Post on 12-Dec-2021
transcript
MSP430™ Hardware Tools
User’s Guide
Literature Number: SLAU278AHMAY 2009 – REVISED MARCH 2021
Read This First...........................................................................................................................................................................7How to Use This Manual.......................................................................................................................................................... 7Information About Cautions and Warnings...............................................................................................................................8Related Documentation From Texas Instruments.................................................................................................................... 8If You Need Assistance............................................................................................................................................................ 9
1 Get Started Now!...................................................................................................................................................................111.1 Kit Contents, MSP-TS430xx............................................................................................................................................ 121.2 Kit Contents, MSP-FET430xx.......................................................................................................................................... 141.3 Kit Contents, MSP-FET....................................................................................................................................................141.4 Kit Contents, MSP-FET430UIF........................................................................................................................................ 141.5 Kit Contents, MSP-FET430PIF........................................................................................................................................ 141.6 Kit Contents, eZ430-F2013.............................................................................................................................................. 141.7 Kit Contents, eZ430-T2012.............................................................................................................................................. 141.8 Kit Contents, eZ430-RF2500........................................................................................................................................... 151.9 Kit Contents, eZ430-RF2500T......................................................................................................................................... 151.10 Kit Contents, eZ430-RF2500-SEH.................................................................................................................................151.11 Kit Contents, eZ430-Chronos-xxx.................................................................................................................................. 151.12 Kit Contents, FET430F6137RF900................................................................................................................................161.13 Kit Contents, EM430Fx1x7RF900..................................................................................................................................161.14 Hardware Installation, MSP-FET and MSP-FET430UIF................................................................................................ 161.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900.......................171.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529........................... 171.17 Important MSP430 Documents on the Web...................................................................................................................17
2 Design Considerations for In-Circuit Programming..........................................................................................................192.1 Signal Connections for In-System Programming and Debugging....................................................................................202.2 External Power.................................................................................................................................................................242.3 Bootloader (BSL)..............................................................................................................................................................24
A Frequently Asked Questions and Known Issues..............................................................................................................25A.1 Hardware FAQs............................................................................................................................................................... 26A.2 Known Issues.................................................................................................................................................................. 28
MSP-FET430UIF................................................................................................................................................................ 28MSP-FET430PIF................................................................................................................................................................ 28
B Hardware...............................................................................................................................................................................29B.1 MSP-TS430D8.................................................................................................................................................................31B.2 MSP-TS430PW14........................................................................................................................................................... 34B.3 MSP-TS430L092............................................................................................................................................................. 37B.4 MSP-TS430L092 Active Cable........................................................................................................................................ 40B.5 MSP-TS430PW20........................................................................................................................................................... 43B.6 MSP-TS430RHL20.......................................................................................................................................................... 48B.7 MSP-TS430PW24........................................................................................................................................................... 51B.8 MSP-TS430RGE24A....................................................................................................................................................... 54B.9 MSP-TS430DW28........................................................................................................................................................... 57B.10 MSP-TS430PW28......................................................................................................................................................... 60B.11 MSP-TS430PW28A....................................................................................................................................................... 63B.12 MSP-TS430RHB32A..................................................................................................................................................... 66B.13 MSP-TS430DA38.......................................................................................................................................................... 69B.14 MSP-TS430QFN23x0....................................................................................................................................................72B.15 MSP-TS430RSB40........................................................................................................................................................75B.16 MSP-TS430RHA40A..................................................................................................................................................... 78B.17 MSP-TS430DL48...........................................................................................................................................................81
Table of Contents
www.ti.com Table of Contents
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 3
Copyright © 2021 Texas Instruments Incorporated
B.18 MSP-TS430PT48...........................................................................................................................................................84B.19 MSP-TS430PT48A........................................................................................................................................................ 88B.20 MSP-TS430RGZ48B..................................................................................................................................................... 92B.21 MSP-TS430RGZ48C..................................................................................................................................................... 95B.22 MSP-TS430PM64..........................................................................................................................................................98B.23 MSP-TS430PM64A..................................................................................................................................................... 101B.24 MSP-TS430PM64D..................................................................................................................................................... 104B.25 MSP-TS430PM64F......................................................................................................................................................107B.26 MSP-TS430RGC64B................................................................................................................................................... 110B.27 MSP-TS430RGC64C...................................................................................................................................................113B.28 MSP-TS430RGC64USB.............................................................................................................................................. 117B.29 MSP-TS430PN80........................................................................................................................................................ 122B.30 MSP-TS430PN80A......................................................................................................................................................125B.31 MSP-TS430PN80B......................................................................................................................................................128B.32 MSP-TS430PN80C......................................................................................................................................................131B.33 MSP-TS430PN80USB.................................................................................................................................................135B.34 MSP-TS430PZ100.......................................................................................................................................................140B.35 MSP-TS430PZ100A.................................................................................................................................................... 143B.36 MSP-TS430PZ100B.................................................................................................................................................... 146B.37 MSP-TS430PZ100C.................................................................................................................................................... 149B.38 MSP-TS430PZ100D.................................................................................................................................................... 152B.39 MSP-TS430PZ100E.................................................................................................................................................... 156B.40 MSP-TS430PZ5x100...................................................................................................................................................160B.41 MSP-TS430PZ100USB............................................................................................................................................... 163B.42 MSP-TS430PZ100AUSB.............................................................................................................................................168B.43 MSP-TS430PEU128....................................................................................................................................................173B.44 EM430F5137RF900.................................................................................................................................................... 176B.45 EM430F6137RF900.................................................................................................................................................... 180B.46 EM430F6147RF900.................................................................................................................................................... 184
C Hardware Installation Guide..............................................................................................................................................189Revision History.................................................................................................................................................................... 190
List of FiguresFigure 2-1. Signal Connections for 4-Wire JTAG Communication.............................................................................................21Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx,
and MSP430F4xx Devices.....................................................................................................................................................22Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable
Devices That are Not Part of F2xx, G2xx, F4xx Families...................................................................................................... 23Figure B-1. MSP-TS430D8 Target Socket Module, Schematic................................................................................................. 31Figure B-2. MSP-TS430D8 Target Socket Module, PCB...........................................................................................................32Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic............................................................................................ 34Figure B-4. MSP-TS430PW14 Target Socket Module, PCB..................................................................................................... 35Figure B-5. MSP-TS430L092 Target Socket Module, Schematic..............................................................................................37Figure B-6. MSP-TS430L092 Target Socket Module, PCB....................................................................................................... 38Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.........................................................................40Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB.................................................................................. 41Figure B-9. UART BSL Signal Select.........................................................................................................................................43Figure B-10. MSP-TS430PW20 Target Socket Module, Schematic.......................................................................................... 44Figure B-11. MSP-TS430PW20 Target Socket Module, PCB....................................................................................................45Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic.........................................................................................48Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB.................................................................................................. 49Figure B-14. MSP-TS430PW24 Target Socket Module, Schematic.......................................................................................... 51Figure B-15. MSP-TS430PW24 Target Socket Module, PCB................................................................................................... 52Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic......................................................................................54Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB............................................................................................... 55Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic..........................................................................................57Figure B-19. MSP-TS430DW28 Target Socket Module, PCB................................................................................................... 58Figure B-20. MSP-TS430PW28 Target Socket Module, Schematic.......................................................................................... 60Figure B-21. MSP-TS430PW28 Target Socket Module, PCB................................................................................................... 61Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic........................................................................................63Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)....................................................................................... 64
Table of Contents www.ti.com
4 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Figure B-24. MSP-TS430RHB32A Target Socket Module, Schematic......................................................................................66Figure B-25. MSP-TS430RHB32A Target Socket Module, PCB............................................................................................... 67Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic...........................................................................................69Figure B-27. MSP-TS430DA38 Target Socket Module, PCB.................................................................................................... 70Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic.................................................................................... 72Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB..............................................................................................73Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic........................................................................................ 75Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB..................................................................................................76Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic......................................................................................78Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB............................................................................................... 79Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic........................................................................................... 81Figure B-35. MSP-TS430DL48 Target Socket Module, PCB.....................................................................................................82Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic........................................................................................... 84Figure B-37. MSP-TS430PT48 Target Socket Module, PCB.....................................................................................................85Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic.........................................................................................88Figure B-39. MSP-TS430PT48A Target Socket Module, PCB.................................................................................................. 89Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic......................................................................................92Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB............................................................................................... 93Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic......................................................................................95Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB............................................................................................... 96Figure B-45. MSP-TS430PM64 Target Socket Module, PCB....................................................................................................99Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic...................................................................................... 101Figure B-47. MSP-TS430PM64A Target Socket Module, PCB............................................................................................... 102Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic......................................................................................104Figure B-49. MSP-TS430PM64D Target Socket Module, PCB............................................................................................... 105Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic...................................................................................... 107Figure B-51. MSP-TS430PM64F Target Socket Module, PCB................................................................................................108Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic....................................................................................110Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB............................................................................................. 111Figure B-54. MSP-TS430RGC64C Target Socket Module, Schematic....................................................................................114Figure B-55. MSP-TS430RGC64C Target Socket Module, PCB.............................................................................................115Figure B-56. MSP-TS430RGC64USB Target Socket Module, Schematic...............................................................................118Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB........................................................................................ 119Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic.........................................................................................122Figure B-59. MSP-TS430PN80 Target Socket Module, PCB.................................................................................................. 123Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic...................................................................................... 125Figure B-61. MSP-TS430PN80A Target Socket Module, PCB................................................................................................126Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic...................................................................................... 128Figure B-63. MSP-TS430PN80B Target Socket Module, PCB................................................................................................129Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic...................................................................................... 131Figure B-65. MSP-TS430PN80C Target Socket Module, PCB................................................................................................132Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic................................................................................. 136Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB...........................................................................................137Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic....................................................................................... 140Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB.................................................................................................141Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic.....................................................................................143Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB.............................................................................................. 144Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic.....................................................................................146Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB.............................................................................................. 147Figure B-74. MSP-TS430PZ100C Target Socket Module, Schematic.....................................................................................149Figure B-75. MSP-TS430PZ100C Target Socket Module, PCB.............................................................................................. 150Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic.....................................................................................152Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB.............................................................................................. 153Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic.....................................................................................156Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB.............................................................................................. 157Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic................................................................................... 160Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB.............................................................................................161Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic................................................................................164Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB......................................................................................... 165Figure B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic............................................................................. 169Figure B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB.......................................................................................170
www.ti.com Table of Contents
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 5
Copyright © 2021 Texas Instruments Incorporated
Figure B-86. MSP-TS430PEU128 Target Socket Module, Schematic.................................................................................... 173Figure B-87. MSP-TS430PEU128 Target Socket Module, PCB..............................................................................................174Figure B-88. EM430F5137RF900 Target Board, Schematic................................................................................................... 176Figure B-89. EM430F5137RF900 Target board, PCB............................................................................................................. 177Figure B-90. EM430F6137RF900 Target Board, Schematic................................................................................................... 180Figure B-91. EM430F6137RF900 Target Board, PCB.............................................................................................................181Figure B-92. EM430F6147RF900 Target Board, Schematic................................................................................................... 184Figure B-93. EM430F6147RF900 Target Board, PCB.............................................................................................................185
List of TablesTable 1-1. Individual Kit Contents, MSP-TS430xx..................................................................................................................... 12Table B-1. MSP-TS430D8 Bill of Materials................................................................................................................................ 33Table B-2. MSP-TS430PW14 Bill of Materials...........................................................................................................................36Table B-3. MSP-TS430L092 Bill of Materials.............................................................................................................................39Table B-4. MSP-TS430L092 JP1 Settings.................................................................................................................................41Table B-5. MSP-TS430L092 Active Cable Bill of Materials....................................................................................................... 42Table B-6. MSP-TS430PW20 Bill of Materials...........................................................................................................................46Table B-7. MSP-TS430RHL20 Bill of Materials......................................................................................................................... 50Table B-8. MSP-TS430PW24 Bill of Materials...........................................................................................................................53Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)...........................................................................................................56Table B-10. MSP-TS430DW28 Bill of Materials.........................................................................................................................59Table B-11. MSP-TS430PW28 Bill of Materials......................................................................................................................... 62Table B-12. MSP-TS430PW28A Bill of Materials...................................................................................................................... 65Table B-13. MSP-TS430RHB32A Bill of Materials.....................................................................................................................68Table B-14. MSP-TS430DA38 Bill of Materials..........................................................................................................................71Table B-15. MSP-TS430QFN23x0 Bill of Materials................................................................................................................... 74Table B-16. MSP-TS430RSB40 Bill of Materials....................................................................................................................... 77Table B-17. MSP-TS430RHA40A Bill of Materials.....................................................................................................................80Table B-18. MSP-TS430DL48 Bill of Materials.......................................................................................................................... 83Table B-19. MSP-TS430PT48 Bill of Materials.......................................................................................................................... 86Table B-20. MSP-TS430PT48A Bill of Materials........................................................................................................................90Table B-21. MSP-TS430RGZ48B Bill of Materials.....................................................................................................................94Table B-22. MSP-TS430RGZ48C Bill of Materials.................................................................................................................... 97Table B-23. MSP-TS430PM64 Bill of Materials....................................................................................................................... 100Table B-24. MSP-TS430PM64A Bill of Materials.....................................................................................................................103Table B-25. MSP-TS430PM64D Bill of Materials.....................................................................................................................106Table B-26. MSP-TS430PM64F Bill of Materials (BOM)......................................................................................................... 109Table B-27. MSP-TS430RGC64B Bill of Materials...................................................................................................................112Table B-28. MSP-TS430RGC64C Bill of Materials.................................................................................................................. 116Table B-29. MSP-TS430RGC64USB Bill of Materials............................................................................................................. 120Table B-30. MSP-TS430PN80 Bill of Materials........................................................................................................................124Table B-31. MSP-TS430PN80A Bill of Materials..................................................................................................................... 127Table B-32. MSP-TS430PN80B Bill of Materials..................................................................................................................... 130Table B-33. MSP-TS430PN80C Bill of Materials..................................................................................................................... 133Table B-34. MSP-TS430PN80USB Bill of Materials................................................................................................................ 138Table B-35. MSP-TS430PZ100 Bill of Materials...................................................................................................................... 142Table B-36. MSP-TS430PZ100A Bill of Materials....................................................................................................................145Table B-37. MSP-TS430PZ100B Bill of Materials....................................................................................................................148Table B-38. MSP-TS430PZ100C Bill of Materials................................................................................................................... 151Table B-39. MSP-TS430PZ100D Bill of Materials................................................................................................................... 154Table B-40. MSP-TS430PZ100E Bill of Materials....................................................................................................................158Table B-41. MSP-TS430PZ5x100 Bill of Materials.................................................................................................................. 162Table B-42. MSP-TS430PZ100USB Bill of Materials...............................................................................................................166Table B-43. MSP-TS430PZ100AUSB Bill of Materials............................................................................................................ 171Table B-44. MSP-TS430PEU128 Bill of Materials................................................................................................................... 175Table B-45. EM430F5137RF900 Bill of Materials....................................................................................................................178Table B-46. EM430F6137RF900 Bill of Materials....................................................................................................................182Table B-47. EM430F6147RF900 Bill of Materials....................................................................................................................186
Table of Contents www.ti.com
6 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is theprogram development tool for the MSP430™ ultra-low-power microcontrollers.
How to Use This ManualRead and follow the instructions in Chapter 1. This section lists the contents of the FET and provides instructionson installing the hardware and the software drivers. After you see how quick and easy it is to use thedevelopment tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430microcontrollers or the development software systems. For details of these items, see the appropriate TIdocuments listed in Section 1.17.
This manual applies to the following tools:
• MSP-FET430PIF – debug interface with parallel port connection, for all MSP430 flash-based devices• MSP-FET430UIF – debug interface with USB connection, for all MSP430 flash-based devices• MSP-FET – successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430 devices• eZ430-F2013 – USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx,
MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices• eZ430-T2012 – three MSP430F2012 based target boards• eZ430-RF2500 – USB stick form factor interface with attached MSP430F2274 and CC2500 target, for
all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, andMSP430G2x31 devices
• eZ430-RF2500T – one MSP430F2274 and CC2500 target board including battery pack)• eZ430-RF2500-SEH – USB stick form factor interface with attached MSP430F2274 and CC2500 target and
solar energy harvesting module• eZ430-Chronos-xxx – USB stick form factor interface with CC430F6137 based development system
contained in a watch; includes <1 GHz RF USB access point
Stand-alone target-socket modules without debug interface are named as MSP-TS430TSxx.
Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective targetsocket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain also theUSB debug interface (MSP-FET430UIF):
• FET430F5137RF900 – for CC430F513x devices in 48-pin RGZ packages (green PCB)• FET430F6137RF900 – for CC430F612x and CC430F613x devices in 64-pin RGC packages (green PCB)
These tools contain the most up-to-date materials available at the time of packaging. For the latest materials(data sheets, user's guides, software, application information, and so on), visit the TI MSP430 website or contactyour local TI sales office.
PrefaceRead This First
www.ti.com Read This First
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 7
Copyright © 2021 Texas Instruments Incorporated
Information About Cautions and WarningsThis document may contain cautions and warnings.
CAUTION
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your software or equipment.
WARNING
This is an example of a warning statement.
A warning statement describes a situation that could potentially cause harm to you.
The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.
Related Documentation From Texas InstrumentsMSP430 development tools documentation:
MSP Debuggers User's Guide
Code Composer Studio IDE for MSP430 MCUs User's Guide
Code Composer Studio IDE
IAR Embedded Workbench for MSP430 User's Guide
IAR Embedded Workbench IDE
eZ430-F2013 Development Tool User's Guide
eZ430-RF2480 Demonstration Kit User's Guide
eZ430-RF2500 Development Tool User's Guide
eZ430-RF2500-SEH Development Tool User's Guide
eZ430-Chronos Development Tool User's Guide
Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide
MSP-EXP430F5529 Experimenter Board User's Guide
MSP-EXP430F5438 Experimenter Board User's Guide
MSP-EXP430G2 LaunchPad Development Kit User's Guide
MSP Gang Programmer (MSP-GANG) User's Guide
MSP430 Gang Programmer (MSP-GANG430) User's Guide
MSP430 device user's guides:
MSP430F1xx Family User's Guide
MSP430x2xx Family User's Guide
MSP430x3xx Family User's Guide
MSP430F4xx Family User's Guide
MSP430F5xx and MSP430F6xx Family User's Guide
CC430 Family User's Guide
Read This First www.ti.com
8 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
MSP430FR57xx Family User's Guide
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide
If You Need AssistanceSupport for the MSP430 devices and the FET development tools is provided by the Texas Instruments ProductInformation Center (PIC). Contact information for the PIC can be found on the TI website at www.ti.com/support.The Texas Instruments E2E™ Community support forums for the MSP430 provide open interaction with peerengineers, TI engineers, and other experts. Additional device-specific information can be found on the MSP430website.
TrademarksMSP430™ and E2E™ are trademarks of Texas Instruments.All trademarks are the property of their respective owners.
www.ti.com Read This First
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 9
Copyright © 2021 Texas Instruments Incorporated
Read This First www.ti.com
10 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
This page intentionally left blank.
This chapter lists the contents of the FET and provides instruction on installing the hardware.
1.1 Kit Contents, MSP-TS430xx.......................................................................................................................................121.2 Kit Contents, MSP-FET430xx.....................................................................................................................................141.3 Kit Contents, MSP-FET...............................................................................................................................................141.4 Kit Contents, MSP-FET430UIF...................................................................................................................................141.5 Kit Contents, MSP-FET430PIF...................................................................................................................................141.6 Kit Contents, eZ430-F2013.........................................................................................................................................141.7 Kit Contents, eZ430-T2012.........................................................................................................................................141.8 Kit Contents, eZ430-RF2500...................................................................................................................................... 151.9 Kit Contents, eZ430-RF2500T....................................................................................................................................151.10 Kit Contents, eZ430-RF2500-SEH........................................................................................................................... 151.11 Kit Contents, eZ430-Chronos-xxx........................................................................................................................... 151.12 Kit Contents, FET430F6137RF900.......................................................................................................................... 161.13 Kit Contents, EM430Fx1x7RF900............................................................................................................................161.14 Hardware Installation, MSP-FET and MSP-FET430UIF..........................................................................................161.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900............... 171.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529..................... 171.17 Important MSP430 Documents on the Web........................................................................................................... 17
Chapter 1Get Started Now!
www.ti.com Get Started Now!
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 11
Copyright © 2021 Texas Instruments Incorporated
1.1 Kit Contents, MSP-TS430xx• One READ ME FIRST document• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)• One target socket module• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• MSP430 MCU samples (see Table 1-1 for sample type)
Table 1-1. Individual Kit Contents, MSP-TS430xxPart Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430D8(green PCB)
8-pin D(TSSOP ZIF) MSP430G2210, MSP430G2230 1 x MSP430G2210ID and
1 x MSP430G2230IDTwo PCB 1×4-pin headers(two male and two female)
MSP-TS430PW14(green PCB)
14-pin PW(TSSOP ZIF)
MSP430F20xx, MSP430G2x01,MSP430G2x11, MSP430G2x21,
MSP430G2x312 × MSP430F2013IPW Four PCB 1×7-pin headers
(two male and two female)
MSP-TS430L092(green PCB)
14-pin PW(TSSOP ZIF) MSP430L092 2 × MSP430L092IPW
Four PCB 1×7-pin headers(two male and two female)A "Micro-MaTch" 10-pin femaleconnector is also present on the PCBwhich connects the kit with an 'ActiveCable' PCB. This 'Active Cable' PCBis connected by 14-pin JTAG cablewith the FET430UIF.
MSP-TS430PW20(green PCB)
20-pin PW(TSSOP ZIF)
MSP430FR2311IPW20,MSP430FR2311IPW16
None. Free samples can beordered in the TI Store.
Four PCB 1×12-pin headers(two male and two female)
MSP-TS430RHL20(green PCB)
20-pin RHL(VQFN ZIF)
MSP430FR2522IRHL,MSP430FR2422IRHL
None. Free samples can beordered in the TI Store.
Four PCB 1×10-pin headers(two male and two female)
MSP-TS430PW24(green PCB)
24-pin PW(TSSOP ZIF) MSP430AFE2xx 2 × MSP430AFE253IPW Four PCB 1×12-pin headers
(two male and two female)
MSP-TS430RGE24A(red PCB)
24-pin RGE(QFN ZIF) MSP430FR2433IRGE None. Free samples can be
ordered in the TI Store.Four PCB 1×6-pin headers(two male and two female)
MSP-TS430DW28(green PCB)
28-pin DW(SSOP ZIF)
MSP430F11x1, MSP430F11x2,MSP430F12x, MSP430F12x2,
MSP430F21xxSupports devices in 20- and 28-pin DA
packages
2 × MSP430F123IDW Four PCB 1×12-pin headers(two male and two female)
MSP-TS430PW28(green PCB)
28-pin PW(TSSOP ZIF)
MSP430F11x1, MSP430F11x2,MSP430F12x, MSP430F12x2,
MSP430F21xx2 × MSP430F2132IPW Four PCB 1×12-pin headers
(two male and two female)
MSP-TS430PW28A(red PCB)
28-pin PW(TSSOP ZIF)
MSP430F20xx, MSP430G2xxx in 14-, 20-,and 28-pin PW packages, MSP430TCH5E
in PW package2 × MSP430G2452IPW20 Four PCB 1×12-pin headers
(two male and two female)
MSP-TS430RHB32A(red PCB)
32-pin RHB(QFN ZIF) MSP430i204x 2 × MSP430i2041TRHB Eight PCB 1×8-pin headers
(four male and four female)
MSP-TS430DA38(green PCB)
38-pin DA(TSSOP ZIF)
MSP430F22xx, MSP430G2x44,MSP430G2x55
2 × MSP430F2274IDA2 × MSP430G2744IDA2 × MSP430G2955IDA
Four PCB 1×19-pin headers(two male and two female)
MSP-TS430QFN23x0(green PCB)
40-pin RHA(QFN ZIF) MSP430F23x0 2 × MSP430F2370IRHA Eight PCB 1×10-pin headers
(four male and four female)
MSP-TS430RSB40(green PCB)
40-pin RSB(QFN ZIF) MSP430F51x1, MSP430F51x2 2 × MSP430F5172IRSB Eight PCB 1×10-pin headers
(four male and four female)
MSP-TS430RHA40A(red PCB)
40-pin RHA(QFN ZIF) MSP430FR572x, MSP430FR573x 2 × MSP430FR5739IRHA Eight PCB 1×10-pin headers
(four male and four female)
MSP-TS430DL48(green PCB)
48-pin DL(TSSOP ZIF) MSP430F42x0 2 × MSP430F4270IDL Four PCB 2×12-pin headers
(two male and two female)
MSP-TS430PT48(green PCB)
48-pin PT(QFP ZIF) MSP430FR235x None. Free samples can be
ordered in the TI Store.Eight PCB 1×12-pin headers(four male and four female)
MSP-TS430PT48A(red PCB)
48-pin PT(QFP ZIF) MSP430FR247x None. Free samples can be
ordered in the TI Store.Eight PCB 1×12-pin headers(four male and four female)
MSP-TS430RGZ48B(blue PCB)
48-pin RGZ(QFN ZIF) MSP430F534x 2 × MSP430F5342IRGZ Eight PCB 1×12-pin headers
(four male and four female)
MSP-TS430RGZ48C(black PCB)
48-pin RGZ(QFN ZIF) MSP430FR58xx and MSP430FR59xx 2 × MSP430FR5969IRGZ Eight PCB 1×12-pin headers
(four male and four female)
Get Started Now! www.ti.com
12 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)Part Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430PM64(green PCB)
64-pin PM(QFP ZIF)
MSP430F13x, MSP430F14x,MSP430F14x1, MSP430F15x,MSP430F16x, MSP430F16x1,MSP430F23x, MSP430F24x,
MSP430F24xx, MSP430F261x,MSP430F41x, MSP430F42x,
MSP430F42xA, MSP430FE42x,MSP430FE42xA, MSP430FE42x2,
MSP430FW42x
TS Kit: 2 × MSP430F2618IPM;FET Kit: 2 × MSP430F417IPMand 2 × MSP430F169IPM
Eight PCB 1×16-pin headers(four male and four female)
MSP-TS430PM64A(red PCB)
64-pin PM(QFP ZIF) MSP430F41x2 2 × MSP430F4152IPM Eight PCB 1×16-pin headers
(four male and four female)
MSP-TS430PM64D(white PCB)
64-pin PM(QFP ZIF) MSP430FR413x, MSP430FR203x 2 × MSP430FR4133IPM Eight PCB 1×16-pin headers
(four male and four female)
MSP-TS430PM64F(purple PCB)
64-pin PM(QFP ZIF) MSP430FR6972 None. Free samples can be
ordered in the TI Store.Eight PCB 1×16-pin headers(four male and four female)
MSP-TS430RGC64B(blue PCB)
64-pin RGC(QFN ZIF) MSP430F530x 2 × MSP430F5310IRGC Eight PCB 1×16-pin headers
(four male and four female)
MSP-TS430RGC64C(black PCB)
64-pin RGC(QFN ZIF)
MSP430F522x, MSP430F521x,MSP430F523x, MSP430F524x,
MSP430F525x2 × MSP430F5229IRGC Eight PCB 1×16-pin headers
(four male and four female)
MSP-TS430RGC64USB(green PCB)
64-pin RGC(QFN ZIF)
MSP430F550x, MSP430F551x,MSP430F552x
2 × MSP430F5510IRGC or 2× MSP430F5528IRGC
Eight PCB 1×16-pin headers(four male and four female)
MSP-TS430PN80(green PCB)
80-pin PN(QFP ZIF)
MSP430F241x, MSP430F261x,MSP430F43x, MSP430F43x1,MSP430FG43x, MSP430F47x,
MSP430FG47x
2 × MSP430FG439IPN Eight PCB 1×20-pin headers(four male and four female)
MSP-TS430PN80A(red PCB)
80-pin PN(QFP ZIF) MSP430F532x 2 × MSP430F5329IPN Eight PCB 1×20-pin headers
(four male and four female)
MSP-TS430PN80B(blue PCB)
80-pin PN(QFP ZIF) MSP430F599x 2 × MSP430F5994IPN Eight PCB 1×20-pin headers
(four male and four female)
MSP-TS430PN80C(black PCB)
80-pin PN(QFP ZIF) MSP430FR6043 None. Free samples can be
ordered in the TI Store.Eight PCB 1×20-pin headers(four male and four female)
MSP-TS430PN80USB(green PCB)
80-pin PN(QFP ZIF) MSP430F552x, MSP430F551x 2 × MSP430F5529IPN Eight PCB 1×20-pin headers
(four male and four female)
MSP-TS430PZ100(green PCB)
100-pin PZ(QFP ZIF)
MSP430F43x, MSP430F43x1,MSP430F44x, MSP430FG461x,
MSP430F47xx2 × MSP430FG4619IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100A(red PCB)
100-pin PZ(QFP ZIF) MSP430F471xx 2 × MSP430F47197IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100B(blue PCB)
100-pin PZ(QFP ZIF) MSP430F67xx 2 × MSP430F6733IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100C(black PCB)
100-pin PZ(QFP ZIF)
MSP430F645x, MSP430F643x,MSP430F535x, MSP430F533x 2 × MSP430F6438IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100D(white PCB)
100-pin PZ(QFP ZIF) MSP430FR698x(1), MSP430FR688x(1) 2 × MSP430FR6989IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100E(yellow PCB)
100-pin PZ(QFP ZIF) MSP430FR604x(1), MSP430FR603x(1) 2 × MSP430FR6047IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ5x100(green PCB)
100-pin PZ(QFP ZIF)
MSP430F543x, MSP430BT5190,MSP430SL5438A 2 × MSP430F5438IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100USB(green PCB)
100-pin PZ(QFP ZIF)
MSP430F665x, MSP430F663x,MSP430F563x 2 × MSP430F6638IPZ Eight PCB 1×25-pin headers
(four male and four female)
MSP-TS430PZ100AUSB(blue PCB)
100-pin PZ(QFP ZIF) MSP430FG662x, MSP430FG642x None. Free samples can be
ordered in the TI Store.Eight PCB 1×25-pin headers(four male and four female)
MSP-TS430PEU128(green PCB)
128-pin PEU(QFP ZIF)
MSP430F677x, MSP430F676x,MSP430F674x, MSP430F677x1,MSP430F676x1, MSP430F674x1
2 × MSP430F67791IPEU
Four PCB 1x26-pin headers(two male and two female)and four PCB 1x38-pin headers(two male and two female)
See the device data sheets for device specifications. Device errata can be found in the respective device productfolder on the web provided as a PDF document. Depending on the device, errata may also be found in thedevice bug database.
www.ti.com Get Started Now!
