Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com

AmericasPhone +1 610 825 6050 electronics.americas@heraeus.com

Asia PacificPhone +65 6571 7677 electronics.apac@heraeus.com

ChinaPhone +86 21 3357 5457 electronics.china@heraeus.com

Europe, Middle East and Africa Phone +49 6181 35 3069

+49 6181 35 3627 electronics.emea@heraeus.com

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.

The

data

giv

en h

ere

is v

alid

. We

rese

rve

the

right

to m

ake

tech

nica

l alte

ratio

ns.

Prin

ted

in T

aiwa

n, L

ayou

t: D&

B, F

rank

furt_

HET2

3001

-051

6-1

Heraeus mAgic Sinter Paste for High Power Density Devices

Heraeus

HET

107.86

Microbond Silver Interconnect

ic47

Say Goodbye to conventional Power Electronics

A family of high achievers

mAgic Sinter Paste products provide max. operation temperatures up to 250°C and do not leave residues. mAgic Sinter Paste are lead free and RoHS conform.

Reliability Performance:mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition in the industry. (e.g. QFN, SOT, QFP, D2PAK, Power QFN, SOIC, PSO, TO…)

For Power Packages, the requirement of higher thermal performance is a challenge using current conductivity adhesive. Heraeus mAgic sinter paste has shown outstanding thermal performance proven by customers:

Heat dissipation performance (ASP295 proven > 50°C lower than adhesive on PA/GaAs package)Good solution to delamination issue

mAgic Silver Sintering – enhancing power packages performance

In Power Package, current solder & adhesive materials technology comes with several limitations and drawbacks in terms of material properties and processability. To overcome this limitations a new interconnect materials are required.

mAgic Sinter Paste, a Pb free materials with outstanding performance to increase device lifetime, enable an increase

in power density and allow elevated operation temperature.

✓ High lifetime & reliability✓ High thermal conductivity✓ High electrical conductivity✓ High operation temperature (up to 250°C) ✓ Lead-free (meets RoHS regulations)✓ No fl ux residues or solder splattering

Materials Properties Comparison:

PlatzhalterPackshots

SeriesmAgic Paste

ASP295 Series Conductive Adhesive

Solder Paste(Pb90Sn10)

Process Temperature (°C) 200 ~ 250 120 ~ 175 ~ 340

Ag Content (%) 100 (after sintering) 75 ~ 85 –

Electrical Resistivity (mΩ·cm) ≤ 0.008 ≤ 0.1 0.02

Thermal Conductivity (W/m·K) ≥ 100 ~ 3 – 10 46

CTE [ppm/K] (below/above Tg) 19 40 / 160 ~ 30

E-Modulus @25°C (Gpa) ~ 25 1 ~ 4 ~ 15

Shear Strength (N/mm2) ≥ 10 > 8 ~ 40

Residue free Yes Yes No

Pb-free Yes Yes No

Reliability tests Condition Results

MSL-1(Moisture Sensitivity Level-1)

168 hrs of 85°C / 85 % RH and 3x refl ow 260°C ✓ Passed

MSL-3(Moisture Sensitivity Level-3)

192 hrs of 30°C / 60 % RH and 3x refl ow 260°C ✓ Passed

TCT (Temperature Cycle Test)

-55°C – 150°C (air to air)H

-65°C – 150°C (air to air)C ✓ Passed

PCT (Pressure Cooker Test)

121°C, 100 % RH, 2atm ✓ Passed

HTST

(High Temperature Storage Test)150°C, 1000 hrs ✓ Passed

Un-Baised HAST 130°C / 85 %, 96 hrs ✓ Passed

348-002214 • Kunde: Heraeus Materials Technology • mAgic 4 Seiter Innenseiten • Farben: 4c (Euroskala) • Format: B 210 mm x H 280 mm (+ 3 mm Beschnitt)

mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition PAK, Power QFN, SOIC, PSO, TO…)

PlatzhalterPackshots

Chip

mAgic Sinter Paste

Lead Frame

X-section after MSl-1 & x3000TCT

1701601501401301201101009080706050

°C

> 50°C

Tc ComparisonASP295 vs. Adhesive

ASP295 (mAgic Sinter Paste)Conductivity Adhesive

A family of high achievers

mAgic Sinter Paste ASP295-Series with special material formulation improve thermal performance compared to solder & adhesive and meet existing production equipments as a drop in solution.

Suitable for non-pressure process Suitable for Conventional Dispensing & Die Placement Equipment/ProcessSuitable for Programmable Convection oven

A family of high achievers

mAgic Sinter Paste products provide max. operation temperatures up to 250°C and do not leave residues. mAgic Sinter Paste are lead free and RoHS conform.

