict the measuring area for

the top edge

Right Line: Restrict the measuring area for

the right edge

Lower Line: Restrict the measuring area for

the bottom edge

Settings:

Length X Length of the caliper in X/Y

direction.

pixels

Y

65



Button Description


camera-image size).






keys.



Masks for edge search


> Mask Settings

Mask used to exclude ranges within the search

model in which errors could occur from the search.



nates (mask area).

Circular The mask is circular.

Parameter


Value range, unit

Mask area:

Upper left corner

X0

Top left corner of the mask.

pixels Y0

Width / Height DX Size (width/height) of the mask.

pixels DY

Checkbuttons

Buttons


Mask options



rotated for the structure search.



inside the mask.


North The top half of the screen is

masked.

East The right half of the screen is

masked.

South The bottom half of the screen is

masked.

West The left half of the screen is

masked.

Angle Masking of the edges produced

by rotation of the search model.

66

1 Bonding


Software Manual A-1


Value range, unit








on page 1-140)

0..255

Trained

middlepoint

X Coordinates of the trained

circle's centre. Value is calcula-

ted and displayed only when the

"Train Middlepoint" button is

pressed.

µm

Y

Button Description

Train Middlepoint Calculate centre of circle using

the three defined alignment

points. The X and Y coordinates

of the centre calculated in this

way are shown after "Train

Middlepoint".












page 1-12)

Alignment data for the Circle Center Finder

search mode

Alignment (A5) > Align Data 1/2 > General

Parameters for calculating the centre of the circle

In the"Circle Center Finder" mode the system

attempts to find the edge of a circle along two hori-

Checkbuttons


zontal and vertical search lines, in order to com-

pute the centre of the circle.

Parameter

Buttons

Multipoint approach

Multiple points are used to define the edge of the circle,

instead of only two points.


Value range, unit

Adjustment charac-

teristics:


1..2






tion (S 5)" on page 1-140)

µm








on page 1-140)

0..255

67



Button Description








directly.



Alignment Point 1/2/3

Alignment (A5) > Align Data 1/2 > Point 1/2/3

Parameter


Value range, unit

Adjustment charac-

teristics:


1..2


Alignment point 1/

2/3

X X and Y coordinates of the cen-

tre of the window in which the

search for the circle edge will

take place.

µm

Y

Test area

width / height DX


search for the circle edge will

take place.

pixels

DY

Buttons

Button Description








terns.

68

1 Bonding


Software Manual A-1

Button Description













page 1-12)








directly.



DCL Parameter for Alignment Point 1/2/3

Alignment (A5) > Align Data 1/2 > Point 1/2/3 >

DCL-Parameter

Parameter


Value range, unit

General

parameters

Contrast Threshold Difference in contrast with the


edge is recognised.



%

Filter Side Size Size of the left and right parts of

the filter for determining a con-

trast transition.

High values reduce sensitivity to

noise.

pixels

Filter Center Size of the filter centre for deter-

mining a contrast transition. The

area of the centre is not taken

into account in computing con-

trast.

pixels

69




Search Direction

Right to Left If this checkbutton is activated

the horizontal search for the

circle edge proceeds from right

to left; otherwise, the direction is

from left to right.

Bottom up If this checkbutton is activated

the vertical search for the circle

edge proceeds from the bottom

to the top; otherwise, the direc-

tion is from top to bottom.

Contrast Change

Dark to Light If this checkbutton is activated

the search is for a change in

contrast from dark to light.

Light to Dark If this checkbutton is activated

the search is for a change in

contrast from light to dark.

Don’t Care If this checkbutton is activated

the search is for any change in

contrast.

Optional Ordinary Activate the "Use" checkbutton if

Alignment you want to use pattern search

as well. The most important

parameters for a pattern search

are displayed. (see "Alignment

data for the Ordinary Alignment

search mode")

Score criteria Preference for an edge if the

result is not unequivocal

Contrast If this checkbox is activated the

edge with the strongest contrast

transition is used.

Prefer Center If this checkbox is activated the

edge closest to the point at

which the search started is used.

Prefer End If this checkbox is activated the

edge closest to the end of the

search area is used.

Checkbuttons Multipoint Approach

Multiple points are used instead of only two to

define the circle edge (see checkbutton A 5 > Align

Data 1/2 > General).

The checkbuttons behind "Flags" are used to

define whether the calipers will be created with

additional points for the horizontal and/or vertical

directions.


Value range, unit

Point counter Number of additional points

used to define the edge of the

circle.

1..5

Buttons

Button Description


camera-image size).






keys.



70

1 Bonding


Software Manual A-1


Value range, unit

Acceptance DCL Quality of the search.


match with the trained pattern

required for acceptance of the

search outcome.

[0..999] = 0..99.9 %

Confusion DCL If the acceptance requirements


search result, the match with the

trained pattern represented by

the value entered here must be

achieved or bettered for the pat-

tern to be identified unequivoca-

lly. Always make sure that the


"Acceptance".

[0..999] = 0..99.9 %






tion (S 5)" on page 1-140)

µm








on page 1-140)

0..255








on page 1-140)

0..255


Value range, unit

Adjustment charac-

teristics:


1..2


Alignment Point

X X and Y coordinates of the cen-

tre of the search area for the

hole.

µm

Y

Search model

width / height DX


search for the hole edges will

take place. Size the area in such

a way that the edges of the hole

are just inside it.

pixels

DY

Search area

width / height DX

Size of the area in which the

system searches for the hole.

pixels DY

Alignment data for the Hole Finder search mode


Parameters for the "Hole Finder" search mode:

This mode is suitable for small circles (holes or

pins) that can be shown in their entirety on the

screen:

Parameter

Buttons Button Description


alignment point.





71



Button Description


terns.













page 1-12)








directly.



Hole Finder DCL Parameters


Parameters for edge detection at the DCL unit

A "Hole Finder" search is performed in two steps:

„ Structure search or circle contour search for

approximate positioning

„ Search for pin or hole

Parameter


Value range, unit

Caliper number maximum number of points at

which – distributed over the

circle – the search for edge tran-

sitions takes place. (Effective

only when the "No caliper limit"

checkbutton is activated.)

Caliper length Length of the caliper

pixels

Filtersize Width of the filter. Points further

away from the centre of the filter

are taken into consideration to a

lesser extent. The wider the filter

the less sensitive it is to noise,

but the edge search, too, beco-

mes progressively less sensi-

tive.

[0..5] pixel

Filtercenter Width of the centre of the filter.

[0..2] pixels

72

1 Bonding


Software Manual A-1


Initial Search Use ordinary alignment for

approximate positioning If this

option is not selected a simpler

search (circle contour) is used.

Edge type


tion.


tion.


Score criteria:



edge identification







threshold.


Value range, unit



edge is recognised.



Checkbuttons


Use Caliper If this checkbox is activated the

search is for the number of edge

transitions defined by the "Cali-

per" parameter.

Always activate this checkbox

Search Mode

Search active Use initial search for approxi-

mate positioning

4 Quarter Fluctuations in the size of circles

are compensated by averaging

(slight loss in precision)





Use Ellipse Ellipsis can be trained, other-

wise circle only

No size test No plausibility test for circle size

No caliper limit Use all calipers, otherwise only

as many as fit on the circumfe-

rence of the circle without over-

lapping.

Caliper to inside From the outside toward the

inside.

Train Mode

Train active Enable training

Circle Mask An initial search to determine the

position of the hole precedes the

edge search as such. If this

checkbutton is activated the

search is for a pattern in which

the inside part of the hole is hid-

den.

Dark Center Activate this checkbox if the

inside of the hole is darker than

the surrounding area.

4 Quarter Fluctuations in size are compen-

sated by averaging (slight loss in

precision)

73




Value range, unit

Production over-

view

Substrate Types: Substrate types

Maximum: Number

current: Current position

Wafers: Different wafer types

Maximum: Number


Oven profiles: Number of profiles created for

Maximum: the "Oven" option

Production Defined production flow

sequences:

Maximum: Number


1.6.7 Production Data (A 9)

Overview

Parameter

Production Sequence

You can use this mask to build up a production flow

by combining sequences. Click on "Insert" to add a

new sequence step at the appropriate position.

Click on "Delete" to remove the sequence step.

Parameter


Value range, unit

Seq.no. The number of the sequence

Checkbuttons


done Checkbuttons that show green

have already been completed.

Deactivating a checkbutton

means that the corresponding

sequence step is skipped.

Dropdown menu


Sequence step Step in the production sequence

The available modes are:

Substrate Align

Pick&Place

Epoxy process

Height measure

Calculate substrate shift

Oven load

Oven unload

74

1 Bonding


Software Manual A-1

Dropdown menu Description 1.6.8 Wafer Data (A 20)

Destination/

Substrate type

Select the substrate type (desti-

nation) to be processed in the

current production-sequence

step.

To create a new substrate type:

go to Substrate type settings >

Overview (see " Overview" on

page 1-33)

To define substrate positions: go

to Mode > Learn Substrate Posi-

tion (see "1.5.5 Learn Substrate

Positions (O 9)" on page 1-25)

Parameters of the wafer-handling system.

What Alignment or position used for

the substrate type

Buttons

Button Description

Insert Create a sequence line.

Delete Clear the sequence.

Parameter


Value range, unit

Wafer number

Act. Show the current wafer number.

Next Number of the next wafer of the

same type.

0: not used

Slot No. Slot number of the wafer cas-

sette that contains the wafer.

Wafer Pos.

Center: X Coordinates of the wafer centre.

µm Y

Start: X Position that the bonder moves

to after a change to a wafer that

has not yet been used, so that it

can start processing the wafer. If

no "Last found Chip" position is

known, the system moves to the

start position.

µm

Y

75




Value range, unit

Last found chip: X Coordinates of the most recently

found chip. This value is reset if

you move the bonder manually

to the start position.

µm

Y

Needle Pos.

Start Lowest position of the ejector

needle during the ejection cycle

(safe position).

µm

Middle Position at which the ejector

speed changes from "Needle up

start" to "Needle up".

Allows a slower rate of move-

ment at the start of the ejection

process, so that the chip deta-

ches more efficiently from the

wafer film.

µm

End Highest position of the ejector

needle during the ejection cycle

(at pickup position).

µm

Focus Height: Z Focusing height of the wafer

camera.

µm

Dimensions

Radius: r Radius of the wafer.

µm

Angle: p The wafer's angular offset

This angle is determined auto-

matically in the "First Chip"

search.

0,01°

Wafflepack size: X If a wafflepack or gel pack is

used instead of a wafer, enter

the size in X and Y here.

µm

Y


Value range, unit

Chip index: X Distance of the chip from the

Y next (adjacent) chip in the same

row.

These values are computed

automatically in an interactive

training session under "Mode >

Learn Chip Index" and they are

shown here for information only

(see "1.5.10 WFS Learn Chip

Index (O 31)" on page 1-28).

µm

Linefeed: X Distance of the chip from the

Y next (adjacent) chip in the next

row.

These values are computed

automatically in an interactive

training session under "Mode >

Learn Chip Index" and they are

shown here for information only

(see "1.5.10 WFS Learn Chip

Index (O 31)" on page 1-28).

µm

End Counter EOS If consecutive chips are not

found in an EOS row, the system

switches to the next row.

End Counter EOW If consecutive chips are not

found in EOW rows, a wafer

change takes place.

