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System System-on on-Chip Chip Qi Ci Qi Ci Qiong Cai Qiong Cai Intel Barcelona Research Center Intel Barcelona Research Center Aula Empresa, Facultat d’Informàtica de Barcelona, February 2010 Aula Empresa, Facultat d’Informàtica de Barcelona, February 2010 © © Intel Corporation, 2010 Intel Corporation, 2010 Outline Outline System System-on on-Chip Illustrated Chip Illustrated SoC Challenges and Current Solutions SoC Challenges and Current Solutions Intel’s Moorestown Platform Intel’s Moorestown Platform Designed for Next Generation Smartphones Designed for Next Generation Smartphones Future SoC: Future SoC: 2 Designing Tomorrow’s Microprocessors Programmable Accelerator Programmable Accelerator System System-on on-Chip is Everywhere ! Chip is Everywhere ! 3 Designing Tomorrow’s Microprocessors Example: iPhone 3GS disassembled Example: iPhone 3GS disassembled 4 Designing Tomorrow’s Microprocessors CPU (Samsung) NAND Flash Memory (Toshiba) SOC contains all components required for a complete system. SoC Challenges and Current Solutions SoC Challenges and Current Solutions 5 Designing Tomorrow’s Microprocessors SoC Challenges SoC Challenges Exponentially increasing SoC design complexity Exponentially increasing SoC design complexity Endless Performance Requirements Endless Performance Requirements Maximum Power Maximum Power-efficiency efficiency 6 Designing Tomorrow’s Microprocessors
Transcript

1

SystemSystem--onon--ChipChipQi C iQi C iQiong CaiQiong Cai

Intel Barcelona Research Center Intel Barcelona Research Center

Aula Empresa, Facultat d’Informàtica de Barcelona, February 2010Aula Empresa, Facultat d’Informàtica de Barcelona, February 2010

© © Intel Corporation, 2010Intel Corporation, 2010

OutlineOutline

•• SystemSystem--onon--Chip IllustratedChip Illustrated

•• SoC Challenges and Current SolutionsSoC Challenges and Current Solutions

•• Intel’s Moorestown PlatformIntel’s Moorestown Platform–– Designed for Next Generation SmartphonesDesigned for Next Generation Smartphones

•• Future SoC:Future SoC:

2 Designing Tomorrow’s Microprocessors

–– Programmable AcceleratorProgrammable Accelerator

SystemSystem--onon--Chip is Everywhere !Chip is Everywhere !

3 Designing Tomorrow’s Microprocessors

Example: iPhone 3GS disassembledExample: iPhone 3GS disassembled

4 Designing Tomorrow’s Microprocessors

CPU (Samsung)

NAND Flash Memory (Toshiba)

SOC contains all components required for a complete system.

SoC Challenges and Current SolutionsSoC Challenges and Current Solutions

5 Designing Tomorrow’s Microprocessors

SoC ChallengesSoC Challenges

•• Exponentially increasing SoC design complexityExponentially increasing SoC design complexity

•• Endless Performance RequirementsEndless Performance Requirements

•• Maximum PowerMaximum Power--efficiency efficiency

6 Designing Tomorrow’s Microprocessors

2

SoC Challenges SoC Challenges –– 1/3 1/3

•• Exponentially increasing SoC design complexityExponentially increasing SoC design complexity–– SoC = all components required for a complete systemSoC = all components required for a complete system

–– 1995: < 1 million gates /one microprocessor1995: < 1 million gates /one microprocessor

–– Today: 100s millions gates / multiple microprocessors Today: 100s millions gates / multiple microprocessors

–– ““Today, as always, to be competitive, you must design Today, as always, to be competitive, you must design almost as complex theoretically possible. If you don’t, almost as complex theoretically possible. If you don’t,

7 Designing Tomorrow’s Microprocessors

almost as complex theoretically possible. If you don t, almost as complex theoretically possible. If you don t, someone else will do, and the extra complexity will provide someone else will do, and the extra complexity will provide competitive edgecompetitive edge.”.”

SoC Challenges SoC Challenges –– 2/32/3•• Endless Performance RequirementEndless Performance Requirement–– Multimedia: many different codec for images/audio/videoMultimedia: many different codec for images/audio/video

•• HD H.264 Decode: 10HD H.264 Decode: 10--50 GOPS for 30 fps (real time)50 GOPS for 30 fps (real time)

•• HD H.264 Encode: ~100 GOPS for 30 fpsHD H.264 Encode: ~100 GOPS for 30 fps

•• Super Resolution: ~1000 GOPS for 30fpsSuper Resolution: ~1000 GOPS for 30fps

–– Networking: diverse and complicated standardsNetworking: diverse and complicated standards•• Telephony: constant bit rate serviceTelephony: constant bit rate service