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 13
Copyright © 2021 Texas Instruments Incorporated
1.2 Kit Contents, MSP-FET430xx• One READ ME FIRST document• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the
case, and a 2×7-pin male connector on the other end of the case.• One USB cable• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• One 14-Pin JTAG conductor cable• One small box containing two MSP430 device samples (See table for Sample Type)• One target socket module. To determine the devices used for each board and a summary of the board, see
Table 1-1. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx kit; forexample, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.
See the device data sheets for device specifications. Device errata can be found in the respective device productfolder on the web provided as a PDF document. Depending on the device, errata may also be found in thedevice bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
1.3 Kit Contents, MSP-FET• One READ ME FIRST document• One MSP-FET interface module• One USB cable• One 14-conductor cable
1.4 Kit Contents, MSP-FET430UIF• One READ ME FIRST document• One MSP-FET430UIF interface module• One USB cable• One 14-conductor cable
1.5 Kit Contents, MSP-FET430PIF• One READ ME FIRST document• One MSP-FET430PIF interface module• One 25-conductor cable• One 14-conductor cable
NoteNOTE: This part is obsolete and is not recommended to use in new design.
1.6 Kit Contents, eZ430-F2013• One QUICK START GUIDE document• One eZ430-F2013 development tool including one MSP430F2013 target board
1.7 Kit Contents, eZ430-T2012• Three MSP430F2012-based target boards
Get Started Now! www.ti.com
14 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
1.8 Kit Contents, eZ430-RF2500• One QUICK START GUIDE document• One eZ430-RF2500 CD-ROM• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)
1.9 Kit Contents, eZ430-RF2500T• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)
1.10 Kit Contents, eZ430-RF2500-SEH• One MSP430 development tool CD containing documentation and development software• One eZ430-RF USB debugging interface• Two eZ430-RF2500T wireless target boards• One SEH-01 solar energy harvester board• One AAA battery pack with expansion board (batteries included)
1.11 Kit Contents, eZ430-Chronos-xxx'433, '868, '915
• One QUICK START GUIDE document• One ez430-Chronos emulator• One screwdriver• Two spare screws
eZ430-Chronos-433:– One 433-MHz eZ430-Chronos watch (battery included)– One 433-MHz eZ430-Chronos access point
eZ430-Chronos-868:– One 868-MHz eZ430-Chronos watch (battery included)– One 868-MHz eZ430-Chronos access point
eZ430-Chronos-915:– One 915-MHz eZ430-Chronos watch (battery included)– One 915-MHz eZ430-Chronos access point
www.ti.com Get Started Now!
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 15
Copyright © 2021 Texas Instruments Incorporated
1.12 Kit Contents, FET430F6137RF900• One READ ME FIRST document• One legal notice• One MSP-FET430UIF interface module• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device
in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.• Two CC430EM battery packs• Four AAA batteries• Two 868-MHz or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2x4-pin headers• One USB cable• One 14-pin JTAG conductor cable
1.13 Kit Contents, EM430Fx1x7RF900• One READ ME FIRST document• One legal notice• Two target socket module
MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which issoldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on thePCB
MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which issoldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on thePCB
MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which issoldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present on thePCB
• Two CC430EM battery packs• Four AAA batteries• Two 868- or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2×4-pin headers
1.14 Hardware Installation, MSP-FET and MSP-FET430UIFSee the MSP Debuggers User’s Guide.
Get Started Now! www.ti.com
16 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,EM430Fx1x7RF900Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:
1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDEinstallation installs drivers automatically.
2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FETshould be recognized, as the USB device driver is installed automatically. If the driver has not been installedyet, the install wizard starts. Follow the prompts and point the wizard to the driver files.
3. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC. Usethe 14-conductor cable to connect the FET interface module to the supplied target socket module.
4. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circularindentation on the top surface) aligns with the "1" mark on the PCB.
5. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Appendix Bincludes illustrations of the target socket modules and their parts.
1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,MSPEXP430F5529To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools:
1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDEinstallation installs drivers automatically.
2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FETshould be recognized, as the USB device driver is installed automatically. If the driver has not been installedyet, the install wizard starts. Follow the prompts and point the wizard to the driver files.
1.17 Important MSP430 Documents on the WebThe primary sources of MSP430 information are the device-specific data sheet and user's guide. The MSP430website contains the most recent version of these documents.
PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian)are in the msp430\documentation folder. A Wiki page (FAQ) for the Code Composer Studio IDE is available, andthe Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provideadditional help besides the product help and Welcome page.
PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker, andthe librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the latestinformation) are available in HTML format in the same directories. An IAR-specific tool page is also available.
www.ti.com Get Started Now!
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 17
Copyright © 2021 Texas Instruments Incorporated
Get Started Now! www.ti.com
18 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
This page intentionally left blank.
This chapter presents signal requirements for in-circuit programming of the MSP430.
2.1 Signal Connections for In-System Programming and Debugging.........................................................................202.2 External Power............................................................................................................................................................242.3 Bootloader (BSL)........................................................................................................................................................ 24
Chapter 2Design Considerations for In-Circuit Programming
www.ti.com Design Considerations for In-Circuit Programming
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 19
Copyright © 2021 Texas Instruments Incorporated
2.1 Signal Connections for In-System Programming and DebuggingMSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430
With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIFand MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the connectionsalso support the MSP-GANG430 or MSP-PRGS430 production programmers, thus providing an easy way toprogram prototype boards, if desired.
Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target devicerequired to support in-system programming and debugging for 4-wire JTAG communication. Figure 2-2 showsthe connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is supported on most MSP430devices, except devices with low pin counts (for example, MSP430G2230). The 2-wire JTAG mode is availableon selected devices only. See the Code Composer Studio IDE for MSP430 MCUs User's Guide or IAREmbedded Workbench IDE for MSP430 MCUs User's Guide for information on which interface method canbe used on which device.
The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430 areidentical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board (through pin 2).In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-sense feature that, if used,requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC presenton the target board (that is, a battery or other local power supply) and adjusts the output signals accordingly. Ifthe target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made,and not the connection to pin 2. This uses the VCC-sense feature and prevents any contention that might occurif the local on-board VCC were connected to the VCC supplied from the FET interface module, MSP-GANG orthe MSP-GANG430. If the VCC-sense feature is not necessary (that is, if the target board is to be powered fromthe FET interface module, MSP-GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAGheader, and no connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports bothscenarios of supplying VCC to the target board. If this flexibility is not required, the desired VCC connections maybe hard-wired to eliminate the jumper block. Pins 2 and 4 must not be connected at the same time.
The connection to the JTAG connector RST pin of Figure 2-1 is required when programming or debugging adevice that supports 2-wire JTAG communication, even when using 4-wire JTAG communication mode on thesedevices. However, this connection is optional on devices that do not support 2-wire JTAG communication. TheMSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gaincontrol over the device. However, if this is unsuccessful, the RST signal of the JTAG connector may be used bythe development tool or device programmer as an additional way to assert a device reset.
Design Considerations for In-Circuit Programming www.ti.com
20 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
13579
1113
2468101214
TDO/TDITDI/VPPTMSTCKGND
TEST/VPP
JTAG
VCC TOOLVCC TARGET
J1 (see Note A)
J2 (see Note A)
VCC
R147 kW
(see Note B)
C210 µF
C30.1 µF
V /AV /DVCC CC CC
RST/NMITDO/TDI
TDI/VPP
TMS
TCK
TEST/VPP (see Note C)
V /AV /DVSS SS SS
MSP430Fxxx
C110 nF/1.1 nF
(see Notes B and E)
RST (see Note D)
Important to connect
(see Note F)
A. If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connectionJ2.
B. The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family user's guide forthe recommended configuration.
C. The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data sheet todetermine if this pin is available.
D. The connection to the JTAG connector RST pin is required when programming or debugging a device that supports 2-wire JTAGcommunication, even when using 4-wire JTAG communication mode on these devices. However, this connection is optional on devicesthat do not support 2-wire JTAG communication.
E. When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should not exceed 2.2 nF.The typical value for SBW communication is shown. The range can vary between 0.1 nF and 2.2 nF depending on SBW speed, voltage,and board design. See the device-specific data sheet for device-specific recommendations.
F. For applications that are particularly concerned with excessive noise or ESD, a 500-Ω to 1-kΩ pulldown resistor can be added to theTEST pin, while still allowing proper programming of the target device.
Figure 2-1. Signal Connections for 4-Wire JTAG Communication
www.ti.com Design Considerations for In-Circuit Programming
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 21
Copyright © 2021 Texas Instruments Incorporated
13579
1113
2468101214
TEST/SBWTCK
MSP430Fxxx
RST/NMI/SBWTDIOTDO/TDI
TCKGND
TEST/VPP
JTAG
VCC TOOLVCC TARGET
330ΩR2
J1 (see Note A)
J2 (see Note A)
Important to connect
V /AV /DVCC CC CC
V /AV /DVSS SS SS
R147 kΩ
C11.1 nF
(see Note B)
VCC
C210 µF
C30.1 µF
(see Note D)
A. If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connectionJ2.
B. The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, andany capacitance that is attached to this signal can affect the ability to establish a connection with the device. The upper limit for C1 is2.2 nF when using current TI tools. The typical value for SBW communication is shown. The range can vary between 0.1 nF and 2.2 nFdepending on SBW speed, voltage, and board design. See the device-specific data sheet for device-specific recommendations.
C. R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the TEST/VPP pin duringthe fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω) and do not connect TEST/VPP toTEST/SBWTCK.
D. For applications that are particularly concerned with excessive noise or ESD, a 500-Ω to 1-kΩ pulldown resistor can be added to theTEST pin, while still allowing proper programming of the target device.
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx, and MSP430F4xx Devices
Design Considerations for In-Circuit Programming www.ti.com
22 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
13579
1113
2468101214
TEST/SBWTCK
MSP430Fxxx
RST/NMI/SBWTDIOTDO/TDI
TCKGND
JTAG
R147 kΩ
VCC TOOLVCC TARGET
C11.1 nF
(see Note B)
J1 (see Note A)
J2 (see Note A)
Important to connect
V /AV /DVCC CC CC
V /AV /DVSS SS SS
VCC
C210 µF
C30.1 µF
(see Note C)
A. Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug orprogramming adapter.
B. The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, andany capacitance that is attached to this signal can affect the ability to establish a connection with the device. The upper limit for C1 is2.2 nF when using current TI tools. The typical value for SBW communication is shown. The range can vary between 0.1 nF and 2.2 nFdepending on SBW speed, voltage, and board design. See the device-specific data sheet for device-specific recommendations.
C. For applications that are particularly concerned with excessive noise or ESD, a 500-Ω to 1-kΩ pulldown resistor can be added to theTEST pin, while still allowing proper programming of the target device.
Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430SBW-Capable Devices That are Not Part of F2xx, G2xx, F4xx Families
NoteOn some Spy-Bi-Wire capable MSP430 devices, TEST/SBWTCK is very sensitive to rising signaledges that can cause the test logic to enter a state where an entry sequence (either 2‑wire or 4-wire)is not recognized correctly and JTAG access stays disabled. Unintentional edges on SBWTCK canoccur when the JTAG connector is connected to the target device.
www.ti.com Design Considerations for In-Circuit Programming
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 23
Copyright © 2021 Texas Instruments Incorporated
2.2 External PowerSee the MSP Debuggers User’s Guide.
2.3 Bootloader (BSL)The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices, thesepins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing maynot be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program(a "bootloader", formerly knows as the "bootstrap loader") that permits the flash memory to be erased andprogrammed using a reduced set of signals. MSP430™ Flash Device Bootloader (BSL) User's Guide describesthis interface. See the MSP430 website for the application reports and a list of MSP430 BSL tool developers.
TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests providingaccess to these signals by, for example, a header).
See FAQ 10 for a second alternative to sharing the JTAG and port pins.
Design Considerations for In-Circuit Programming www.ti.com
24 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.
A.1 Hardware FAQs.......................................................................................................................................................... 26A.2 Known Issues.............................................................................................................................................................28
Appendix AFrequently Asked Questions and Known Issues
www.ti.com Frequently Asked Questions and Known Issues
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 25
Copyright © 2021 Texas Instruments Incorporated
A.1 Hardware FAQs1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6(socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequencycrystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configurationand only to the period while a debug session is active.Workarounds:• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration.
This can be achieved by placing jumpers JP4 through JP9 accordingly.• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at
top of Debug View). This prevents the debugger from accessing the MSP430 device while the applicationis running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDEdocumentation for more information on this feature.
• Use an external clock source to drive XIN directly.2. With current interface hardware and software, there is a weakness when adapting target boards that
are powered externally. This leads to an accidental fuse check in the MSP430 device. This is valid for PIFand UIF but is seen most often on the UIF. A solution is being developed.Workarounds:• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the RST line,
which also resets the device internal fuse logic.• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down menu.
This prevents the debugger from accessing the MCU while the application is running. Note that in thismode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for moreinformation on this feature.
• Use an external clock source to drive XIN directly.3. The 14-conductor cable that connects the FET interface module and the target socket module must not
exceed 8 inches (20 centimeters) in length.4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB
FET.5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket
module. See the schematic of the target socket module to populate the capacitor according to the data sheetof the device.
6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on thetarget socket module. See the schematic of the target socket module to populate the capacitor according tothe data sheet of the device.
7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module. ForMSP430 devices that contain user-selectable loading capacitors, see the device and crystal data sheets forthe value of capacitance.
8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C-SPY(as any required clocking and timing is derived from the internal DCO and FLL).
9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.For C-SPY: "Release JTAG On Go" must be selected.
10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using anMSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 isthat the family members are code and architecturally compatible, so code developed on one device (forexample, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent setof peripherals).
11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customersshould erase the information memory before its first use. Main memory of packaged devices is blank whenthe device is delivered from TI.
Frequently Asked Questions and Known Issues www.ti.com
26 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
12. The device current is higher then expected. The device current measurement may not be accurate withthe debugger connected to the device. For accurate measurement, disconnect the debugger. Additionallysome unused pins of the device should be terminated. See the Connection of Unused Pins table in thedevice's family user's guide.
13. MSP-FETv2 – SBW may have issues with some target socket boards. Check the capacitance of theRST (SBWTDIO) line. If there is no capacitance, you may need to add at least 100 pF to the RST signal.The additional capacity on the RST line ensures that the timing between the SBWTDIO and SBWTCKsignals is synchronized.
14. The following ZIF sockets are used in the FET tools and target socket modules:• 8-pin device (D package): Yamaichi IC369-0082• 14-pin device (PW package): Enplas OTS-14-065-01• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02• 28-pin device (DW package): Wells-CTI 652 D028• 28-pin device (PW package): Enplas OTS-28-0.65-01• 38-pin device (DA package): Yamaichi IC189-0382-037• 40-pin device (RHA package): Enplas QFN-40B-0.5-01• 40-pin device (RSB package): Enplas QFN-40B-0.4• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001• 48-pin device (DL package): Yamaichi IC51-0482-1163• 64-pin device (PM package): Yamaichi IC51-0644-807• 64-pin device (RGC package): Yamaichi QFN11T064-006• 80-pin device (PN package): Yamaichi IC201-0804-014• 100-pin device (PZ package): Yamaichi IC201-1004-008• 128-pin device (PEU package): Yamaichi IC500-1284-009P
Enplas: www.enplas.com
Wells-CTI (Sensata Technologies): www.sensata.com
Yamaichi: www.yeu.com
www.ti.com Frequently Asked Questions and Known Issues
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 27
Copyright © 2021 Texas Instruments Incorporated
A.2 Known IssuesMSP-FET430UIFCurrent detection algorithm of the UIF firmware
Problem Description
If high current is detected, the ICC monitor algorithm stays in a loop of frequently switching on and off the targetpower supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state thatrequires a power cycle to return the device to JTAG control.
A side issue is that if the UIF firmware has entered this switch on and switch off loop, it is not possible to turn offthe power supply to the target by calling MSP430_VCC(0). A power cycle is required to remove the device fromthis state.
Solution
IAR KickStart and Code Composer Essentials that have the MSP430.dll version 2.04.00.003 and higher donot show this problem. Update the software development tool to this version or higher to update the MSP-FET430UIF firmware.
MSP-FET430PIFSome PCs do not supply 5 V through the parallel port
Problem Description
Device identification problems with modern PCs, because the parallel port often does not deliver 5 V as wascommon with earlier hardware.
1. When connected to a laptop, the test signal is clamped to 2.5 V.2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter through pin 4 (sense).
Solution
Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the VCC pads of the interface.The jumper on a the target socket must be switched to external power.
Frequently Asked Questions and Known Issues www.ti.com
28 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and billsof materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-specific user'sguides.
Topic SectionMSP-TS430D8 Appendix B.1
MSP-TS430PW14 Appendix B.2
MSP-TS430L092 Appendix B.3
MSP-TS430L092 Active Cable Appendix B.4
MSP-TS430PW20 Appendix B.5
MSP-TS430RHL20 Appendix B.6
MSP-TS430PW24 Appendix B.7
MSP-TS430RGE24A Appendix B.8
MSP-TS430DW28 Appendix B.9
MSP-TS430PW28 Appendix B.10
MSP-TS430PW28A Appendix B.11
MSP-TS430RHB32A Appendix B.12
MSP-TS430DA38 Appendix B.13
MSP-TS430QFN23x0 Appendix B.14
MSP-TS430RSB40 Appendix B.15
MSP-TS430RHA40A Appendix B.16
MSP-TS430DL48 Appendix B.17
MSP-TS430PT48 Appendix B.18
MSP-TS430PT48A Appendix B.19
MSP-TS430RGZ48B Appendix B.20
MSP-TS430RGZ48C Appendix B.21
MSP-TS430PM64 Appendix B.22
MSP-TS430PM64A Appendix B.23
MSP-TS430PM64D Appendix B.24
MSP-TS430PM64F Appendix B.25
MSP-TS430RGC64B Appendix B.26
MSP-TS430RGC64C Appendix B.27
MSP-TS430RGC64USB Appendix B.28
MSP-TS430PN80 Appendix B.29
MSP-TS430PN80A Appendix B.30
MSP-TS430PN80B Appendix B.31
MSP-TS430PN80C Appendix B.32
MSP-TS430PN80USB Appendix B.33
MSP-TS430PZ100 Appendix B.34
Appendix BHardware
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 29
Copyright © 2021 Texas Instruments Incorporated
Topic SectionMSP-TS430PZ100A Appendix B.35
MSP-TS430PZ100B Appendix B.36
MSP-TS430PZ100C Appendix B.37
MSP-TS430PZ100D Appendix B.38
MSP-TS430PZ100E Appendix B.39
MSP-TS430PZ5x100 Appendix B.40
MSP-TS430PZ100USB Appendix B.41
MSP-TS430PZ100AUSB Appendix B.42
MSP-TS430PEU128 Appendix B.43
EM430F5137RF900 Appendix B.44
EM430F6137RF900 Appendix B.45
EM430F6147RF900 Appendix B.46
Hardware www.ti.com
30 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.1 MSP-TS430D8
GN
D
10
0n
F
330R
10
uF
/10
V
47K
2.2
nF
GN
D
330R
GN
D
GN
D
gre
en
FE
4L
FE
4H
GN
D
Ext_
PW
R
So
cke
t:YA
MA
ICH
ITyp
e:
IC3
69
-00
82
Vcc
ext
int
tom
ea
su
resu
pp
lycu
rren
tD
NP
1 3 5 7 9 11 13
2 4 6
12
148
10
SB
W
C5R
3
C7
R5
C8
1
2
3
J3
1
2J4
1 2
J6
1 2 3
J5
R2
D1
1234
J1
5 6 7 8
J2
DV
CC
1D
VS
S8
P1.2
/TA1/A
22
P1.5
/TA0/A
5/S
CLK
3
P1.6
/TA1/A
6/S
DO
/SC
L4
TS
T/S
BW
TC
K7
RS
T/S
BW
TD
IO6
P1.7
/A7/S
DI/S
DA
5
U1
MS
P-T
S4
30
D8
GN
D
VC
C
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
SB
WT
CK
VC
C4
30
TS
T/S
BW
TC
K
TS
T/S
BW
TC
K
TS
T/S
BW
TC
KP
1.5
P1
.6P
1.7
P1
.2
Da
te:
28
.07
.20
1111
:03
:35
Sh
ee
t:1/1
RE
V:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
D8
+
1.0
MS
P-T
S4
30
D8
Targ
et S
ocke
t Bo
ard
Figure B-1. MSP-TS430D8 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 31
Copyright © 2021 Texas Instruments Incorporated
Jumper J4Open to disconnect LED
D1LED connected to P1.2
Orient Pin 1 of MSP430 device
14-pin connector for debuggingin Spy-Bi-Wire mode only
(4-Wire JTAG not available)
Jumper J6Open to measure current
Jumper J51-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector J3External power connectorJumper J5 to “ext”
Figure B-2. MSP-TS430D8 Target Socket Module, PCB
Hardware www.ti.com
32 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-1. MSP-TS430D8 Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
3 SBW 1 10-pin connector, male, TH HRP10H-ND
4 J3 1 3-pin header, male, TH SAM1035-03-ND
5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292
6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND
7 R5 1 47K, 0805 541-47000ATR-ND
8 C5 1 100nF, CSMD0805 311-1245-2-ND
9 R2, R3 2 330R, 0805 541-330ATR-ND
10 J1, J2 2 4-pin header, TH SAM1029-04-ND DNP: headers enclosed with kit.Keep vias free of solder.
10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit.
11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi
12 D1 1 red, LED 0603
13 MSP430 2 MSP430G2210, MSP430G2230 DNP: enclosed with kit. Is suppliedby TI
14 PCB 1 50,0mmx44,5mm MSP-TS430D8 Rev. 1.0
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 33
Copyright © 2021 Texas Instruments Incorporated
B.2 MSP-TS430PW14
12pF
12pF
GN
D
100nF
330R
10uF
/10V
47K
2.2
nF
GN
D
330R
100nF
GN
D
GN
D
GN
D
gre
en
Ext_
PW
R
Socket: E
NP
LA
SType: O
TS
-14-0
65
Vcc
ext
int
to m
easure
supp
ly c
urre
nt
DN
P
DN
P
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
od
e s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mp
ers
J7
to J
12
to p
ositio
n 2
-3
2-w
ire "S
pyB
iWire
": Se
t jum
pe
rs J
7 to
J1
2 to
po
sitio
n 2
-1
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C5R
3
C7
R5
C8
123
J3
Q1
8 910
11
12
13
14
J2
1234567
J1
12J
4
1 2
J6
J5
1 2 3
R2
C3
J7
1 2 3
J8
1 2 3
J9
1 2 3
J10
1 2 3
J11
1 2 3
J1
2
1 2 3
12345678 9 10
14
13
12
11
D1
P1.0
P1.3
P1.2
P1.1
XO
UT
XO
UT
GN
D
XIN
XIN
VC
C
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
VC
C430
P1.4
/TC
K
P1.4
/TC
K
P1.5
/TM
S
P1.5
/TM
S
P1.6
/TD
I
P1.6
/TD
I
P1.7
/TD
O
P1.7
/TD
O
TD
O/S
BW
TD
IO
RS
T/N
MI
TM
ST
DI
Da
te:
7/1
6/2
00
7 8
:22
:36
AM
Sh
ee
t:1
/1 RE
V:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
PW
14
+
2.0
MS
P-T
S4
30
PW
14
Ta
rge
t So
cke
t Bo
ard
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic
Hardware www.ti.com
34 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumper J4Open to disconnect LED
Orient Pin 1 of MSP430 device Jumper J6Open to measure current
Connector J3External power connectorJumper J5 to "ext"D1
LED connected to P1.0
Jumpers J7 to J12Close 1-2 to debug in Spy-Bi-Wire mode.Close 2-3 to debug in 4-wire JTAG mode.
