MIT Lincoln Laboratory

Purchase of Wafer Aligner/Bonder

Andrew Loomis

April 7, 2000

MIT Lincoln Laboratory

Outline

• System objectives

• Alignment options

• Principles of alignment

• Bonder functions

• Available systems

• Summary

MIT Lincoln Laboratory

System Objectives

• Face to face wafer alignment

0.25m alignment accuracy

• Hold alignment and bond

• Robust and void free bond

• Various bonding options

– Anodic

– Silicon Fusion

– Eutectic

– Adhesive

MIT Lincoln Laboratory

Alignment Options

• Bottom Side Alignment (BSA)

• Inter Substrate Alignment (ISA)

• Top Side Alignment (TSA)

• Infrared Alignment (IR)

MIT Lincoln Laboratory

Principles of Alignment

MIT Lincoln Laboratory

Bonder Functions

• Max. bond temperature- 550ºC

• Max. pressure- 1000 lbs

• Anodic bonding- 1200V/ 50ma

• Vacuum- 5 E-3 mbar

MIT Lincoln Laboratory

Available Systems

• Only two companies make wafer align and bond equipment

– Karl Suss

– Electronic Visions Systems

• Both claim +/- 1m accuracy

• Both companies have similar platforms

• Barely satisfactory for existing program

• New system development will be necessary

MIT Lincoln Laboratory

Summary

• Current status

– Visited with both companies

– RFQ being placed

– Lack of market needs for high precision aligner/bonder

– Present systems available will work with relaxed design tolerances

• 3D program will demonstrate the need for advanced systems

• Technology already exists for high precision systems

– Stepper alignment technology

– Interferometric alignment stages and precision air bearing tables