No. of Chips in X Defines the layout of the rectan-

Y gular wafer. Number of columns (X direction) and rows

(Y direction) on the wafer or the

wafflepack. If you enter 0, the

"Chip Count X / Y" parameter is

inactive.

Chip count X Show the column number (X)

and row number (Y) of the chip Y

Delays [ms]

currently being picked from the

wafer. Not used unless "No. of

Chips in X / Y" in A 20 is not

equal to 0 (see "1.6.8 Wafer

Data (A 20)" on page 1-74).

De air: ON Pulse of compressed air to

break the ejector vacuum before

each movement of the wafer

table.

ms

76

1 Bonding


Software Manual A-1


Value range, unit

Speed Settings

Chip index Speed of the wafer table when

moving to the next chip while

production is in progress.

% of normal speed

WaferChange Positioning speed of the wafer

table. This speed is used for

movements that involve longer

distances as in indexing, for

instance (e.g. for wafer chan-

ges).

% of normal speed

Workholder Speed of the workholder con-

veyor system.

% of normal speed

Needle up start Needle speed between the

lowest needle position and the

midway position.

% of normal speed

Needle up Needle speed between the mid-

way position and the topmost

needle position.

% of normal speed

Button Description

Wafer Flags Call up flags for wafers

Pickup Data Call up parameters for the pik-

kup system see page 1-78

Bond Data Call up bond parameters.





F2: DE Block Raise or lower the chip ejector.

F3: FirstChip Starts a search for the first chip

(manual search), for example

following a wafer change.

F4: DE/GP Switch the vacuum at the chip

Vacuum ejector on or off.


unit on or off.

F6: Search Run pattern recognition.

F7: Alignment Perform pattern recognition and

correct to the pickup position.

F8: Chip Index Move to the next chip.


control position.

F10: Move WT Switch to trackball control for

moving the x-y table using the

trackball. Press the "+" key to

increase the speed of move-

ment, or press the "–" key to

reduce the speed. Press "Shift"

to activate a higher speed

directly.



fn+F2: Delete Delete all the data of the current

Wafer wafer.

fn+F3: Measure- Measure the distance between

ChipIndex chips (distance between the

adjacent chip and the trained

chip).

The measured values are auto-

matically entered in the corre-

sponding fields of this menu.

fn+F6: Trace Automatic transfer to the pro-







page 1-12)

Buttons

Dropdown menu


Wafer type Defines the type of wafer used

Standard Wafer Round wafer

Rectangular Wafer Rectangular wafer

Waffle Pack: Chips in waffle packs

Gelpack Gel pack

Search mode Defines the wafer-recognition

mode

Moving Wafer Always select Moving Wafer

Camera Camera.

Search Corner Do not use with MWC.

Upper Left: The result is relative to the top

left corner.

Upper Right: The result is relative to the top

right corner.

Lower Left: The result is relative to the bot-

tom left corner.

Lower Right: The result is relative to the bot-

tom right corner.

Middlepoint: The result is relative to the chip

centre.

77



Button Description

fn+F7: Copy Wafer Copy all wafer data of the cur-

rent wafer number to a new

wafer number.

fn+F8: DCC open Open the die carrier clamp.

fn+F9: DCC close Close the die carrier clamp.

Wafer Flags

Wafer Data > Wafer Flags

Checkbuttons


Alignment

Ink search Search for inkdots

Pickup Inked Die Pick up the marked chip.

Use InkRef for Do not use with MWC.

Angle

Vacuum for Wafer-table vacuum is switched

Alignment on before the search.

Black windows Reverse video display mode for

highly reflective chips.

Search next chip Search for the next chip.

Correction Move

WaferXY Correction by table (on) or DCL

Correction unit (off) to allow for difference

between trained and actual

wafer positions.

Chip Index

Use Edge Do not use with MWC.

Correction

78

1 Bonding


Software Manual A-1


Value range, unit

DCL V-check time-

out

WT: Maximum time allowed for appli-

cation of wafer-table vacuum for

pickup. If overshot: Error mes-

sage. (0: Function is inactive)

ms

DCL (before ns Maximum time allowed for appli-

up): cation of DCL vacuum for pik-

kup, before the ejector needles

extend. If overshot: Error mes-

sage.


ms

DCL (after pickup Maximum time allowed for appli-

delay): cation of DCL vacuum after the

"pickup delay". If overshot: Error

message. (0: Function is inac-

tive)

ms

Clean die at pickup

Clean delay: Time spent by the DCL unit at

the pickup ramp position with

compressed air on for cleaning

the wafer. (0: Function is inac-

tive)

ms


Value range, unit

General Data

Offset X Offset in X, Y and Z from the pik-

kup position.

µm

Y

Z

P 0.01°

Ramp up speed Speed of the Z-axis for upward

stroke to ramp (ramp: time

during which only the Z-axis

moves).

% of normal speed

Ramp down speed Speed of the Z-axis for down-

ward stroke to ramp.

% of normal speed

Pickupdelay Delay between end of ejection

and the start of the Z movement

of the DCL unit; allows the wafer

foil to detach completely from

the chip.

ms

Pickup Data

Wafer Data (A20) > Pickup Data

Parameter

Chip control

Define the sensor for chip control:

„ "Use IR" (infrared sensor) checkbutton

„ Dropdown menu for selecting a vacuum sensor

C A U T I O N

In order to avoid malfunctions, use at

least one sensor for chip control.

Dropdown menu


DCL Tool DCL tool used.

EPO Tool EPO tool /

dispenser used

Die Ejector Tool Chip-ejector tool used

79



Checkbuttons


Use wafer angle If this checkbox is activated the

rotational offset of the wafer is

taken into account.

USE FlipChip for Use the optional flip-chip unit to

pickup pick up chips

Use lookup camera Use the optional lookup camera

Bond Data

Wafer Data (A20) > Bond Data

There are register tabs for the following masks:

„ Bond delay & bond ramp speeds

„ Scrub settings (see " Scrub settings" on page 1-

80)

„ Option: Oven Settings (see " Oven settings

(option)" on page 1-81)

Bond delay & bond ramp speeds


This is where the parameters for the timing of the

bonding process are managed.

Parameter


Value range, unit

Bond delay

Bond delay Dwell time of the DCL tool at the

bond position.

Allows uniform, cavity-free

spread of the epoxy adhesive

underneath the chip

ms

Vacuum time Time during which the vacuum is

sustained at the DCL tool after

the bond position has been rea-

ched.

ms

Air time Duration of the pulse of com-

pressed air to break the ejector

vacuum.

ms

No of pulses Number of pulses

On time Duration of one compressed-air

pulse

ms

80

1 Bonding


Software Manual A-1


Value range, unit

Off time Time between two successive

compressed-air pulses

ms

Bond ramp speeds

Up Percentage speed upward

%

Down Percentage speed downward

%


Bond delay

Standard One pulse of compressed air to

break the vacuum (see the "Air

time" parameter).

Pulsed Multiple pulses of compressed

air to break the vacuum (see the

parameter below "Air time").

Checkbuttons

Scrub settings


This is where you can define scrub movements

(high-frequency movements) to facilitate sprea-

ding of the adhesive.

Use the checkbutton under "Scrub settings" to

define whether or not scrub movements are execu-

ted.

Parameter


Value range, unit

Amplitude: X Amplitude of the scrub move-

ment

µm

Y

Z

P 0.01°

Cycles settings

No cycles Number of repetitions

Acc Acceleration

0,01 mm/s2

Vel Speed

0,01 mm/s

Delays

Start Delay preceding start of scrub

movement

ms

Move Delay at the points of reversal of

scrub movement

ms

81




Value range, unit

Wafer The number of the current wafer.

You can use the <PREVIOUS>/

<NEXT> buttons to find the

wafer you want.

Chip definitions

Chip Size: X Chip size. You enter these

values in an interactive training

session under "Mode > Learn

Chip" and they are shown here

for information only (see "1.5.9

WFS Learn Chip (O 30)" on

page 1-27).

µm

Y

Ref. Offset X Coordinates referenced to the

centre of the screen and defining

the point at which the structure

search starts. Default: (0,0)

µm

Y


Value range, unit

End Delay at end of scrub movement

ms

Oven settings (option)


This is where the temperature profiles for the optio-

nal oven are managed.

ÆActivate the "Use oven " checkbutton if you want

to use a eutectic oven.

ÆIf scrub movement is not planned, set the delay

time in the "delay" field.

ÆUse the checkbuttons to define whether the pro-

cess will use constant temperatures (Use temp)

or temperature profiles (Use Profile) for heating

(Heat up) and cooling (cool down).

ÆSelect the profile for a standard oven (Oven) or

for an oven with forming gas (Forming gas

mixer) or enter the constant temperatures, as

applicable.

Oven profiles are created in A 60.

1.6.9 Wafer Recognition (A 21)

Settings in this mask: Moving Wafer Camera

recognition for pattern recognition on the wafer

Adjustment at up to three positions is necessary in

order to achieve unambiguous definition of the

wafer's position and orientation.

You can use any combination of the three possible

search modes. Characteristic 3 also includes the

possibility of using an ink search.

Parameter

82

1 Bonding


Software Manual A-1


Value range, unit

Needle Pos. X On-screen position of the need-

les in X and Y.

pixels

Y

Global Data:

Camera Delay Delay between arrival at the

camera position and the start of

imaging.

ms

Camera Speed The speed of camera move-

ment.

1...150 % of normal speed

Light switch delay Time until the light reaches the

preset intensity.

ms


Use Global Data Normally active, so that Global

Setting Parameters can be

used.

Align Chip Normally active, so that align-

ment can be performed. If this

checkbutton is deactivated ali-

gnment does not take place.

Single Adjust Search for all characteristics

from a single camera position.

Buttons

Button Description

Align Data 1 Call up parameters for substrate

2 alignment. The input mask

3 varies, depending on which

search mode is selected.

High Resolution Global camera data for the high-

resolution camera (see "

Camera resolution" on page 1-

83)

Low Resolution Global camera data for the low-

resolution camera (see "

Camera resolution" on page 1-

83)

Checkbuttons

Dropdown menu


Camera Select one of the two available

wafer cameras

High Resolution Use the high-resolution camera

for small chips

Low Resolution Use the low-resolution camera

for large chips

Characteristic 1 Select the search mode for up to

2 three characteristics

3

Ordinary Structure search

Alignment

Edge search Edge search

Hole finder Find hole

Ink search Characteristic 3 only

Trafo Select the coordinate transfor-

mation

Standard Standard transformation

Single Edge Edge search at only one adjust

Search point.

Laser Chip Special transformation

83



Button Description

Light

Compute Scale Change the scaling factor for the

DCL camera.

Reset Scale Reset the scaling factor for the

DCL camera.

Compute Trafo Define the coordinate transfor-

mation

Reset Trafo Reset the coordinate transfor-

mation





F2: Move PCP Move the camera to the pickup

position.

F5: Cancel Adj. Discard the alignment data.








page 1-12)








directly.



Camera resolution

Wafer Recognition (A21) > High Resolution/Low

Resolution

A camera with either low resolution or high resolu-

tion is used, depending on the size of the chips.

„ Use the high-resolution camera for small chips

„ Use the low-resolution camera for large chips

The structure of the "Low Resolution" mask is ana-

logous.

Parameter

Buttons


Value range, unit

Global Data

Focus Height Focusing height

µm

Camera Scale X Scaling factor for the DCL

camera (display only); use the

Compute Scale button to

change.