Jumper J51-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 35
Copyright © 2021 Texas Instruments Incorporated
Table B-2. MSP-TS430PW14 Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3
4 C8 0 2.2nF, SMD0805 DNP
5 D1 1 green LED, SMD0603 475-1056-2-ND
6 J1, J2 0 7-pin header, TH
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder
SAM1029-07-ND : HeaderSAM1213-07-ND : Receptacle
7J3, J5, J7,J8, J9, J10,
J11, J128 3-pin header, male, TH SAM1035-03-ND Place jumpers on headers J5, J7, J8, J9,
J10, J11, J12; Pos 1-2
8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2
10 JTAG 1 14-pin connector, male,TH HRP14H-ND
12 Q1 0 CrystalMicro Crystal MS1V-T1K32.768kHz, C(Load) =12.5pF
DNP: keep vias free of solder
13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas
17 PCB 1 56 x 53 mm 2 layers
18 Adhesiveplastic feet 4 Approximately 6mm width,
2mm height
For example, 3MBumpons Part No.SJ-5302
Apply to corners at bottom side
19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI
Hardware www.ti.com
36 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.3 MSP-TS430L092
Figure B-5. MSP-TS430L092 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 37
Copyright © 2021 Texas Instruments Incorporated
Settings of the MSP-TS430L092 Target Socket
Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended:
• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current
consumption. For default operation, they should be closed.
Connector J3External power connector
Jumper JP3Open to measure current
Jumper JP1Write enable for EPROM
Orient pin 1 ofMSP430 device
Figure B-6. MSP-TS430L092 Target Socket Module, PCB
Hardware www.ti.com
38 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-3. MSP-TS430L092 Bill of MaterialsPos. Ref Des No. No. Per Board Description Digi-Key Part No. Comment
1 C1, C2 2 330nF, SMD0603
2 C5 1 100n, SMD0603
3 C6 1 10u, SMD0805
4 C10 1 100n, SMD0603
5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND
7 J1, J2 2 7-pin header, TH
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.
SAM1213-07-ND : HeaderSAM1035-07-ND : Receptacle
8 J3 1 3-pin header, male, TH SAM1035-03-ND
9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder.
11 J13 1 MICRO_STECKV_10 Reichelt: MicroMaTch-Connector: MM FL 10G
12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557
16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065
17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC
18 R0, R6, R7 3 2K7, SMD0603
19 R1 1 1k, SMD0603
20 R2 1 47k, SMD0603
21 R4,R5, R8,R10, RC, RD 6 10k, SMD0603
22 RA 1 3.9k, SMD0603
23 RB 1 6.8k, SMD0603
24 U1 1 14 Pin Socket -IC189-0142-146 Manuf. Yamaichi
22 MSP430 2 MSP430L092PWR DNP: Enclosed with kit. Issupplied by TI.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 39
Copyright © 2021 Texas Instruments Incorporated
B.4 MSP-TS430L092 Active Cable
Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic
Hardware www.ti.com
40 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:
• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.Table B-4. MSP-TS430L092 JP1 Settings
Jumper 1 Jumper 2 Description
Off Off The active cable has no power and does not function.
Off OnThe active cable receives power from target socket. For this option, thetarget socket must have its own power supply.
On Off The active cable receives power from the JTAG connector.
On OnThe JTAG connector powers the active cable and the target socket. Forthis option, the target socket must not have its own power source, asthis would cause a not defined state.
• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to high andcan also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
Connector JTAG
For JTAG Tool
JP2
JP1
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 41
Copyright © 2021 Texas Instruments Incorporated
Table B-5. MSP-TS430L092 Active Cable Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 C1, C3, C5, C6 4 100nF, SMD0603
2 C2, C4 2 1uF, SMD0805
3 R1, R10 2 10K, SMD0603
4 R2 1 4K7, SMD0603
5 R5, R6, R7, R9 4 100, SMD0603
6 R8 1 680k, SMD0603
7 R11, R15 2 1K, SMD0603
8 R12 0 SMD0603 DNP
9 R13 0 SMD0603 DNP
10 R14 1 0, SMD0603
11 IC1 1 SN74AUC1G04DBVR Manu: TI
12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI
13 J2 1 MICRO_STECKV_10 Reichelt: MicroMaTch-Connector: MM FL 10G
14 JP1 1 2x2 Header JP2Q Put jumper on Position 1 and 2.Do not mix direction.
15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header
16 JTAG 1 14-pin connector, male, TH HRP14H-ND
17 Q1 1 BC817-25LT1SMD, SOT23-BEC
Digi-Key:BC817-25LT1GOSCT-ND
18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI
Hardware www.ti.com
42 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.5 MSP-TS430PW20The MSP-TS430PW20 microcontroller development board supports the MSP430FR23x and MSP430FR21xFRAM devices in both 20-pin and 16-pin TSSOP (TI package code PW) packages. No microcontroller devicesare included in the MSP-TS430PW20 kit, but can be ordered from the TI Store.
The MSP-TS430PW20 microcontroller development board has two jumpers on header J11 that direct the UARTBSL signals, depending on which device is being used (see Figure B-9).
Figure B-9. UART BSL Signal Select
• GROUP2: Jumpers on 3-5 and 4-6 for MSP430FR231x PW16• GROUP1: Jumpers on 1-3 and 2-4 for all other compatible devices, including MSP430FR231x PW20
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 43
Copyright © 2021 Texas Instruments Incorporated
DN
P
I2C
UA
RT
P1.3
Jum
pers
JP
3 to
JP
8C
lose 1
-2 to
debug in
Spy-B
i-Wire
mode.
Clo
se 2
-3 to
debug in
4-w
ire J
TA
G m
ode.
BS
LTool S
ele
ct:
Open =
BS
LC
onnecto
rC
losed =
JTA
G C
onnecto
r
DN
P
DN
P
12p
12p
GN
D
GN
D
33
0R
0R0R
GN
D
GN
D
1.1
nF
47
kG
ND
0R0R
QU
AR
Z5
10
0n
F
1uF/10V
gre
en
GN
D
EV
Q11
0R
DNP
DN
P
10
0n
FGN
D
10
k1
0k
33
0R
yello
w D
NP3
30
R
red D
NP
MS
P430F
R231X
IPW
20
SA
M1029-1
0-N
D/1
-10
SA
M1029-1
0-N
D/1
1-2
0
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
Ext_
PW
R
MS
P-T
S4
30
PW
20
Vcc
int
ext
DN
PD
NP
DN
P
JTA
G ->
SB
W ->
1.1
DN
P
P1
.3
Socket: E
npla
s O
TS
-20S
-0.6
5-0
07
PW
16
PW
20
DN
P
DN
P
Ta
rge
t So
cke
t Bo
ard
for M
SP
43
0F
R2
31
x d
evic
es
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C9
C8
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R9R8
Q2
C11
C7
D1
SW
1
R1
3
TP2TP1
SW2
R1
4
C6
12
JP
13
12
JP
14
12
JP
15
123
JP
16
1 2
JP17
1 2
JP18
R7
R1
5
R5
12J
P2
D2
R6
12J
P10
D3
TP
3
P1
.1/U
CB
0C
LK
/AC
LK
/C1
/A1
1
P1
.0/U
CB
0S
TE
/SM
CL
K/C
0/A
0/V
ER
EF
+2
TE
ST
/SB
WT
CK
3
RS
T/N
MI/S
BW
TD
IO4
DV
CC
5
DV
SS
6
P2
.7/T
B0
CL
K/X
IN7
P2
.6/M
CL
K/X
OU
T8
P2
.5/U
CB
0S
OM
I/UC
B0
SC
L9
P2
.4/U
CB
0S
IMO
/UC
B0
SD
A1
0
P1
.2/U
CB
0S
IMO
/UC
B0
SD
A/T
B0
TR
G/O
A0
-/A2
/VE
RE
F-
20
P1
.3/U
CB
0S
OM
I/UC
B0
SC
L/O
A0
O/A
31
9
P1
.4/U
CA
0S
TE
/TC
K/O
A0
+/A
41
8
P1
.5//U
CA
0C
LK
/TM
S/T
RI0
O/A
51
7
P1
.6/U
CA
0R
XD
/UC
A0
SO
MI/T
B0
.1/T
DI/T
CL
K/T
RI0
-/A6 16
P1
.7/U
CA
0T
XD
/UC
A0
SIM
O/T
B2
.0/T
D0
/TR
I0+
/A7
/VR
EF
+1
5
P2
.0/T
B1
.1/C
O1
4
P2
.1/T
B1
.21
3
P2
.2/U
CB
0S
TE
/TB
1C
LK
12
P2
.3/U
CB
0C
LK
/TB
1T
RG
11
U1
J3
12345678910
J4
11
12
13
14
15
16
17
18
19
20
5 3 1246
JP
11
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
P1
.1
P1.1
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
P1.5
/TM
S
P1.5
/TM
S
P1.4
/TC
KP1.4
/TC
K
P1.2
P1
.2
P1.2
XO
UT XO
UT
XIN
XIN
XTLGND
DV
CC
DV
CC
DVCC
DV
CC
DV
CC
DV
SS
DV
SS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RX
D/S
IMO
RX
D/S
IMO
TX
D/S
OM
I/SD
A
TX
D/S
OM
I/SD
A
SP
ICLK
/SC
L
SP
ICLK
/SC
L
TX
D/S
OM
I/SD
A1
PIN
14
PIN
14
PIN
15
PIN
15
PIN
15
PIN
15
PIN
16
PIN
16
PIN
16
TD
X
TD
X
RX
D
RX
D
P1.3
P1.3
IPW
16
IPW
20
1 2 3 4 5 6
1 2 3 4 5 6
Title
:
Da
te:
Pa
ge
1/1
MS
P-T
S4
30
PW
20
11
/27
/20
15
12
:49
:07
PM
A3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Re
v.:
Figure B-10. MSP-TS430PW20 Target Socket Module, Schematic
Hardware www.ti.com
44 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
14
1
2
10
1
2
JP11
Jumper JP1Open to measure current
Orient Pin 1 of MSP430 device
Jumpers JP9, JP2, JP10Open to disconnect LEDs
D1 to D3LEDs connected to P1.0 to P1.2
Connector J2External power connector
Jumper J1 to "ext"
Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Connector BSLFor ToolBootloader
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
SW1Close to reset
Figure B-11. MSP-TS430PW20 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 45
Copyright © 2021 Texas Instruments Incorporated
Table B-6. MSP-TS430PW20 Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 PCB 1 90.0 x 92.5 mm "MSP-TS430PW20" Rev. 1.1 2 layers, green solder mask
2JP1, JP9,
JP13, JP14,JP15
5 2-pin header, male, TH SAM1035-02-ND place jumper on header
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only
4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
6 JP3, JP4, JP5,JP6, JP7, JP8 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
7 JP16 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
8 J2 1 3-pin header, male, TH SAM1035-03-ND
9 JP11 1 2x3pin header, male, TH SAM1034-03-ND
PW20: Place jumpers on pins1-3 and 2-4PW16: Place jumpers on pins3-5 and 4-6
10 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP
11 R3, R13 2 0R, 0805 541-0.0ATR-ND
12 C5 1 1.1nF, CSMD0805 490-1623-2-ND
13 C7 1 1uF/10V, CSMD0805 490-1702-2-ND
14 R7, R15 1 10k, 0805 541-10KATR-ND
15 R4 1 47k, 0805 541-47KATR-ND
16 C6, C11 2 100nF, CSMD0805 490-1666-1-ND
17 C8, C9 2 12p, DNP, CSMD0805 BC1257TR-ND DNP
18 R1 1 330R, 0805 541-330ATR-ND
19 R5, R6 2 330R, 0805 541-330ATR-ND DNP
20 R14 1 47k, 0805 541-47KATR-ND DNP
21 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder
22 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder
23 J3, J4 2 10-pin header, TH SAM1029-10-NDDNP: headers are enclosedwith kit.Keep vias free of solder.
24 J3, J4 2 10-pin receptacle, TH SAM1213-10-NDDNP: Receptacles areenclosed with kit.Keep vias free of solder.
25 TP1, TP2, TP3 3 Test point DNP, keep pads free of solder
26 BSL 1 10-pin connector, male, TH HRP10H-ND
27 JTAG 1 14-pin connector, male, TH HRP14H-ND
28 IC1 1 Socket: OTS-20S-0.65-007 Manuf. Enplas
29 IC1 1 MSP430FR2311IPW20 DNP: Free samples can beordered in the TI Store
30 Q2 1 4MHz Crystal 4MHz Buerklin: 78D134 DNP: Crystal is enclosed withkit
31 Q2 1 MSV3V-T1R (32.768kHz /20ppm / 12.5pF)
DNP: Crystal is enclosed withkit
32 D1 1 green LED, HSMG-C170DIODE0805 516-1434-1-ND Avago, Farnell 5790852
33 D3 1 red LED, DIODE0805 DNP
34 D2 1 yellow LED, DIODE0805 DNP
Hardware www.ti.com
46 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-6. MSP-TS430PW20 Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment
35 Rubber standoff 4 Buerklin: 20H1724 apply to corners at bottom side
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 47
Copyright © 2021 Texas Instruments Incorporated
B.6 MSP-TS430RHL20
1 1
2 2
3 3
4 4
5 5
6 6
DD
CC
BB
AA
12
8/3
/20
17
MS
P-T
S4
30
RH
L2
0_
V1
.0.S
ch
Do
c
Sh
ee
tT
itle:
Siz
e:
Mo
d.
Da
te:
File
:S
he
et:
ofB
http
://ww
w.ti.c
om
Co
nta
ct:
http
://ww
w.ti.c
om
/su
pp
ort
MS
P-T
S4
30
RH
L2
0P
roje
ctT
itle:
De
sig
ne
dfo
r:Pu
blic
Re
lea
se
Asse
mb
lyV
aria
nt:[N
oV
aria
tion
s]
©T
exa
sIn
stru
me
nts
20
17
Dra
wn
By:
En
gin
ee
r:M
.P
ridg
en
Te
xa
sIn
stru
me
nts
an
d/o
rits
lice
nso
rsd
on
ot
wa
rran
tth
ea
ccu
racy
or
co
mp
lete
ne
ss
of
this
sp
ecific
atio
no
ra
ny
info
rma
tion
co
nta
ine
dth
ere
in.Te
xa
sIn
stru
me
nts
an
d/o
rits
lice
nso
rsd
on
ot
wa
rran
tth
at
this
de
sig
nw
illm
ee
tth
esp
ecific
atio
ns,
will
be
su
itab
lefo
ryo
ur
ap
plic
atio
no
rfit
for
an
yp
artic
ula
rp
urp
ose
,o
rw
illo
pe
rate
ina
nim
ple
me
nta
tion
.Te
xa
sIn
stru
me
nts
an
d/o
rits
lice
nso
rsd
on
ot
wa
rran
tth
at
the
de
sig
nis
pro
du
ctio
nw
orth
y.Y
ou
sh
ou
ldco
mp
lete
lyva
lida
tea
nd
test
yo
ur
de
sig
nim
ple
me
nta
tion
toco
nfirm
the
syste
mfu
nctio
na
lityfo
ryo
ur
ap
pl
ica
tio
Ve
rsio
nco
ntro
ld
isa
ble
dS
VN
Re
v:
Nu
mb
er:
Re
v:
1.0
TID
#:
N/A
Ord
era
ble
:E
VM
_o
rde
rab
le
1 2 3
J1
TS
W-1
03
-07
-G-S
1
2
3
J2
TS
W-1
03
-07
-G-S
1 2 3
JP
9
TS
W-1
03
-07
-G-S
1 2 3
JP
10
TS
W-1
03
-07
-G-S
1 2 3
JP
5
TS
W-1
03
-07
-G-S
1 2 3
JP
6
TS
W-1
03
-07
-G-S
1 2 3
JP
7
TS
W-1
03
-07
-G-S
1 2 3
JP
8
TS
W-1
03
-07
-G-S
ext
int
VC
C
JTA
G->
SB
W->
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
GN
D
47
k
R7
11
00
pF
C5
SW
2
EV
Q-1
1L
05
R
RS
T/S
BW
TD
IOP
1.7
/TD
OP
1.6
/TD
IP
1.5
/TM
SP
1.4
/TC
K
DV
SS
TM
ST
DI
TD
O/S
BW
TD
IO
VC
C
GN
D
GN
D
TE
ST
/SB
WT
CK
BS
L_
RX
BS
L_
TX
RS
T/S
BW
TD
IO
BS
L_
SC
L
BS
L_
SD
A
UA
RT
BS
LC
onnectio
n
I2C
Pullu
ps
BS
LR
XB
SLT
XB
SL
_T
XB
SL
_R
X
BS
LS
CL
BS
LS
DA
BS
L_
SD
AB
SL
_S
CL
DV
CC
TP
1T
P2
TP
3T
P4
VC
CC
urre
nt
Me
asu
rem
en
t4
.7k
R1
6
4.7
k
R1
7
DV
CC
BS
LS
DA
BS
LS
CL
BS
L_
TX
BS
L_
RX
BS
L_
SD
A
BS
L_
SC
L
RS
T/N
MI
TC
K/S
BW
TC
K
0 R2
1 0 R2
00 R
19
12 34
12
34
56
78
91
0
111
2
13
14
JTA
G
SB
H11
-PB
PC
-D0
7-S
T-B
K
12
34
SW
3
12
34
SW
4
12
34
SW
50 R
3
DN
PR
4
Ext_
PW
R
I2C
BS
LC
onnectio
n
VC
C
12
34
56
78
91
0
BS
L
AW
HW
-10
G-0
20
2-T
DV
CC
12
JP
1
TS
W-1
02
-07
-G-S
Ife
xte
rna
lsu
pp
lyvo
ltag
e:
rem
ove
R3
an
da
dd
R4
(0o
hm
)
an
dth
eI2
CB
SL
an
dth
eI2
Cp
ull-u
ps
are
dis
co
nn
ecte
d
By
de
fau
ltth
eU
AR
TB
SL
isco
nn
ecte
d
0.1
µF
C6
DV
CCD
VS
S
DN
P
R8
DN
P
R9
DN
P
C8
DN
P
C9
DV
SS
HF
GN
DC
on
ne
ctio
nb
yvia
XIN
_e
xt
XIN
XO
UT
XO
UT
_e
xt
10µ
FC
7
1
2
JP
11
TS
W-1
02
-07
-G-S
1
2
JP
12
TS
W-1
02
-07
-G-S
DV
SS
33
0
R1
Gre
en
12
D1
P1
.0
P2
.3
SW
1
EV
Q-1
1L
05
R
DN
PR
13
DVCC
P2
.2
0 R1
0G
ND
TP
5
TP
6
Blu
e
21
D2
20
0
R2
5 4 123678910
J3
541 2 3 6 7 8 9
10
J4
P1
.1/U
CB
0C
LK
/AC
LK
/A1
/VR
EF
+/C
AP
1.1
P1
.0/U
CB
0S
TE
/A0
/Ve
ref+
/CA
P1
.0T
ES
T/S
BW
TC
KR
ST
/NM
I/SB
WT
DIO
DV
CC
DV
SS
P2
.1/U
CA
0R
XD
/XIN
P2
.0/U
CA
0T
XD
/XO
UT
P2
.6/U
CB
0S
OM
I/UC
B0
SC
LP
2.5
/UC
B0
SIM
O/U
CB
0S
DA
/A7
P2
.4/T
A1
CL
K/U
CB
0C
LK
/A6
P2
.3/T
A1
.2/U
CB
0S
TE
/A5
P2
.2/T
A1
.1/S
YN
C/A
4
P1
.7/U
CA
0S
TE
/TD
O/C
AP
0.3
P1
.6/U
CA
0C
LK
/TA
0C
LK
/TD
I/TC
LK
/CA
P0
.2P
1.5
/UC
A0
RX
D/U
CA
0S
OM
I/TA
0.2
/TM
S/C
AP
0.1
P1
.4/U
CA
0T
XD
/UC
A0
SIM
O/T
A0
.1/T
CK
/CA
P0
.0V
RE
GP
1.3
/UC
B0
SO
MI/U
CB
0S
CL
/MC
LK
/A3
/CA
P1
.3P
1.2
/UC
B0
SIM
O/U
CB
0S
DA
/SM
CL
K/A
2/V
ere
f-/CA
P1
.2
BS
LT
XB
SL
RX
BS
LS
DA
BS
LS
CL
P1
.4/T
CK
P1
.5/T
MS
P1
.6/T
DI
P1
.7/T
DO
P1
.0
P2
.2P
2.3
1µ
FC
1
DV
SS
VR
EG
XIN
XO
UT
XIN
_e
xt
XO
UT
_e
xt
DV
SS
DV
CC
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
123456789
10
11 12
13
14
15
16
17
18
19
20
IC1
1 2
DN
PQ
1
Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic
Hardware www.ti.com
48 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector JTAG ForJTAG Tool
Connector J2External power connector
Jumper J1 to External
Jumper JP1Open to measure current
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi Wire modeClose 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper J11-2 (Debugger): Power supply from JTAG interface
2-3 (External): External power supplyConnector BLSFor Bootloader Tool
BSL Interface SwitchesSelect which BSL interface toconnect to connector BSL
I2C pullup enable switchSwitch On to connect I2C pullupresistors
Jumpers JP11, JP12Open to disconnect LEDs D1 and D2
LEDs D1, D2LEDs connector to P1.0 and P2.3
Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 49
Copyright © 2021 Texas Instruments Incorporated
Table B-7. MSP-TS430RHL20 Bill of MaterialsItem No. Designator Quantity Description Supplier Part Number Note
1 !PCB 1 Printed Circuit Board
2 BSL 1 Header(Shrouded), 2.54mm,5x2, Gold, TH AWHW-10G-0202-T-ND
3 C1 1 CAP, CERM, 1 µF, 10 V, ±10%,X7R, 0805 490-1695-1-ND
4 C5 1 CAP, CERM, 1100 pF, 50 V,±5%, C0G/NP0, 0805 490-1623-1-ND
5 C6 1 CAP, CERM, 0.1 µF, 50 V,±10%, X7R, 0805 490-1666-1-ND
6 C7 1 CAP, CERM, 10 µF, 16 V,±10%, X5R, 0805 478-5165-1-ND
7 C8, C9 0 CAP, CERM, 22 pF, 50 V, ±5%,C0G/NP0, 0805 490-3608-1-ND DNP
8 D1 1 LED, Green, SMD 754-1939-1-ND
9 D2 1 LED, Blue, SMD 732-4982-1-ND
10 H5, H6, H7, H8 4 Bumpon, Cylindrical, 0.312 X0.200, Black SJ5746-0-ND
11 IC1 1 Socket, QFN-20, 0.5 mm Pitch use IC564-020-130 socket
12 J1, J2, JP5, JP6, JP7,JP8, JP9, JP10 8 Header, 100mil, 3x1, Gold, TH SAM1029-03-ND
13 J3, J4 2 Header, 100mil, 10x1, Gold, TH SAM1029-10-ND DNP: Headers are enclosedin kit. Keep vias free of solder
14 J3, J4 2 Receptacle, 100mil, 10x1, Gold,TH SAM1213-12-ND
DNP: Receptacles areenclosed in kit. Keep vias freeof solder
15 JP1, JP11, JP12 3 Header, 100mil, 2x1, Gold, TH SAM1029-02-ND
16 JTAG 1 Header (shrouded), 100 mil,7x2, Gold, TH S9170-ND
17 Q1 1 Crystal, 32.768 KHz, 12.5 pF,SMD X1A0001410014 DNP: One Epson Crystal
Included in kit
18 R1 1 RES, 330, 5%, 0.125 W, 0805 541-330ACT-ND
19 R2 1 RES, 200, 5%, 0.125 W, 0805 541-200ACT-ND
20 R3, R10, R19, R20,R21 5 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND
21 R4, R8, R9 0 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND DNP
22 R7 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND
23 R13 0 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND DNP
24 R16, R17 2 RES, 4.7 k, 5%, 0.125 W, 0805 541-4.7KACT-ND
25
SH‑J1, SH‑JP1,SH‑JP5, SH‑JP6,SH‑JP7, SH‑JP8,SH‑JP9, SH‑JP10,SH‑JP11, SH‑JP12
10 Shunt, 100mil, Gold plated,Black 3M9580-ND
J1: 1-2, JP1: 1-2, JP5: 2-3,JP6: 2-3, JP7: 2-3, JP8: 2-3,JP9: 2-3, JP10: 2-3, JP11:1-2, JP12: 1-2
26 SW1, SW2 2 Switch Tactile SPST-NO 0.02A15V P8079STB-ND
27 SW3, SW4, SW5 3 Switch, DPST, Slide, Off-On, 1Pos, 0.15A, 30V, TH GH7727-ND
Install with arrow on partmatching arrow on PCB. SW3and SW4 should be in theOFF position, SW5 should bein the ON position
28 TP1, TP2, TP3, TP4,TP5, TP6 0 Test Point, Miniature, Black, TH 36-5001-ND DNP
Hardware www.ti.com
50 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.7 MSP-TS430PW24
Figure B-14. MSP-TS430PW24 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 51
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to measure current
Orient Pin 1 of MSP430 device
D1LED connected to P1.0
Jumper JP3Open to disconnect LED
Connector J5External power connectorJumper JP1 to "ext"
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Figure B-15. MSP-TS430PW24 Target Socket Module, PCB
Hardware www.ti.com
52 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-8. MSP-TS430PW24 Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C5 1 2.2nF, SMD0805
3 C3, C7 2 10uF, 10V, SMD0805
4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND
6 J1, J2 0 12-pin header, TH SAM1029-07-NDSAM1213-07-ND
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder.(Header and Receptacle)
7
J5, JP1,JP4, JP5,JP6, JP7,JP8, JP9
8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9Place on 1-2 on JP1
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND see Pos 7 and 8
10 JTAG 1 14-pin connector, male,TH HRP14H-ND
11 Q1 0 Crystal DNP: keep vias free of solder
12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
13 R5, R6, R8,R9, 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6
14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND
15 U1 1 Socket: OTS24(28)-065-02-00 Manuf.: Enplas
16 PCB 1 68.5 x 61 mm 2 layers
17 Adhesiveplastic feet 4 Approximately 6mm width,
2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side
18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 53
Copyright © 2021 Texas Instruments Incorporated
B.8 MSP-TS430RGE24A
DN
P
Socket:
EN
PLA
S Q
FN
-24B
-0.5
-0.1
c
I2C
UA
RT
P1.3
P1.5
Jum
pers
JP
3 to
JP
8C
lose 1
-2 to
debug in
Spy-B
i-Wire
mode.
