Introduction to Freescale Corporate Presentation...Freescale Semiconductor Confidential and...

Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the

Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service

names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are

the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

TM

14 December, 2011 Imran Fazley Ibrahim

Freescale KLM Final Test to Freescale TJN Final Test Expansion

1M34C - 9S12C32 Correlation Report

TM Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the Freescale logo are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

TM

1

0. Introduction – Reason for Final Test Transfer

Logistical Expansion – align test with assembly location

NPI Site to Mass Production Site - Expected (normal) product

transfer from NPI Final Test Site to Mass Production Site. This

transfer minimizes logistical complexities and offers flexibility and

synergy between Assembly and Final Test.

Capacity Expansion - Freescale internal test capacity is reaching

maximum utilization and an external (Sub Con) Test site must be

qualified for Bosch assurance of supply – to avoid delivery

interruptions.



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2

1. Objective and Considerations

1.1 Objective

Objective is to qualify Freescale Tianjin (TJN) Final Test facility as joint Final Test site for

testing 1M34C. Complete list of affected parts is outlined in PCN 14452 and QSD.

This report details the correlation result of1M34C 9S12C32 to demonstrate that TJN Final

Test facility correlates with the Freescale Kuala Lumpur (KLM) Final Test facility.

The correlation units were first tested at the current KLM Final Test facility (full flow) and then

both rejects and good units were tested at the TJN Final Test facility.

No impact of customer deliveries

Scheduled to complete by 10/12/2011

1.2 Considerations

Test Platform Hardware in TJN Final Test is identical platform used in KLM Final Test, and

verified by tester calibration and dual site correlation analysis.

Identical Final test load board design used in both sites

Test Program Revision and test limits are the same in both sites.

Measurement Systems Analysis (GR&R) performed per 12MRM97179A.



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3

2. Qualification/Correlation Plan

2.1 Requirements:

The requirements and acceptance criteria are based on Freescale specification 12MQS10009G.

2.2 General Method:

Using the production test program, perform 100% screening of 3 lots of 9S12C32 at 140°C temperature, 25°C room

temperature and –40°C cold temperatures in the new test site, TJN. Test the same lots under the same conditions in the

current test site, KLM. Any mis-correlations at TJN will be sent to KLM for evaluation.

Correlation Plan

Brief Description

Detail description Acceptance Criteria

3.0

3k unit (with minimum 15 reject units included) bin-to-bin

A minimum sample of 3000 units from minimum 3 different wafer lots shall be used for correlating bin-to-bin per production test flow for every production test insertion. *Not applicable for analog products.

100% correlation for all good and reject units

4.1 Class A Qual

A minimum sample of 3000 good units from minimum 3 different wafer lots shall be tested at 100% QC Gate for all specified test insert temperatures (Hot, Room and Cold) for every production test insertion.

0 failure

4.3 Parametric comparison

A minimum sample of 30 good units between Site A and Site B shall be used for parametric comparison. Minimum 2 critical parametric tests shall be used for all specified test insert temperatures for every production test insertion. Reference spec 12MWS10156G (section 6.1) for critical parameter selection.

As minimum requirement: t-test and f-test should be no significant difference with p-value more than 0.05.



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Slide 4

Correlation Results (CHD - TJN) 3. Correlation Results 3.1 Bin-to-bin Correlation Results:

Tables below summarize the correlation results. All numbers filled in green boxes means correlation was achieved.

All numbers filled in yellow boxes means results did not correlate and requires further explanation.

Bin-to-Bin Correlation Matrix for Hot Test Lot A TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Lot B TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Lot C TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%



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Slide 5

Correlation Results (CHD - TJN) 3. Correlation Results Bin-to-Bin Correlation Matrix for Room Test

Lot A TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Lot B TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Lot C TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%



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Slide 6

Correlation Results (CHD - TJN) 3. Correlation Results Bin-to-Bin Correlation Matrix for Cold Test

Lot A TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Lot B TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Lot C TJN RESULT

BIN 1 2 3 4 5 6 7 8

KL

M R

ES

UL

T

1 Pass

2 100%

3 100%

4 100%

5 100%

6 100%

7 100%

8 100%

Results: Pass



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Slide 7

Correlation Results (CHD - TJN) 4. QA GATE Results 4.1 QA Gate results (tested at spec limits):

Table below shows the QA Gate results Qual in new Test site TJN.