µm

Y

P °

WT-DCL Trafo X Coordinate transformation

µm Y

P °

Camera Offset X Camera offset in X and Y direc-

tions between the search pattern

and the pickup position.

(Display only)

µm

Y

84

1 Bonding


Software Manual A-1

Align Data 1/2/3

Wafer Recognition (A21) > Align Data 1/2/3




(see " Alignment data for Ordinary Alignment

search mode (pattern recognition)" on page 1-

84)

„ Edge Search,

(see " Alignment data for Edge Search search

mode" on page 1-86)

„ Ink Search,

(see " Alignment data for Ink Search search

mode" on page 1-92)

Alignment data for Ordinary Alignment search

mode (pattern recognition)

Wafer Recognition (A21) > Align Data 1/2/3

Parameters for "Ordinary Alignment" search

mode.

Parameter


Value range, unit

Adjustment charac-

teristics:

No. The number of the characteristic

1..3

Alignment point: X X and Y coordinates for the


To train:




-Move to the point

-<F10> -<F6>

µm

Y

Focus Height Focusing height.






µm

85




Value range, unit

Task Id No The number of the task

Camera No. The number of the camera

Search model

Upper left corner Top left corner of the pattern to

be found.

pixels

Width / Height DX Size (width/height) of the search


pixels

DY

Angle Angular offset of the search

model

0,10 °, 0 = deactivated.

Depth Default 16:

Number of greyscales

Angle range Permissible rotation of the




Angle increment Distance between two search


0.1 °

Search area

Upper left corner

X0



pixels Y0

Width / height DX Size (width/height) of the search


pixels





[0..999] = 0..99.9 %









"Acceptance".

(e.g. 700)

[0..999] = 0..99.9 %


Value range, unit

Trained Point X The coordinates of a trained

point

µm/°

Buttons

Button Description

Light






position.


terns.














page 1-12)








directly.



86

1 Bonding


Software Manual A-1


Value range, unit

Adjustment charac-

teristics:


1..3



To train:




-Move to the point

-<F10> -<F6>

µm

Y


Wafer Recognition (A21) > Bond Data 1/2/3

The Edge Search" is performed in two steps:

„ Structure search for approximate positioning

„ Edge search

Parameters for edge search.


Value range, unit







µm

Task No. The number of the task


Edge window

Upper left corner

X0

Y0



pixels


DY window for the edge search.

pixels

Angle: P Skew of the search window for

the edge search.

°

Search Model Used for approximating the posi-

tions of the edges.

Upper left corner

X0

Y0

Op left corner of the search

model.

pixels

Width / height DX Size (width/height) of the search Parameter

DY model.

pixels

Angle: P Skew of the search window for

the edge search.

0.1 °

Search Area

Upper left corner

X0

Y0



pixels


area for the initial search. DY

Initial Search

pixels





[0..999] = 0..99.9 %

87



Button Description






position.


terns.














page 1-12)








directly.




Value range, unit









"Acceptance".

[0..999] = 0..99.9 %

Model depth Default 16: Number of greysca-

les

Trained Point


(Display only)

µm/ °

Y

P

Reference Point



µm

Y

Free Point






µm

Y

Buttons

Button Description

Light

Flags (see " Flags for edge search" on

page 1-88)

Calipers (see " Calipers for edge search"

on page 1-90)

Mask Settings

88

1 Bonding


Software Manual A-1





threshold.

General search

mode






(corner)


Upper right

Lower right

Lower left

Center Middle point





found.

Result options






ter).



these edges.

Calc line by

extreme value:



Right

Bottom

Left

Use max. extreme

value:


Upper Right value

Lower Right

Lower Left


Calipers type





toward the inside).

Testable edges









Score criteria:

Contrast edge Use the strongest contrast tran-

sitions for edge identification.





Wafer Recognition (A21) > Bond Data 1/2/3 >

Flags

Checkbuttons

Buttons

Description Button

Optional

parameters


vertical corners

89




Flags:


be activated





Edge type


tion.


tion.


Score criteria:










threshold.

Optional Parameters


Flags > Optional Parameters



edges.

Parameter

Checkbuttons


Value range, unit

Settings:




valid.

%







edge is recognised.



%

90

1 Bonding


Software Manual A-1


Value range, unit









[0..5] pixels

Y


[0..2] pixels Y




valid.

%








edge.








dow).

0,1°


Wafer Recognition (A21) > Bond Data 1/2/3 > Cali-

pers




of the edge.

The theoretical measuring area is divided up uni-

formly by the number of calipers defined in the

"total" field.






outside areas are defined as the restricted measu-

ring area.

Parameter


Value range, unit

Calipers Ranges:


the left edge


the top edge


the right edge


the bottom edge

Settings:


direction.

pixels

Y

91



Button Description


camera-image size).






keys.





Mask Settings





nates (mask area).


Parameter


Value range, unit

Mask area:

Upper left corner

X0


pixels Y0


pixels DY

Checkbuttons

Buttons


Mask options






inside the mask.



masked.


masked.


masked.


masked.



92

1 Bonding


Software Manual A-1


Value range, unit

Ink data

Upper left corner

X0

Top left corner of the area for the

search to locate the inkdot on

the substrate.

pixels

Y0

Width / height DX Size (width/height) of the area

for the search to locate the

inkdot on the substrate.

pixels

DY

Threshold Greyscale threshold as of which

a pixel is identified as white or

black. The lower the value, the

more dark pixels will be assi-

gned to the white range.

0..255 (black..white)

Limit Limit for the proportion of white

pixels in the ink window. A value

lower than this threshold is inter-

preted as indicating that the chip

is inked. A value higher than this

threshold is interpreted as indi-

cating that the chip is OK.

0..100 % white


Value range, unit

Adjustment charac-

teristics:


1..3



To train:




-Move to the point

-<F10> to deactivate the track-

ball

-<F6> to accept the point

µm

Y







µm



Alignment data for Ink Search search mode

Wafer Recognition (A21) > Bond Data 3

As an option, an inkspot can be applied to identify

substandard chips.

These substandard chips can be detected again

only in Characteristic 3.

Parameter

Checkbuttons


Inkpoint color If this checkbutton is activated

the search is for a white instead

of a black inkdot.

93




Value range, unit

Startpos X Position that the bonder moves

to after a wafer change, so that it

can start processing the wafer.

µm

Y

Chip count X Show the column number (X)

and row number (Y) of the chip

currently being picked from the

wafer. Used only when "No. of

Chips in X / Y" in A 20 is not

equal to 0 (see "1.6.8 Wafer

Data (A 20)" on page 1-74).

Y

Chip index: X Distance of the chip from the

next (adjacent) chip in the same

row.

µm

Y

Line feed: X Distance of the chip from the

next (adjacent) chip in the next

row.

µm

Y

Wafer angle: P The wafer's angular offset.

This angle is determined auto-

matically in the "First Chip"

search.

0,01°

1.6.10 Option: Wafer Magazine (A 25)

Parameters for administration of the wafer maga-

zine.

Dropdown menu


Number of used The number of slots needed.

slots

Slots Selection of a wafer type for

which the slot is reserved

Status of the slot

Full The slot is full and has not been

processed as yet

In Use A wafer in the slot is now being

processed

Empty The slot has been fully proces-

sed

Checkbuttons


Use Data Use individual wafer data for the

slot.

Otherwise the data from the

Wafer Data page is used.

Data

Wafer Magazine (A 25) > Data

Individual wafer data for the slot in question.

Parameter

Buttons

Button Description

Data Call up the parameters for slot-

specific wafer data

Buttons

Button Description

==> Next Chip Change of direction in proces-

sing of the wafer.

94

1 Bonding


Software Manual A-1

Button Description

Copy from Wafer Copy data from selected wafer

to this location.

Copy to Wafer Copy data from this location to

selected wafer.





F2: DE Block Raises or lowers the chip ejec-

tor.

F4: DE Vacuum Switch the vacuum at the chip

ejector on or off.

F6: Search Run pattern recognition

F7: Alignment Perform pattern recognition and

correct to the pickup position

F8: Chip Index Move to the next chip.

F10: Move WT Switch to trackball control for

moving the x-y table using the

trackball.

"+" key: increase speed,

"–" key: reduce speed.

"shift" key: activate a higher

speed directly.



1.6.11 Lookup camera (A 40)

Parameters for an optional camera that performs

alignment from below after pickup.

You can use any combination of the four possible

search modes. Use the Dropdown-Menüs behind

"Characteristic 1" and "Characteristic 2" to select any

of the following search modes:

„ No Operation: characteristic 1/2 not active

„ Ordinary Alignment: Structure search

„ Edge Search: Edge search

„ Hole Finder: find hole

Use the Dropdown-Menü behind "Trafo" to select

one of the following transformations:

„ Standard: standard transformation

„ Single Edge Search: transformation with only an

adjust point for the edge search.

Checkbuttons


Configuration Two or more checkbuttons can

be activated

Align Chip Must be activated as otherwise

alignment from below for the

chip will not take place. If this

checkbutton is deactivated ali-

gnment from below does not

take place.

Use Global Data Activate this checkbutton so that

Global Setting parameters can

be used.

95




Auto Skip If this checkbutton is activated

chips for which at least one of

the characteristics is not found

are rejected.

Otherwise: Manual Adjust

Single Adjust Activate this checkbutton to

search for all characteristics

from a single camera position.

Black windows Activate this checkbutton if

structures are so bright that

white graphics cannot be identi-

fied in the video image.

Button Description


alignment 1


alignment 1

Additional Data

Data Call up additional parameters.

F2: Base Pos. Move to the camera's idle posi-

tion.


F7: Align Die Alignment for Die


Value range, unit



imaging.

ms

Speed The speed of camera move-

ment.


Buttons

Parameter


Value range, unit

Global Setting

Single Adjust X Camera position from which all

characteristics are searched for

(precondition: Single Adjust

checkbutton activated).

µm

Y

Focus height Z Focusing height of the unit.

Effective when the "Global





µm

P Focusing angle of the unit.

0.01°

Incident Brightness of the vertical direct







on page 1-140).

0..255

Oblique Brightness of the LED ring light

for illuminating the substrate at

the DCL unit. Effective only

when the "Global Focus / Light"

checkbutton is not activated in

the configuration settings (See

"1.8.4 Configuration (S 5)" on

page 1-140).

0..255

96

1 Bonding


Software Manual A-1


Value range, unit

Adjustment charac-

teristics

Index The index of the characteristic

1, 2


1, 2



To train:




-Move to the point

-<F10> -<F6>

µm

Y

Data

Lookup camera (A 40) > Data

Mask for defining the tool centrepoint and the

scaling factors.

Buttons

Button Description

Axis Center

Teach Center The four corners of the tool are

approached one after the other

in clockwise sequence (starting

at the bottom right). A centre is

then calculated and displayed.

Move To Center Move to the centre of the tool.

Camera Scale

Compute Scale Calculate camera resolution

(1 pixel corresponds to the

scaling factor in µm

Reset Scale Reset the scaling factor.

F2: Base Pos. Move DCL head to the base

position.


Align Data 1/2

Lookup camera (A 40) > Align Data




See " Alignment data for Ordinary Alignment

search mode" on page 1-96

„ Edge Search,

See " Alignment data for Edge Search search

mode" on page 1-98

„ Hole Finder,

See " Alignment data for Hole Finder search

mode" on page 1-105

Alignment data for Ordinary Alignment search

mode


Parameters for structure search.