Clo
se 2
-3 to
debug in
4-w
ire J
TA
G m
ode.
BS
LTool S
ele
ct:
Open =
BS
LC
onnecto
rC
losed =
JTA
G C
onnecto
r
DN
P
DN
P
DN
P
DN
P
GN
D
GN
D
33
0R
0R0R
GN
D
GN
D
1.1
nF
47
kG
ND0R 0R
QU
AR
Z5
10
0n
F
1uF/10V
gre
en
GN
D
EV
Q11
0R
DNP
DN
P
10
0n
F
GN
D1
0k
10
k
MS
P430F
R2433IR
GE
SA
M1029-0
6-N
D1-6
SAM1029-06-ND7-12
SA
M1029-0
6-N
D13-1
8
SAM1029-06-ND19-24
33
0R
yello
w D
NP3
30
R
red D
NP
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
Ext_
PW
R
MS
P-T
S4
30
RG
E2
4A
Vcc
int
ext
DN
PD
NP
DN
P
JTA
G ->
SB
W ->
1.0
DN
P
P1
.3
Ta
rge
t So
cke
t Bo
ard
for M
SP
43
0F
R2
43
3 d
evic
e
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C9
C8
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R9 R8
Q2
C11
C7
D1
SW
1
R1
3
TP2TP1
SW2
R1
4
C6
12
JP
13
12
JP
14
12
JP
15
123
JP
16
1 2
JP17
1 2
JP18
R7
R1
5
RS
T/N
MI/S
BW
TD
IO1
TE
ST
/SB
WT
CK
2
P1.4
/UC
A0T
XD
/UC
A0S
IMO
/TA
1.2
/TC
K/A
43
P1.5
/UC
A0R
XD
/UC
A0S
OM
I/TA
1.1
/TM
S/A
54
P1.6
/UC
A0C
LK
/TA
1C
LK
/TD
I/TC
LK
/A6
5
P1.7
/UC
A0S
TE
/SM
CLK
/TD
O/A
76
P2.3
13
P3.1
/UC
A1S
TE
14
P2.4
/UC
A1C
LK
15
P2.5
/UC
A1R
XD
/UC
A1S
OM
I16
P2.6
/UC
A1T
XD
/UC
A1S
IMO
17
DV
SS
18
P1.0/UCB0STE/TA0CLK/A07
P1.1/UCB0CLK/TA0.1/A18
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A29
P1.3/UCB0SOMI/UCB0SCL/MCLK/A310
P2.2/ACLK11
P3.012
P2.719
P3.220
P2.0/XOUT21
P2.1/XIN22
DVSS23
DVCC24
IC1
123456
J3
7
8
9
10
11
12
J4
13
14
15
16
17
18
J5
192021222324
J6
R5
12J
P2
D2
R6
12J
P10
D3
TP
3P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
P1.1
P1
.1 TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
P1.7
/TD
O
P1.7
/TD
O
P1.5
/TM
S
P1.5
/TM
S
P1.5
/TM
S
P1.4
/TC
K
P1.4
/TC
K
P1.4
/TC
K
P1.6
/TD
I
P1.6
/TD
I
P1.2
P1.2
P1
.2
XO
UT
XOUT
XIN
XIN
XTLGNDD
VC
C
DV
CC
DVCC
DVCC
DV
CC
DV
SS
DV
SS
DVSS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RX
D/S
IMO
RX
D/S
IMO
TX
D/S
OM
I/SD
A
TX
D/S
OM
I/SD
A
SP
ICLK
/SC
L
SP
ICLK
/SC
LS
PIC
LK
/SC
L1
SPICLK/SCL1
SP
ICLK
/SC
L1
TX
D/S
OM
I/SD
A1
1 2 3 4 5 6
1 2 3 4 5 6
Title
:
Da
te:
Pa
ge
1/1
MS
P-T
S4
30
RG
E2
4A
4/2
8/2
01
5 3
:52
:36
PM
A3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Re
v.:
Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic
Hardware www.ti.com
54 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector JTAGFor JTAG tool
Connector BSLFor bootloader tool
Orient Pin 1 of MSP430 device
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector J2External power connector
Jumper J1 to “ext”
Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 55
Copyright © 2021 Texas Instruments Incorporated
Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)Position Ref Des No. per
Board Description Digi-Key Part No. Comment
1 PCB 1 90.0 x 92.5 mm "MSP-TS430RGE24A" Rev.1.0 2 layers, red solder mask
2JP1, JP9,
JP13, JP14,JP15
5 2-pin header, male, TH SAM1035-02-ND place jumper on header
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only
4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
6
JP3, JP4,JP5, JP6,JP7, JP8,
JP16
7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
7 J2 1 3-pin header, male, TH SAM1035-03-ND
8 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP
9 R3, R13 2 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C7 1 1uF/10V, CSMD0805 490-1702-2-ND
12 R7, R15 1 10k, 0805 541-10KATR-ND
13 R4 1 47k, 0805 541-47KATR-ND
14 C6, C11 2 100nF, CSMD0805 490-1666-1-ND
15 R1 1 330R, 0805 541-330ATR-ND
16 R5, R6 2 330R, 0805 541-330ATR-ND DNP
17 R14 1 47k, 0805 541-47KATR-ND DNP
18 C8, C9 2 DNP, CSMD0805 DNP
19 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder.Lacon: 1251459
20 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder,Lacon: 1251459
21 J3, J4, J5, J6 4 6-pin header, TH SAM1029-06-ND DNP: headers enclosed in kit.Keep vias free of solder.
22 J3, J4, J5, J6 4 6-pin receptacle, TH SAM1213-06-NDDNP: receptacles enclosed inkit.Keep vias free of solder.
23 TP1, TP2,TP3 3 Test point DNP, keep pads free of solder
24 BSL 1 10-pin connector, male, TH HRP10H-ND
25 JTAG 1 14-pin connector, male, TH HRP14H-ND
26 IC1 1 Socket:QFN-24B-0.5-0.1c Manuf. Enplas
27 IC1 1 MSP430FR2433IRGER DNP: Free samples can beordered in the TI Store
28 Q2 1 DNP: MS3V-TR1 (32,768kHz/20ppm/12,5pF) depends on application DNP: Micro Crystal, enclosed
in kit. Keep vias free of solder
29 D1 1 green LED, HSMG-C170DIODE0805 516-1434-1-ND Avago, Farnell 5790852
30 D3 1 red (DNP), DIODE0805 DNP
31 D2 1 yellow (DNP), DIODE0805 DNP
32 Rubber standoff 4 Buerklin: 20H1724 Apply to corners at bottom
side
Hardware www.ti.com
56 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.9 MSP-TS430DW28
ML
14
LE
D3
12
pF
12
pF
GN
D
GND
10
0n
F
56
0R
ML
10
JP
1Q
JP
1Q
10
uF
/10
V
50
K1
0n
F
0R
0R
0R
-
-0R
-
U1
SO
CK
28
DW
F1
23
FE
14
HF
E1
4L
0R
GN
D
rem
ove
R8
an
d a
dd
R9
(0 O
hm
)
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R11
an
d a
dd
R1
0 (0
Oh
m)
SM
D-F
oo
tprin
t
So
cke
t:Y
am
aic
hi
2.0
MS
P-T
S4
30
DW
28
Ta
rge
t So
cke
t DW
28
Typ
e: IC
18
9-0
28
2-0
42
If exte
rna
l su
pp
ly v
olta
ge
:
R1
, C1
, C2
no
t asse
mb
led
no
t asse
mb
led
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
D1
C2
C1
C5
R3
BO
OT
ST
12
34
56
78
91
0
1 2
J5
J4
12
C7
R5
C8
R6
R7
R8
R9
R1
0
R11
R1
12345678910
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
TS
T1
VC
C2
P2
.53
VS
S4
XO
UT
5
XIN
6
RS
T7
P2
.08
P2
.19
P2
.21
0P
2.3
19
P2
.42
0P
1.0
21
P1
.12
2P
1.2
23
P1
.32
4P
1.4
25
P1
.52
6P
1.6
27
P1
.72
8
P3
.011
P3
.11
2
P3
.21
3
P3
.31
4P
3.4
15
P3
.51
6P
3.6
17
P3
.71
8
U2
15
16
17
18
19
20
21
22
23
24
25
26
27
28
J2
J1
12345678910
11
12
13
14
R2
123
J3
Q1
QUARZ3
P1
.0
P1
.0
P1
.3
P1
.3
P1
.2
P1
.2
P1
.1
P1
.1R
ST
/NM
I
RS
T/N
MI
RS
T/N
MIRS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
K
TM
S
TM
S
TM
S
TD
I
TD
I
TD
I
TD
O
TD
O
TD
O
XO
UT
XO
UT
VC
C
GN
D
GN
D
GN
D
P2
.3
P2
.3
P2
.4
P2
.4
XIN
XIN
P2
.5
P2
.5
P2
.2
P2
.2P
2.1
P2
.1
P2
.0
P2
.0
TS
T/V
PP
TS
T/V
PP
TS
T/V
PP
P3
.0
P3
.0
P3
.1
P3
.1
P3
.2
P3
.2
P3
.3
P3
.3
P3
.7
P3
.7
P3
.6
P3
.6
P3
.5
P3
.5
P3
.4
P3
.4
VC
C4
30
Ext_
PW
R
Da
te:
11
/14
/20
06
1:2
6:0
4 P
MS
he
et:
1/1 R
EV
:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
DW
28
+
VC
C4
30
Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 57
Copyright © 2021 Texas Instruments Incorporated
Jumper J4Open to disconnect LED
Orient Pin 1 ofMSP430 device
Jumper J5Open to measure current
Connector J3External power connector
Remove R8 and jumper R9
D1LED connected to P1.0
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-19. MSP-TS430DW28 Target Socket Module, PCB
Hardware www.ti.com
58 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-10. MSP-TS430DW28 Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2, Cover holes whilesoldering
2 C5 1 100nF, SMD0805
3 C7 1 10uF, 10V Tantal Elko B
4 C8 1 10nF SMD0805
5 D1 1 LED3 T1 3mm yellow RS: 228-4991
6 Q1 0 QUARZ, CrystalMicro Crystal MS1V-T1K32.768kHz, C(Load) =12.5pF
DNP: Cover holes while soldering
7 J1, J2 2 14-pin header, TH male
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle
7.1 2 14-pin header, TH female
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle
8 J3 1 3-Pin Connector, male
9 J4, J5 2 2-Pin Connector, male With jumper
10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering
11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121
12R1, R2, R6,R7, R8,R9,R10, R11
4 0R, SMD0805 DNP: R1, R2, R9, R10
13 R3 1 560R, SMD0805
14 R5 1 47K, SMD0805
15 U1 1 SOP28DW socket Yamaichi: IC189-0282-042
16 U2 0 TSSOP DNP
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 59
Copyright © 2021 Texas Instruments Incorporated
B.10 MSP-TS430PW28
12pF
12pF
GN
D
GN
D
100nF
33
0R
10uF
/10V
-
0R
GN
D
GN
D
gre
en
2.2
nF
47
kG
ND
0R
0R
33
0R
MS
P430F
12xx
If exte
rnal s
upply
volta
ge:
rem
ove R
11 a
nd a
dd R
10 (0
Ohm
)
3.1
MS
P-T
S4
30
PW
28
:
OT
S-2
8-0
.65-0
1S
ocket: E
npla
s
Vcc
int
ext
Targ
et S
ocket B
oard
for M
SP
430
's in
PW
28 p
ackage
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
JP
4 to
JP
9 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
4 to
JP
9 to
positio
n 1
-2
DN
P
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2C1
C4
R1
12
34
56
78
91
0
BO
OT
ST
C3
R2
R3
123
J5
JP
1
1 2 3
JP
2
1 212J
P3
D1
C5
R4
JP
4
1 2 3
JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2 3
JP
9
1 2 3
R5
R6
21
Q1
R7
J1
12345678910
11
12
13
14
J2
1 2 3 4 5 6 7 8 91
011
12
13
14
U1 TS
T1
VC
C2
P2
.53
VS
S4
XO
UT
5
XIN
6
RS
T7
P2
.08
P2
.19
P2
.21
0P
2.3
19
P2
.42
0P
1.0
21
P1
.12
2P
1.2
23
P1
.32
4P
1.4
25
P1
.52
6P
1.6
27
P1
.72
8
P3
.011
P3
.11
2
P3
.21
3
P3
.31
4P
3.4
15
P3
.51
6P
3.6
17
P3
.71
8
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
GN
D
VC
C430
VC
C430
P2.0
P1.1
P1.1
P3.3
P3.2
P3.1
P3.0
P2.2
P2.2
XIN
/P2.6
XIN
/P2.6
XO
UT
/P2.7
XO
UT
/P2.7
P2.1
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
P3.4
P3.5
P3.6
P3.7
P2.3
P2.4
P1.2
P1.3
P1.4
/TC
K
P1.4
/TC
K
P1.5
/TM
S
P1.5
/TM
S
P1.6
/TD
I
P1.6
/TD
I
P1.7
/TD
O
P1.7
/TD
O
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
P2.5
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
XT
LG
ND
Ext_
PW
R
+
Figure B-20. MSP-TS430PW28 Target Socket Module, Schematic
Hardware www.ti.com
60 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to measure current
Jumper JP3Open to disconnect LED
D1LED connected to P5.1
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Connector J5External power connectorJumper JP1 to “ext”
Figure B-21. MSP-TS430PW28 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 61
Copyright © 2021 Texas Instruments Incorporated
Table B-11. MSP-TS430PW28 Bill of MaterialsPos.(1) Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 , Cover holeswhile soldering
2 C3 1 10uF, 10V Tantal Elko B
3 C4 1 100nF, SMD0805
4 C5 0 2.2nF, SMD0805 DNP
5 D1 1 LED green SMD0603
6 Q1 0 QUARZ, Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF
DNP: Cover holes andneighboring holes whilesoldering
7 J1, J2 2 14-pin header, TH male
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.: Header: Receptacle
7.1 2 14-pin header, TH female
DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.: Header: Receptacle
8 J5, IP1 1 3-Pin Connector , male
8aJP1, JP4,JP5, JP6,
JP7, JP8, JP97 3-Pin Connector , male Jumper on Pos 1-2
9 JP2, JP3 2 2-Pin Connector , male with Jumper
10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 DNP: Cover holes whilesoldering
11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121
12 R1, R7 2 330R, SMD0805
12 R2, R3, R5,R6 0 0R, SMD0805 DNP
14 R4 1 47K, SMD0805
15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01
(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
Hardware www.ti.com
62 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.11 MSP-TS430PW28A
JTAG Mode selection:
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1
Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 63
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3Open to disconnect LED
D1LED connected to P1.0
Connector J5External power connectorJumper JP1 to "ext"
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)
Note
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. Ifthe board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0Ω) must be assembled, and R3 must be removed.
Hardware www.ti.com
64 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-12. MSP-TS430PW28A Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C5 1 2.2nF, SMD0805
3 C3 1 10uF, 10V, SMD0805
4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND
6 J1, J2 0 14-pin header, THDNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:(Header and Receptacle)
7
J5, JP1,JP4, JP5,JP6, JP7,JP8, JP9
8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 Placeon 1-2 on JP1
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND see Pos 7 an 8
10 JTAG 1 14-pin connector, male,TH HRP14H-ND
11 BOOTST 0 DNP Keep vias free of solder
12 Q1 0 CrystalMicro Crystal MS3V32.768kHz, C(Load) =12.5pF
DNP: keep vias free of solder
13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
14 R2, R3,R5,R6, 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas
17 PCB 1 63.5 x 64.8 mm 2 layers
18 Adhesiveplastic feet 4 Approximately 6mm width,
2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side
19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 65
Copyright © 2021 Texas Instruments Incorporated
B.12 MSP-TS430RHB32A
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
GN
D
0R
330R
2.2
nF
PWR3
GN
D
GN
D
0R
47K
470nF
100nF
100nF
10uF
GN
D
GND
20k/0
.1%
10k
10k
10k
10k
GN
DAV
SS
AVSS
10k
10k
10k
10k
GN
D
SA
M1
02
9-0
8-N
D1
-8
SA
M1
02
9-0
8-N
D9
-16
MS
P4
30
I20
40
TR
HB
QF
N11
T0
32
-00
3
SA
M1
02
9-0
8-N
D1
7-2
41
7-2
4
SA
M1
02
9-0
8-N
D2
5-3
2
1.0
for M
SP
43
0i2
04
0
MS
P4
30
:Ta
rge
t-So
cke
tM
SP
-TS
43
0R
HB
32
A
DN
P
<-
SB
W
<-
JTA
G
Vcc
int
ext
So
cke
t:Ya
ma
ich
iQ
FN
11
T0
32
-00
3
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
GR1
R3
C8
J51
2
3
JP
112
1
2
JP
2
R4
123
JP
4123
JP
9123
JP
8123
JP
7123
JP
6123 JP
5
R5
D1
C9
1 2 3
JP
3
C14
C13
C12
R2
R6
R8
R9
R10
R11
R12
R13
R14
12345678
J1
910
1112
13
14
15
16
J2
A0.0
+1
A0.0
-2
A1.0
+3
A1.0
-4
A2.0
+5
A2.0
-6
A3.0
+7
A3.0
-8
VR
EF
9
AV
SS
10
RO
SC
11
DV
SS
12
VC
C13
VC
OR
E14
P2.3
/VM
ON
IN28
P2.2
/TA
1.2
27
P2.1
/TA
1.1
26
P2.0
/TA
1.0
/CLK
IN25
P1.7
/UC
B0S
DA
/UC
B0S
IMO
/TA
1C
LK
24
P1.6
/UC
B0S
CL/U
CB
0S
OM
I/TA
0.2
23
P1.5
/UC
B0C
LK
/TA
0.1
22
P1.4
/UC
B0S
TE
/TA
0.0
21
P1
.3/U
CA
0T
XD
/UC
A0S
IMO
/TA
0C
LK
/TD
O/T
DI
20
P1.2
/UC
A0R
XD
/UC
A0S
OM
I/AC
LK
/TD
I/TC
LK
19
P1.1
/UC
A0C
LK
/SM
CLK
/TM
S18
P1.0
/UC
A0S
TE
/MC
LK
/TC
K17
TE
ST
/SB
WT
CK
16
RS
T/N
MI/S
BW
TD
IO15
U1
P2.4
/TA
1.0
29
P2.5
/TA
0.0
30
P2.6
/TA
0.1
31
P2.7
/TA
0.2
32
17
18
19
20
21
22
23
24
J3
25
26
27
28
29
30
31
32
J4
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
TD
O
VC
C
GN
D
GN
D
P1
.4
P1
.4
DV
CC
DV
CC
DV
CC
AV
SS
M
M
I
I
O
O
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
KC
CT
ES
T/S
BW
TC
K
TE
ST
/SB
WT
CK
VC
OR
E
A0
.0+
A0
.0-
A1
.0+
A1
.0-
VR
EF
RO
SC
RS
T
RS
T
RS
T
A2
.0+
A2
.0-
A3
.0+
A3
.0-
P1
.5P
1.6
P1
.7
P2
.0P
2.1
P2
.2P
2.3
P2
.4P
2.5
P2
.6P
2.7
Figure B-24. MSP-TS430RHB32A Target Socket Module, Schematic
Hardware www.ti.com
66 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Orient Pin 1 of MSP430 device
D1LED connected to P1.4
Jumper JP1Open to measure current
Connector J5External power connectorJumper JP3 to “ext”
Connector JTAGFor JTAG Tool
Jumper JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumper JP2Open to disconnect LED
P1
.4
14
1
2
GN
D
GN
D
VC
C
12
3
123
15
8
916
17
24
20
25 3230
Vccext int
MS
P-T
S4
30
RH
B3
2A
Re
v.:1
.0R
oH
S
SBWJTAG
1
Cu
rr.M
ea
s.
JTA
G
R1
R3
C8
J5
JP
1
JP
2
R4
JP
4
JP
9
JP
8
JP
7
JP
6
JP
5
R5
D1
C9
JP
3
C1
4
C13
C12
R2
R6
R8
R9
R10
R11
R12
R13
R14
J1
J2
U1
J3
J4
12
3
12
3
12
3
12
3
12
3
Figure B-25. MSP-TS430RHB32A Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 67
Copyright © 2021 Texas Instruments Incorporated
Table B-13. MSP-TS430RHB32A Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 PCB 1 76.9 x 67.6 mm MSP‐TS430RHB32A Rev. 1 2 layers, red solder mask
2 D1 1 green LED, DIODE0805 P516TR‐ND
3 JP1, JP2 2 2‐pin header, male, TH SAM1035‐02‐ND place jumper on header
4 JP3, JP4,JP5, JP6,JP7, JP8, JP9
7 3‐pin header, male, TH SAM1035‐03‐ND place jumpers on pins 1‐2(SBW)
5 R1, R4 2 0R, 0805 541‐0.0ATR‐ND
6 C8 1 2.2nF, CSMD0805 490‐1628‐2‐ND DNP
7 R6, R8, R9,R10, R11,R12, R13,R14
8 10k, 0805 311‐10KARTR‐ND DNP
8 C12 1 10uF, CSMD0805 445‐1371‐2‐ND
9 R2 1 20k/0.1%, 0805 P20KDACT‐ND
10 R5 1 47K, 0805 311‐47KARTR‐ND
11 C13, C14 2 100nF, CSMD0805 311‐1245‐2‐ND
12 R3 1 330R, 0805 541‐330ATR‐ND
13 C9 1 470nF, CSMD0805 445‐1357‐2‐ND
14 J1, J2, J3, J4 1 8‐pin header, TH SAM1029‐08‐ND DNP: headers andreceptacles, enclosed with kit.Keep vias free of solder.
15 J1, J2, J3, J4 1 8‐pin receptable, TH SAM1213‐08‐ND DNP: headers andreceptacles, enclosed with kit.Keep vias free of solder.
16 JTAG 1 14‐pin connector, male, TH HRP14H‐ND
17 U1 1 Socket QFN11T032‐003 Manuf.: Yamaichi
18 U1 1 MSP430i2041TRHB DNP: enclosed with kit.Is supplied by TI
19 J5 1 3‐pin header, male, TH SAM1035‐03‐ND
20 Rubber standoff
4 Buerklin: 20H1724 apply to corners at bottomside
Hardware www.ti.com
68 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.13 MSP-TS430DA38
12
pF
12
pF
GN
D
GN
D
10
0n
F
560R
10
uF
/10
V
47k
10nF
-
0R
GN
D
MS
P4
30
F2
27
4ID
A
GN
D330R
GN
D
ye
llow
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R11
an
d a
dd
R1
0 (0
Oh
m)
IC1
89
-03
82
-03
7
So
cke
t:
4-w
ire J
TA
G:
2-w
ire "S
pyB
iWire
":
JTA
G-M
od
e s
ele
ctio
n:
Se
t jum
pe
rs J
P4
to J
P9
to p
ositio
n 2
-3
Se
t jum
pe
rs J
P4
to J
P9
to p
ositio
n 2
-1
JTA
G ->
SB
W ->
Ya
ma
ich
i
DN
P
DN
P
DN
PD
NP
DN
P
DN
P
DN
P
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2C1
C5
R3
12
34
56
78
910
BO
OT
ST
C7
R5
C8
R10
R11
123
J3
Q1
TE
ST
/SB
WT
CK
1
P3.5
26
P3.6
27
P1.4
/TC
K35
RS
T/S
BW
DA
T7
DV
CC
2
DV
SS
4
P4.7
24
P3.7
28
AV
SS
15
AV
CC
16
P3.0
11
P3.1
12
P3.2
13
P3.3
14
P4.0
17
P4.1
18
P4.2
19
P3.4
25
P2.5
3
P2.4
30
P2.3
29
P2.2
10
P2.1
9P
2.0
8
P1.5
/TM
S36
P1.6
/TD
I37
P1.7
/TD
O38
P2.7
5
P2.6
6
P4.6
23
P4.5
22
P4.4
21
P4.3
20
P1.0
31
P1.1
32
P1.2
33
P1.3
34
U1
JP
1
1 2 3
JP
2
1 2
12J
P3
1 2 3JP
4JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2 3
R1
JP
9
1 2 3
2345678910
11
12
13
14
15
16
17
18
19
1
J1
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
20
J2
D1
P1
.0
P1
.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
GN
D
GN
DV
CC
43
0
VC
C4
30
VC
C4
30
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
P2
.5
P2
.0P
2.1
P3
.0P
3.1
P3
.2P
3.3
P4
.0P
4.1
P4
.2
P1
.7/T
DO
P1
.7/T
DO
P1
.6/T
DI
P1
.6/T
DI
P1
.5/T
MS
P1
.5/T
MS
P1
.4/T
CK
P1
.4/T
CK
P1
.3P
1.2
P1
.1
P1
.1
P2
.4P
2.3
P3
.7P
3.6
P3
.5P
3.4
P4
.7P
4.6
P4
.5P
4.4
P4
.3
P2
.7/X
OU
T
P2
.7/X
OU
T
P2
.6/X
IN
P2
.6/X
IN
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
P2
.2
P2
.2
Ext_
PW
R
Date
:6/1
8/2
008 1
1:0
4:5
6A
MS
heet:
1/1 R
EV
:
TIT
LE
:
Docum
ent N
um
ber:
MS
P-T
S430D
A38
+
1.3
MS
P-T
S430D
A38:
Vcc
int
ext
Ta
rge
t So
cke
t Bo
ard
for M
SP
43
0F
22
47
IDA
Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 69
Copyright © 2021 Texas Instruments Incorporated
Orient pin 1 of MSP430 device
D1LED connected to P1.0
Connector J3External power connector
Jumper JP1 to "ext"
Jumper JP3Open to disconnect LED
Jumper JP2Open to measure current
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-27. MSP-TS430DA38 Target Socket Module, PCB
Hardware www.ti.com
70 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-14. MSP-TS430DA38 Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 0 2.2nF, SMD0805 DNP
5 D1 1 green LED, SMD0603 475-1056-2-ND
6 J1, J2 0 19-pin header, TH
DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.