QA Gate Results

4.2 Analysis Conclusions and Verification

Bin-to-bin activity shows 100% correlation of >1000 good units/ lot at hot, cold and room temperatures between the new

Test site TJN and the current Test site KLM.

The QA Gate correlation passes at the new Test site TJN

Parametric comparison between new Test site TJN and the current KLM passes. The results demonstrate that the new

Test site TJN Final Test Site has qualified as a test site for this product line.

QA Gate Results

Hot 140C Cold -40C Room 25C

Lot # Pass # Fail # Pass # Fail # Pass # Fail

A 100% 0 100% 0 100% 0

B 100% 0 100% 0 100% 0

C 100% 0 100% 0 100% 0

Results: Pass Parametric Comparison:

t-test and f-test should not demonstrate significant difference. P-value should be greater than 0.05.

P-value vreg 3v3 bandgap Wait IDD vreg_3v3_fpm

Cold Hot Room Cold Hot Room Cold Hot Room

t-test 0.0513 0.3083 0.3114 0.1846 0.9486 0.1769 0.5844 0.9638 0.2817

f-test 0.8946 0.9479 0.5769 0.9183 0.1491 0.7013 0.9666 0.8044 0.5069

Results: Pass



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Slide 8

Correlation Results (CHD - TJN) 5. Burn In Qualification Results 1. Introduction:

This report details the burn-in correlation plan and result of 9S12C32 so that the Freescale Tianjin China (TJNFM) can burn-in the same production line as in the Trio Tech Malaysia (TTM) and KESM Malaysia (KESM) site. These correlation units were first processed at the

TJNFM test site and then processed in TTM, with the ambient burn-in temperature at 125 C. Goldfish Mask set: 1M34C Production Line: G9GSC32A/G9GSC32B/S9GSC32A/ S9GSC32B Package code: 6089/8260

TTM Hardware: Burn-in System : IBE Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC1 Burn-in Program Software: : MBI 6.5.0 Environment Plan : 125C Burn-in Program(s) : ENG-9SC32-ATMC-F6.1 TJNFM Hardware: Burn-in System : IBE Burn-in Pattern Generator : Flash Memory Burn-in Driver : CC1 Burn-in Program Software : MBI 6.5.0 Environment Plan : 125C Burn-in Program(s) : ENG-9SC32-ATMC-F6.1

Conclusion: Same hardware and software environment were used in both TTM and TJNFM.



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Slide 9

Correlation Results (CHD - TJN) 5. Burn In Qualification Results

Correlation Lot Information:

BI&FTSite Final Test Lot # Device Part ID Mask/Rev Wafer lot Package Descr. Start Qty

TJN YZME0041R500 MC9S12GC32MFAE ATMC (1M34C) DD622701 LQFP 48 7*7*1.4P0.5 1000

TJN YZME0041JP00 MC9S12GC32MPBE ATMC (1M34C) DD589661 LQFP 52 10*10*1.4P0.65 1000

TJN YZME0041JN00 MC9S12GC32MPBE ATMC (1M34C) DD624751 LQFP 52 10*10*1.4P0.65 1000

TTM YZME0041R501 MC9S12GC32MFAE ATMC (1M34C) DD622701 LQFP 48 7*7*1.4P0.5 1000

TTM YZME0041JP01 MC9S12GC32MPBE ATMC (1M34C) DD589661 LQFP 52 10*10*1.4P0.65 1000

TTM YZME0041JN01 MC9S12GC32MPBE ATMC (1M34C) DD624751 LQFP 52 10*10*1.4P0.65 803

2. Engineering Qualification Plan:

2.1. Requirements:

The requirements and acceptance criteria were based off of agreements between MCD Reliability and MCD Product Engineering. If a specification exists for this transfer/change, then the specification overrides these requirements.

Name Detail Description

Req’d per Correlation Plan Acceptance Criteria Comment

(Y / N?)

Pattern Verify

Goal: Correlate and verify correct functionality of burn-in patterns, cycling, etc

Y Correct pattern written

to array or other product module(s)

Perform 1 full board units checkout. The checkout result must be correlated with status dump or PBIT result.

