More Precision
Sensors & ApplicationsSemiconductor Industry
Measurement tasks in the semiconductor industry place high demands on the sensors used. Micro-Epsilon offers a wide product range containing high precision displacement sensors to address the needs of wafer processing for the chip industry and production of displays.
Micro-Epsilon sensors come into play where high accelerations, strong magne-tic fields and ultra-high vacuums prevail, e.g. in wafer production, metallizing processes, lithography and packaging.
confocalDT 2471 HSConfocal chromatic sensors for wafer inspection
Nano precision distance measurement and one-sided thickness measurement of transparent materials
Passive sensors with measuring ranges up to 30 mm, vacuum-suitable models available
High lateral resolution from 3 µm
Worldwide fastest controller for monitoring of dynamic processes
optoNCDTCompact laser triangulation displacement sensor for high speed, precision measurements
Measuring displacement and distance without contact (measuring ranges from 2 mm to 500 mm)
Models with red / blue laser
High measuring rates for dynamic measurements
Compact design with integrated controller
Miniature measurement spot detects smallest objects
capaNCDT 6230Capacitive multi-channel measuring system for machine position monitoring
Measuring displacement and distance without contact (measuring ranges from 0.05 mm to 10 mm)
Nanometer resolution
Modular design for up to 4 channels
Sensor models and accessories for vacuum / UHV
Ideal for long-term stable measurements
confocalDT �Confocal sensors for measuring displacement and thickness � Suitable for all surfaces: mat, reflective and rapidly changing surfaces �High repeatability � Fastest controller in the world, ideal for dynamic measurement tasks
Inline quality control
Transparent layers & adhesive beadingConfocal chromatic sensors are used for one-sided layer thickness measurements. Multi-peak measurement enables even the finest of layers to be measured reliably.
Wafer measurements using confocal chromatic sensors
Sawing marksAnother crucial task is to detect and measure sawing marks. Since confocal chromatic sensors tolerate a large tilt angle and offer an extremely small light spot, they reliably detect indentations on the wafer.
Cracks and breakageConfocal chromatic sensors from Micro-Epsilon are used to detect cracks and other defects on the wafer.
Bumps on silicon wafersConfocal chromatic sensors from Micro-Epsilon in spect bump dimensions at extremely high resolution.
Bow and warpConfocal chromatic sensors scan the wafer surface to detect bow, warp and distortion.
Wafer thickness / TTVConfocal chromatic sensors measure the thickness deviation (Total Thickness Variation) and the wafer thickness from both sides.
World leading sensor range
� Vacuum suitability �Detection of finest structures with a lateral resolution from 3 µm �Compact sensors, designs with 90° beam path �High numerical aperture (NA) ensures highest precision �Measuring distance, displacement and roughness
capaNCDT � Capacitive multi-channel measuring system for machine position monitoring � Non-contact displacement and distance measurement with measuring ranges from 0.05 mm to 10 mm �Nanometer resolution �High bandwidth for dynamic measurements � Ideal for long-term stable measurements
eddyNCDT � High-performance inductive displacement measuring system � Non-contact displacement and distance measurements with measuring ranges from 0.4 mm to 80 mm � Nanometer resolution �High frequency response for dynamic measurement tasks �Customer-specific sensor designs
Position monitoring in the stage
Positioning the lens system in lithography machinesHighly dynamic, inductive displacement sensors (eddy current) measure the position of lens elements in order to achieve the highest possible imaging accuracy.
Sensor: eddyNCDT
Mask positioning in lithography applicationsLithography processes require high resolution and long-term stable measurement of machine movements in order to achieve maximum precision. Capacitive displacement sensors monitor this highly accurate mask positioning process.
Sensor: capaNCDT
Positioning the wafer stageNon-contact sensors from Micro-Epsilon are used for position monitoring in the wafer stage where they measure highly dynamic XYZ movements. Capacitive and inductive (eddy current) sensors achieve nanometer resolution.
Sensors: capaNCDT / eddyNCDT
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Sensors and Systems from Micro-Epsilon
Sensors and systems for displacement, distance and position
Sensors and measurement devices fornon-contact temperature measurement
Measuring and inspection systems for metal strips, plastics and rubber
Optical micrometers and fiber optics,measuring and test amplifiers
Color recognition sensors, LED analyzers and inline color spectrometers
3D measurement technology for dimensional testing and surface inspection
More PrecisionWhether it is for quality assurance, predictive maintenance, process and machine monitoring, automation or R&D – sensors from Micro-Epsilon make a vital contribution to the improvement of products and processes. High precision sensors and measuring systems solve measurement tasks in all core industries – from machine building to automated production lines and integrated OEM solutions.