SAM1029-19-ND : HeaderSAM1213-19-ND : Receptacle
7
"J3, JP1, JP4,JP5, JP6,JP7, JP8,
JP9"
8 3-pin header, male, TH SAM1035-03-NDPlace jumpers on headersJP1, JP4,JP5, JP6, JP7, JP8,JP9; Pos 1-2
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1-2
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
12 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND
14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi
17 PCB 1 67 x 66 mm 2 layers
18 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons
Part No. SJ-5302Apply to corners at bottomside
19 MSP430 2 MSP430F2274IDA DNP: enclosed with kitsupplied by TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 71
Copyright © 2021 Texas Instruments Incorporated
B.14 MSP-TS430QFN23x0
Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic
Hardware www.ti.com
72 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
D1LED connected to P1.0
Connector J5External power connectorJumper JP1 to "ext"
Jumper JP3Open to disconnect LED
Jumper JP2Open to measure current
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. Ifthe board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0Ω) must be assembled, and R3 must be removed.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 73
Copyright © 2021 Texas Instruments Incorporated
Table B-15. MSP-TS430QFN23x0 Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C4 1 100nF, SMD0805 478-3351-2-ND
4 C5 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND
6 J1, J2, J3, J4 0 10-pin header, TH
DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.
SAM1034-10-ND : HeaderSAM1212-10-ND : Receptacle
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1;Pos 1-2.
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
12 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
13 R1 1 330 Ω, SMD0805 541-330ATR-ND
14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
17 PCB 1 79 x 66 mm 2 layers
18 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons
Part No. SJ-5302Apply to corners at bottomside
19 MSP430 2 MSP430F2370IRHA DNP: enclosed with kitsupplied by TI
Hardware www.ti.com
74 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.15 MSP-TS430RSB40
Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 75
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3Open to disconnect LED
D1LED connected to P1.0
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector J5External power connectorJumper JP1 to "ext"
Connector JTAGFor JTAG Tool
Connector BOOTSTFor ToolBootloader
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. Ifthe board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0Ω) must be assembled, and R3 must be removed.
Hardware www.ti.com
76 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-16. MSP-TS430RSB40 Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
2 C3, C7, C10,C12 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12
3 C4, C6, C8,C11 3 100nF, SMD0805 311-1245-2-ND DNP C11
4 C5 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 10-pin header, TH
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.: Header: Receptacle
7.1 4 10-pin header, TH
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.: Header: Receptacle
8JP1, JP4,JP5,JP6, JP7, JP8,JP9, J5, JP10
9 3-pin header, male, TH SAM1035-03-ND Jumper: 1-2 on JP1, JP10; 2-3on JP4-JP9
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder
12 U1 1 QFN-40B-0.4_ENPLAS_SOCKET Enplas
13 Q1 0 Crystal Micro Crystal MS3V-T1R32.768kHz, C(Load) = 12.5pF
DNP: Q1. Keep vias free ofsolder
15 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8, JP9, JP10
16 R1,R7 2 330R SMD0805
17R2, R3, R5,R6, R8, R9,
R103 0R SMD0805 DNP R2, R3, R5, R6
18 R4 1 47k SMD0805
19 MSP430 2 MSP430F5132 DNP: enclosed with kit. Issupplied by TI
20 Rubber standoff 4 select appropriate; for example,
Buerklin: 20H1724 apply to corners at bottom side
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 77
Copyright © 2021 Texas Instruments Incorporated
B.16 MSP-TS430RHA40A
Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic
Hardware www.ti.com
78 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to measure current
Connector J5External power connectorJumper JP1 to "ext"
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
Jumper JP3Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor ToolBootloader
Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 79
Copyright © 2021 Texas Instruments Incorporated
Table B-17. MSP-TS430RHA40A Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
2 C5 0 2.2nF, SMD0805 DNP C12
3 C3, C7 2 10uF, 10V, SMD0805 5 DNP C11
4 C4, C6 2 100nF, SMD0805 478-3351-2-ND
5 C9 1 470nF, SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3,J4 4 10-pin header, TH
DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle
7.1 4 10-pin header, TH
DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle
8
J5, JP1,JP4, JP5,JP6, JP7,JP8, JP9
8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9; Placeon 1-2 on JP1
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 9 Jumper 15-38-1024-ND see Pos 8 an 9
11 JTAG 1 14-pin connector, male,TH HRP14H-ND
12 BOOTST 0 10-pin connector, male,TH DNP. Keep vias free of solder
13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
14 Q1 0 CrystalMicro Crystal MS3V-T1R
32.768kHz, C(Load) =12.5pF
DNP: Q1. Keep vias free of solder
15 R1,R7 2 330R SMD0805 541-330ATR-ND
16 R2, R3, R5,R6, R8, R9, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6
17 R4 1 47k SMD0805
18 PCB 1 79 x 66 mm 2 layers
19 Rubberstand off 4
select appropriate;for example, Buerklin:
20H1724apply to corners at bottom side
20 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI
Hardware www.ti.com
80 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.17 MSP-TS430DL48
ML
14
LE
D3 1
2p
F
12
pF
GN
D
GND
10
0n
F
560R
ML
10
JP
1Q
JP
1Q
10
uF
/10
V
47K
10nF
0R
0R
GN
D
0R
0R
10
uF
/10
V
GN
D
IC51-1
387.K
S-1
5186
100nF
1.3
MS
P-T
S430D
L48
Targ
et S
ocket D
L48
Q1
, C1
, C2
no
t asse
mb
led
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
D1
C2
C1
C5
R3
BO
OT
ST
12
34
56
78
910
1 2
J5
J4
12
C7
R5
C8
R6 R
7
123
J3
Q1
QUARZ3
J2
135
24679
810
11
13
15
12
14
16
17
19
18
20
21
23
22
24
135
24679
810
11
13
15
12
14
16
17
19
18
20
21
23
22
24
J1
R12
R4
JP
1
1 2 3
123
JP
2
C4
U1
TD
O/T
DI
1
TD
I/TC
LK
2
TM
S3
TC
K4
RS
T/N
MI
5
DV
CC
6
DV
SS
7
XIN
8
XO
UT
9
AV
SS
10
AV
CC
11
VR
EF
+12
P6.0
13
P6.1
14
P6.2
15
P6.3
16
P6.4
17
P6.5
18
P6.6
19
P6.7
20
P2.5
39
P2.4
40
P2.3
41
P2.2
42
P2.1
43
P2.0
44
CO
M0
45
P5.2
46
P5.3
47
P5.4
48
LC
DR
EF
29
LC
DC
AP
30
P5.1
31
P5.0
32
P5.5
33
P5.6
34
P5.7
35
S5
36
P2.7
37
P2.6
38
P1.7
21
P1.6
22
P1.5
23
P1.4
24
P1.0
28
P1.1
27
P1.2
26
P1.3
25
C3
P1
.0
P1
.0
RS
T/N
MI
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
K
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
XO
UT
XO
UT
GN
D
GN
DG
ND
XIN
XIN
BS
L_
TX
VC
C
BS
L_
RX
Ext_
PW
R
Date
:11/1
4/2
006 1
:24:4
4 P
MS
heet:
1/1 R
EV
:
TIT
LE
:
Docum
ent N
um
ber:
MS
P-T
S430D
L48
+
+
Vcc
ext
int
int
ext Vcc
Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 81
Copyright © 2021 Texas Instruments Incorporated
Jumper J4Open to disconnect LED
D1LED connected to P1.0
Orient pin 1 of MSP430 device
Jumper J5Open to measure current
Connector J3External power connector
Jumper JP2 to "ext"
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP21-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Figure B-35. MSP-TS430DL48 Target Socket Module, PCB
Hardware www.ti.com
82 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-18. MSP-TS430DL48 Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C3, C5 2 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND
6 J1, J2 0 24-pin header, TH
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.
SAM1034-12-ND : HeaderSAM1212-12-ND : Receptacle
7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1;Pos 1-2. DNP: JP2
8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
12 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
13 R3 1 560 Ω, SMD0805 541-560ATR-ND
14 R4, R6, R7,R12 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC51-1387 KS-15186 Manuf.: Yamaichi
17 PCB 1 58 x 66 mm 2 layers
18 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons
Part No. SJ-5302Apply to corners at bottomside
19 MSP430 2 MSP430F4270IDL DNP: Enclosed with kitsupplied by TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 83
Copyright © 2021 Texas Instruments Incorporated
B.18 MSP-TS430PT48
Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic
Hardware www.ti.com
84 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector JTAGFor JTAG tool
Connector BSLFor bootloader tool
Jumper J11-2 (Debugger): Power supply from JTAG interface
2-3 (External): External power supply
Connector J2External power connector
Jumper J1 to External
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP1Open to measure current
BSL Interface SwitchesSelect which BSL interface toconnect to connector BSL
I2C pullup enable switchSwitch on to connectI2C pullup resistors
Orient pin 1 of MSP430 device
Jumpers JP11 and JP12Open to disconnect LEDs D1 and D2
D1, D2LEDs connected to P1.0, P1.1
Figure B-37. MSP-TS430PT48 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 85
Copyright © 2021 Texas Instruments Incorporated
Table B-19. MSP-TS430PT48 Bill of MaterialsRef Des No. per
Board Value Description PackageReference Part Number Manufacturer
!PCB 1 Printed circuit board MCU061 Any
BSL 1 Header(Shrouded),2.54mm, 5x2, Gold, TH
Header, 2.54mm,5x2, TH AWHW-10G-0202-T Assman WSW
C5 1 1100pF CAP, CERM, 1100 pF, 50V, +/- 5%, C0G/NP0, 0805 0805 GRM2165C1H112JA01D MuRata
C6 1 0.1uF CAP, CERM, 0.1 µF, 50 V,+/- 10%, X7R, 0805 0805 GRM21BR71H104KA01L MuRata
C7 1 10uF CAP, CERM, 10 µF, 16 V,+/- 10%, X5R, 0805 0805 0805YD106KAT2A AVX
D1 1 Green LED, Green, SMD LED_0805 APT2012LZGCK Kingbright
D2 1 Blue LED, Blue, SMD LED_0805 150080BS75000 Wurth Elektronik
H5, H6, H7,H8 4 Bumpon, Cylindrical,
0.312 X 0.200, Black Black Bumpon SJ61A1 3M
IC1 1 Socket, QFP-48, 0.5 mmPitch
Socket, QFP-48,0.5 mm Pitch IC357-0484-142P-2 Yamaichi
Electronics
J1, J2, JP5,JP6, JP7,JP8, JP9,
JP10
8 Header, 100mil, 3x1, Gold,TH 3x1 Header TSW-103-07-G-S Samtec
J3, J4, J5,J6 4 Header, 100mil, 12x1,
Gold, TH 12x1 Header TSW-112-07-G-S Samtec
J3A, J4A,J5A, J6A 4 Receptacle, 2.54mm,
12x1, Gold, THReceptacle,2.54mm, 12x1, TH PPPC121LFBN-RC Sullins Connector
Solutions
JP1, JP11,JP12 3 Header, 100mil, 2x1, Gold,
TH 2x1 Header TSW-102-07-G-S Samtec
JTAG 1 Header (shrouded), 100mil, 7x2, Gold, TH
7x2 ShroudedHeader SBH11-PBPC-D07-ST-BK Sullins Connector
Solutions
R1 1 330 RES, 330, 5%, 0.125 W,0805 0805 CRCW0805330RJNEA Vishay-Dale
R2 1 200 RES, 200, 5%, 0.125 W,0805 0805 CRCW0805200RJNEA Vishay-Dale
R3, R10,R19, R20,
R215 0 RES, 0, 5%, 0.125 W,
0805 0805 CRCW08050000Z0EA Vishay-Dale
R7 1 47k RES, 47 k, 5%, 0.125 W,0805 0805 CRCW080547K0JNEA Vishay-Dale
R16, R17 2 4.7k RES, 4.7 k, 5%, 0.125 W,0805 0805 CRCW08054K70JNEA Vishay-Dale
SH-J1, SH-JP1, SH-JP5, SH-JP6, SH-JP7, SH-JP8, SH-JP9, SH-JP10, SH-JP11, SH-
JP12
10 1x2 Shunt, 100mil, Goldplated, Black Shunt
SNT-100-BK-GAlternate part number:969102-0000-DA
Samtec
SW1, SW2 2 Switch, SPST-NO, Off-Mom, 0.02 A, 15 VDC, TH 6x6mm EVQ-11A04M Panasonic
SW3, SW4,SW5 3 Switch, DPST, Slide, Off-
On, 1 Pos, 0.15A, 30V, TH 9.65x7.12mm 78F01T Grayhill
C8, C9 0 12pF CAP, CERM, 12 pF, 50 V,+/- 5%, C0G/NP0, 0805 0805 C0805C120J5GACTU Kemet
Hardware www.ti.com
86 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-19. MSP-TS430PT48 Bill of Materials (continued)Ref Des No. per
Board Value Description PackageReference Part Number Manufacturer
FID1, FID2,FID3 0 Fiducial mark. There is
nothing to buy or mount. N/A N/A N/A
Q1A 0 Crystal, 4MHz, 18 pF, TH 11.5x5mm 9B-4.000MAAJ-B TXC Corporation
Q1B 0 Crystal, 32.768 kHz,12.5pF, SMD
1.4x1.4x5.0mmSMD
MS3V-T1R 32.768KHZ+/-20PPM 12.5PF Micro Crystal AG
R4, R8, R9 0 0 RES, 0, 5%, 0.125 W,0805 0805 CRCW08050000Z0EA Vishay-Dale
R13 0 47k RES, 47 k, 5%, 0.125 W,0805 0805 CRCW080547K0JNEA Vishay-Dale
TP1, TP2,TP3, TP4 0 Black Test Point, Miniature,
Black, THBlack miniaturetestpoint 5001 Keystone
TP5, TP6 0 Test Point, Miniature,Black, TH
Black miniaturetestpoint 5001 Keystone
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 87
Copyright © 2021 Texas Instruments Incorporated
B.19 MSP-TS430PT48A
1 1
2 2
3 3
4 4
5 5
6 6
DD
CC
BB
AA
12
9/1
2/2
018
MC
U046A
_S
chem
atic
.SchD
oc
SheetT
itle:
Siz
e:
Mod.D
ate
:
File
:S
heet:
ofB
http
://ww
w.ti.c
om
Conta
ct:
http
://ww
w.ti.c
om
/support
MS
P-T
S430P
T48A
Pro
jectT
itle:
Desig
ned
for:
Public
Rele
ase
Assem
bly
Varia
nt:
001
©T
exa
sIn
stru
ments
2018
Dra
wn
By:
Engin
eer:
M P
ridgen
Texas
Instru
ments
and/o
r its lic
ensors
do
notw
arra
nt th
eaccura
cy
or
com
ple
teness o
f this
specifi
catio
nor
any
info
rmatio
nconta
ined
there
in.Texas In
stru
ments
and/o
rits
licensors
do
not
warra
nt th
at th
is d
esig
nw
illm
eetth
especifi
catio
ns, w
illbe
suita
ble
for
your
applic
atio
nor
fit fo
r any p
artic
ula
r purp
ose,or
will opera
te in
an
imple
menta
tion.
Texas
Instru
ments
and/o
rits
licensors
do
notw
arra
ntth
atth
edesig
nis
pro
ductio
nw
orth
y.Y
ou
should
com
ple
tely
valid
ate
and
testyour d
esig
nim
ple
menta
tion
tocon
firm
the
syste
mfu
nctio
nality
for y
our
applic
atio
n.
Vers
ion
contro
ldis
able
dS
VN
Rev: M
CU
046
Num
ber:
Rev:
AT
ID#:
N/A
Ord
era
ble
:M
SP
-TS
430P
T48A
ext
int
VC
C
JTA
G->
SB
W->
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
GN
D
RS
T/S
BW
TD
IOP
1.7
/TD
OP
1.6
/TD
IP
1.5
/TM
SP
1.4
/TC
K
DV
SS
TM
ST
DI
TD
O/S
BW
TD
IO
VC
C
GN
D
GN
D
TE
ST
/SB
WT
CK
BS
L_R
XB
SL_T
X
DV
SS
P1.0
P4.7
DVCC
P4.0
GN
D
RS
T/S
BW
TD
IO
BS
L_S
CL
BS
L_S
DA
UA
RT
BS
LC
on
ne
ctio
n
I2C
Pu
llup
s
BS
LR
XB
SLT
XB
SL_T
XB
SL_R
X
BS
LS
CL
BS
LS
DA
BS
L_S
DA
BS
L_S
CL
DV
CC
VC
C C
urre
nt
Measure
ment
DV
CC
BS
LS
DA
BS
LS
CL
BS
L_T
X
BS
L_R
X
BS
L_S
DA
BS
L_S
CL
RS
T/N
MI
TC
K/S
BW
TC
K
Ext_
PW
R
I2C
BS
LC
on
ne
ctio
n
VC
C
DV
CCD
VS
S
P1.4
/TC
KP
1.5
/UC
A0R
XD
/UC
A0S
OM
I/TA
1.1
/TM
S/A
5P
1.5
/TM
SP
1.4
/UC
A0T
XD
/UC
A0S
IMO
/TA
1.2
/TC
K/A
4/V
RE
F+
P1.7
/TD
OP
1.7
/UC
A0S
TE
/SM
CLK
/TD
O/A
7P
1.6
/UC
A0C
LK
/TA
1C
LK
/TD
I/TC
LK
/A6
P1.6
/TD
I
P5.3
/UC
B1C
LK
/TA
3.0
/A10
P5.4
/UC
B1S
TE
/TA
3C
LK
/A11
P1.0
/UC
B0S
TE
/TA
0C
LK
/A0/V
ere
f+
RS
T/N
MI/S
BW
TD
IOD
VC
C
DV
SS
HF
GN
DC
onnectio
n b
yvia
XO
UT
_ext
XIN
_ext
P4.4
/UC
B1S
IMO
/UC
B1S
DA
/TB
0.6
/A9
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IOD
VC
C
DV
CC
X1
on
hard
ware
page
isin
clu
ded
loose
inth
ekit
and
isin
tended
to b
epopula
ted
on
Q1B
as
needed
P1.1/UCB0CLK/TA0.1/COMP0.0/A1P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2/Veref-P1.3/UCB0SOMI/UCB0SCL/MCLK/A3P2.2/ACLK/COMP0.1P4.5/UCB0SOMI/UCB0SCL/TA3.2P4.6/UCB0SIMO/UCB0SDA/TA3.1P5.5/UCB0CLK/TA2CLKP5.6/UCB0STE/TA2.0P5.7/TA2.1/COMP0.2P6.0/TA2.2/COMP0.3P3.0/TA2.2P3.3/TA2.1
TE
ST
/SB
WT
CK
P2.7
/UC
B1S
TE
P4.2
/TA
3C
LK
P4.1
/TA
3.0
P4.0
/TA
3.1
P3.7
/TA
3.2
DN
CP
2.6
/UC
A1T
XD
/UC
A1S
IMO
P2.5
/UC
A1R
XD
/UC
A1S
OM
IP
2.4
/UC
A1C
LK
P3.1
/UC
A1S
TE
P3.4
/TA
2C
LK
/CO
MP
0O
UT
P2.3
/TA
2.0
DVSSP2.1/XINP2.0/XOUTP5.2/UCA0TXD/UCA0SIMO/TB0.4P5.1/UCA0RXD/UCA0SOMI/TB0.3P5.0/UCA0CLK/TB0.2P4.7/UCA0STE/TB0.1P6.2/TB0.0P6.1/TB0CLKP3.6/UCB1SOMI/UCB1SCLP3.2/UCB1SIMO/UCB1SDAP3.5/UCB1CLK/TB0TRG
Ifexte
rnalsupply
volta
ge:
rem
ove
R3
and
add
R4
(0ohm
)
and
the
I2C
BS
Land
the
I2C
pull-u
ps
are
dis
connecte
d
By
defa
ult
the
UA
RT
BS
Lis
connecte
d
XO
UT
XIN
SW
2
SW
1
12pF
C8
DN
P
12pF
C9
DN
P
1 2
GN
D3
32.7
68kH
z
Q1B
DN
P
P4.3
/UC
B1S
OM
I/UC
B1S
CL/T
B0.5
/A8
P1.0
XINXOUT
XIN_extXOUT_ext
DVSS
P4.0
12
34
56
78
910
BS
L
1100pF
C5
10uF
C7
Gre
en
D1
Blu
e
D2 1 2 3
J1
1
2
3
J2
1 2 3
JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2 3
JP
9
1 2 3
JP
10
5 4 123678910
11
12
J3
DN
P
5
4
1
2
3
6
7
8
9
10
11
12
J4
DN
P
541 2 3 6 7 8 9
10 11
12
J5
DN
P
5
4
1
2
3
6
7
8
9
10
11
12
J6
DN
P
JP
1
JP
11
JP
12
12
34
56
78
910
11
12
13
14
JTA
G
Q1A
DN
P
330
R1
200
R2
0 R3
0 R4
DN
P
47k
R7
0 R8DN
P
0 R9DN
P
0 R10
47k
R13
DN
P
4.7
k
R16
4.7
k
R17
0 R19
0 R20
0 R21
12
34
SW
3
12
34
SW
4
12
34
SW
5
TP
1D
NP
TP
2D
NP
TP
3D
NP
TP
4D
NP
TP
5D
NP
TP
6
DN
P
48
14
45
17
42
20
39
23
26
29
32
35
15
16
46
47
43
44
21
22
40
41
37
38
25
28
31
30
34
36
27
33
11 8 5 2
13
18
19
24
12 9 67 3 1
10 4
49
IC1
1uF
C10
DN
P
DN
C
DV
SS
BS
LR
XB
SLT
X
BSLSCLBSLSDA
P4.7
Custo
mer N
ote
Popula
te e
ither Q
1A
(Hig
hS
peed)
or
Q1B
(Low
Speed,
32.7
68K
Hz)
cry
sta
l
Custo
mer N
ote
CO
NN
1-4
and
CO
NN
5-8
are
male
and
fem
ale
headers
inclu
ded
loose
inth
ekit
and
are
inte
nded
tobe
popula
ted
on
J3-6
as
needed
Custo
mer N
ote
0.1
uF
C6
Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic
Hardware www.ti.com
88 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector JTAG
For JTAG ToolConnector BSL
For Bootloader Tool
Jumper J1
1-2 (Debugger): Power supply from JTAG Interface
2-3 (External): External power supply
Connector J2
External power connector
Jumper J1 to External
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP1
Open to measure current
BSL Interface SwitchesSelect which BSL interface toconnect to connector BSL
I2C pullup enable switchSwitch On to connectI2C pullup resistors
Orient Pin 1 ofMSP430 device
Jumpers JP11 and JP12
Open to disconnect LEDs D1 and D2
D1, D2
LEDs connected to P1.0, P4.7
Figure B-39. MSP-TS430PT48A Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 89
Copyright © 2021 Texas Instruments Incorporated
Table B-20. MSP-TS430PT48A Bill of MaterialsRef Des Quantity Value Description Package
Reference Part Number Manufacturer
!PCB 1 Printed Circuit Board MCU046 Any
BSL 1 Header(Shrouded),2.54mm, 5x2, Gold, TH
Header, 2.54mm,5x2, TH AWHW-10G-0202-T Assman WSW
C5 1 1100pF CAP, CERM, 1100 pF, 50V, +/- 5%, C0G/NP0, 0805 0805 GRM2165C1H112JA01D MuRata
C6 1 0.1uF CAP, CERM, 0.1 uF, 16 V,+/- 10%, X7R, 0603 0603 C0603X104K4RACTU Kemet
C7 1 10uF CAP, CERM, 10 uF, 16 V,+/- 10%, X5R, 0805 0805 0805YD106KAT2A AVX
CONN1,CONN2,CONN3,CONN4
4 Header, 100mil, 12x1,Gold, TH 12x1 Header TSW-112-07-G-S Samtec
CONN5,CONN6,CONN7,CONN8
4 Receptacle, 2.54mm,12x1, Gold, TH
Receptacle,2.54mm, 12x1, TH PPPC121LFBN-RC Sullins Connector
Solutions
D1 1 Green LED, Green, SMD LED_0805 APT2012LZGCK Kingbright
D2 1 Blue LED, Blue, SMD LED_0805 150080BS75000 Wurth Elektronik
H1, H2, H3,H4 4 Bumpon, Cylindrical,
0.312 X 0.200, Black Black Bumpon SJ61A1 3M
IC1 1 Socket, QFP-48, 0.5 mmPitch, www.yamaichi.com
Socket, QFP-48,0.5 mm Pitch IC357-0484-142P-2 Yamaichi
Electronics
J1, J2, JP5,JP6, JP7,JP8, JP9,
JP10
8 Header, 100mil, 3x1, Gold,TH 3x1 Header TSW-103-07-G-S Samtec
JP1, JP11,JP12 3 Header, 100mil, 2x1, Gold,
TH 2x1 Header TSW-102-07-G-S Samtec
JTAG 1 Header (shrouded), 100mil, 7x2, Gold, TH
7x2 ShroudedHeader SBH11-PBPC-D07-ST-BK Sullins Connector
Solutions
R1 1 330 RES, 330, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW0805330RJNEA Vishay-Dale
R2 1 200 RES, 200, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW0805200RJNEA Vishay-Dale
R3, R10,R19, R20,
R215 0 RES, 0, 5%, 0.333 W,
AEC-Q200 Grade 0, 0805 0805 CRCW08050000Z0EAHP Vishay-Dale
R7 1 47k RES, 47 k, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW080547K0JNEA Vishay-Dale
R16, R17 2 4.7k RES, 4.7 k, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW08054K70JNEA Vishay-Dale
SH-J1, SH-JP1, SH-JP5, SH-JP6, SH-JP7, SH-JP8, SH-JP9, SH-JP10, SH-JP11, SH-
JP12
10 1x2 Shunt, 100mil, Goldplated, Black Shunt
SNT-100-BK-GAlternate part number:969102-0000-DA
Samtec
SW1, SW2 2 Switch, SPST-NO, Off-Mom, 0.02 A, 15 VDC, TH 6x6mm EVQ-11A04M Panasonic
Hardware www.ti.com
90 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-20. MSP-TS430PT48A Bill of Materials (continued)Ref Des Quantity Value Description Package
Reference Part Number Manufacturer
SW3, SW4,SW5 3 Switch, DPST, Slide, Off-
On, 1 Pos, 0.15A, 30V, TH 9.65x7.12mm 78F01T Grayhill
X1 1 Crystal, 32.768 kHz,12.5pF, SMD
1.4x1.4x5.0mmSMD
MS3V-T1R 32.768KHZ+/-20PPM 12.5PF Micro Crystal AG
C8, C9 0 12pF CAP, CERM, 12 pF, 50 V,+/- 5%, C0G/NP0, 0805 0805 C0805C120J5GACTU Kemet
C10 0 1uF CAP, CERM, 1 uF, 50 V,+/- 10%, X5R, 0603 0603 GRM188R61H105KAALD MuRata
FID1, FID2,FID3 0 Fiducial mark. There is
nothing to buy or mount. N/A N/A N/A
J3, J4, J5,J6 0 Header, 100mil, 12x1,
Gold, TH 12x1 Header TSW-112-07-G-S Samtec
Q1A 0 Crystal, 4 MHz, 18 pF, TH 11.5x5mm 9B-4.000MAAJ-B TXC Corporation
Q1B 0 Crystal, 32.768 kHz,12.5pF, SMD
1.4x1.4x5.0mmSMD
MS3V-T1R 32.768KHZ+/-20PPM 12.5PF Micro Crystal AG
R4, R8, R9 0 0 RES, 0, 5%, 0.333 W,AEC-Q200 Grade 0, 0805 0805 CRCW08050000Z0EAHP Vishay-Dale
R13 0 47k RES, 47 k, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW080547K0JNEA Vishay-Dale
TP1, TP2,TP3, TP4,TP5, TP6
0 Test Point, Miniature,Black, TH
Black MiniatureTestpoint 5001 Keystone
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 91
Copyright © 2021 Texas Instruments Incorporated
B.20 MSP-TS430RGZ48B
Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic
Hardware www.ti.com
92 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to disconnect LED
Connector J5External power connectorJumper JP3 to "ext"
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
Jumper JP1Open to measure current
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 93
Copyright © 2021 Texas Instruments Incorporated
Table B-21. MSP-TS430RGZ48B Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C12 3 10uF, 6.3V, SMD0805
4 C5, C11,C13, C14 4 100nF, SMD0805 311-1245-2-ND
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 D1 1 green LED, SMD0805 P516TR-ND
8 J1, J2, J3,J4 0 12-pin header, TH
SAM1029-12-ND(Header) SAM1213-12-ND(Receptacle)
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:
9 J5 1 3-pin header, male, TH
10
JP3, JP5,JP6, JP7,JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-NDplace jumpers on pins 2-3 on JP5, JP6,JP7, JP8, JP9, JP10 place jumpers onpins 1-2 on JP3,
11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11
13 JTAG 1 14-pin connector, male,TH HRP14H-ND
14 BOOTST 0 10-pin connector, male,TH "DNP Keep vias free of solder"
15 Q1 0 CrystalMicro Crystal MS3V-T1R32.768kHz, C(Load) =12.5pF
DNP: Q1 Keep vias free of solder
16 Q2 0 Crystal Q2: 4MHz Buerklin:78D134 DNP: Q2 Keep vias free of solder
17 Insulatingdisk to Q2 0 Insulating disk to Q2
http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121
18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
19
R1, R2, R4,R6, R8,R9,R10,R11, R12
3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
20 R5 1 47k Ω, SMD0805 541-47000ATR-ND
21 U1 1Socket:QFN11T048-008_A101121_RGZ48
Manuf.: Yamaichi
22 PCB 1 81 x 76 mm 2 layers
23 Adhesiveplastic feet 4 Approximately 6mm width,
2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side
24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI
Hardware www.ti.com
94 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.21 MSP-TS430RGZ48C
DN
P
DN
P
DN
P
GN
D
GN
D
100nF
330R
-0R
GN
D
GN
D
1.1
nF
47k
GN
D
0R 0R
0R
QU
AR
Z5
1uF
/10V
100nF
1uF
/10V
gre
en
DN
P
yello
w (D
NP
) DN
P
red (D
NP
)
0R
GN
D
DN
P
DN
P
0R0R
QUARZ5
EV
Q11
0R
DNP
DN
P
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
1.2
Ext_
PW
R
MS
P-T
S4
30
RG
Z4
8C
Vcc
int
ext
Targ
et S
ocket B
oard
for M
SP
430F
R58xx, F
R59xx IR
GZ
DN
PD
NP
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
JP
4 to
JP
9 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
4 to
JP
9 to
positio
n 1
-2
connectio
n b
y v
ia
DN
P
DN
P
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C4
R1
12
34
56
78
910
BO
OT
ST
R2R3
123
J2
J1
1 2 3
JP
1
1 2
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R5 R6
R7
Q1
C3
C6
C7
D1
R10
12J
P10
D2
R11
12J
P11
D3
R12
JP
2
1 2
C8
C9
R8R9
Q2
SV
4
12345678910
11
12
SV1
123456789
101112
SV
2
1 2 3 4 5 6 7 8 910
11
12
SV3
123456789101112
1_P
1.0
1
2_P
1.1
2
3_P
1.2
3
4_P
3.0
4
5_P
3.1
5
6_P
3.2
6
7_P
3.3
7
8_P
4.7
8
9_P
1.3
9
10_P
1.4
10
11_P
1.5
11
12_P
J.0
_T
DO
12
13_PJ.1_TDI13
14_PJ.2_TMS14
15_PJ.3/TCK15
16_P4.016
17_P4.117
18_P4.218
19_P4.319
20_P2.520
21_P2.621
22_TEST/SBWTCK22
23_RST/SBWTDIO23
24_P2.024
25_P
2.1
25
26_P
2.2
26
27_P
3.4
27
28_P
3.5
28
29_P
3.6
29
30_P
3.7
30
31_P
1.6
31
32_P
1.7
32
33_P
4.4
33
34_P
4.5
34
35_P
4.6
35
36_D
VS
S36
37_DVCC 3738_P2.7 3839_P2.3 3940_P2.4 40
41_AVSS 4142_HFXIN 42
43_HFXOUT 4344_AVSS 4445_LFXIN 45
46_LFXOUT 4647_AVSS 4748_AVCC 48
U1
SW
1
R13
TP2TP1
SW2
R14
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
P1.1
P1.1
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IORST/SBWTDIO
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
PJ.0
/TD
O
PJ.0
/TD
O
PJ.2
/TM
S
PJ.2/TMS
PJ.3
/TC
K
PJ.3/TCK
PJ.1
/TD
I
PJ.1/TDI
P1.2
P1.2
P2.0
P2.0
P2.1
P2.1
P1.3
P1.3
P1.4
P1.5
AVCC
AV
CC
AVSS
AV
SS
AVSS
AVSS
LF
XO
UT
LF
XIN
LF
GN
DH
FG
ND
HF
XO
UT
HF
XIN
P2.4P2.3P2.7DVCC
DV
CC
DV
CC
DVCC
DV
SS
DV
SS
P4.6
P4.5
P4.4
P1.7
P1.6
P3.7
P3.6
P3.5
P3.4
P2.2
P2.6P2.5P4.3P4.2P4.1P4.0
P4.7
P3.3
P3.2
P3.1
P3.0
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
1
TEST/SBWTCK
TE
ST
/SB
WT
CK
Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 95
Copyright © 2021 Texas Instruments Incorporated
Jumper JP1Open to measure current
Connector J2External power connectorJumper J1 to "ext"
Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Switch SW1Device reset
LEDs connected toP1.0, P1.1, P1.2 viaJP9, JP10, JP11(only D1 assembled)
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor ToolBootloader
Jumper J11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP2Analog/digital power
Switch SW2Connected to P1.3
HF ands LF oscillators with capacitorsand resistors to connect pinheads
1
Vccext
int
Vcc
GND
GND
JTAG
SBW
5
10
1520
25
30
35
40 45
RESET
Ext.Pwr.