Lot quantity: 1 lot for each maskset (1M34C) exclude Goldfish TSMC (2L45J)

Units per lot: Full board (78 pcs) for each maskset

Temperature: 125C

BI Duration: 12hours and 10 minutes

Type of units: good

Site: TTM, TJN

Equipment Release

Goal: Calibration and verification of entire system according to site standard equipment release procedure (May include performing voltage calibration on all drivers including debug station, meet GR&R requirements, etc.)

Y Approval by

manufacturing CAB N/A



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Slide 10


Lot quantity / Units per lot: 0

Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Site: TJN

Package Case Temperature

Goal: Compare temperature at surface of mold compound or on-chip temperature monitor

Y

Less than 15% variation or to be

agreed by PE/TE and R&QA

Thermocouples on five units with full burn-in board running stress pattern. For high power devices, also verify with single part on board to ensure no overheating.

Lot quantity: 1

Units per lot: Full Board

Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TJN

Ambient Temperature

Goal: Compare temperate of air inside chamber

Optional


agreed by PE/TE and R&QA.

One thermocouple. Can be performed along with Package Case Temperature.

Lot quantity: 1

Units per lot: Full Board

Temperature: BI Ta

Type of units: good

BI Duration: N/A

Site: TJN

Burn-in Board Voltages

Lot quantity / Units per lot: 0

Y Voltage within range of target to be agreed by PE/TE and R&QA

Measure at front & back of empty and full burn-in board.

Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Type of units: good

Site: TJN

Burn-in Board Current

Goal: Compare burn-in board current Y


agreed by PE/TE and R&QA.

Best measured on individual devices. Or measure entire full board current minus empty board current divided by # of devices on full board.



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Slide 11


Three Lot Burn-in Check

Goal: Verify that burn-in system does not cause abnormal non-burn-in failures

Y Address

manufacturability / over-stress issues.

Run through standard test flow.

Lot quantity: 3 lots for each maskset(1M34C) exclude Goldfish TSMC (2L45J)

Units per lot: 1000

Temperature: BI Ta

BI Duration: Typical BI Duration

Type of units: good

Site: TJN

Burn-in Yield

Goal: Verify that burn-in system does not cause unusually low yield

Y Post BI yield within

PDA limit or agreed up by PE/TE and R&QA.

The yield of TJN should be equal or better than TTM.

Lot quantity: 1 lot for each maskset(1M34C) exclude Goldfish TSMC (2L45J)

Units per lot: 1000

Temperature: BI Ta

BI Duration: Typical BI Duration

Type of units: good

Site: TTM, TJN

Visual Inspection

Goal: Check for visual mechanical

Y

Less than 2% variation or agreed upon by PE/TE and

R&QA.

Use the same units from Burn-in Yield check in BI

correlation. Lot quantity:1 lot for each maskset(1M34C) exclude Goldfish TSMC (2L45J)

Units per lot: 500

(the microscope 10x is utilized for manually

inspection)

Temperature: 25C

BI Duration: N/A

Type of units: good

Site: TTM, TJN

Solderability Test

Goal: Check for solderability on the leads

Y As per 12MRM27364A

Lot quantity: 1 lot for each package

Units per lot: 20

Type of units: good

Site: TJN



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Slide 12


3. Correlation/Qualification Results:

3.1. Pattern Verify: Table 1 summarizes the pattern comparison results.

Table 1.

BI site Lot Number Maskset BI Program BIB And Raw Stock Quantity Result

TTM YZME0041R501 ATMC (1M34C) ENG-9SC32-ATMC-F6.1 1 Full Board with 78pcs raw stock Pass

TJN YZME0041R500 ATMC (1M34C) ENG-9SC32-ATMC-F6.1 1 Full Board with 78pcs raw stock Pass

Conclusion: Passed requirement.

