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MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

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MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green. Jeffrey Logsdon John Ly Daniel Henderson Nataly Sumarriva. Project Objectives. Develop team-oriented skills Interpret printed circuit board layout Make ultra-fine solder connections Compile programs and files to run software - PowerPoint PPT Presentation
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MSP430 Group Project MSP430 Group Project ECE 300 ECE 300 Spring 2007 Spring 2007 Dr. Walter Green Dr. Walter Green Jeffrey Logsdon Jeffrey Logsdon John Ly John Ly Daniel Henderson Daniel Henderson Nataly Sumarriva Nataly Sumarriva
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Page 1: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

MSP430 Group ProjectMSP430 Group ProjectECE 300ECE 300

Spring 2007Spring 2007Dr. Walter GreenDr. Walter Green

Jeffrey LogsdonJeffrey LogsdonJohn LyJohn Ly

Daniel HendersonDaniel HendersonNataly SumarrivaNataly Sumarriva

Page 2: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Project ObjectivesProject Objectives

Develop team-oriented skillsDevelop team-oriented skills Interpret printed circuit board layoutInterpret printed circuit board layout Make ultra-fine solder connectionsMake ultra-fine solder connections Compile programs and files to run softwareCompile programs and files to run software Be introduced to C-Spy debugging tool of IAR Be introduced to C-Spy debugging tool of IAR

SoftwareSoftware Flash software to microprocessor boardFlash software to microprocessor board Select and learn the characteristics of sensorsSelect and learn the characteristics of sensors Troubleshoot a circuit boardTroubleshoot a circuit board

Page 3: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Overview of Project StagesOverview of Project Stages Stage 1Stage 1

Soldering practice and familiarity with the circuit components on the Soldering practice and familiarity with the circuit components on the practice circuit boardspractice circuit boards

Stage 2Stage 2 Soldering circuit components and microchip to boardSoldering circuit components and microchip to board

Stage 3Stage 3 Flashing “Hello” message to LCD screen by programming MSP430 chipFlashing “Hello” message to LCD screen by programming MSP430 chip

Stage 4Stage 4 Selecting and studying various sensorsSelecting and studying various sensors

Stage 5Stage 5 Adjusting computer codes to show sensor output on LCD screenAdjusting computer codes to show sensor output on LCD screen

Stage 6Stage 6 Demonstration of sensor and data collectionDemonstration of sensor and data collection

Stage 7Stage 7 Project team presentationProject team presentation

Page 4: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 1 - PracticeStage 1 - Practice

After years of no soldering, the team After years of no soldering, the team members obtained practice soldering members obtained practice soldering components onto the practice circuit board components onto the practice circuit board

Each team member soldered one side of Each team member soldered one side of the microchip to the circuit board, a task the microchip to the circuit board, a task which was tedious but useful which was tedious but useful

Page 5: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 2 – The Real DealStage 2 – The Real Deal

The microchip and the circuit components The microchip and the circuit components were soldered in the following order:were soldered in the following order:Surface-mounted capacitors and resistorsSurface-mounted capacitors and resistorsPush-button switch, voltage regulator, 5 volt Push-button switch, voltage regulator, 5 volt

input plus, slider switchinput plus, slider switchMSP430 microchipMSP430 microchipLCD pinsLCD pinsJTAG ConnectorJTAG Connector

Page 6: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 3 – Flashing “Hello”Stage 3 – Flashing “Hello”

The files lcd.c, lcd.h, delay.c, delay.h, The files lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c. were downloaded from demo.c, sensor.c. were downloaded from the class websitethe class website

New project was created under IAR New project was created under IAR Embedded WorkbenchEmbedded Workbench

Flashed “Hello” and “88880888” by Flashed “Hello” and “88880888” by adjusting code in the demo fileadjusting code in the demo file

Page 7: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 4 – Sensors, Sensors, Stage 4 – Sensors, Sensors, EverywhereEverywhere

Various sensors were investigated from Analog Various sensors were investigated from Analog DevicesDevices AD 590 – Temperature SensorAD 590 – Temperature Sensor AD 22103 – Temperature SensorAD 22103 – Temperature Sensor TMP04F5 – Temperature SensorTMP04F5 – Temperature Sensor AD 22151G – Magnetic Field Strength SensorAD 22151G – Magnetic Field Strength Sensor

Ultimately, the AD 590 and AD 22103 were Ultimately, the AD 590 and AD 22103 were selected to allow for most efficient temperature selected to allow for most efficient temperature output, considering the necessary components output, considering the necessary components and the accuracy of the sensorand the accuracy of the sensor

Page 8: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Spotlight on…the AD22103KSpotlight on…the AD22103K FeaturesFeatures

3.3 voltage input from circuit board 3.3 voltage input from circuit board itselfitself

0 to 100º C temperature span0 to 100º C temperature span Minimal self-heatingMinimal self-heating Cost-effective: uses the same Cost-effective: uses the same

voltage that the analog-to-digital voltage that the analog-to-digital converter uses as a reference, converter uses as a reference, eliminating the need for a eliminating the need for a precision referenceprecision reference

Requires no calibrationRequires no calibration Less expensive than the AD590 Less expensive than the AD590

and no need for extra reference or and no need for extra reference or calibration componentscalibration components

By using voltage output instead of By using voltage output instead of current output, there is a current output, there is a minimization of leakage errors, minimization of leakage errors, such as those caused by such as those caused by condensation at low temperaturescondensation at low temperatures