Parameter

97




Value range, unit

Focus Height Focusing height of the unit.






µm

Light Incident Brightness of the vertical direct







on page 1-140).

0..255

Light Oblique Brightness of the LED ring light







page 1-140).

0..255



imaging.

ms


ment.




Search Model

Upper left corner X Top left corner of the pattern to

be found.

pixels

Y



pixels

DY

Search Area Search model for approximating

the position.

Upper left corner X Top left corner of the search

model to be found.

pixels

Y


Value range, unit



pixels

DY







0,1 °





[0..999] = 0..99.9 %









"Acceptance".

[0..999] = 0..99.9 %

Trained Point X The coordinates of a trained

point

µm/°

Y

P

Checkbuttons






Buttons

Button Description



input field


position.


terns.

98

1 Bonding


Software Manual A-1

Button Description












cursor and the linked fields








directly.





Parameters for edge search.

Parameter


Value range, unit

Adjustment charac-

teristics


1, 2


1, 2



To train:




-Move to the point

-<F10> -<F6>

µm

Y

Focus Height Focusing height of the unit.






µm

99




Value range, unit








on page 1-140).

0..255








page 1-140).

0..255



imaging.

ms


ment.


PRU Data







[0..999] = 0..99.9 %









"Acceptance".

[0..999] = 0..99.9 %





Checkbuttons






Buttons

Button Description



input field


position.


terns.




















directly.



1 Bonding


Software Manual A-1

100


Value range, unit

Trained Point


(Display only)

µm/ °

Y

P

Reference Point



µm

Y

Free Point






µm

Y

Description Button

Flags Show the window for defining

the edge search see page 1-61.

Calipers Call up caliper parameters see

page 1-64

Mask Settings Call up mask parameters for

hiding error sources see page 1-

65


position.


terns.








camera-image size).






keys.



EDC Parameters

Lookup camera (A 40) > Align Data > EDC -Para-

meter

Parameter Buttons


Value range, unit

Edge window:

Upper left corner

X0



pixels Y0


window for the edge search.

pixels

DY

Angle Skew of the search window for

the edge search.

Search Model:

Upper left corner

X0

Op left corner of the search

model.

pixels Y0


model.

pixels

DY

Search Area:

Upper left corner

X0



pixels Y0



pixels

DY



101








threshold.

General search

mode






(corner)


Upper right

Lower right

Lower left

Center Middle point





found

Result options






ter).



these edges.

Calc line by

extreme value:



Right

Bottom

Left

Use max. extreme

value:


Upper Right value

Lower Right

Lower Left


Lookup camera (A 40) > Align Data > EDC -Para-

meter > Flags

Checkbuttons


Calipers type





toward the inside).

Testable edges









Score criteria:

Contrast edge Use the strongest contrast tran-

sitions for edge identification.

1 Bonding


Software Manual A-1

102

Buttons Optional Parameters

Description Button Alignment (A5) > Align Data 1/2 >EDC-Parameter

Optional

parameters


vertical corners

> Flags > Optional Parameters



edges.

Parameter


Value range, unit

Settings:




valid.

%







edge is recognised.



%

Checkbuttons



be activated



103






Edge type


tion.


tion.


Score criteria:



edge identification







threshold.


Lookup camera (A 40) > Align Data 1/2 > EDC -

Parameter > Calipers




of the edge.

The theoretical measuring area is divided up uni-

formly by the number of calipers defined in the

"total" field.






outside areas are defined as the restricted measu-

ring area.

Parameter


Value range, unit

Calipers Ranges:


the left edge


the top edge


the right edge


the bottom edge

Settings:


direction.

pixels

Y

1 Bonding


Software Manual A-1

104


Value range, unit









[0..5] pixels

Y


[0..2] pixels Y




valid.

%








edge.








dow).

0,1°


Lookup camera (A 40) > Align Data 1/2 > EDC -

Parameter > Mask Settings



Parameter


Value range, unit

Mask area:

Upper left corner

X0


pixels Y0


pixels DY

Checkbuttons


Mask options






inside the mask.



masked.


masked.


masked.


masked.





105

Button Description


camera-image size).






keys.





nates (mask area).


Buttons

Alignment data for Hole Finder search mode


Parameters for hole search.

Parameter


Value range, unit

Adjustment charac-

teristics


1, 2


1, 2



To train:




-Move to the point

-<F10> -<F6>

µm

Y

Focus height Z Focusing height of the unit.






µm

1 Bonding


Software Manual A-1

106


Value range, unit







0,1 °





[0..999] = 0..99.9 %









"Acceptance".

[0..999] = 0..99.9 %

Trained Point

X

The coordinates of a trained

point

µm

°

Y

P

Button Description

Parameter Call up parameters for the align-

ment point in question.



input field


position.


terns.


Value range, unit

P Focusing angle of the unit.

0.01°








on page 1-140).

0..255








page 1-140).

0..255



imaging.

ms


ment.


Task ID /

Camera



Search Model

Upper left corner X Top left corner of the pattern to

Y be found.

pixels

Checkbuttons






Buttons


DY area for the initial search.

pixels

Search Area Search model for approximating

the position.

Upper left corner

X0

Y0



pixels


DY area for the initial search.

pixels



107

Button Description




















directly.



DCL parameters

Lookup camera (A 40) > Align Data > Parameter

Parameter


Value range, unit

Caliper number Maximum number of points at

which – distributed over the

circle – the search for edge tran-

sitions takes place. (Effective

only when the "No caliper limit"

checkbutton is activated.)

Caliper length Length of the caliper

pixels

Filtersize Width of the filter. Points further

away from the centre of the filter

are taken into consideration to a

lesser extent. The wider the filter

the less sensitive it is to noise,

but the edge search, too, beco-

mes progressively less sensi-

tive.

[0..5] pixels

Filtercenter Width of the centre of the filter.

[0..2] pixels



edge is recognised.



1 Bonding


Software Manual A-1

108


Score criteria:




Prefer Center Use the contrast transition that is



Prefer End Use the contrast transition that is



threshold.

Checkbuttons


Use Caliper If this checkbox is activated the

search is for the number of edge

transitions defined by the "Cali-

per" parameter.

Always activate this checkbox

Search mode

Search active Use initial search for approxi-

mate positioning



precision)





Use Ellipse Ellipsis can be trained, other-

wise circle only

No size test No plausibility test for circle size

No caliper limit Use all calipers, otherwise only

as many as fit on the circumfe-

rence of the circle without over-

lapping.

Caliper to inside From the outside toward the

inside.

Train Mode

Train active Enable training

Circle Mask An initial search to determine the

position of the hole precedes the

edge search as such. If this

checkbutton is activated the

search is for a pattern in which

the inside part of the hole is hid-

den.

Dark Center Activate this checkbox if the

inside of the hole is darker than

the surrounding area.



precision)





Edge type


tion.


tion.




109


Value range, unit

No of Points Number of nodes

Nodes table

Point No. Consecutively numbered rows

Duration Time between two nodes

ms

Set Point Temperature at the node

(specified temperature)

°C

Band Width Temperature bandwidth as crite-

rion that the setpoint tempera-

ture has been achieved (not

effective unless the "Band Setup

Active" checkbutton is activated,

see "Band Setup Active")

°C

Lower

Upper

Band Scan Number of scans within as crite-

Number rion for acceptance that the set-

point temperature has been

achieved (not effective unless

the "Band Setup Active" check-

button is activated, see "Band

Setup Active")

Band Scan Interval Interval between two consecut-

ive measurements (not effective

unless the "Band Setup Active"

checkbutton is activated, see

"Band Setup Active")

Display Settings Scaling of the display

Out of range values are highligh-

ted by a yellow background in

the table.

Duration Limit Maximum displayed value on

the time axis

ms

Profile Temp. Displayed temperature range

°C

1.6.12 Oven Profile (A 60)

Temperature profiles for the oven.


browse between temperature profiles.

The temperature/time diagram consists of nodes

interconnected by lines.

A yellow background for a parameter is a warning

that the reading is outside the maximum values

shown on the screen.

A red background is a warning that the controller

failed to achieve the value within the specified

time.

Inserting a node

Click the middle mouse button in the zone between

two nodes to create a new node; "No of Points" is

incremented by one and a new row is added to the

nodes table.

Moving a node

Press and hold down the left mouse button and

drag the node to any point between its neighbou-

ring nodes or place it elsewhere in the temperature

range. The values in the nodes table change

accordingly.

Deleting a node

Click the middle mouse button on a node to open

a shortcut menu to delete the node, or else move

the cursor to the corresponding row.

Parameter


Value range, unit

Profil ID Number of the temperature pro-

file.

Name of the temperature profile

Checkbuttons


Profile Setup Two or more checkbuttons can

be activated

Time Controlled Activate: Temperature is not

checked until the end of the pro-

file.

Otherwise the system pauses at

each node until the setpoint tem-

perature is achieved.

1 Bonding


Software Manual A-1

110


Band Setup Active If this checkbutton is deactivated

the defaults from "Oven Settings

(M 9)" are used for achievement

of the setpoint temperature.

Ramp If possible, leave "Manual Con-

trol" and "Error Override" deacti-

vated.

Additional functionality for ramps

if the regulator is too slow. Abor-

tion of a profile can be preven-

ted. It is a better idea, however,

to interpolate nodes to ease the

ramp.

Manual Control If this function is activated set-

point jumps are used instead of

ramps. Additional functionality

for ramps if the regulator is too

slow. Abortion of a profile can be

prevented. It is a better idea,

however, to interpolate nodes to

ease the ramp.

Error Override If this checkbutton is activated

temperature criteria are not

checked before nodes for

ramps.


Value range, unit

Profil ID The number of the temperature

profile

Select the heating regulator

used to run the profile.

Curr. Temp Current actual value

°C

Setpoint Current setpoint value

°C


Time Controlled Shows the values set in the

Oven Profile menu (A60).

Set Startup Temp. Abort the profile or the startup

Timed temperature approach after 30

seconds.

Cont. Curve The actual curve continues after

Update the end of the profile. The target

profile slides to the left and off

the screen.

Manual Control Shows the values set in the


Oven Profile (Execution)

Oven Profile (A 60) > F1: Exec Profile

The profile you select is shown green.

The derivative controller setpoint values are shown

in red at the start of the profile.

The current temperature values (actual values)

have a blue background.

Older curves are still shown in grey.

Parameter

Buttons

Button Description

F1: Exec Profile Show the actual-value profile

fn+F7: Ins./Del.



rent data record



record


record

Checkbuttons



111

Button Description

Execute Profile Execute the profile when the

actual temperature is in the tem-

perature bandwidth of the star-

tup temperature.

Set Startup Temp. Go to the profile's startup tempe-

rature.

Abort Profile/Temp Abort the profile or the startup

temperature approach.

Edit Parameter Call up the Profile Control para-

meters.

Clear Display Reset the profile display.


Error Override Shows the values set in the


Buttons

Profile Control parameters

Oven Profile (A 60) > F1: Exec Profile > Edit Para-

meter

Calls the same parameters as in M 9. The parame-

ters displayed vary, depending on which controller

is used.

Parameter


Value range, unit

Heating These are control-related para-

meters and the settings should

be changed by service engi-

neers only.