3.2. Equipment Release: (TJNFM equipment Buy-off and release stuff)

3.3. Burn-in Board Voltage Measurements: Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.

Table 2. Burn-in Board Voltage Measurements at 125C

BIB Condition BIB Location Target (V) TJNFM (V) Delta from Target (V)

Empty VDUT1(V1) 6 6.03 0.03

VDUT2(V2) 0 0 0

Full VDUT1(V1) 6 5.98 -0.02

VDUT2(V2) 0 0 0




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Slide 13


3.1. Package Case Temperature: Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one socket at the center of the burn-in board (see Figure 2). The thermocouples were epoxied to the top of the device.

Figure 1. Location of Thermocouples

Table 3. Case Temperatures

Thermocouple # Thermocouple Location

Target (C) TJNFM (C) % Delta

1 Upper Left Corner 125 126 0%

2 Lower Left Corner 125 126 0.8%

3 Center of BIB 125 125 0%

4 Lower Right Corner 125 125 0%

5 Upper Right Corner 125 125 0%


1 1

5 2

3 Feedthrough Connector (Driver-side)

6



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Slide 14


3.1. Ambient Temperature: Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.

Table 4. Chamber Air Temperature

Thermocouple # Thermocouple Location TJNFM (C) TTM (C) Delta (%)

6 Open Area in Chamber 28 28 0


3.2. Burn-in Board Current: Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.

Table 5. Burn-in Board Current

BI Program # Units on

BIB Time Phase

TTM (mA)

TJNFM (mA)

% Delta

ENG-9SC32-ATMC-F6.1

78

Burn In start 300 300 0.00%

Hour1 650 700 7.69%

Hour2 900 900 0.00%

Hour3 3450 3450 0.00%

Hour4 3450 3450 0.00%

Hour5 3450 3450 0.00%

Hour6 3450 3450 0.00%

Hour7 3450 3450 0.00%

Hour8 3450 3450 0.00%

Hour9 3450 3450 0.00%

Hour10 3450 3450 0.00%

Hour11 3400 3450 1.47%

Hour12 450 450 0.00%

Burn In Complete

50 50 0.00%




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Slide 15


3.1. 3-Lot Burn-in Check: Table 6 shows the result of the burn-in check.

Table 6. 3-Lot Burn-in Check

BI Site Lot Number Maskset BI Program Start Qty Result

TJN YZME0041JP00 ATMC (1M34C) ENG-9SC32-ATMC-F6.1 1000 Pass

TJN YZME0041JN00 ATMC (1M34C) ENG-9SC32-ATMC-F6.1 1000 Pass

TJN YZME0041R500 ATMC (1M34C) ENG-9SC32-ATMC-F6.1 1000 Pass


3.2. Burn-in Yield:

Table 7 shows the result of the post burn-in yield.

Table 7. Burn-in Yield

BI Site Final Test Lot # Start Qty BI Yield

TTM YZME0041R501 1000 100%

TJN YZME0041R500 1000 97.90%

Conclusion: Transfer site (TJN) has comparable yield with original site (TTM).

3.9 Visual inspection

Table 8 shows the result of the visual inspection post burn-in.

Table 8.Visual Inspection

BI Site Final Test Lot # Inspection Qty Visual Yield

TTM YZME0041R501 500 100%

TJN YZME0041R500 500 100%

Conclusion: All result showed passed



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Slide 16


3.9 Solderability Test

Table 9 shoes the result of solderability test post burn-in. Note: Test were done using 9S12C128 parts with similar package sizes

Table 9.Solderability Test

BI Site Final Test Lot # Package Test Qty Result

TJN YZME0041R400 LQFP 48 7*7*1.4P0.5 20 Passed

TJN YZME004D8S00 LQFP 52 10*10*1.4P0.65 20 Passed

LQFP 48 sample photos LQFP 52 sample photos

Conclusion: All result showed passed



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17

6. Conclusion and Recommendation

6.1 Conclusion

Based on this report, 1M34C passed all correlation requirements without any issues.

Bin-to-bin activity shows 100% correlation at room/cold/hot temperature between TJN

and the current KLM final test site.

The QA Gate correlation passes at TJN.

Parametric comparison between new site TJN and the current site KLM for 30 good

units per lot passes. The results demonstrate that the new site TJN Final Test Site has

qualified as a test and burn in site for this product.

6.2 Recommendation

Test program for 1M34C, package codes 6089 and 8260 can be released in Freescale

Tianjin Final Test.



TM

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