PWR
DVCCAVCC
TCK TMS TDI TDO
RST/SBWTDIO TEST/SBWTCK
GND
GND
P1
.3
14
1
2
10
1
2
12
3
12
3
12
3
12
3
12
3
12
3
12
3
QFN11T048-008 A101121
Clamshell
MSP-TS430RGZ48CRev. 1.2 RoHS
Q2
Q1
P1
.0
P1
.1
P1
.2
JTA
G
C2
C1
C4
R1
BO
OT
ST
R2
R3
J2
J1
JP
1
JP
9
C5
R4
JP3JP4JP5JP6JP7JP8
R5
R6
R7
C3
C6
C7
D1
R1
0JP
10
D2
R11
JP
11
D3
R1
2
JP
2
C8
C9
R8
R9
U1
SW
1
R1
3
TP2
TP1
SW
2
R1
4
Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB
Note
LFOSC and HFOSC pins are swapped at SV1.42_HFXIN (pin 42) → SV1 (pin 7)43_HFXOUT (pin 43) → SV1 (pin 6)45_LFXIN (pin 45) → SV1 (pin 10)46_LFXOUT (pin 46) → SV1 (pin 9)
Hardware www.ti.com
96 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-22. MSP-TS430RGZ48C Bill of Materials
Pos Ref DesNumber
PerBoard
Description Digi-Key Part Number Comment
1 SV1, SV2, SV3,SV4
4 12-pin header, TH DNP: headers and receptacles enclosed with kit.Keep vias free of solder.
SAM1029-12-ND : Header
: Receptacle
1.1 SV1, SV2, SV3,SV4
4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.Keep vias free of solder.
: Header
SAM1213-12-ND : Receptacle
2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP
4 J1, JP3, JP4, JP5,JP6, JP7, JP8
7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
5 J2 1 3-pin header, male, TH SAM1035-03-ND
6 JP1, JP2, JP9, J1,JP3, JP4, JP5, JP6,JP7, JP8
10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,JP7, JP8
7 R2, R3, R5, R6, R8,R9, R10, R11, R14
9 DNP, 0805 DNP
8 R12, R13, R7 3 0R, 0805 541-000ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND
11 R4 1 47k, 0805 541-47000ATR-ND
12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND
13 R1 1 330R, 0805 541-330ATR-ND
14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP
16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
17 JTAG 1 14-pin connector, male, TH HRP14H-ND
18 Q1 1 DNP: MS3V-TR1 (32768kHz,20ppm, 12.5pF)
depends on application Micro Crystal, DNP, enclosed in kit, keep vias free ofsolder
19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder
20 U1 1 Socket: QFN11T048-008A101121-001
Manuf.: Yamaichi
20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.
21 D1 1 green LED, DIODE0805 P516TR-ND
22 D3 1 red (DNP), DIODE0805 DNP
23 D2 1 yellow (DNP), DIODE0805 DNP
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48CRev. 1.2
2 layers, black solder mask
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 97
Copyright © 2021 Texas Instruments Incorporated
B.22 MSP-TS430PM64
ML
14
LED3
0R
12pF
12pF
12pF
12pF
GN
D
GND
0R
100nF
560R
ML
10
JP1Q
JP
1Q
10uF/6,3V
10uF/10V
47K10nF
0R
0R
0R
-
-
0R
-
0R
0R
FE
16
-1-1
FE16-1-2
FE
16
-1-3
FE16-1-4
PWR3
GN
DG
ND
-
MS
P64P
M
not assembled
not a
ssem
ble
d
not a
ssem
ble
d
not a
ssem
ble
d
enhancement
reserved forfuture
JTA
G
1 3 5 7 9 11
13
2 4 6
12
148
10
D1
R2
C2
C1
C3
C4
R1
C5
R3
BO
OT
ST
12
34
56
78
910
J71 2
J6
12
C6
C7
R5C8
R6
R7
R8
R9
R10
R11
R12
R13
R14
12345678910
11
12
13
14
15
16
J1
J2
17181920212223242526272829303132
J3
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49505152535455565758596061626364
J4
J5123
R4
Q1
LFXTCLK
XTCLK
U2
DV
CC
234567XIN
XO
UT
10
11
12
13
14
15
16
17181920212223242526272829303132
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
4950515253
TDOTDI
TMSTCKRST
596061
AVSSDVSSAVCC
RS
T/N
MI
TC
KT
MS
TD
IT
DO
VC
C
Date
:3/1
4/2
006 1
0:4
6:3
0A
MS
heet:
1/1 R
EV
:
TIT
LE
:
Docum
ent N
um
ber:
MS
P-T
S430P
M64
+
+
1
MS
P-T
S430P
M64
Targ
et S
ocket P
M64
Ya
ma
ich
iIC
51
-06
44
-80
7
So
cke
t:
1.2
for F
14x a
nd F
41x
Op
en
J6
if LC
D
is c
on
ne
cte
d
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R8
an
d a
dd
R9
(0 O
hm
)
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R11
an
d a
dd
R1
0 (0
Oh
m)
Fo
r BS
Lu
sa
ge
ad
d:
R6
R7
R1
3 R
14
MS
P4
30
F1
4x : 0
0 o
pe
n o
pe
nM
SP
43
0F
41
x : o
pe
n o
pe
n 0
0
Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made.
Figure B-44. MSP-TS430PM64 Target Socket Module, Schematic
Hardware www.ti.com
98 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector J5External power connectionRemove R8 and jumper R9
D1LED connected to pin 12
Jumper J6Open to disconnect LED
Jumper J7Open to measure current
Orient Pin 1 ofMSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-45. MSP-TS430PM64 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 99
Copyright © 2021 Texas Instruments Incorporated
Table B-23. MSP-TS430PM64 Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 0 16-pin header, TH
DNP: Headers and receptaclesenclosed with kit.Keep vias freeof solder.
SAM1029-16-ND : HeaderSAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 2 Jumper 15-38-1024-ND Place on: J6, J7
12 JTAG 1 14-pin connector, male, TH HRP14H-ND
13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
14 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
15 R3 1 330 Ω, SMD0805 541-330ATR-ND
16
R1, R2, R4,R6, R7, R8,
R9, R10, R11,R12, R13, R14
3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R7, R9, R10, R11,R12, R13, R14
17 R5 1 47k Ω, SMD0805 541-47000ATR-ND
18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
19 PCB 1 78 x 75 mm 2 layers
20 Rubberstandoff 4 select appropriate Apply to corners at bottom side
21 MSP430 22 MSP430F2619IPMMSP430F417IPM
DNP: Enclosed with kit suppliedby TI
Hardware www.ti.com
100 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.23 MSP-TS430PM64A
0R
12
pF
12
pF
GN
D
GN
D
0R
10
0n
F
33
0R
10
uF
/6.3
V
0R
0R
0R
0R
PWR3
GN
D
47
k
2.2
nF
33
0R
GN
D
GN
D
10
0n
F
GN
D
0R
0R
MS
P-T
S4
30
PM
64
ATa
rge
t So
cke
t
DN
P
Yam
aic
hi
IC51-0
644-8
07
Socket:
DN
P
1.1
for F
41
52
Open J
P1 if L
CD
is c
onnecte
d
JTA
G ->
SB
W ->
DN
P
DN
P
DN
P
DN
PD
NP
DN
PD
NP
Vccext
int
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IOP
7.0
/TD
OP
7.1
/TD
IP
7.2
/TM
SP
7.3
/TC
K
AD
D L
CD
-CA
P!
DN
PDN
P
JTA
G
1 3 5 7 9 11
13
2 4 6
12
148
10
R2
C2
C1 R
1
C5
R3
BO
OT
ST
12
34
56
78
91
0
C6
R1
0R
11
R1
3R
14
12345678910
11
12
13
14
15
16
J1
17181920212223242526272829303132
J2
J3
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49505152535455565758596061626364
J4
J5123
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32313029282726252423222120191817
16 12345678911
12
13
14
15
10
64636261605958575655545352515049
21
Q1
R4
C3
1 2 3JP
4JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2 3
R6
JP
9
1 2 3
12
JP
1
JP
2
1 2
JP
3
1 2 3
D1
C4R
5
R7
RS
T/N
MI
TM
ST
DI
VC
C
GN
D XT
LG
ND
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
VC
C43
0
VC
C430
VC
C430
P5.1
P5.1 A
VC
C
AV
CC
AV
SS
AV
SS
P1.0
P1.1
XIN
XO
UT
A
AA
B
BB
C
C
D
D
E
E
F
F
Da
te:
3/2
9/2
011
3:0
7:0
2 P
MS
he
et:
1/1 R
EV
:
TIT
LE
:
Do
cu
me
nt N
um
be
r:
MS
P-T
S4
30
PM
64
A
+
TE
ST
/SB
WT
CK
RS
T/S
BW
TD
IO
If supplie
d lo
cally
: popula
te R
10 (0
R), re
move R
11
If supplie
d b
y in
terfa
ce: p
opula
te R
11 (0
R), re
move R
10
Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 101
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to measure current
Jumper JP1Open to disconnect LED
D1LED connected to P5.1
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Connector J5External power connectorJumper JP3 to "ext"
Figure B-47. MSP-TS430PM64A Target Socket Module, PCB
Hardware www.ti.com
102 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-24. MSP-TS430PM64A Bill of MaterialsPos. Ref Des No. per Board Description Digi-Key Part No. Comment
1 C1, C2, 0 12pF, SMD0805 DNP
2 C3 0 2.2nF, SMD0805 DNP
3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND
4 C4, C5 2 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND
6 J1, J2, J3, J4 0 16-pin header, TH
DNP: Headers and receptaclesenclosed with kit. Keep viasfree of solder.
SAM1029-16-ND : HeaderSAM1213-16-ND : Receptacle
7J5, JP3, JP4,
JP5, JP6, JP7,JP8, JP9
8 3-pin header, male, TH SAM1035-03-ND
8 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 2 Jumper 15-38-1024-ND Place on: J6, J7
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
12 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND
14R1, R2, R5,R7, R9, R10,
R11, R13, R142 0 Ω, SMD0805 541-000ATR-ND DNP: R5, R7, R9, R10, R11,
R13, R14
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
17 PCB 1 78 x 75 mm 4 layers
18 Rubber standoff 4 select appropriate Apply to corners at bottom side
19 MSP430 2 MSP430F4152IPM DNP: Enclosed with kit suppliedby TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 103
Copyright © 2021 Texas Instruments Incorporated
B.24 MSP-TS430PM64D
DN
P
DN
PD
NP
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
Socket:
Yam
aic
hi IC
51-0
644-8
07
12pF
12pF
100nF
33
0R
47
K
1.1nF
QUARZ5
10uF
/10V
0R
0R
LE
D_G
reen
33
0R
LE
D_G
reen
33
0R
LE
D_G
reen
EV
Q11
EV
Q11
MS
P430F
R413xIP
M / M
SP
430F
R203xIP
M
0R
0R
10
0n
F
10
0n
F
10
0n
F
10
0n
F
Ext_
PW
R
Vcc
ext
int
to m
easure
supply
curre
nt
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
J4 to
J9 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
4 to
JP
9 to
positio
n 2
-1
DN
P
DN
P
BS
LT
XB
SLR
X
MS
P-T
S430P
M64D
Targ
et S
ocket B
oard
for M
SP
430F
R413xIP
M a
nd M
SP
430F
R203xIP
M
1.0
Disconnect JP3 andJP4 before BSL use.
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C4
R1
R4
C5
123
J5
12J
P3
1 2
JP
2
JP
1
1 2 3
JP
10
1 2 3
JP
9
1 2 3
JP
8
1 2 3
JP
7
1 2 3
JP
6
1 2 3
JP
5
1 2 3
Q1
C3
12
34
56
78
91
0
BS
LR
10
R11
D1
R5
D2
R6
D3
SW
1
SW
2
P4
.7/R
13
1
P4
.6/R
23
2
P4
.5/R
33
3
P7.5/L5 59
DV
SS
8
DV
CC
9
TE
ST
/SB
WT
CK
111
RS
T/N
MI/S
BW
TD
IO1
0
P1.0/UCA0TXD/UCA0SIMO/A024P1.1/UCA0RXD/UCA0SOMI/A123P1.2/UCA0CLK/A222P1.3/UCA0STE/A321P1.4/MCLK/TCK/A420P1.5/TA0CLK/TMS/A519P1.6/TA0.2/TDI/TCLK/A618P1.7/TA0.1/TDO/A717
P7.1/L1 63
P7.2/L2 62
P7.3/L3 61
P7.4/L4 60
P7.0/L0 64
P4
.4/L
CD
C2
4
P4
.3/L
CD
C1
5
P4
.2/X
OU
T6
P4
.1/X
IN7
P4
.0/T
A1
.11
2
P8
.3/T
A1
.21
3
P8
.2/T
A1
CL
K1
4
P5.5/L3727
P5.4/L3628
P5.3/UCB0SOMI/UCB0SCL/L3529
P5.2/UCB0SIMO/UCB0SDA/L3430
P5.1/UCB0CLK/L3331
P5.0/UCB0STE/L3232
P3.0/L8 56
P3.1/L9 55
P3.2/L10 54
P3.3/L11 53
P3.4/L12 52
P3.5/L13 51
P3.6/L14 50
P3.7/L15 49
P6
.0/L
16
48
P6
.1/L
17
47
P6
.2/L
18
46
P6
.3/L
19
45
P6
.4/L
20
44
P6
.5/L
21
43
P2
.0/L
24
40
P2
.1/L
25
39
P2
.2/L
26
38
P2
.3/L
27
37
P2
.4/L
28
36
P2
.5/L
29
35
P2
.6/L
30
34
P2
.7/L
31
33
P8
.1/A
1C
LK
/A9
15
P8
.0/S
MC
LK
/A8
16
P5.6/L3826P5.7/L3925
P6
.6/L
22
42
P6
.7/L
23
41
P7.6/L6 58
P7.7/L7 57
U1
12345678910
11
12
13
14
15
16
J1
17181920212223242526272829303132
J2
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
J3
49505152535455565758596061626364
J4
R2
R3
C6
C7
C8
C9
TP2TP1
12J
P4
XO
UT
XO
UT
GND
GND
GN
D
XIN
XIN
VC
C
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
TC
K
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
VC
C430
VC
C430
P1.4
/TC
K
P1.4/TCK
P1.5
/TM
S
P1.5/TMS
P1.6
/TD
I
P1.6/TDI
P1.7
/TD
O
P1.7/TDO
TD
O/S
BW
TD
IO
RS
T/N
MI
TM
ST
DI
P1.0
P1.0
P1.0
P1.1
P1.1
P1.1
P1.2
P1.2
P1.3
P1.3
P4.7
P4.7
P4.6
P4.6
P4.5
P4.5
P4.4
P4.4
P4.3
P4.3
BS
LIn
terfa
ce
1 2 3 4 5 6
1 2 3 4 5 6
Tite
l:
Datu
m:
Seite
1/1
MS
P-T
S430P
M64D
9/3
/2014 3
:08:1
8 P
MA
3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Rev.:
Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic
Hardware www.ti.com
104 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
P1.2
P1.1
P1.0
P1.3
RESET
VCCint
ext
JTAG->
SBW->
MS
P-T
S4
30
PM
64
DR
ev.
1.0
Ro
HS
Cu
rr.
Me
as. GND
GND
Disconnect JP3 andJP4 before BSL use!
14
1
2
GND
GND
VCC
12
3
12
3
12
3
12
3
12
3
12
3
12
3
10
1
2
IC51-0644-807
Clamshell
116
510
32 17202530
33
48
35
40
45
49 6455 60
JTA
GC2
C1
C4
R1
R4 C5
J5
JP3
JP
2JP
1
JP
10
JP
9
JP
8
JP
7
JP
6
JP
5
Q1
C3
BS
L
R1
0
R11
D1
R5 D2
R6 D3
SW
1S
W2U1
J1
J2
J3
J4
R2
R3
C6
C7
C8
C9
TP2
TP1
JP4
Connector J5External power connector
Jumper JP1 to "ext"
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Switch SW1Device reset
Orient Pin 1 ofMSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP2Open to measure current
Switch SW2Connected to P1.3
Figure B-49. MSP-TS430PM64D Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 105
Copyright © 2021 Texas Instruments Incorporated
Table B-25. MSP-TS430PM64D Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white soldermask
2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
3 D1 1 Green LED, HSMG-C170,DIODE0805
516-1434-1-ND Avago, Farnell 5790852
4 D2, D3 2 LED, DIODE0805 DNP
5 JP2, JP3,JP4
3 2-pin header, male, TH SAM1035-02-ND place jumper on header
6 JP1, JP5,JP6, JP7,JP8, JP9,JP10
7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG)
7 R1 1 330R, 0805 541-330ATR-ND
8 R5, R6 2 330R, 0805 541-330ATR-ND DNP
9 R2, R3,R10, R11
4 0R, 0805 541-0.0ATR-ND DNP
10 R4 1 47K, 0805 311-47KARTR-ND
11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND
12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND
13 C4 1 100nF, CSMD0805 311-1245-2-ND
14 C6, C7, C8,C9
4 100nF, CSMD0805 311-1245-2-ND DNP
15 C5 1 1.1nF, CSMD0805 490-1623-2-ND
16 J1, J2, J3,J4
1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles,enclosed with kit. Keep vias freeof solder.
17 J1, J2, J3,J4
1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles,enclosed with kit. Keep vias freeof solder.
18 JTAG 1 14-pin connector, male, TH HRP14H-ND
19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi
20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Issupplied by TI.
21 J5 1 3-pin header, male, TH SAM1035-03-ND
22 Q1 1 Microcrystal 32768Hz, MS3V-T1R (32.768kHz, 20ppm, 12.5pF)
23 SW1, SW2 2 Panasonic EVQ11 P8079STB-ND DNP, Lacon: 1251459
24 Rubberstand off
4 Buerklin: 20H1724 apply to corners at bottom side
Hardware www.ti.com
106 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.25 MSP-TS430PM64F
DN
P
Socket:
Yam
aic
hi C
51-0
644-8
07
I2C
UA
RT
P1.7
P2.1
Jum
pers
JP
3 to
JP
8C
lose 1
-2 to
debug in
Spy-B
i-Wire
mode.
Clo
se 2
-3 to
debug in
4-w
ire J
TA
G m
ode.