Reliability Performance:mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition in the industry. (e.g. QFN, SOT, QFP, D2PAK, Power QFN, SOIC, PSO, TO…)

For Power Packages, the requirement of higher thermal performance is a challenge using current conductivity adhesive. Heraeus mAgic sinter paste has shown outstanding thermal performance proven by customers:

Heat dissipation performance (ASP295 proven > 50°C lower than adhesive on PA/GaAs package)Good solution to delamination issue

mAgic Silver Sintering – enhancing power packages performance

In Power Package, current solder & adhesive materials technology comes with several limitations and drawbacks in terms of material properties and processability. To overcome this limitations a new interconnect materials are required.

mAgic Sinter Paste, a Pb free materials with outstanding performance to increase device lifetime, enable an increase

in power density and allow elevated operation temperature.

✓ High lifetime & reliability✓ High thermal conductivity✓ High electrical conductivity✓ High operation temperature (up to 250°C) ✓ Lead-free (meets RoHS regulations)✓ No fl ux residues or solder splattering

Materials Properties Comparison:

PlatzhalterPackshots

SeriesmAgic Paste

ASP295 Series Conductive Adhesive

Solder Paste(Pb90Sn10)

Process Temperature (°C) 200 ~ 250 120 ~ 175 ~ 340

Ag Content (%) 100 (after sintering) 75 ~ 85 –

Electrical Resistivity (mΩ·cm) ≤ 0.008 ≤ 0.1 0.02

Thermal Conductivity (W/m·K) ≥ 100 ~ 3 – 10 46

CTE [ppm/K] (below/above Tg) 19 40 / 160 ~ 30

E-Modulus @25°C (Gpa) ~ 25 1 ~ 4 ~ 15

Shear Strength (N/mm2) ≥ 10 > 8 ~ 40

Residue free Yes Yes No

Pb-free Yes Yes No

Reliability tests Condition Results

MSL-1(Moisture Sensitivity Level-1)

168 hrs of 85°C / 85 % RH and 3x refl ow 260°C ✓ Passed

MSL-3(Moisture Sensitivity Level-3)

192 hrs of 30°C / 60 % RH and 3x refl ow 260°C ✓ Passed

TCT (Temperature Cycle Test)

-55°C – 150°C (air to air)H

-65°C – 150°C (air to air)C ✓ Passed

PCT (Pressure Cooker Test)

121°C, 100 % RH, 2atm ✓ Passed

HTST

(High Temperature Storage Test)150°C, 1000 hrs ✓ Passed

Un-Baised HAST 130°C / 85 %, 96 hrs ✓ Passed

348-002214 • Kunde: Heraeus Materials Technology • mAgic 4 Seiter Innenseiten • Farben: 4c (Euroskala) • Format: B 210 mm x H 280 mm (+ 3 mm Beschnitt)

mAgic Sinter Paste ASP295-Series are qualifi ed on many Lead-Frame package type with tough reliability test condition PAK, Power QFN, SOIC, PSO, TO…)

PlatzhalterPackshots

Chip

mAgic Sinter Paste

Lead Frame

X-section after MSl-1 & x3000TCT

1701601501401301201101009080706050

°C

> 50°C

Tc ComparisonASP295 vs. Adhesive

ASP295 (mAgic Sinter Paste)Conductivity Adhesive

A family of high achievers

mAgic Sinter Paste ASP295-Series with special material formulation improve thermal performance compared to solder & adhesive and meet existing production equipments as a drop in solution.

Suitable for non-pressure process Suitable for Conventional Dispensing & Die Placement Equipment/ProcessSuitable for Programmable Convection oven

Heraeus ElectronicsHeraeus Deutschland GmbH & Co. KG Heraeusstraße 12-1463450 Hanau, Germanywww.heraeus-electronics.com

AmericasPhone +1 610 825 6050 electronics.americas@heraeus.com

Asia PacificPhone +65 6571 7677 electronics.apac@heraeus.com

ChinaPhone +86 21 3357 5457 electronics.china@heraeus.com

Europe, Middle East and Africa Phone +49 6181 35 3069

+49 6181 35 3627 electronics.emea@heraeus.com

The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.

The

data

giv

en h

ere

is v

alid

. We

rese

rve

the

right

to m

ake

tech

nica

l alte

ratio

ns.

Prin

ted

in T

aiwa

n, L

ayou

t: D&

B, F

rank

furt_

HET2

3001

-051

6-1

Heraeus mAgic Sinter Paste for High Power Density Devices

Heraeus

HET

107.86

Microbond Silver Interconnect

ic47

Say Goodbye to conventional Power Electronics