Proportional (Pb1) P parameter of the controller

°C

Integr. Action Time I parameter (integral time) of the

(ti1) controller

0.1 s

Deriv. Action Time D parameter (derivative time) of

(td1) the controller

0.1 s

Min. Cycle Time Minimum duration of a period

(ti1) 0.1 s

Output Limits

Lower Output Limit Lower limit of manipulated varia-

(Y.Lo) ble

%

Upper Output Limit Upper limit of manipulated varia-

(Y.Hi) ble

%

Lim. Mean Val Limitation of the mean value

(Ym.H) %

1 Bonding


Software Manual A-1

112


Value range, unit

Temp. Offset Temperature compensation to

allow for discrepancy between

location of sensor and bond

position

°C

Cooling Air Offset Temperature differential as of

which cooling with compressed

air is activated

°C

113


1.7 Machine Pages menu (M)


Value range, unit

PnP Loop

Pickup pos

X

Position of the DCL unit during

the eject process.

µm Y

Z

P 0,01°

Pickup rampheight Height above the touchdown

point (pickup position), as of

which speed of the Z-axis is

reduced.

µm

Chip control pos X Position at which chip control by

the LED array takes place.

µm

Y

Z

1.7 Machine Pages menu (M) The "Machine Pages" menu is for accessing most


Value range, unit

of the software-definable parameters affecting

general machine settings. They relate primarily to

positional and dynamic values (speed and accele-

ration).

Wafer Camera free

Y

The Y coordinate of the position

at which the wafer camera has

an unobstructed view of the

wafer.

µm 1.7.1 DCL Machine Data (M 1)

Machine-specific parameters of the DCL unit.

Rad height: Z Height of the arc described by

the DCL unit between the pickup

position and the bond position.

Do not attempt to change these

values.

µm

Correction ramp: Z Height above the bond position

adopted immediately after ima-

ging (see also M1 > Speed set-

tings > Correction move).

µm

Pickup retries # Number of pickup retries

attempted before an error mes-

sage is issued on account of a

vacuum fault.

Miscellaneous

Indexer free

positions: X

Y

Z

Safety position of the DCL unit at

which no collision can occur bet-

ween DCL unit and the indexer

during indexing (required for

manual indexing only)

µm

Clean position: X The position of the DCL unit for

Parameter

Y

Z

Tool offset

chip ejection above the trash-

can.

µm

Camera <–> Tool X Offset between the camera and

Y the DCL unit

You enter these values in an

interactive training session

under "Mode > DCL camera -

Tool Offset" and they are shown

here for information only (see

"1.5.3 DCL Camera <–> Tool

Offset (O 3)" on page 1-24).

Note, however, that the values

can also be changed in this

page.

µm

Offset position: X Significant point for defining off-

Y set

µm

114

1 Bonding


Software Manual A-1

Button Description








page 1-12)

F8: NextChip Move to the next chip.


control position.

F10: Move DCL Switches to trackball control for

moving along the X- and Y-axes






directly.




Value range, unit

Focus & imprint Height for focusing and imprin-

height: Z ting

µm

Imprint delay Time for imprint

ms

Light 1/2 Brightness

0 .. 255

Camera settings

Scale X Scaling factor for the DCL

camera.



under "Mode > DCL Camera

Scale" and they are shown here

for information only (see "1.5.1

DCL Camera Scale (O 1)" on

page 1-18).

µm

Y



imaging.

ms

cts for 360° Scaling of the P-axis (rotation) of

the DCL unit. Number of steps

for 360° rotation

Buttons

Button Description

Speed setting Opens the window for entering

speed settings (see below)

HML settings Call the window for touchdown

search (see " DCL HML Set-

tings" on page 1-116)

Lookup camera Use the lookup camera to train

the base position.

Flip Chip Parameters for the "Flip Chip"

option





F3: DE Block Raises or lowers the chip ejec-

tor.

F4: DE Vacuum Switches the vacuum at the chip

ejector on or off.


unit on or off.

115



DCL Speed Settings

DCL Machine Data (M 1) > Speed Settings

When you press the "Speed settings" button you

have access to the window for setting speeds for

the pick&place process:


Value range, unit

Toolchanger: v[%] Speed of movement for chan-

ging the DCL unit.


Parameters

Correction move

[%]:

Speed of movement from "Cor-

rection ramp Z" to "Bond ramp

Z". Effective only when single

chip/single placement optimiza-

tion is configured.



Value range, unit

Speed Settings

Production: v[%] Speed during production.

Flip chip: v[%] Speed of the flip-chip unit.

Segment factors Speed of movement for the seg-

ment in question, as a percen-

tage of the value set in the

"Production: v[%]" parameter.

10...100 %

PRU Speed for PRU recognition.


IX: v[%] Speed of movement for moving

to the "indexer free" position


Init: v[%] Speed of movement for initial

movements prior to start of pro-

duction.


Clean: v[%] Speed of movement for moving

to cleaning position above the

trashcan.


116

1 Bonding


Software Manual A-1


Value range, unit

X Tool offset in X/Y direction rela-

tive to the DCL/EPO position

when measurement takes place

µm

Y

Save position:

X

Safe position above the sub-

strate (move to this position after

manual search/train, for

example)

µm

Y

Z

P 0,01°

Ref. position:

Search start Z Height at which the search for

the reference position starts

µm

X Coordinates of the reference

position

µm

Y

Z


Value range, unit

General settings

V start [ %] Speed during rapid approach.

0...100 %

A TD Delay for approach.

µm/ms2

V search Speed for slow approach.

µm/ms

Unknown height

Search max Z Maximum height/depth for the

search in train mode.

µm

Search area Search area for locating the sub-

strate height.

µm

Height already trai-

ned

Search offset Offset of the search above the

trained height. The search for

the height at slow speed (VTD/

ATD) starts as of this height in

production mode.

Tool settings

Tool number: Number of the height measure-

ment tool.

Sensor position: P: P offset of the HML tool relative

to the sensor

[0,01°]

Tool offset:

DCL HML Settings

DCL Machine Data (M 1) > HML settings

The positions moved to are the DCL positions:

Parameters

Buttons

Button Description

F2: TD search cur- Search for the height of the cur-

rent rent DCL/EPO position.

<fn> F2: TD train Train/retrain the current height.

current

F3: HML search Search for all heights on the

ALL substrate.

<fn> F3: HML train Train/retrain all heights.

all

F7: Reset found Reset heights found before-

heights hand.

F8: Reset data file Delete the file that contains the

heights.

F9: Put HML tool Put the HML unit in the toolchan-

ger.

117



Lookup Camera (option)

DCL Machine Data (M 1) > Lookup Camera

When you press the "Lookup Camera" button you

have access to the window for the parameters for

the lookup camera, which images from below.

ÆYou can either enter the coordinates of the base

position above the lookup camera directly, or

train them as described below.

ÆClick <F10> (Move).

ÆUse the trackball to move the DCL head to any

position above the lookup camera (base posi-

tion).

ÆClick <F6> (Trace) to accept the coordinates.

Use <F1> (Move To) to move to the base position

(to test a numeric input, for example).

Parameters

Button Description








directly.




Value range, unit

Base Position

X The camera's idle position.

µm Y

Z

P 0.01°

Buttons

Button Description



input field







118

1 Bonding


Software Manual A-1


Value range, unit

Transfer pos:

X

Coordinates of the DCL tool for

transfer from the flip-chip tool

µm Y

Z

P 0,001°

Transfer ramp: Z Height as of which only the

Z-axis moves and only at redu-

ced speed.

µm

Transfer save pos.

Y

Collision-free waiting position

µm Z

Transfer vac. Delay after an error message is

timeout issued.

ms

Ramp speed: up/ Speed of the DCL Z-axis for

down ramping up or down (ramp: time

during which only the Z-axis

moves).

% of normal speed of the Z-axis.


Value range, unit

Flip Chip Pickup

Pickup pos Height of the flip-chip unit during

pickup from the wafer

counts

Z

Pickup rampheight Height above the touchdown

point (pickup position), as of

which speed of the Z-axis is

reduced.

counts

Flip chip

transfer

Transfer pos: Z Z position of the flip-chip tool for

transfer to the DCL unit.

counts

Transfer ramp: Z Z height before the transfer posi-

tion as of which the speed of

approach to the transfer position

is reduced.

counts

R Speed of the flip-chip Z-axis

during movement from "Transfer

ramp" to "Transfer pos"

%

Transfer delay: Time for transfer from the flip-

chip tool to the DCL unit.

ms

FC vacuum off Time in which both the DCL

delay: vacuum and the flip-chip

vacuum are ON.

ms

DCL settings:

Flip Chip (option)

DCL Machine Data (M 1) > Flip Chip

Parameter

Buttons

Button Description

F1: FC Move To Move to the coordinates corre-


input field

F2: Needle up Extend the needles.

F3: Needle down Retract the needles.

F4: DE-vacuum Switch the vacuum at the chip

ejector on or off.

F5: DCL vacuum Switch DCL vacuum on and off.







F7: FC vacuum Switch the vacuum at the flip-

chip unit on or off.

F9: Chip Cntrl Move to the chip-control posi-

tion.

119



Button Description

F10: Move FC Switch to trackball control for







directly.



fn+F1: FC to pickup Move the flipchip to the pickup

position

fn+F2: FC to pick Move the flipchip to the "Pickup

ramp rampheight" position

fn+F3: FC to Move the flipchip to the transfer

transfer position

fn+F5: DCL to Move the DCL tool to the trans-

transfer fer position

fn+F6: DCL to tr. Move the DCL tool to the "Trans-

ramp fer ramp" position

fn+F7: DCL to tr. Move the DCL tool to the colli-

save sion-free waiting position

fn+F8: DCL to CC Move the DCL tool to the chip-

control position

fn+F9: FC pickup The flip-chip unit picks up the

chip.

fn+F10: FC => Transfer of the chip from the flip-

chip tool to the DCL tool

1.7.2 EPO Machine Data (M 2)

Machine-specific parameters of the EPO unit.

Two squeegee units can be used, so that two dif-

ferent adhesives can be applied. In this way a conductive and a nonconductive adhesive can be app-

lied.

General

Parameter


Value range, unit

Squeegee

Rotation on/off time Intervals after machine switch-

on in which the squeegee is

rotating or stopped.

Active only if the "Timed squee-

gee" checkbutton in the Bonder

Configuration page is activated.

If the "Timed squeegee" check-

button is not activated, the

squeegee is in constant rotation.

ms

Refill on/off time Times after machine switch-on

when the squeegee is being fil-

led with adhesive or when the

supply of adhesive is interrup-

ted.

Filling takes place only when the

squeegee is rotating: Set "Refill

on time" to a lower value than

"Rotation on time".

ms

1 Bonding


Software Manual A-1

120

Button Description

Speed setting Opens the window for entering

speed settings (see below)












page 1-12)









directly.




Value range, unit

Maximal refills The maximum number (pulsed)

or maximum time for filling,

before the "No adhesive" error

message is issued.

Speed Settings

EPO Machine Data (M 2) > General > Speed Set-

tings

When you press the "Speed settings" button you

have access to the window for setting speeds for

the EPO unit:

Buttons

Parameters


Value range, unit

Speed Settings

Production Speed during production.


Segment factors Speed of movement for the seg-

ment in question, as a percen-

tage of the value set in the

"Production: v[%]" parameter.

10...100 %

PRU Speed for PRU recognition.