BS
LTool S
ele
ct:
Open =
BS
LC
onnecto
rC
losed =
JTA
G C
onnecto
r
DN
P
DN
P
GN
D
GN
D
100nF
33
0R
0R0R
GN
D
GN
D
1.1
nF
47
kG
ND
0R 0R
QU
AR
Z5
1uF
/10V
100nF
1uF/10V
gre
en
DN
P
yello
w (D
NP
) DN
P
red (D
NP
)
0R
GN
DD
NP
DN
P
0R0R
QUARZ5
EV
Q11
0R
DNP
DN
P
100nF
GN
D
10
0nF
GN
D
4u
7
GN
D
MS
P4
30
FR
69
7X
PM
/RG
C
SAM1129-16-ND
SA
M1129-1
6-N
D
SAM1129-16-ND
SA
M1129-1
6-N
D
10
k1
0k
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R3
an
d a
dd
R2
(0 O
hm
)
Ext_
PW
R
MS
P-T
S4
30
PM
64
F
Vcc
int
ext
DN
PD
NP
DN
P
JTA
G ->
SB
W ->
DN
P
DN
P
1.0
DN
P
DN
PD
NP
connectio
n b
y v
ia
Ta
rge
t So
cke
t Bo
ard
for M
SP
43
0F
R6
97
x/6
87
x d
evic
es
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C9
C8
C4
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R9 R8
Q2
C3
C11
C7
D1
R1
0
12J
P10
D2
R11
12J
P11
D3
R1
2
1 2
JP
2
C1
C2
R6R5
Q1
SW
1
R1
3
TP2TP1
SW2
R1
4
C10
C6
C15
P4
.3/U
CA
0S
OM
I/UC
A0
RX
D/U
CB
1S
TE
/S4
1
P1
.4/U
CB
0C
LK
/UC
A0
ST
E/T
A1
.0/S
32
P1
.5/U
CB
0S
TE
/UC
A0
CL
K/T
A0
.0/S
23
P1
.6/U
CB
0S
IMO
/UC
B0
SD
A/T
A0
.1/S
14
P1
.7/U
CB
0S
OM
I/UC
B0
SC
L/T
A0
.2/S
05
R3
3/L
CD
CA
P6
P6
.0/R
23
7
P6
.1/R
13
/LC
DR
EF
8
P6
.2/C
OU
T/R
03
9
P6
.3/C
OM
01
0
P6
.4/T
B0
.0/C
OM
1/S
30
11
P6
.5/T
B0
.1/C
OM
2/S
29
12
P6
.6/T
B0
.2/C
OM
3/S
28
13
P3
.0/U
CB
1C
LK
/TA
3.2
/S2
71
4
P3
.1/U
CB
1S
IMO
/UC
B1
SD
A/T
A3
.3/S
26
15
P3
.2/U
CB
1S
OM
I/UC
B1
SC
L/T
A3
.4/S
25
16
DVSS117
DVCC118
TEST/SBWTCK19
RST/NMI/SBWTDIO20
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG121
PJ.1/TDI/TCLK/MCLK/SRSCG022
PJ.2/TMS/ACLK/SROSCOFF23
PJ.3/TCK/COUT/SRCPUOFF24
P3.3/TA1.1/TB0CLK/S2425
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2326
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2227
P3.6/UCA1CLK/TB0.2/S2128
P3.7/UCA1STE/TB0.3/S2029
P2.3/UCA0STE/TB0OUTH/S1930
P2.2/UCA0CLK/TB0.4/RTCCLK/S1831
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S1732
P2
.0/U
CA
0S
IMO
/UC
A0
TX
D/T
B0
.6/T
B0
CL
K/S
16
33
P7
.0/T
A0
CL
K/S
15
34
P7
.1/T
A0
.0/S
14
35
P7
.2/T
A0
.1/S
13
36
P7
.3/T
A0
.2/S
12
37
P7
.4/S
MC
LK
/S11
38
DV
SS
239
DV
CC
240
P1
.3/T
A1
.2/A
3/C
341
P1
.2/T
A1
.1/T
A0
CL
K/C
OU
T/A
2/C
242
P1
.1/T
A0
.2/T
A1
CL
K/C
OU
T/A
1/C
1/V
RE
F+
/VE
RE
F+
43
P1
.0/T
A0
.1/D
MA
E0
/RT
CC
LK
/A0
/C0
/VR
EF
-/VE
RE
F-
44
P9
.4/A
12
/C1
245
P9
.5/A
13
/C1
346
P9
.6/A
14
/C1
447
P9
.7/A
15
/C1
548
AVCC149
AVSS150
PJ.4/LFXIN51
PJ.5/LFXOUT52
AVSS253
PJ.7/HFXOUT54
PJ.6/HFXIN55
AVSS356
P5.7/UCA1STE/TB0CLK/S1057
P4.4/UCB1STE/TA1CLK/S958
P4.5/UCB1CLK/TA1.0/S859
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S760
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S661
DVSS362
DVCC363
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S564
U1
12345678910
11
12
13
14
15
16
J3
17181920212223242526272829303132
J433
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
J5
49505152535455565758596061626364
J6
12
JP
13
12
JP
14
12
JP
15
123
JP
16
1 2
JP17
1 2
JP18
R7
R1
5
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
P1.1
P1.1
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
PJ.0
/TD
O
PJ.0/TDO
PJ.2
/TM
S
PJ.2/TMS
PJ.3
/TC
K
PJ.3/TCK
PJ.1
/TD
I
PJ.1/TDI
P1.2
P1.2
P1.3
P1.3
AV
CC
AVCC
AV
SS
AVSS
AVSS
AVSS
HF
XO
UT
HF
XIN
HF
GN
D
LF
XIN
LF
XO
UT
DV
CC
DV
CC
DVCC
DVCC
DV
CC
DVCC
DV
CC
DV
CC
DV
SS
DVSS
DV
SS
DVSS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TEST/SBWTCK
TE
ST
/SB
WT
CK
LC
DC
AP
LC
DC
AP
RST/SBWTDIO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
ST
E
ST
E
RX
D/S
IMO
RX
D/S
IMO
TX
D/S
OM
I/SD
A
TX
D/S
OM
I/SD
A
SP
ICLK
/SC
L
SP
ICLK
/SC
LS
PIC
LK
/SC
L1
SP
ICLK
/SC
L1
RX
D/S
IMO
1
RXD/SIMO1
TX
D/S
OM
I/SD
A1
P1.6
P1.6
P2.0
P2.0
LF
GN
D
1 2 3 4 5 6
1 2 3 4 5 6
Title
:
Da
te:
Pa
ge
1/1
MS
P-T
S4
30
PM
64
F
10
/20
/20
14
4:3
8:5
3 P
MA
3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Re
v.:
Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 107
Copyright © 2021 Texas Instruments Incorporated
1412
1012
IC51-0644-807
Clamshell
15
10
15
2025303
54
04
5
50 55 60
R1
C11
D1
R1
0D
2
R11
D3
U1
J3
J4J5
J6
R7
R15
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
LEDs connected toP1.0, P1.1, P1.2 from
JP9, JP10, JP11(only D1 assembled)
Switch SW2Connected to P1.3
Switch SW1Device reset
Connector J2External power connector
Jumper J1 to “ext”
HF and LF oscillators with capacitorsand resistors to connect pinheads
Connector JTAGFor JTAG Tool
Connector BSLFor Bootloader
Jumper JP1, JP2Open to measure
digital or analog current
Jumper JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
BSL Tool SelectJumper JP13 to JP15Open = BSL ConnectorClose = JTAG Connector
Close JP17 and JP18to enable BSL pullups
BSL Interface SelectJumper J16
Close 1-2 for I CClose 2-3 for UART
2
Jumper Configuration UART BSL Configuration I C BSL Configuration2
JP17 and JP18 Open Close
JP16 Close 2-3 (UART) Close 1-2 (I2C)
This target board supports UART or I C BSL configuration. To select the configuration to use, set thejumpers as shown in the following table.
2
Figure B-51. MSP-TS430PM64F Target Socket Module, PCB
Hardware www.ti.com
108 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-26. MSP-TS430PM64F Bill of Materials (BOM)
Pos. Ref DesNumber
perBoard
Description DigiKey Part Number Comment
1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask
2 JP1, JP2, JP9, JP13,JP14, JP15, 6 2-pin header, male, TH SAM1035-02-ND place jumper on header
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only
4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
6 JP3, JP4, JP5, JP6,JP7, JP8, JP16 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
7 J2 1 3-pin header, male, TH SAM1035-03-ND
8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP
9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
12 C15 1 4u7, CSMD0805 445-1370-1-ND DNP
13 R7, R15 1 10k, 0805 541-10KATR-ND
14 R4 1 47k, 0805 541-47KATR-ND
15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND
16 R1 1 330R, 0805 541-330ATR-ND
17 R10, R11 2 330R, 0805 541-330ATR-ND DNP
18 R14 1 47k, 0805 541-47KATR-ND DNP
19 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND DNP: headers enclosed with kit.Keep vias free of solder.
23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND DNP: receptacles enclosed with kit.Keep vias free of solder.
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 BSL 1 10-pin connector, male, TH HRP10H-ND
26 JTAG 1 14-pin connector, male, TH HRP14H-ND
27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi
28 U1 2 MSP430FR6972IPMR DNP: enclosed with kit.Is supplied by TI.
29 Q1 1 DNP: MS3V-TR1(32,768kHz/ 20ppm/12,5pF) depends on application Micro Crystal, DNP, enclosed in kit,
keep vias free of solder
30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder
31 D1 1 green LED, HSMG-C170DIODE0805 516-1434-1-ND Avago, Farnell 5790852
32 D3 1 red (DNP), DIODE0805 DNP
33 D2 1 yellow (DNP), DIODE0805 DNP
34 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 109
Copyright © 2021 Texas Instruments Incorporated
B.26 MSP-TS430RGC64B
Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic
Hardware www.ti.com
110 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumper JP2Open to disconnect LED
Connector J5External power connectorJumper JP3 to "ext"Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to "ext"
Orient Pin 1 of MSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1Open to measure current
Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R11 or R12 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R12(0 Ω) must be assembled, and R11 must be removed.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 111
Copyright © 2021 Texas Instruments Incorporated
Table B-27. MSP-TS430RGC64B Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C10 3 10uF, 6.3V, SMD0805
4C5, C11,
C13, C14,C15
5 100nF, SMD0805 311-1245-2-ND
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
9 D1 1 green LED, SMD0805 P516TR-ND
10 J1, J2, J3, J4 0 16-pin header, THSAM1029-16-ND(Header) SAM1213-16-ND(Receptacle)
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:
11 J5 , J6 2 3-pin header, male, TH
12
JP3, JP5,JP6, JP7,JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-NDplace jumpers on pins 2-3 on JP5, JP6,JP7, JP8, JP9, JP10 place jumpers on pins1-2 on JP3,
13 JP1, JP2,JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
15 JTAG 1 14-pin connector, male, TH HRP14H-ND
16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"
17 Q1 0 CrystalMicro Crystal MS3V-T1R32.768kHz, C(Load) =12.5pF
DNP: Q1 Keep vias free of solder
18 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 DNP: Q2 Keep vias free of solder
19 Insulatingdisk to Q2 0 Insulating disk to Q2
http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121
20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
21
R1, R2, R4,R6, R8,
R9,R10, R11,R12
3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
22 R5 1 47k Ω, SMD0805 541-47000ATR-ND
23 U1 1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi
24 PCB 1 85 x 76 mm 2 layers
25 Adhesiveplastic feet 4 Approximately 6mm width,
2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side
26 D3,D4
27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI
Hardware www.ti.com
112 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.27 MSP-TS430RGC64CThe MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIOinput voltage supplied via header J6 (see Figure B-54). This development platform does not supply the 1.8-VDVIO rail on board and it MUST be provided by external power supply for proper device operation. For correctJTAG connection, programming, and debug operation, it is important to follow this procedure:
1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to0 V.
2. Enable the 1.8-V external DVIO power supply.3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-
FET430UIF JTAG debugger interface).4. Connect the MSP-FET430UIF JTAG connector to the target board.5. Start the debug session using IAR or CCS IDE.
For more information on debugging the MSP430F522x and MSP430F525x, see the device-specific data sheets(MSP430F522x and MSP430F525x) and Designing with MSP430F522x and MSP430F521x Devices.
For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain, short JP4with the jumper.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 113
Copyright © 2021 Texas Instruments Incorporated
1.1
MS
P-T
S4
30
RG
C6
4C
TI F
riesin
g
Tools
MS
P4
30
11
12
/14
/10
S.G
.
65
43
21
ABCD
ABCD
De
sig
n:
Ap
pr.:
Re
v.:
Co
mm
en
t:
Dra
win
g#
:R
evis
ion
:
Pa
ge
:F
ile:
Siz
e:
Title
of S
ch
em
atic
of
Me
nto
r Pa
ds L
og
ic V
9
Da
te:
Na
me
:
65
43
21
MS
P-T
S430R
GC
64C
.sch
<-- S
BW
<-- J
TA
G
ext
int
VC
C
DV
IO P
ow
er C
ircle
BS
L
1P
6.0
/CB
0/A
0
2P
6.1
/CB
1/A
1
3P
6.2
/CB
2/A
2
4P
6.3
/CB
3/A
3
5P
6.4
/CB
4/A
4
6P
6.5
/CB
5/A
5
7P
6.6
/CB
6/A
6
8P
6.7
/CB
7/A
7
9P
5.0
/A8/V
ER
EF
+
10
P5
.1/A
9/V
ER
EF
-
11
AV
CC
12
P5
.4/X
IN
13
P5.5
/XO
UT
14
AV
SS
15
DV
CC
16
DV
SS
17 VCORE
18 P1.0/TA0CLK/ACLK
19 P1.1/TA0.0
20 P1.2/TA0.1
21 P1.3/TA0.2
22 P1.4/TA0.3
23 P1.5/TA0.4
24 P1.6/TA1CLK/CBOUT
25 P1.7/TA1.0
26 P2.0/TA1.1
27 P2.1/TA1.2
28 P2.2/TA2CLK/SMCLK
29 P2.3/TA2.0
30 P2.4/TA2.1
31 P2.5/TA2.2
32 P2.6/RTCCLK/DMAE0
33
P2
.7/U
CB
0S
TE
/UC
A0C
LK
34
P3.0
/UC
B0S
IMO
/UC
B0S
DA
35
P3
.1/U
CB
0S
OM
I/UC
B0
SC
L
36
P3
.2/U
CB
0C
LK
/UC
A0S
TE
37
P3.3
/UC
A0T
XD
/UC
A0S
IMO
38
P3.4
/UC
A0R
XD
/UC
A0
SO
MI
39
DV
SS
40
DV
IO
41
P4
.0/P
M_U
CB
1S
TE
42
P4.1
/PM
_U
CB
1S
IMO
43
P4.2
/PM
_U
CB
1S
OM
I
44
P4.3
/PM
_U
CB
1C
LK
45
P4.4
/PM
_U
CA
1T
XD
46
P4
.5/P
M_U
CA
1R
XD
47
P4.6
/PM
_N
ON
E
48
P4.7
/PM
_N
ON
E
49P7.0/TB0.0
50P7.1/TB0.1
51P7.2/TB0.2
52P7.3/TB0.3
53P7.4/TB0.4
54P7.5/TB0.5
55BSLEN
56RST/NMI
57P5.2/XT2IN
58P5.3/XT2OUT
59TEST/SBWTCK
60PJ.0/TDO
61PJ.1/TDI/TCLK
62PJ.2/TMS
63PJ.3/TCK
64RSTDVCC/SBWTDIO
65 THERMAL_1
66 THERMAL_2
67 THERMAL_3
68 THERMAL_4
69 THERMAL_5
70 THERMAL_6
71 THERMAL_7
72 THERMAL_8
U1
MS
P430F
5229
12
34
56
78
910
11
12
13
14
JTA
G
12
34
56
78
91
0
BO
OT
ST
CN
-ML10
12345678910
11
12
13
14
15
16
J1
123
45
678
91011
1213
141516
J2
1 2 3 4 5 6 7 8 910
11
12
13
14
15
16
J3
123
45
678
91011
1213
141516
J4
123
JP
5
PIN
HE
AD
_1X
3
123
JP
6
PIN
HE
AD
_1X
3
123
JP
7
PIN
HE
AD
_1X
3
123
JP
8
PIN
HE
AD
_1X
3
123
JP
9
PIN
HE
AD
_1X
3
123 JP
10
PIN
HE
AD
_1X
3
123
J5
PIN
HE
AD
_1X
3
R7
330R
1 2 3
JP
3
C1
0
10uF
C1
4100nF
C5
10uF
C6
100nF
R10R R
20R
R60R
R80R
C1
12pF
C2
12pF
C7
10uF
C1
3
100nF
12
JP2
R3
330R
12
D1
??
?R
40R
C9
470nF
R5
47K
C82.2
nF
R110R
R12
0R
C1
6
4.7
uF
C3
tbd
C4
tbd
R90R
R1
00R
C1
5
100nF
1 2 3
J6
PIN
HE
AD
_1X
3
12
JP
4
PIN
HE
AD
_1X
2
D3
Q2
QUARZ_4PIN
26MHz/ASX53
Q1
12
JP
1
PIN
HE
AD
_1X
2
SH
C1
SH
OR
TC
UT
2
GN
D
GN
D
GN
D
GN
D
XT
LG
ND
VCORE
GN
D
GN
D
DV
CCD
VC
C
GN
D
XT
LG
ND
2
GN
D
GN
D
DV
CC
GN
D
RS
T/N
MI
TC
K
TM
ST
DI
TD
O
RS
TD
VC
C_
SB
WT
DIO
TD
O
RS
T/N
MI
TC
K
CT
CK
MT
MS
IT
DI
OT
DO
DV
CC
P1.2
/TA
0.1
P1.1
/TA
0.0
TE
ST
/SB
WT
CK
CMIO
DVCC
P1.1/TA0.0P1.2/TA0.1
RS
TD
VC
C_
SB
WT
DIO
TE
ST
/SB
WT
CK
AV
SS
Figure B-54. MSP-TS430RGC64C Target Socket Module, Schematic
Hardware www.ti.com
114 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector J5External power connector for DVCCSet jumper JP3 to "ext"
IMPORTANT NOTE:Rev1.0 of the board does not haveconnection from pin 4 of BOOTST topin 64 of MCU. To use BSL, these pinsshould be connected by a wire.
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Orient Pin 1 of MSP430 device
Jumper JP4For F524x devices, close.For F522x, F523x, and F525x devices,close only if one power supply is usedfor VCC and DVIO, and if VCC is nothigher then 1.98 V. Otherwise, supplyDVIO over J6.Do not close if VCC > 1.98 V, as it maydamage the chip.
Connector J6External power connectorto supply DVIO
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supplyJumper JP1Open to measure current
Figure B-55. MSP-TS430RGC64C Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R11 or R12 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R12(0 Ω) must be assembled, and R11 must be removed.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 115
Copyright © 2021 Texas Instruments Incorporated
Table B-28. MSP-TS430RGC64C Bill of MaterialsItem Qty Reference Value Description Comment Supplier No.
1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2
2 0 C3, C4 CAP, SMD, Ceramic, 0805 DNP C3 C4
4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805
5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 Digi-Key: 311-1245-2-ND
5 5 C8 2.2nF CAP, SMD, Ceramic, 0805
6 1 C9 470nF CAP, SMD, Ceramic, 0805 Digi-Key: 478-1403-2-ND
7 1 C16 4.7uF CAP, SMD, Ceramic, 0805
8 1 D1 Green LED LED, SMD, 0805
9 4 J1-J4 16-pin header Pin header 1x16: Grid: 100mil(2.54 mm)
DNP: headers andreceptacles enclosed withkit. Keep vias free of solder.: Header: Receptacle
SAM1029-16-NDSAM1213-16-ND
10 2 J5, J6 3-pin header, male, TH Pin header 1x3: Grid: 100mil(2.54 mm) SAM1035-03-ND
11 JP5, JP6, JP7,JP8, JP9, JP10 3-pin header, male, TH Pinheader 1x3: Grid: 100mil
(2.54 mm) place jumpers on pins 2-3 SAM1035-03-ND
12 JP3 3-pin header, male, TH Pin header 1x3: Grid: 100mil(2.54 mm) place jumper on pins 1-2 SAM1035-03-ND
13 JP1, JP2, JP4 2-pin header, male, TH Pin header 1x2; Grid: 100mil(2.54 mm) place jumper on header SAM1035-02-ND
14 10 JumperPlace on: JP1, JP2, JP3,JP4, JP5, JP6, JP7, JP8,JP9, JP10
15-38-1024-ND
15 1 JTAG 2x7Pin,Wanne Header, THD, Male 2x7 Pin,Wanne, 100mil spacing HRP14H-ND
16 0 BOOTST 2x5Pin,Wanne Header, THD, Male 2x5 Pin,Wanne, 100mil spacing DNP
17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit.
18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND
19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406
20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND
21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND
22R1, R2, R4, R6,
R8, R9, R10,R11, R12
0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% DNP: R6, R8, R9, R10,R11,R12 541-000ATR-ND
23 1 U1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi
24 2 MSP430 MSP430F5229IRGCR IC, MCU, SMD, 9.15x9.15mmThermal Pad with Socket
25 4 Rubber stand off Rubber stand off apply to corners at bottomside Buerklin: 20H1724
26 1 PCB 84 x 76 mm 84 x 76 mm
Hardware www.ti.com
116 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.28 MSP-TS430RGC64USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 Vlower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, torun the MCU at 3.0 V, set it to 3.3 V.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 117
Copyright © 2021 Texas Instruments Incorporated
Figure B-56. MSP-TS430RGC64USB Target Socket Module, Schematic
Hardware www.ti.com
118 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
141
2
GN
D
GN
D
VC
C
12
3
12
3
12
3
12
3
12
3
12
3
123
123
4964
116
3217
33
48
QFN11T064-006
Clamshell
Vccext int
MSP-TS430RGC64USBRev.: 1.4 RoHS
SBW ->
JTAG ->
1
JTA
G
R2
C2C1
C3
C4
R1
C5
R3
+
C6
+C
7
C8
J5
JP
1
JP
2
R4
JP
5
JP
6
JP
7
JP
8
JP
9
JP
10
R7R
5
C11C12
D1
C9
C13
C10
R6
R8R
9
R12
JP3
US
B1
R33
C35
C36
R34
R35
R36
C39
D2
IC7
C40
C33
C38
JP4
LE
D3
S1
S2
R13 LE
D1
R15
LE
D2
R16
LED
S3
R10
C14
R11
D3
D4
J4
J1
J2
J3
U1
Q1
Q2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
USB1USB connector
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 119
Copyright © 2021 Texas Instruments Incorporated
Table B-29. MSP-TS430RGC64USB Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
3 C5, C11, C13,C14 4 100nF, SMD0805 311-1245-2-ND
3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 16-pin header, TH
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.
SAM1029-16-ND : Header
SAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9JP5, JP6, JP7,
JP8, JP9,JP10
6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
12 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 Q1 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF
DNP: Q1Keep vias free of solder
15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
17R1, R2, R4,R6, R8, R9,
R122 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0805
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
21 Rubber standoff 4 Buerklin: 20H1724 Apply to corners at bottom side
22 MSP430 2 MSP430F5509 RGC DNP: enclosed with kit. Issupplied by TI
23 Insulating diskto Q2 1 Insulating disk to Q2
http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35 1 10p SMD0603 Buerklin: 56D102
29 C36 1 10p SMD0603 Buerklin: 56D102
30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
Hardware www.ti.com
120 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-29. MSP-TS430RGC64USB Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment34 IC7 1 TPD4E004 Manu: TI
36 LED 0 JP3QE SAM1032-03-ND DNP
37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP
39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP
40 R13, R15, R16 0 470R Buerklin: 07E564 DNP
41 R33 1 1k4 / 1k5 Buerklin: 07E612
42 R34 1 27R Buerklin: 07E444
43 R35 1 27R Buerklin: 07E444
44 R36 1 33k Buerklin: 07E740
45 S1 0 PB P12225STB-ND DNP
46 S2 0 PB P12225STB-ND DNP
46 S3 1 PB P12225STB-ND
47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 121
Copyright © 2021 Texas Instruments Incorporated
B.29 MSP-TS430PN80
A. For MSP430F47x and MSP430FG47x devices:Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).
Hardware www.ti.com
122 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.
Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic
Connector J5External power connectorJumper JP1 to "ext"
D1LED connected to pin 12
Jumper J6Open to disconnect LED
Orient Pin 1 ofMSP430 device
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumper JP2Open to measure current
Figure B-59. MSP-TS430PN80 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 123
Copyright © 2021 Texas Instruments Incorporated
Table B-30. MSP-TS430PN80 Bill of MaterialsPos. Ref Des No. per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND
6 J1, J2, J3, J4 0 25-pin header, TH
DNP: Headers and receptaclesenclosed with kit.Keep vias freeof solder.
SAM1029-20-ND : HeaderSAM1213-20-ND : Receptacle
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND
8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-2
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
12 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
13 R3 1 560 Ω, SMD0805 541-560ATR-ND
14R1, R2, R4,R6, R7, R10,
R11, R122 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R7, R10, R11,
R12
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi
17 PCB 1 77 x 77 mm 2 layers
18 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons Part
No. SJ-5302 Apply to corners at bottom side
19 MSP430 2 MSP430FG439IPN DNP: Enclosed with kit suppliedby TI
Hardware www.ti.com
124 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.30 MSP-TS430PN80A
Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 125
Copyright © 2021 Texas Instruments Incorporated
Connector J5External power connectorJumper JP3 to "ext"
Orient Pin 1 ofMSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
D1LED connected to P1.0
Jumper JP2Open to disconnect LED
Connector J6If the system is supplied from LDOI,close JP4 and set JP3 to external
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supplyJumper JP1Open to measure current
Figure B-61. MSP-TS430PN80A Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.
Hardware www.ti.com
126 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-31. MSP-TS430PN80A Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7,C10, C12 3 10uF, 6.3V, SMD0805 DNP C10
4C5, C11,
C13, C14,C15
5 100nF, SMD0805 311-1245-2-ND
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
9 D1 1 green LED, SMD0805 P516TR-ND
10 J1, J2, J3,J4 0 20-pin header, TH
SAM1029-20-ND(Header) SAM1213-20-ND(Receptacle)
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:
11 J5 , J6 2 3-pin header, male, TH
12
JP3, JP5,JP6, JP7,JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-NDplace jumpers on pins 2-3 on JP5, JP6,JP7, JP8, JP9, JP10 place jumpers onpins 1-2 on JP3,
13 JP1, JP2,JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
15 JTAG 1 14-pin connector, male,TH HRP14H-ND
16 BOOTST 0 10-pin connector, male,TH "DNP Keep vias free of solder"
17 Q1 0 CrystalMicro Crystal MS3V-T1R32.768kHz, C(Load) =12.5pF
DNP: Q1 Keep vias free of solder
18 Q2 0 Crystal Q2: 4MHz Buerklin:78D134 DNP: Q2 Keep vias free of solder
19 Insulatingdisk to Q2 0 Insulating disk to Q2
http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121
20 D3,D4 2 LL103A Buerklin: 24S3406
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
22
R1, R2, R4,R6, R8,R9,R10,R11, R12
3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi
25 PCB 1 77 x 91 mm 2 layers
26 Adhesiveplastic feet 4 Approximately 6mm width,
2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side
27 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 127
Copyright © 2021 Texas Instruments Incorporated
B.31 MSP-TS430PN80B
DN
P
So
cke
t:Y
am
aic
hi IC
20
1-0
80
4-0
14
I2C
UA
RT
P1
.7P
2.1
Ju
mp
ers
JP
3 to
JP
8C
lose
1-2
to d
eb
ug
in S
py-B
i-Wire
mo
de
.C
lose
2-3
to d
eb
ug
in 4
-wire
JTA
G m
od
e.