8 Designing Tomorrow’s Microprocessors

•• Telephony: constant bit rate serviceTelephony: constant bit rate service

•• Multimedia streaming: higher bandwidth but variable bitMultimedia streaming: higher bandwidth but variable bit--rate rate serviceservice

–– WirelessWireless•• Many wireless coding standardMany wireless coding standard

–– WiWi--Fi, WiMax, etcFi, WiMax, etc

•• New standards appear all the timeNew standards appear all the time

SoC Challenges SoC Challenges –– 3/33/3

•• Maximum PowerMaximum Power--EfficiencyEfficiency–– Phone: 3W power budgetPhone: 3W power budget

•• Otherwise, the user feels too hotOtherwise, the user feels too hot

–– HD.264 DecodeHD.264 Decode•• Normal PC: 45W or more, depending on the video formatNormal PC: 45W or more, depending on the video format

•• Hardware Decoder in SoC: 100Hardware Decoder in SoC: 100--300mW300mW

9 Designing Tomorrow’s Microprocessors

•• A big challengeA big challenge–– How to meet different performance requirements under How to meet different performance requirements under

very tight power budget?very tight power budget?

Current SoC Design Solution: Divide and ConquerCurrent SoC Design Solution: Divide and Conquer

•• A SoC is divided into blocks and each block is optimized for A SoC is divided into blocks and each block is optimized for different performance/power requirement.different performance/power requirement.–– Some blocks are control processors (control plane)Some blocks are control processors (control plane)

•• Programmable / flexibleProgrammable / flexible

–– Some blocks are data processing units and implemented with RTL Some blocks are data processing units and implemented with RTL hardware (data plane)hardware (data plane)

•• Very limited programmableVery limited programmable

10 Designing Tomorrow’s Microprocessors

Partition of Control and Data PlanesPartition of Control and Data Planes

1. Data plane blocks can be optimized for different applications.

2. The IP blocks can be reused and the design complexity decreases.

11 Designing Tomorrow’s Microprocessors

(a) Control/Data plane functions in SoCs

Multiple CPUs are reality. For example, Cisco’s router chip contains 192 CPUs.

On-chip memory is growing to meet data-intensive requirements from data planes

1999: 20% of total area2002: 52%2005: 71%2008: 83%

Intel’s Moorestown PlatformIntel’s Moorestown PlatformDesigned for Next Gen SmartphonesDesigned for Next Gen Smartphones

12 Designing Tomorrow’s Microprocessors

-- Designed for Next Gen SmartphonesDesigned for Next Gen Smartphones

3

Intel SoC RoadmapIntel SoC Roadmap

13 Designing Tomorrow’s Microprocessors

Moorestown Platform OverviewMoorestown Platform Overview

2D/3DGraphics

CPUCore

Hardware Video Accelerator

Link toLangwell

MemoryController

Lincroft (45nm)ATOM uLP CPU Core• 45nm HighK SoC Process• Intel Hyper Threading Support

Intel Graphics• OpenGL ES 2.0 (subset of OpenGL 3D)• OpenVG (for Flash/SVG)

Memory Support

Hardware Accelerated Video Decode and Encode

14 Designing Tomorrow’s Microprocessors

AudioCodec

USBController

NANDController

Langwell (65nm)

Memory Support• LPDDR1 and DDR2• Single Channel• x32 bit interface

Moorestown HighlightsMoorestown Highlights

•• High Performance for amazing Internet experienceHigh Performance for amazing Internet experience

•• Dramatically lower PowerDramatically lower Power–– Up to 50x platform idle power reduction compared to Up to 50x platform idle power reduction compared to

Menlow PlatformMenlow Platform

•• Small size for smartphone form factor Small size for smartphone form factor

15 Designing Tomorrow’s Microprocessors

Small size for smartphone form factor Small size for smartphone form factor

Moorestown Performance TechnologyMoorestown Performance Technology

•• Intel Hyper Thread TechnologyIntel Hyper Thread Technology

•• Intel Burst Performance TechnologyIntel Burst Performance Technology

16 Designing Tomorrow’s Microprocessors

Intel HyperIntel Hyper--Threading TechnologyThreading Technology

17 Designing Tomorrow’s Microprocessors

Intel Burst Performance TechnologyIntel Burst Performance Technology

18 Designing Tomorrow’s Microprocessors

4

Moorestown Power ReductionMoorestown Power Reduction

•• Active Power Management Active Power Management –– Power and Clock Power and Clock GatingGating

•• Use Low Power and Handheld IOUse Low Power and Handheld IO–– LPDDRLPDDR

•• Accelerators (GFX video decoder)Accelerators (GFX video decoder)

19 Designing Tomorrow’s Microprocessors

•• Accelerators (GFX, video decoder)Accelerators (GFX, video decoder)–– Enable functionality at low power (e.g.. HD video)Enable functionality at low power (e.g.. HD video)