IX Speed of movement for moving

to the "indexer free" position


Init Speed of movement for initial

movements prior to start of pro-

duction.


Clean Speed of movement for moving

to the cleaning position.


Toolchanger Speed of movement for chan-

ging the stamp unit.




121


Value range, unit

Correction move Speed of movement from "Cor-

rection ramp Z" to "Bond ramp

Z". Effective only when single

chip/single placement optimiza-

tion is configured.


EPO Machine Data > Dispenser

EPO Machine Data (M 2) > Dispenser

Parameter


Value range, unit

Dispenser

settings

Purge pos X The position for cleaning the dis-

penser needle

µm

Y

Z

Interval Time for the cleaning process

s

Amount Quantity dispensed at the purge

position

Dispenser

Offsets

Camera <–> Dis-

penser X

Offset between camera and dis-

penser.



under "Mode > EPO camera -

tool offset" and they are shown

here for information only.

µm

Y

Buttons

Button Description





1 Bonding


Software Manual A-1

122

Button Description








page 1-12)









directly.



Squeegee 1/2

EPO Machine Data (M 2) > Squeegee 1/2

Parameters for a squeegee unit for preparation of

the adhesive.

Parameter


Value range, unit

Stamp settings

Squeegee position

X

Position for picking up epoxy

adhesive in the squeegee unit (P

= axis of rotation)

µm

Y

Z

P 0.01°

Ramp height up Height above the point at which


gee unit, as of which the upward

speed of the Z-axis is increased.

µm

Ramp height down Height above the point at which


gee unit, as of which the down-

ward speed of the Z-axis is

reduced.

µm

Ramp speed v up Speed of the stamp from the

immersion point to the "Ramp

height up".

% of operating speed



123


Value range, unit

Ramp speed v Speed of the stamp from the

down "Ramp height down" to the

immersion point.

% of operating speed

Squeegee delay Time during which the stamp is

dipped into the adhesive

ms

Ramp up delay Delay between arrival at the

"Ramp height up" position and

resumption of stamp movement.

The "Ramp up delay" prevents

strings of adhesive forming.

ms

Button Description












page 1-12)









directly.



Buttons

Tool Assign

EPO Machine Data (M 2) > Tool Assign

Dropdown menus enable you to assign each

stamp tool a squeegee unit. This ensures that a

stamp cannot become contaminated with the

wrong adhesive.

Buttons

Button Description












page 1-12)









directly.



1 Bonding


Software Manual A-1

124

Button Description

Corridor: 1..6 Open the window in which the

change positions for the corre-

sponding corridor are defined.

F1: Move to Move to the coordinates corre-




F2: Change tool Change the DCL unit.

F3: Toolchanger Move the toolchanger to the

change position/idle position.

F5: Manual Pos. Position for the manual tool

change.








page 1-12)

F9: Chip Cntrl Move to the chip-control posi-

tion.








directly.



1.7.3 DCL Toolholder Positions (M 3)

Machine-specific parameters of the DCL toolchan-

ger.

Parameter


Value range, unit

Change Position: X X/Y coordinates of the position

at which the manual toolchange

is performed.

µm

Y

Buttons


Value range, unit

General Data

Change free Y Y position of the DCL unit at

which there is no possibility of

collision with the extended

toolchanger

µm

Move height: Z Height of the DCL unit in Z at

which the change is performed.

µm

Change speed Speed of movement for chan-

ging the DCL unit.

1...150 %

Change delay Delay after the change position

in the toolchanger is reached

ms

Tear Off

Offset: Z Height in Z that the DCL unit

rises when the DCL unit is pla-

ced in the toolchanger.

µm

Speed Upward speed of the DCL unit

for setdown movement


Delay Delay after the DCL unit is set

down in the toolchanger.

ms

Manual change:



125


Value range, unit

Corridor

number

No. For rapid changes between the

six corridors.

1..6

Entry 1 position

X Position of the DCL unit before it

enters the corridor

µm

Y

Z

P 0.01°

Positions in front of

Slot

Slot 1/2 X Position of the DCL unit before it

enters the slot

µm

Y

Z

P 0.01°

Positions in Slot

Slot 1/2 X Position of the DCL unit in the

slot at which the DCL unit is set

down or picked up.

µm

Y

Z

P 0.01°

1.7.4 Corridor Settings

DCL Toolholder Positions (M 3) > Corridor Settings

Machine-specific parameters of the DCL toolchan-

ger. The settings are identical for all six magazine

corridors.

Parameter

Buttons

Button Description

F1: Move to Move to the coordinates corre-




F2: Change tool Change the DCL unit.

F3: Toolchanger Move the toolchanger to the

change position/idle position

F5: Manual Pos. Position for the manual tool

change.








page 1-12)








directly.



1.7.5 DCL Tool Offset (M 5)

P-axis offset (rotational axis) of the DCL tool, as

trained in the Mode menu. The values are shown

here for information only; they cannot be changed.

1 Bonding


Software Manual A-1

126


Value range, unit

Pickup area

min/ max X

Range for the pickup position in

X, Y, Z and P.

µm Y

Z

P 0.01°

Clean area

min/max X

Range for the cleaning position

in X, Y, Z and P.

µm Y

Z

P 0.01°

Tool change area

min/max X

Range for the tool-change posi-

tion of the DCL unit

µm Y

Z

P 0.01°

Lookup camera

area min/max X

Range for the lookup camera.

µm Y

Z

P 0.01°

FC => DCL transfer

area (DLC head)

min/max X

Range for transfer from the flip-

chip unit to the DCL unit

µm Y

Z

P 0.01°

Button Description








page 1-12)

F8: Deinit De-energise the motors to faci-

litate training by moving the

table manually.

F9: Init Re-initialise the motors.

F10: Default set- Restore the factory defaults for

tings the DCL unit.

1.7.6 DCL Limits (M 7)

Limit settings for the DCL positions.

Parameter


Value range, unit

Work area

min/max X

Y

PRU area

min/max X

Y

.

µm

Range in X and Y in which the

DCL unit must be located for

imaging.

µm

Focus height min Z Z range for focusing height of

max Z the DCL camera.

µm

Rad height min Z Z range of the highest point on

max Z

Flip-chip unit

the arc described on the way to

the substrate.

µm

Buttons

FC pickup min Z Z range for the flip-chip pickup

max Z position

FC transfer min Z Z range for the flip-chip transfer

max Z

Bond area

min/max X

Y

Z

position

Range for the bond position in X,

Y, Z and P.

µm

P 0.01°



127


Value range, unit

Stamp area min/

max X

Range for the stamp position in

X, Y, Z and P.

µm Y

Z

P 0.01°

Stamp area max X Maximum coordinates for the

epoxy position in X, Y, Z and P.

µm

Y

Z

P 0.01°

Squeegee area

min/max X

Range for pickup of the adhe-

sive from the squeegee unit in X,

Y, Z and P.

µm (0.01° for P-axis)

Y

Z

P 0.01°


Value range, unit

General limits

Work area:

min/max X

Working range for the EPO unit

in X and Y

µm Y

PRU area:

min/ max X

Range for EPO unit for imaging

µm Y

Focus height min Z Z range for focusing height of

the EPO camera.

µm

max Z

Rad height

min/max Z

Z range of the highest point on

the arc described on the way to

the substrate.

µm

Limits for dispenser

Dispense area min/

max X

Range for the dispensing posi-

tion in X, Y, Z and P.

µm Y

Z

P 0.01°

Purge area min/

max X

Range for the purging position

for the dispenser needle in X, Y,

Z and P.

µm

Y

Z

P 0,01°

Limits for stamp

tools

1.7.7 EPO Limits (M 8)

Limit settings for the EPO positions.

Parameter

Buttons

Description Button








page 1-12)

F8: Deinit De-energise the motors to faci-

litate training by moving the

table manually.

F9: Init Re-initialise the motors.

F10: Default set- Restore the factory defaults for

tings the EPO unit.

1 Bonding


Software Manual A-1

128


Value range, unit

Default band width Temperature bandwidth as

check criterion for achievement

of the specified temperature.

°C

Upper

Lower

Default band scans

Interval Time between two measure-

ments

Number Number of consecutive intervals

with a measured temperature

inside the temperature band-

width as a criterion for accep-

tance.




neers only.


°C


(ti1) controller

0.1 s



0.1 s


(ti1) 0.1 s

Output Limits


(Y.Lo) ble

%


(Y.Hi) ble

%


(Ym.H) %




position

°C



air is activated

°C

1.7.8 Oven Settings (M 9)

Parameters for five oven controllers.

Oven Heating

Parameters for the KS 40-1 temperature controller

Checkbuttons


In use Use controller

Startup

behaviour

Room temp. Startup temperature 15°C wit-

hout cooling

Work temp. Startup temperature as set by

means of the "Work" parameter.

Standby temp Startup temperature as set by

means of the "Standby" parame-

ter.

Parameter


Value range, unit

Default temps.

Work Working temperature selectable

under "Startup behaviour"

°C

Standby Standby temperature selectable


°C

Temp. Range The permissible temperature

range

°C



129


Value range, unit



°C


range

°C




°C

Default band scans





tance.


ments

Control These are control-related para-

Parameters meters and the settings should


neers only.

Proportional (PB1) P parameter of the controller

°C

Integral (TI1) I parameter (integral time) of the

controller

0.1 s

Differential (TD1) D parameter (derivative time) of

the controller

0.1 s

Dead Band (DB) Practical starting value: -15

Parameters for optimising coo-

ling

Cooling

Parameters

Proportional (CPB) Proportional range for cooling as

% of proportional (PB1)

Power Limits

Output 1 Voltage limit

100 % = 10 V

%

Output 2 Voltage limit

100 % = 10 V

%

Buttons

Description Button

F1: Work Temp Heat oven to working tempera-

ture.

F2: Standby Temp Heat oven to standby tempera-

ture

Gas Heating

Parameters for the KS 20 forming-gas temperature

controller

Checkbuttons



Startup

behaviour


hout cooling





ter.

Parameter


Value range, unit

Default temps.



°C

1 Bonding


Software Manual A-1

130


Value range, unit

Offset (SHIF) Temperature compensation to



position

°C

Buttons

Description Button


ture.


ture

Gas Mixer

Parameters for the KS 40-1 temperature controller

Checkbuttons



Startup

behaviour


hout cooling





ter.

Parameter


Value range, unit

Default temps.



°C



°C


range

°C




°C

Default band scans



131


Value range, unit


ments





tance.




neers only.


°C


(ti1) controller

0.1 s



0.1 s


(ti1) 0.1 s

Output Limits


(Y.Lo) ble

%


(Y.Hi) ble

%


(Ym.H) %




position

°C



air is activated

°C

Description Button


ture

Mass Flow

Parameters for the KS 20 forming-gas mass-flow

controller

Checkbuttons



Parameter


Value range, unit

Mass Flow

Settings.

Flow Flow rate per hour

l/h

Buttons

Description Button


ture.

1 Bonding


Software Manual A-1

132

Display settings

Parameter for viewing the controller profiles

Checkbuttons


Oven Heating Controller for oven temperature

Gas Mixer Controller for gas temperature

Live display Online display of temperature

transient

Heat & cool Two separate views for heating

and cooling

Parameter


Value range, unit


°C


Value range, unit

Live display Display scaling

settings


the time axis

ms


°C

Heat up settings Display scaling for heating


the time axis

ms


°C

Cool down settings Display scaling for cooling


the time axis

ms



133


Value range, unit

Change position

X

Position of the wafer x-y table for

wafer changes.