Page 9: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

AD22103K’s Theory of OperationAD22103K’s Theory of Operation

Output voltage is proportional Output voltage is proportional to power supply voltageto power supply voltage

Sensor contains temperature-Sensor contains temperature-dependent resistor, Rdependent resistor, RTT, whose , whose resistance changes linearly resistance changes linearly with temperaturewith temperature

Op amp in sensor takes the Op amp in sensor takes the voltage across Rvoltage across RTT and applies and applies appropriate gain and offset to appropriate gain and offset to achieve the output voltage achieve the output voltage functionfunction

At the nominal supply voltage At the nominal supply voltage of 3.3 V, the output voltage is of 3.3 V, the output voltage is 0.25 V at 0º C and 3.05 V at 0.25 V at 0º C and 3.05 V at 100º C100º C

Page 10: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Connecting the AD22103K to Connecting the AD22103K to Circuit BoardCircuit Board

Pin 1 - Voltage Input Connection to voltage

output terminal on circuit board

Pin 2 - Voltage Output Connection to input

terminal on board

Pin 3 - Ground

Page 11: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Spotlight on…the AD590JHSpotlight on…the AD590JH FeaturesFeatures

Produces output current Produces output current proportional to temperature: 1 proportional to temperature: 1 microAmp per KelvinmicroAmp per Kelvin

-55º C to 150º C temperature -55º C to 150º C temperature rangerange

Wide power supply range: 4V to Wide power supply range: 4V to 30V30V

Electrically durable – withstands a Electrically durable – withstands a voltage as high as 44V and a voltage as high as 44V and a reverse voltage of 20V, so pin reverse voltage of 20V, so pin reversal does not damage sensorreversal does not damage sensor

High output impedance (over High output impedance (over 10MOhms) allows for minimum 10MOhms) allows for minimum changes in output current despite changes in output current despite large changes in input voltagelarge changes in input voltage

Low costLow cost

Page 12: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 5 – Sensor OuputStage 5 – Sensor Ouput

Previously-made codes Previously-made codes were obtained from class were obtained from class file file

These new files were These new files were integrated into the circuit integrated into the circuit board with the IAR board with the IAR Embedded Workbench Embedded Workbench and the C-Spy Debuggerand the C-Spy Debugger

Many trials were needed Many trials were needed to obtain the correct to obtain the correct sensor outputsensor output

Page 13: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 6 – Demonstration and DataStage 6 – Demonstration and Data

Completed Circuit Board

Page 14: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 6 – Demonstration and DataStage 6 – Demonstration and Data

Our breadboard with sensors Their breadboard with sensors

Page 15: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 6 – Demonstration and DataStage 6 – Demonstration and Data Data of Temperature Rising 75 Data of Temperature Rising 75

to 90º Fto 90º F Theoretically, the time and Theoretically, the time and

temperature relationship temperature relationship should be linear and equal for should be linear and equal for both sensors. Since the both sensors. Since the AD22103 reaches 90 degrees AD22103 reaches 90 degrees faster, this may indicate either faster, this may indicate either less accuracy or greater less accuracy or greater efficiency of the sensor. Thus, efficiency of the sensor. Thus, the 590JH may be a more the 590JH may be a more accurate yet less efficient accurate yet less efficient sensorsensor

Less efficiency at the Less efficiency at the temperature extremestemperature extremes

Sensor 22103K Temperature Rising

74

76

78

80

82

84

86

88

90

92

0 5 10 15 20 25

Time (sec)

Tem

per

ature

(F)

Sensor 590JH Temperature Rising

70

75

80

85

90

0 5 10 15 20 25 30 35 40

Time (sec)

Tem

per

ature

(F)

Page 16: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 6 – Demonstration and DataStage 6 – Demonstration and Data

Data of temperature Data of temperature falling from 90 to 75º Cfalling from 90 to 75º C

For decreasing For decreasing temperature, the 590JH temperature, the 590JH sensor demonstrates a sensor demonstrates a more linear relationship more linear relationship between time and between time and temperature, again temperature, again demonstrating the slightly demonstrating the slightly finer quality than the finer quality than the 22103K 22103K

Sensor 22103K Temperature Falling

74

76

78

80

82

84

86

88

90

0 5 10 15 20 25 30 35 40

Time (sec)

Tem

per

ature

(F)

Sensor 590JH Temperature Falling

74

76

78

80

82

84

86

88

90

92

0 10 20 30 40 50

Time (sec)

Tem

per

ature

(F)

Page 17: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 7 – The Fruits of Hard WorkStage 7 – The Fruits of Hard Work

A Happy Dr. GreenA Happy Dr. Green

Page 18: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 7 – The Fruits of Hard WorkStage 7 – The Fruits of Hard Work

An Enlightened Group of StudentsAn Enlightened Group of Students

Page 19: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Stage 7 – The Fruits of Hard WorkStage 7 – The Fruits of Hard Work

Reduced risk of future injury from circuit Reduced risk of future injury from circuit boards and electrical devicesboards and electrical devices

Page 20: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

ConclusionConclusion

This project allowed the team members to This project allowed the team members to learn to work together, to become familiar learn to work together, to become familiar with basic circuit board design, and to with basic circuit board design, and to combine various aspects of previous combine various aspects of previous engineering education to output a real engineering education to output a real productproduct

Page 21: MSP430 Group Project ECE 300 Spring 2007 Dr. Walter Green

Thank youThank you

Are there any questions?Are there any questions?


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