Active Power ManagementActive Power Management

•• Enables long standby battery life needed for Enables long standby battery life needed for smartphonessmartphones–– Through low idle powerThrough low idle power

•• Lower active scenario power by shutting things off Lower active scenario power by shutting things off that are not used in that modethat are not used in that mode

20 Designing Tomorrow’s Microprocessors

–– Switching off video decode block in web browsingSwitching off video decode block in web browsing

Power GatingPower Gating

21 Designing Tomorrow’s Microprocessors

Software Development for Moorestown: MoblinSoftware Development for Moorestown: Moblin

Opportunity forCustomers to differentiate

22 Designing Tomorrow’s Microprocessors

Moblin-basedSoftware Stack

Future SoCFuture SoC-- Programmable AcceleratorProgrammable Accelerator

23 Designing Tomorrow’s Microprocessors

Current SoCCurrent SoC

•• IP blocks based on fixed function implementation IP blocks based on fixed function implementation are not programmableare not programmable–– Each data plane block cannot used for other purposeEach data plane block cannot used for other purpose

•• Long TimeLong Time--toto--market (TTM)market (TTM)–– The block is not programmableThe block is not programmable

•• High NonHigh Non Recurrent Engineering(NRE) costRecurrent Engineering(NRE) cost

24 Designing Tomorrow’s Microprocessors

•• High NonHigh Non--Recurrent Engineering(NRE) costRecurrent Engineering(NRE) cost

5

A Solution for Future SoCA Solution for Future SoC

•• Low Power Programmable accelerator Low Power Programmable accelerator

•• The challenge is to meet performance requirement The challenge is to meet performance requirement under a given power and cost budgetunder a given power and cost budget

CPU+Fixed LogicPo

wer

25 Designing Tomorrow’s Microprocessors

CPU +Programmable

Accelerator

Fixed Logic

Cost & TTM

Perf

orm

ance

/P

Softwareon CPU

Our Programmable Accelerator: BSAOur Programmable Accelerator: BSA

Main Memory

Next Generation SoC

Blue Summer Controller

Master DataPort to Memory

Master Control

Port to DMA

Control/Data Network

Slave ControlPort from

Core

DMA Engine

26 Designing Tomorrow’s Microprocessors

x86 core

Control/Data Network

SharedCache Shared

RAMPEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE

Blue Summer Architecture (BSA)

DMA Engine

Low PowerProgrammable

Accelerator

Programmable AcceleratorProgrammable Accelerator

•• Different applications can be mapped into the same Different applications can be mapped into the same programmable accelerator programmable accelerator

•• TTM & NRE cost are reducedTTM & NRE cost are reduced

27 Designing Tomorrow’s Microprocessors

BSA for H264 EncodingBSA for H264 EncodingBlue Summer Controller

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE

PE

PE

PE

PE

Motion Estimation

Transformation

Deblocking

Entropy Coding

Other

28 Designing Tomorrow’s Microprocessors

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE Other

BSA for H264 DecodingBSA for H264 Decoding

Blue Summer Controller

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE

PE

PE

PE

Transformation

Deblocking

Entropy Coding

Other

29 Designing Tomorrow’s Microprocessors

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

PE PEPE PEPE PEPE PE

(In sleep mode to save power)

PE

TakeTake--away Messagesaway Messages

•• SoC is everywhere!SoC is everywhere!

•• The SoC design challenge is to meet exponentially The SoC design challenge is to meet exponentially increasing performance requirement under tight increasing performance requirement under tight power budget and design costpower budget and design cost

30 Designing Tomorrow’s Microprocessors

6

Q & AQ & A

31 Designing Tomorrow’s Microprocessors

ReferencesReferences

•• Rapid Repair Website: IPhone 3GS disassemblyRapid Repair Website: IPhone 3GS disassembly

•• R. Patel, Moorestown Platform: Based on Lincroft R. Patel, Moorestown Platform: Based on Lincroft SoC Designed for Next Generation Smartphones, SoC Designed for Next Generation Smartphones, HotChips 2009HotChips 2009

•• Shreekant Thakkar, Moorestown: Intel’s Next Shreekant Thakkar, Moorestown: Intel’s Next Generation Platform for MIDs and Smartphones Generation Platform for MIDs and Smartphones

32 Designing Tomorrow’s Microprocessors

Generation Platform for MIDs and Smartphones, Generation Platform for MIDs and Smartphones, IDF 2009IDF 2009

•• Steve Leibson, How to Avoid the Traps and Pitfalls Steve Leibson, How to Avoid the Traps and Pitfalls of SoC Design, Microprocessor Report, 2009of SoC Design, Microprocessor Report, 2009

•• Moblin: http://moblin.orgMoblin: http://moblin.org


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