This position must be specified

only during setup.

In the X direction, the position

should be as close as possible

to the transport wheel. Leave a

margin of safety of

1 - 2 mm.

µm

Y

Offset dy Offset of the workholder in Y

direction before moving into the

clamp

Distance of the workholder from

the transport roll in the X direc-

tion while the input pusher

opens or closes

µm

Magazine lift

Slot positions

first slot

Position of the magazine lift on

transfer of a wafer from the first

or last slot, respectively.

µm

last slot

Slot definitions Number of slots per magazine.

No of slots

Slot definitions Number of the slot currently in

Active slot use.

You have the option of selecting

a slot manually. Enter the slot

number of your choice in the

input field, press "Enter" to con-

firm your choice and click the

"F1: Move To" button to move to

the slot.

There is no check to ensure that

the slot actually contains a

wafer.

Transport clamp

Change pos X Position of the clamps for wafer

changes in X.

µm

Upper Z Position of the upper clamp for

wafer changes in Z.

µm

Lower Z Position of the lower clamp for

wafer changes in Z.

µm

1.7.9 Wafer Machine Data (M 22)

Machine-specific parameters of the wafer-handling

system.

Parameter


Value range, unit

Wafer Number

Act. Number of the wafer currently on

the x-y table.

Wafer table

Center position X Centre of the wafer x-y table

This position is a factory setting:

Do not change this setting

unless mechanical changes

affecting it have been performed

at the wafer x-y table.

µm

Y

Radius r Radius of the wafer carrier.

This is a factory setting: do not

change this setting unless

mechanical changes affecting it

have been performed at the

wafer carrier.

µm

1 Bonding


Software Manual A-1

134

Button Description

F5: Close LTC Close the lower clamp.








page 1-12)

F7: ChangeWafer Perform a complete wafer-

change cycle.

F8: NextSlot Move the wafer lift down one

slot.


control position.

F10: Move WT Toggle trackball function bet-

ween mouse function and move-

ment of the axes.

fn+F6: DE Block Raise or lower the chip ejector.

fn+F8: DCC open Open the die carrier clamp.

fn+F9: DCC close Close the die carrier clamp.


Value range, unit

Work Z Position of clamps in Z at which

there is no possibility of collision

with the x-y table.

µm

Lift positions Position of the workholder con-

Pos1 X veyor system in X, when the

wafer in the wafer magazine is

picked up or set down.

µm

Lift Positions Collision-free position of the

Pos 2 X workholder conveyor system

with reference to the wafer lift

µm

Delays

Camera Delay between arrival at the


imaging.

ms

Timeouts for wafer

change

Transportation Time within which transport

must be completed. An error

message is issued if this timeout

is overshot.

ms

Clamping Time within which the workhol-

der clamp must close. An error

message is issued if this timeout

is overshot.

ms

WH Start Slow Pos Position, pos 1 x and pos 2 x, at

which the wafer frame is not yet

in the magazine. Slow approach

as of this position.

µm

WH Start Slow Reduced speed

Speed

Buttons

Button Description

Lift Home Move the magazine lift to the

home position.

TC home Move the workholder transport

system to the home position.



input field.



135

1.7.10 Die Ejector Rotor Position (M 24)

Definition of the positions of the chip ejector

toolchanger when each chip ejector is changed.

Parameter


Value range, unit

DieEjector Tool Number of the chip ejector unit

number for which you want to set the

position.

Toolpostion P Position of the toolchanger when

the chip ejector unit you selected

is changed.

0,01°

DieEjektorBlock Delay

delay ms

counts for 360° Number of steps into which 360°

rotation rotation is subdivided

Buttons

Button Description








directly.



<fn> F2: Defaults Once the first position has been

trained, the other seven positi-

ons are distributed equidistantly

around the circle.

Button Description





F2: DE Block Raise or lower the chip ejector.

F3: Change Tool Perform a chip ejector change.








page 1-12)

136

1 Bonding

1.8 Service menu (S)

Software Manual A-1

Button Description

Switch to DCL Switch to the DCL wizard

wizard

Switch to WFS Switch to the WFS wizard

wizard

General

Positions

Epo pos. Move to the epoxy position

Next epo pos. Move to next epoxy position

Prev.epo pos. Move to previous epoxy posi-

tion.

Next subst. Move to next substrate position.

Previous subst. Move to previous substrate posi-

tion.

Next module Move to next module position.

1 . 8 Se rvi c e m en u (S)

The "Service" menu permits access to certain

basic functions of the motor controller card and the

I/O cards. This pull-down menu is for service and/

or update purposes and some of its functions are

not accessible to ordinary users.

1.8.1 Reinit motors (S 1)

Re-energise all motors driven by the motor control-

ler card. List of motors: (see "1.8.2 Deinit motors

(S 2)" on page 1-136).

1.8.2 Deinit motors (S 2)

De-energise all motors driven by the motor control-

ler card. The corresponding axes can be moved

freely by hand. List of motors:

„ Wafer x-y table X-axis

„ Wafer x-y table Y-axis

„ Chip ejector (ejector system)

„ Wafer lift

„ DCL unit X-axis

„ DCL unit Y-axis

„ DCL unit Z-axis

„ DCL unit P-axis

„ Chip-ejector tool holder

„ Workholder transport clamp X

„ Workholder transport clamp Z

1.8.3 Wizard (S 4)

Direct access to a wind range of machine move-

ments and functions, without having to open the

appropriate pages. The following wizards are

available:

„ Wizard for the EPO tool

„ Wizard for the DCL tool

„ Wizard for the wafer handling system

„ Wizard for the oven

You can use the buttons to switch from one wizard

to another. The screens shown below might differ

from those on your machine, because the range of

functions available depends on the machine confi-

guration.

EPO wizard

Buttons

137



Button Description

Previous module Move to previous module posi-

tion.

EPO head

Trackball move Activate the trackball in order to

move the EPO unit

Move EPO HOME Move to EPO home position.

Dispenser

Purge pos. Move to the purging position

Purge Clean dispensing needle

Squeegee

Squeegee pos. Move to position for picking up

epoxy adhesive in the squeegee

unit

Squeegee ON/Off Switch squeegee for adhesive

on and off.

Reset Squeegee Reset the squeegee.

Tools

Put tool Set down the EPO tool.

Get tool Pick up the EPO tool.

Manual Manual tool change

Toolchange

Toolchanger home Move to the toolchanger's home

position.

Toolchanger for- Move to the toolchanger's work

ward position.

Bond info

Cancel Adjust Discard all adjustment data

Cancel bond info Discard all statistics on proces-

sed and rejected chips

DCL wizard

Buttons

Button Description

Switch to EPO Switch to the EPO wizard

wizard

Switch to WFS Switch to the WFS wizard

wizard

General

positions

Dcl pos. Move to the bond position

Next Dcl pos. Move to next bond position

Prev.Dcl pos. Move to previous bond position.

Next subst. Move to next substrate position.

Previous subst. Move to previous substrate posi-

tion.

Next module Move to next module position.

Previous module Move to previous module posi-

tion.

Pickup pos. Move to the pickup position

Camera free pos. Move to the position at which the

wafer camera has an unobstruc-

ted view of the wafer

Clean pos. Move to the position above the

trashcan

Chip control pos. Move to the position above the

chip-control LED

DCL head


move the DCL unit.

Move DCL HOME Move DCL to the home position

138

1 Bonding


Software Manual A-1

Button Description

Tool

Put tool Set down the EPO tool.

Get tool Pick up the EPO tool.

Manual Manual tool change

Toolchange

Toolchanger home Move to the toolchanger's home

position.

Toolchanger for- Move to the toolchanger's work

ward position.

Vacuum ON Switch on the vacuum.

Air ON Switch on the supply of com-

pressed air.

Medium OFF Switch off vacuum/compressed

air.

Bond info

Cancel Adjust Discard all adjustment data

Cancel bond info Discard all statistics on proces-

sed and rejected chips

WFS wizard

Buttons

Button Description

Switch to EPO Switch to the EPO wizard.

wizard

Switch to DCL Switch to the DCL wizard.

wizard

General

Positions

Start pos. Move to the position at which

processing of a new wafer

starts.

Center pos. Move to the centre of the wafer.

Change pos. Move to the position at which the

wafer camera has an unobstruc-

ted view of the wafer.

Wafer table


move the wafer table.

Move WT HOME Move the wafer table to the

home position.

Wafer align

Search Search for chip.

Align Search for chip and move to the

pickup position.

Change Wafer Perform a manual wafer change.

139



Button Description

Change

Components

If the bonder is restarted in an

undefined state after a disrup-

tion, this mask can be used to

achieve a defined state without

the necessity of removing sub-

strates and wafers from the

machine

Button Description

Empty Machine All wafers still in the machine are

returned to the wafer-magazine

lift.

First chip Move to the first chip on the

wafer.

Measure chip index Automatically compute spaces

between chips in X and Y.

Die handling

DCC open Open the die carrier clamp.

DCC close Close the die carrier clamp.

Open UTC Open the upper clamp.

Close UTC Close the upper clamp.

Open LTC Open the lower clamp.

Close LTC Close the lower clamp.

TC ==> Move the workholder transport

system to the change position at

the wafer cassette.

TC <== Move the workholder transport

system to the change position.

UTC/LTC to work Move top/bottom clamp to work

high height

UTC to DCC height Move top clamp to the height for

die carrier clamping

LTC to DCC height Move top clamp to the height for

die carrier clamping

Move TC HOME Move the workholder transport

system to the home position.

DE block

UP Move the chip ejector up.

Down Move the chip ejector down.

Get DE tool Function is inactive.

Needle up Extend the needles.

Needle down Retract the needles.

Vacuum ON Switch on the vacuum.

Medium OFF Switch off the vacuum.

Magazine lift

First slot Move the magazine lift into posi-

tion at the first slot.

Last slot Move the magazine lift into posi-

tion at the last slot.

Next slot Move the magazine lift into posi-

tion at the next slot.

Active Compon-

ents

1 Bonding


Software Manual A-1

140

Button Description

Set Heat or cool, as applicable, to

the setpoint temperature as

shown.

Abort Abort heating or cool, as appli-

cable, to the setpoint tempera-

ture.

Standby Temp Heat or cool, as applicable, to

the standby temperature.

Work Temp Heat or cool, as applicable, to

the working temperature.

Oven wizard

The measured temperature (actual value) is

shown in green in the top line, along with the cur-

rent setpoint temperature.

The permitted temperature range is shown in

green in the second line.

Parameter


Value range, unit

temp New setpoint value

°C

timeout Time after which heating or coo-

ling, as applicable, to the set-

point temperature is aborted

0.01°

Buttons

1.8.4 Configuration (S 5)

Basic bonder settings. Activate or deactivate indi-

vidual components or modules for servicing and

testing.

The screen might not necessarily be as shown

here: the layout varies in accordance with the con-

figuration of the machine.

The following functions and modules can be acti-

vated and deactivated:

DCL unit

„ Entire DCL unit

„ Substrate alignment

„ Individual adjustment movements

„ Inkdot check

„ Pickup

„ Chip-eject system

„ Vacuum check

„ Infrared chip check

„ Provision for wafer angle

„ Indexer

„ Height measurement

Wafer station

„ Entire wafer x-y table

„ Chip alignment

„ Wafer change



141

1.8.5 Machine Counter (S 6)

Displays various counters. The first column con-

tains overall counters of the objects in question,

and cannot be reset. You can reset the counter in

the second column ("Actual Values") by clicking

the appropriate button.

Machine Counter > Properties WY

The wafer yield figure can be adjusted to suit con-

ditions. Yield can be calculated separately for each

wafer or from reset to reset.

1.8.6 Change Epoxy (S 7)

The epoxy adhesive has to be applied within a defi-

ned time. You enter the data for the epoxy adhe-

sive in this menu.

Parameter


Value range, unit

Epoxy Age Current age of the epoxy adhe-

(HH:MM) sive. Updated automatically by

the program.

Hours: Minutes

Epoxy Lifetime (H) Maximum life of the epoxy adhe-

sive. The program interrupts

bonding and issues an error

message when this time has

elapsed.


Hours

Warning time (MIN) Time until the life of the adhesive

expires. The program issues a

warning to the effect that the

adhesive has to be changed.

Minutes

Buttons

Button Description

Epoxy Changed Resets the counter for Epoxy

Lifetime.

1 Bonding


Software Manual A-1

142

1.8.7 Cycle Times (S 8)

Show the last cycle times.

Parameter


Value range, unit

EPO Cycle Time Last cycle time of the EPO unit.

ms

DCL Cycle Time Last cycle time of the DCL unit

ms

WFS Cycle Time Last cycle time of the wafer

system

ms

INX Cycle Time Last cycle time of the indexer

ms

1.8.8 Tool hits (S 9)

Resettable counters for EPO and DCL

1.8.9 Diebonder I/O page (S 10)

All bonder inputs and outputs which do not belong

to the indexer are listed on this page. This page

enables the outputs to be activated and the sensor

inputs checked for service purposes and for fixing

faults during production.

A T T E N T I O N

R I S K O F C O L L I S I O N

No safety check

1.8.10 Indexer IO page (S 11)

All bonder inputs and outputs which belong to the

indexer are listed on this page. This page enables

the outputs to be activated and the sensor inputs

checked for service purposes and for fixing faults

during production. You will find more information in

the user guide for the indexer.

1.8.11 Indexer Settings (S 12)

Settings for the indexer You will find more informa-

tion in the user guide for the indexer.

1.8.12 Inputlift Page (S 13)

Settings for the input lift. You will find more infor-

mation in the user guide for the lifts.

1.8.13 Outputlift Page (S 14)

Settings for the output lift. You will find more infor-

mation in the user guide for the lifts.



143

1.8.14 Motor Service (S 15)

Help functions for troubleshooting and monitoring

the measuring systems and drives.

A T T E N T I O N

R I S K O F C O L L I S I O N

No safety check

1.8.15 Get Versions (S 20)

Overview of version numbers of all software modu-

les installed.

1.8.16 User Administration (S 90)

Each user group has its own, specific scope of

access to machine functions and parameter set-

tings. A user group is defined by its password.

There are three user groups:

„ Technician

„ Engineer

„ Supervisor

Changing the password for a user group:

ÆEnter the supervisor password.

ÆUse Switchbox to select the user group whose

password you want to change.

ÆEnter the new password twice.

ÆClick the "CHANGE PASSWORD" button.

Changing user rights:


I M P O R T A N T

Level Editor closes automatically if 30 seconds

pass without a user input. Changes that have

not been saved are lost when this happens.

ÆLevel Editor button: Press "Edit".

The menu closes.

ÆSelect the input field in a menu for which you

want to assign new rights.

ÆClick the right mouse button to start the dialog.

Menu with checkbuttons appears on the screen.

1 Bonding


Software Manual A-1

144

Checkbuttons


enabled Editable input field

selectable Entries not possible, but field

can be selected so that function

buttons can be used.

disabled View only, no access

ÆAssign the user right or rights.

ÆRepeat the procedure for other input fields as

necessary.

To define a user right on a permanent basis: ÆReselect User Administration (S 90).


ÆActivate by pressing the "Save changed set-

tings" button.

The menu closes and the changes are saved.

1.8.17 Change User Level (S 91)

Changes the user group.

ÆMark the user group you want to change.

ÆEnter the appropriate password.

ÆPress "enter" to confirm.

ÆClick "Escape" to change the user group and

exit the menu.

145

Software Manual A-1

1 Bonding

1.9 Preparations

1.8.18 Show Logfiles (Service 98)

There are register tabs for the following logfiles:

„ Console: Log of all keyboard entries

„ DCL Heights: Log of all defined heights

„ Modem: Log of all information about connection

setup and data transfer by modem

„ Syslog: Log of all machine actions

1.8.19 Set Printer Format (S 99)

Set the parameters according to whether you want

to print to a file or use a postscript-compatible or

HP PCL-compatible printer.

1. 9 Preparations This section outlines the procedure for starting pro-

duction with the bonder.

1.9.1 Switching on the bonder

ÆPress and hold down the green button on the

main-switch module until all three contactors of

the power supply unit pull up with an audible

click (approx. 3 seconds).

ÆWait until the bonder software is fully loaded.

The following message appears on the screen:

ÆClick "OK" to start the startup procedure.

ÆClick "Yes" to move all axes to their home posi-

tions, or click "No" to cancel.

ÆClick "Yes" to position the wafer x-y table in the

centre, or click "No" to cancel.

ÆClick "Yes" to raise the chip ejector block, or

click "No" to cancel.

ÆClick "Yes" to reset the indexer, or click "No" to

cancel.

146

1 Bonding

1.9 Preparations

Software Manual A-1

Initialisation is now complete.

ÆInstall the DCL toolholder in the toolholder

attachment.

1.9.2 Train the machine-specific parame-

ters

Changes to the machine hardware components

listed in this subsection necessitate the retraining

of the parameters cross-referenced below.

DCL camera

Parameters that have to be changed if modificati-

ons are made to the mechanical or optical subsy-

stems of the DCL camera.

„ See "1.5.1 DCL Camera Scale (O 1)" on page 1-

18

„ See "1.5.3 DCL Camera <–> Tool Offset (O 3)"

on page 1-24

„ See "1.5.12 MWC Wafertable <–> DCL Trafo

(O 52)" on page 1-30

DCL Tool


ons are made to the DCL tool.

„ See "1.5.2 DCL Tool Offset (O 2)" on page 1-19

„ See "1.5.3 DCL Camera <–> Tool Offset (O 3)"

on page 1-24

„ See "1.5.13 MWC Camera <–> Tool Offset

(O 53)" on page 1-31

Needle

Parameters that have to be changed if needles are

changed.

„ See "1.5.8 Camera-Needle Offset (O 25)" on

page 1-27

Wafer camera


ons are made to the wafer camera.

„ See "1.5.8 Camera-Needle Offset (O 25)" on

page 1-27

„ See "1.5.11 MWC Camera Scale (O 51)" on

page 1-29

„ See "1.5.13 MWC Camera <–> Tool Offset

(O 53)" on page 1-31

Wafer table


ons are made to the wafer table.

„ See "1.5.12 MWC Wafertable <–> DCL Trafo

(O 52)" on page 1-30

147

Software Manual A-1

1 Bonding

1.9 Preparations

Lookup camera


ons are made to the optional lookup camera.

„ See "1.5.14 Option Lookup Camera Scale

(O 60)" on page 1-31

1.9.3 Setting up an application

When the program starts the "File > Load" com-

mand is called automatically and the applications

stored in memory are listed.

ÆUse "File > Load" to select an application similar

to the new application.

The advantage of this approach is that it minimises

the number of new parameters to be programmed.

The following routines have to be executed in the

"Mode" menu:

„ Train the substrate positions: (see "1.5.5 Learn

Substrate Positions (O 9)" on page 1-25)

„ Train the module positions: (see "1.5.6 Learn

Module Positions ( 10)" on page 1-26)

„ Train the wafer radius: (see "1.5.7 Learn Wafer

Radius (O 21)" on page 1-26)

„ Train the chip positions: (see "1.5.9 WFS Learn

Chip (O 30)" on page 1-27)

„ Train the spacing between the chips: (see

"1.5.10 WFS Learn Chip Index (O 31)" on page

1-28)

1.9.4 Indexer

The bonder can operate with various types of sub-

strate: it may be necessary to reset the indexer for

each new type. The indexer is the subject of a

separate User Guide.

148

1 Bonding

1.9 Preparations

Software Manual A-1

149

Software Manual A-1

Index

Index

A

administrate user groups 143

Air & Vacuum 11

Application Pages menu 32

B

background knowledge 6

backup

bond data 14 C

calculate centre of circle 66

Calipers 64, 103

calipers 64, 90, 103

cardiac pacemakers 5

Change Epoxy 141

chip ejector toolchanger 135

Circle Center Finder 66

Configuration 140

counter 141

Cycle Times 142

D

DCL

adjusting speeds 115

setting limits 126

Tool Offset 125

toolchanger 124

wizard 137

DCL Camera - Tool Offset 24

DCL Camera Scale 18

DCL Machine Data 113

DCL tool offset 19

deinit motors 136

Delete File 14

Diebonder I/O page 142

DieEject Block 11

E

EBP 6

Edge Search 86

edge search 59, 71

EMERGENCY STOP 5

EPO

adjusting speeds 120

change adhesive 141

setting limits 127, 128

wizard 136

EPO Camera - Dispenser Offset 25

EPO Machine Data 119

F

file menu 13

G

grounding 6

H

hazards when bonding 5

height measure settings 116

HML 116

Hole Finder

holes 70

HOME 12

I

Indexer IO page 142

inkdot search 53

K

keyboard functions 12

Index Software Manual A-1

150

L

learn module positions 26

Learn Substrate Positions 25

Learn Wafer Radius 26

load application data 13

load machine data 13

Load Program from FTP-Server 15

Load Program to FTP-Server 15

M

Machine Counter 141

Machine Pages 113

masks 65, 91, 104

mode 71

mode menu 17

N

notes on safety 5

O

offset, needle position 27

Optional Parameters 63, 102

Ordinary Alignment 56

Oven

wizard 140

oven

temperature profiles 109

S

safety 5

safety device 5

safety instructions 5

Save As 13

save bond files to floppy disc 15

screen layout 9

search lines 64, 90, 103

search mode 86

service menu 136

setting up a new application 147

software version 143

START 12

status and barcode information 11

STEP 12

STOP 12

substrate adjustment

Circle Center Finder 66

Hole Finder 70

switching off the bonder 16

switching on 145

switching on the bonder 145

T

touchdown search 116

transformations 52, 94

U

User Administration 143

P

pattern recognition 56

preparations 145

Production Data 73

V

version numbers 143

R

reinit motors 136

RESTART 12

restore

complete 14

single bonding file 15

Software Manual A-1

Index

151

W

Wafer

wizard 138

Wafer Data 74

Pickup Data 78

wafer data

pickup data 34

WFS learn chip 27

WFS learn chip index 28

wizard 136

Index Software Manual A-1

152

Geringer Halbleitertechnik GmbH & Co KG Subject to change without prior notice

2012 All rights reserved

To be ordered from:

Geringer Halbleitertechnik GmbH &Co KG

Liebigstr. 1

93092 Barbing

Germany

Printed by Geringer

Date post:	28-Nov-2015
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Geringer a-1 US_Software Manual

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