BS
LTo
ol S
ele
ct:
Op
en
= B
SL
Co
nn
ecto
rC
lose
d =
JTA
G C
on
ne
cto
r
DN
P
DN
P
DN
P
DN
P
GN
D
GN
D
100nF
33
0R
0R0R
GN
D
GN
D
1.1
nF
47
kG
ND
0R 0R
QU
AR
Z5
100nF
1uF/10V
gre
en
DN
P
ye
llow
(DN
P) DN
P
red
(DN
P)
0R
GN
DD
NP
DN
P
0R0R
QU
AR
Z5
EV
Q11
0R
DNP
DN
P
100nF
GN
D
100nFG
ND
10
k1
0k
MS
P4
30
FR
59
XX
PN
SAM1029-20-ND
SA
M1
02
9-2
0-N
D
SAM1029-20-ND
SA
M1
02
9-2
0-N
D
1uF/10V
If exte
rna
l su
pp
ly v
olta
ge
:re
mo
ve
R3
an
d a
dd
R2
(0 O
hm
)
Ext_
PW
R
MS
P-T
S4
30
PN
80
B
Vcc
int
ext
DN
PD
NP
DN
P
JTA
G ->
SB
W ->
DN
PD
NP
1.0
DN
PD
NP
co
nn
ectio
n b
y v
ia
Ta
rge
t so
cke
t bo
ard
for M
SP
43
0F
R5
99
4IP
N d
evic
e
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C9
C8
C4
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
112J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R9 R8
Q2
C11
C7
D1
R1
0
12J
P1
0
D2
R11
12J
P11
D3
R1
2
1 2
JP
2
C1 C2
R6R5
Q1
SW
1
R1
3
TP2TP1
SW2
R1
4
C10
C6
12
JP
13
12
JP
14
12
JP
15
123
JP
16
1 2
JP17
1 2
JP18
R7
R1
5
P1
.0/T
A0
.1/D
MA
E0
/RT
CC
LK
/A0
/C0
/VR
EF
-/VE
RE
F-
1
P1
.1/T
A0
.2/T
A1
CL
K/C
OU
T/A
1/C
1/V
RE
F+
/VE
RE
F+
2
P1
.2/T
A1
.1/T
A0
CL
K/C
OU
T/A
2/C
23
P3
.0/A
12
/C1
24
P3
.1/A
13
/C1
35
P3
.2/A
14
/C1
46
P3
.3/A
15
/C1
57
P6
.0/U
CA
3T
XD
/UC
A3
SIM
O8
P6
.1/U
CA
3R
XD
/UC
A3
SO
MI
9
P6
.2/U
CA
3C
LK
10
P6
.3/U
CA
3S
TE
11
P7
.0/U
CB
2S
IMO
/UC
B2
SD
A1
3
P7
.1/U
CB
2S
OM
I/UC
B2
SC
L1
4
P8
.01
5
P1
.3/T
A1
.2/U
CB
0S
TE
/A3
/C3
16
P1
.4/T
B0
.1/U
CA
0S
TE
/A4
/C4
17
P1
.5/T
B0
.2/U
CA
0C
LK
/A5
/C5
18
DV
SS
19
DV
CC
20
P4
.71
2
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C621
PJ.1/TDI/TCLK/MCLK/SRSCG0/C722
PJ.2/TMS/ACLK/SROSCOFF/C823
PJ.3/TCK/SRCPUOFF/C924
P7.2/UCB2CLK25
P7.3/UCB2STE/TA4.126
P7.4/TA4.0/A1627
P7.5/A1728
P7.6/A1829
P7.7/A1930
P4.0/A831
P4.1/A932
P4.2/A1033
P4.3/A1134
P2.5/TB0.0/UCA1TXD/UCA1SIMO35
P2.6/TB0.1/UCA1RXD/UCA1SOMI36
TEST/SBWTCK37
RST/NMI/SBWTDIO38
DVSS39
DVCC40P
2.0
/TB
0.6
/UC
A0
TX
D/U
CA
0S
IMO
/TB
0C
LK
/AC
LK 41
P2
.1/T
B0
.0/U
CA
0R
XD
/UC
A0
SO
MI 4
2P
2.2
/TB
0.2
/UC
B0
CL
K4
3P
8.1
44
P8
.24
5P
8.3
46
P3
.4/T
B0
.3/S
MC
LK
47
P3
.5/T
B0
.4/C
OU
T4
8P
3.6
/TB
0.5
49
P3
.7/T
B0
.65
0P
1.6
/TB
0.3
/UC
B0
SIM
O/U
CB
0S
DA
/TA
0.0 5
1P
1.7
/TB
0.4
/UC
B0
SO
MI/U
CB
0S
CL
/TA
1.0 5
2P
5.0
/UC
B1
SIM
O/U
CB
1S
DA
53
P5
.1/U
CB
1S
OM
I/UC
B1
SC
L5
4P
5.2
/UC
B1
CL
K/T
A4
CL
K5
5P
5.3
/UC
B1
ST
E5
6P
4.4
/TB
0.5
57
P4
.55
8P
4.6
59
DV
SS
60
AVCC 80
AVSS 79
PJ.5/LFXOUT 78
PJ.4/LFXIN 77
AVSS 76
PJ.7/HFXOUT 75
PJ.6/HFXIN 74
AVSS 73
P6.7/UCB3STE 72
P6.6/UCB3CLK 71
P6.5/UCB3SOMI/UCB3SCL 70
P6.4/UCB3SIMO/UCB3SDA 69
P5.7/UCA2STE/TA4.1/MCLK 68
P5.6/UCA2CLK/TA4.0/SMCLK 67
P5.5/UCA2RXD/UCA2SOMI/ACLK66
P5.4/UCA2TXD/UCA2SIMO/TB0OUTH65
P2.4/TA1.0/UCA1CLK/A7/C11 64
P2.3/TA0.0/UCA1STE/A6/C10 63
P2.7 62
DVCC 61
U1
12345678910
11
12
13
14
15
16
17
18
19
20
J3
2122232425262728293031323334353637383940
J4
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
J5
6162636465666768697071727374757677787980
J6
C3
P1
.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
P1
.1
P1.1
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
PJ.0
/TD
O
PJ.0/TDO
PJ.2
/TM
S
PJ.2/TMS
PJ.3
/TC
K
PJ.3/TCK
PJ.1
/TD
I
PJ.1/TDI
P1
.2
P1.2
P1
.3
P1.3
AV
CC
AVCC
AV
SS
AVSS
AVSS
AVSS
HF
XO
UT
HFXOUT
HF
XIN
HFXIN
HF
GN
D
LF
XIN
LFXIN
LF
XO
UT
LFXOUT
DV
CC
DV
CC
DVCC
DV
CC
DV
CC
DV
CC
DVCC
DV
CC
DVCC
DV
SS
DV
SS
DVSS
DV
SS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TEST/SBWTCK
TE
ST
/SB
WT
CK
RST/SBWTDIO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
ST
E
ST
E
RX
D/S
IMO
RX
D/S
IMO
TX
D/S
OM
I/SD
A
TX
D/S
OM
I/SD
A
SP
ICL
K/S
CL
SP
ICL
K/S
CL
SP
ICL
K/S
CL
1
SP
ICL
K/S
CL
1
RX
D/S
IMO
1
RX
D/S
IMO
1
TX
D/S
OM
I/SD
A1
P1
.6
P1
.6
P2
.0
P2
.0
LF
GN
D
1 2 3 4 5 6
1 2 3 4 5 6
Title
:
Da
te:
Pa
ge
1/1
MS
P-T
S4
30
PN
80
B
10
/5/2
01
5 2
:54
:53
PM
A3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Re
v.:
Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic
Hardware www.ti.com
128 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
141
2
101
2
Connector J2External power connector
Jumper JP3 to "ext"
Orient Pin 1 ofMSP device
Jumpers JP3 JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
through
D1 D3LEDs connected toP1.0 through P1.2
through
Jumpers JP9 JP11Open to disconnect LEDs
through
Connector JTAGFor JTAG Tool
Connector BSLFor Bootloader Tool
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Jumpers JP1 and JP2Open to measure current
Figure B-63. MSP-TS430PN80B Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 129
Copyright © 2021 Texas Instruments Incorporated
Table B-32. MSP-TS430PN80B Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 PCB 1 90.0 x 92.5 mm "MSP-TS430PN80B" Rev.1.0 2 layers, blue solder mask
2JP1, JP2,JP9, JP13,JP14, JP15
6 2-pin header, male, TH SAM1035-02-ND place jumper on header
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one side of header
4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
6
JP3, JP4,JP5, JP6,JP7, JP8,
JP16
7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
7 J2 1 3-pin header, male, TH SAM1035-03-ND
8 R2, R5, R6,R8, R9 5 0R, 0805 541-0.0ATR-ND DNP
9 R3, R12,R13 3 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
12 R7, R15 2 10k, 0805 541-10KATR-ND
13 R4 1 47k, 0805 541-47KATR-ND
14 C4, C6,C10, C11 4 100nF, CSMD0805 490-1666-1-ND
15 R1 1 330R, 0805 541-330ATR-ND
16 R10, R11 2 330R, 0805 541-330ATR-ND DNP
17 R14 1 47k, 0805 541-47KATR-ND DNP
18 C1, C2, C8,C9 4 DNP, CSMD0805 DNP
19 SW2 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder
20 SW1 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder
21 TP1, TP2 2 Test point DNP, keep pads free of solder
22 BSL 1 10-pin connector, male,TH HRP10H-ND
23 JTAG 1 14-pin connector, male,TH HRP14H-ND
24 U1 1 Socket IC201-0804-014 Manuf. Yamaichi
25 MSP device 1 MSP430FR5994 DNP: Not enclosed in kit
26 Q1 1DNP: MS3V-TR1(32768kHz, 20ppm,12.5pF)
depends on application Micro Crystal, DNP, enclosed in kit, keepvias free of solder
Hardware www.ti.com
130 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.32 MSP-TS430PN80C
1 1
2 2
3 3
4 4
5 5
6 6
DD
CC
BB
AA
12
2/1
6/2
018
MC
U022A
_M
SP
-TS
430P
N80C
_S
chem
atic
.SchD
oc
SheetT
itle:
Siz
e:
Mod. D
ate
:
File
:S
heet:
ofB
http
://ww
w.ti.c
om
Conta
ct:
http
://ww
w.ti.c
om
/support
MS
P-T
S430P
N80C
Pro
jectT
itle:
Desig
ned fo
r:P
ublic
Rele
ase
Assem
bly
Varia
nt:
001
©Te
xa
s In
stru
me
nts
20
17
Dra
wn B
y:
Engin
eer:
Mik
e P
ridgen
Texas In
stru
ments
and/o
r its lic
ensors
do n
ot w
arra
nt th
e a
ccura
cy o
r com
ple
teness o
f this
specifi
catio
n o
r any in
form
atio
n c
onta
ined th
ere
in.Texas In
stru
ments
and/o
r its lic
ensors
do n
ot
warra
nt th
at th
is d
esig
n w
ill meet th
e s
pecifi
catio
ns, w
ill be s
uita
ble
for y
our a
pplic
atio
n o
rfit fo
r any p
artic
ula
r purp
ose, o
r will o
pera
te in
an im
ple
menta
tion.
Texas In
stru
ments
and/o
r itslic
ensors
do n
ot w
arra
nt th
at th
e d
esig
n is
pro
ductio
n w
orth
y.Y
ou s
hould
com
ple
tely
valid
ate
and te
styour d
esig
n im
ple
menta
tion to
confirm
the sy
ste
m fu
nctio
nality
for
your a
pplic
atio
n.
Vers
ion c
ontro
l dis
able
dS
VN
Rev: M
CU
022
Num
ber:
Rev:
AT
ID #
:N
/AO
rdera
ble
:M
SP
-TS
430P
N80C
1 2 3
J1
1
2
3
J2
1 2 3
JP
9
1 2 3
JP
10
1 2 3
JP
5
1 2 3
JP
6
1 2 3
JP
7
1 2 3
JP
8
1 2
JP
1
1
2
JP11
1
2
JP
12
ext
int
VC
C
JTA
G ->
SB
W ->
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
GN
D
47k
R7
1100pF
C5
RS
T/S
BW
TD
IOP
J.0
/TD
OP
J.1
/TD
IP
J.2
/TM
SP
J.3
/TC
K
DV
SS
TM
ST
DI
TD
O/S
BW
TD
IO
VC
C
Ext_
PW
R
GN
D
GN
D
TE
ST
/SB
WT
CK
BS
L_R
XB
SL_T
X
0.1
μF
C6
0.1
μF
C11
AV
SS
DV
SS
330
R1
Gre
en
12
D1
P1.0
P1.1
47k
R13
DN
P
DVCC
P1.3
0 R12
0 R10
AV
SS
GN
D
4.7
uF
C12
DN
P
DVSSDVCC
AV
SS
Connectio
n b
y v
ia
AV
CC
0 R8
DN
P
0 R9
DN
P
22pF
C8
DN
P
22pF
C9
DN
P
DV
CC
AV
SS
HF
GN
D
12pF
C2
DN
P
12pF
C1
DN
P
Connectio
n b
y v
ia
AV
SS
DV
SS
DV
CC
DV
SS
DV
SS
0 R11
PV
SS
1 2
JP
4
PV
SS
PV
CC
1 2
JP
14
1 2
JP
13
PV
SS
Ch0IN
Ch1IN
RS
T/S
BW
TD
IO
BS
L_S
CL
BS
L_S
DA
UA
RT
BS
LC
onnectio
n
I2C
BS
LC
onnectio
n
I2C
Pullu
ps
BS
LR
XB
SLT
XB
SL_T
XB
SL_R
X
BS
LS
CL
BS
LS
DA
BS
L_S
DA
BS
L_S
CL
Connectio
n b
y v
ia
VC
C
DV
CC
0 R18
LC
DC
AP
Use L
CD
_C
Module
No L
CD
_C
Module
R18
C12
DN
P
DN
P0
ohm
4.7
uF
TP
1D
NP
TP
2D
NP
TP
3D
NP
TP
4D
NP
1 2
JP
2
1 2
JP
3
VC
C C
urre
nt
Measure
ment
Pow
er R
ail
Connectio
ns
4.7
k
R16
4.7
k
R17
DV
CC
0.1
μF
C4
BS
L_T
X
BS
L_R
X
BS
L_S
DA
BS
L_S
CL
RS
T/N
MI
TC
K/S
BW
TC
K
0 R21
0 R20
0 R19
1234
TP
5D
NP
TP
6
DN
P
Blu
e
21
D2
200
R2
12
34
56
78
910
1112
13
14
JTA
G
12
34
SW
3
12
34
SW
4
12
34
SW
5
HF
XIN
_ext
HF
XIN
HF
XO
UT
HF
XO
UT
_ext
LF
XO
UT
0 R5
DN
P
0 R6
DN
PLF
XIN
_ext
LF
XO
UT
_ext
US
SX
TIN
USSXTOUT_extUSSXTIN_ext
US
SX
TIN
_ext
US
SX
TO
UT
_ext
0 R3
0 R4
DN
P
DVSS1DVCC1
AVSS
AVSS
12
34
56
78
910
BS
L
US
SX
TO
UT
22
R22
0 R14
DN
P
0 R15
DN
P
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
4 (0
ohm
)
27pF
C14
27pF
C15
1000pF
C13
47μ
FC
16
5 4 123678910
1112
13
14
15
16
17
18
19
20
J3
5
4
1
2
3
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
J4
HF
XIN
_ext
HF
XO
UT
_ext
TE
ST
/SB
WT
CK
LF
XIN
_ext
LF
XO
UT
_ext
AV
SS
AV
SS
AV
CC
1P
2.2
/CO
UT
/UC
A0C
LK
/A14/C
14
P2.3
/TA
0.0
/UC
A0S
TE
/A15/C
15
P1.0
/UC
A1C
LK
/TA
1.0
/A0/C
0/V
RE
F-/V
eR
EF
-P
1.1
/UC
A1S
TE
/TA
4.0
/A1/C
1/V
RE
F+
/VeR
EF
+A
VS
S2
PJ.4
/LF
XIN
PJ.5
/LF
XO
UT
AV
SS
3P
J.6
/HF
XIN
/US
SX
T_B
OU
TP
J.7
/HF
XO
UT
P2.4
/TA
0C
LK
/TB
0C
LK
/TA
1C
LK
/LC
DS
24
P2.6
/UC
A0S
IMO
/UC
A0T
XD
/TA
1.2
/TA
1.2
C/L
CD
S23
P2.7
/UC
A0S
OM
I/UC
A0R
XD
/TA
4.1
/TA
4.1
C/L
CD
S22
TE
ST
/SB
WT
CK
RS
T/N
MI/S
BW
TD
IOP
J.0
/UC
A2C
LK
/SR
SC
G1/D
MA
E0/C
10/T
DO
PJ.1
/UC
A2S
TE
/SR
SC
G0/T
A4C
LK
/C11
/TD
I/TC
LK
PJ.2
/UC
A2S
IMO
/UC
A2T
XD
/SR
OS
CO
FF
/TB
0O
UT
H/C
12/T
MS
PJ.3
/UC
A2S
OM
I/UC
A2R
XD
/SR
CP
UO
FF
/TB
0.6
/C13/T
CK
RS
T/S
BW
TD
IO
P2.5/TA0.2/TA4.0/LCDS21P3.0/TB0.0/LCDS20P1.2/UCA1SIMO/UCA1TXD/TA1.0/A8/C8P1.3/UCA1SOMI/UCA1RXD/TA1.1/A9/C9P2.0/UCA1CLK/UCA3SIMO/UCA3TXD/LCDS19P2.1/UCA1STE/UCA3SOMI/UCA3RXD/LCDS18P1.6/UCA3STE/UCB0SIMO/UCB0SDA/LCDS17P1.7/USSTRG/UCA3CLK/UCB0SOMI/UCB0SCL/LCDS16P1.4/TB0.4/UCB0STE/A2/C2P1.5/TB0.5/UCB0CLK/A3/C3P3.1/TA1CLK/TB0.1/MTIF_OUT_INP4.0/RTCCLK/TA4.1/MTIF_PIN_ENP4.1/UCA0CLK/TB0.4/UCA3SOMI/UCA3RXD/LCDS15P4.2/UCA0STE/TB0.5/UCA3SIMO/UCA3TXD/LCDS14P4.3/UCA0SIMO/UCA0TXD/LCDS13P4.4/UCA0SOMI/UCA0RXD/LCDS12P4.5/TA0CLK/TA1CLK/LCDS11P4.6/TB0CLK/TA4CLK/LCDS10
P1.3
541 2 3 6 7 8 9
10
11 12
13
14
15
16
17
18
19
20
J5
5
4
1
2
3
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
J6
PVSSPVCC
Ch0IN
PVCCPVSS
Ch1IN
LCDCAP
P6.3
/CO
M7/R
23
DV
CC
3D
VS
S3
P6.2
/TB
0C
LK
/R13/L
CD
RE
F/L
CD
S32
P6.1
/RT
CC
LK
/R03/L
CD
S33
P7.0
/TA
1.0
/TA
1.2
/XP
B0/L
CD
S30
P6.6
/AC
LK
/CO
M2/L
CD
S31
P6.5
/SM
CLK
/CO
M1/L
CD
S34
P6.4
/MC
LK
/CO
M0
P5.7
/TA
0.2
/UC
B1S
TE
/LC
DS
1P
6.0
/TA
0C
LK
/CO
UT
/LC
DS
0
P5.6
/TB
0O
UT
H/U
CB
1S
OM
I/UC
B1S
CL/L
CD
S2
P5.5
/TA
4.1
/UC
B1S
IMO
/UC
B1S
DA
/LC
DS
3P
5.4
/TA
0.0
/UC
B1C
LK
/TA
4.0
/LC
DS
4P
5.3
/TB
0.3
/UC
A2S
TE
/LC
DS
5P
5.2
/TB
0.2
/UC
A2C
LK
/LC
DS
6P
5.1
/TB
0.1
/UC
A2S
OM
I/UC
A2R
XD
/LC
DS
7P
5.0
/TB
0.0
/UC
A2S
IMO
/UC
A2T
XD
/LC
DS
8P
4.7
/DM
AE
0/L
CD
S9
DV
SS
2
USSXTINUSSXTOUTAVSS1
AVSS4
CH0_IN
PVCCPVSSPVCC
CH1_IN
PVSS
P3.5/ACLK/COM3/COUT/LCDS26P3.4/SMCLK/COM6/DMAE0/LCDS27P3.3/MCLK/TB0.3/XPB1/LCDS25P3.2/TA1.1/COM5/LCDS28P6.7/TA0.1/COM4/LCDS29R33/LCDCAP
P3.7/UCB1SOMI/UCB1SCL/TB0.2/TB0OUTH/LCDS36P3.6/UCB1SIMO/UCB1SDA/TB0.6/USSXT_BOUT/LCDS35BSLTX
BSLRXBSLSDABSLSCL
PJ.0
/TD
OP
J.1
/TD
IP
J.2
/TM
SP
J.3
/TC
K
Ch0OUT
Ch1OUT
1000pF
C17
DN
P
1000pF
C18
DN
P200
R23
DN
P200
R24
DN
PC
h0O
UT
Ch1O
UT
TP
7
DN
P
TP
8
DN
P
123456789
10
1112
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
IC1
IC357-0
804-0
96P
-1
P1.0
P1.1
BS
LS
DA
BS
LS
CL
Ground pad not used
LF
XIN
LF
XO
UT
HF
XIN
HF
XO
UT
AV
CC
Q1A
DN
PQ
1
Q2A
DN
P
Q2
DN
P
LF
XIN
Popula
te e
ither Q
1 o
r Q1A
if a c
rysta
l is n
eeded
Popula
te e
ither Q
2 o
r Q2A
if a c
rysta
l is n
eeded
SW
1
SW
2
DV
CC
AV
CC
DV
SS
DV
SS
DV
CC
PVCC
CH1_OUT
CH0_OUT
VCC_Meas
VC
C
US
SX
T_O
UT
1uF
C7
1uF
C3
Q3
Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 131
Copyright © 2021 Texas Instruments Incorporated
Connector JTAGFor JTAG Tool
Connector BSLFor Bootloader Tool
Jumper J11-2 (Debugger): Power supply from JTAG Interface
2-3 (External): External power supply
Connector J2External power connector
Jumper J1 to External
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumpers JP1 to JP4Open to measure current
BSL Interface SwitchesSelect which BSL interface to connect toconnector BSL
I2C pullup enable switchSwitch On to connect I2C pullup resistors
Orient Pin 1 of MSP430 device
Jumpers JP11 and JP12Open to disconnect LEDs D1 and D2
D1, D2LEDs connected to P1.0, P1.1
Figure B-65. MSP-TS430PN80C Target Socket Module, PCB
Hardware www.ti.com
132 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-33. MSP-TS430PN80C Bill of MaterialsDesignator Quantity Value Description Package Reference Part Number Manufacturer Comments
!PCB 1 Printed Circuit Board MCU022 Any
BSL 1 Header(Shrouded),2.54mm, 5x2, Gold, TH
Header, 2.54mm, 5x2,TH AWHW-10G-0202-T Assman WSW
C3, C7 2 1uF CAP, CERM, 1 uF, 10V, ±10%, X5R, 0805 0805 GRM216R61A105KA01D MuRata
C4, C6, C11 3 0.1uFCAP, CERM, 0.1 µF,50 V, ±10%, X7R,0805
0805 GRM21BR71H104KA01L MuRata
C5 1 1100pFCAP, CERM, 1100 pF,50 V, ±5%, C0G/NP0,0805
0805 GRM2165C1H112JA01D MuRata
C13 1 1000pF
CAP, CERM, 1000 pF,50 V, ±5%, C0G/NP0,AEC-Q200 Grade 1,0805
0805 GCM2165C1H102JA16D MuRata
C14, C15 2 27pFCAP, CERM, 27 pF,50 V, ±5%, C0G/NP0,0603
0603 GRM1885C1H270JA01D MuRata
C16 1 47uFCAP, CERM, 47 µF,6.3 V, ±20%, X5R,0805
0805 GRM21BR60J476ME15L MuRata
D1 1 Green LED, Green, SMD LED_0805 APT2012LZGCK Kingbright
D2 1 Blue LED, Blue, SMD LED_0805 150080BS75000 Wurth Elektronik
H1, H2, H3,H4 4 Bumpon, Cylindrical,
0.312 X 0.200, Black Black Bumpon SJ61A1 3M
IC1 1 Socket, QFP-80,0.5 mm Pitch
Socket, QFN-80,0.5 mm Pitch IC357-0804-096P-1 Yamaichi Electronics
J1, J2, JP5,JP6, JP7,JP8, JP9,
JP10
8 Header, 100mil, 3x1,Gold, TH 3x1 Header TSW-103-07-G-S Samtec
J3, J4, J5, J6 4 Header, 100mil, 20x1,Gold, TH 20x1 Header TSW-120-07-G-S Samtec Not installed,
included in kit
J3A, J4A,J5A, J6A 4 Receptacle, 2.54 mm,
20x1, Gold, THReceptacle, 2.54mm,20x1, TH PPPC201LFBN-RC Sullins Connector
SolutionsNot installed,included in kit
JP1, JP2,JP3, JP4,
JP11, JP12,JP13, JP14
8 Header, 100mil, 2x1,Gold, TH 2x1 Header TSW-102-07-G-S Samtec
JTAG 1 Header (shrouded),100 mil, 7x2, Gold, TH 7x2 Shrouded Header SBH11-PBPC-D07-ST-BK Sullins Connector
Solutions
Q1 1 Crystal, 32.768 kHz,12.5pF, SMD 1.4x1.4x5.0mm SMD MS3V-T1R 32.768KHZ
±20PPM 12.5PF Micro Crystal AG Not installed,included in kit
Q3 1 Crystal, 8MHz, SMD 4.7x4.1mm R- 8,00M-ZTACS/MT-0,5-0,4-H-30/30-TR Auris-GmbH
R1 1 330 RES, 330, 5%,0.125 W, 0805 0805 CRCW0805330RJNEA Vishay-Dale
R2 1 200 RES, 200, 5%,0.125 W, 0805 0805 CRCW0805200RJNEA Vishay-Dale
R3, R10,R11, R12,R18, R19,R20, R21
8 0 RES, 0, 5%, 0.125 W,0805 0805 CRCW08050000Z0EA Vishay-Dale
R7 1 47k RES, 47 k, 5%,0.125 W, 0805 0805 CRCW080547K0JNEA Vishay-Dale
R16, R17 2 4.7k RES, 4.7 k, 5%,0.125 W, 0805 0805 CRCW08054K70JNEA Vishay-Dale
R22 1 22 RES, 22, 5%, 0.1 W,0603 0603 CRCW060322R0JNEA Vishay-Dale
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 133
Copyright © 2021 Texas Instruments Incorporated
Table B-33. MSP-TS430PN80C Bill of Materials (continued)Designator Quantity Value Description Package Reference Part Number Manufacturer Comments
SH‑J1,SH‑JP1,SH‑JP2,SH‑JP3,SH‑JP4,SH‑JP5,SH‑JP6,SH‑JP7,SH‑JP8,SH‑JP9,SH‑JP10,SH‑JP11,SH‑JP12,SH‑JP13,SH‑JP14
15 1x2 Shunt, 100mil, Goldplated, Black Shunt SNT-100-BK-G Samtec
Alternate partnumber:969102-0000-DA
SW1, SW2 2Switch, SPST-NO, Off-Mom, 0.02 A, 15 VDC,TH
6x6mm EVQ-11A04M Panasonic
SW3, SW4,SW5 3
Switch, DPST, Slide,Off-On, 1 Pos, 0.15A,30V, TH
9.65x7.12mm 78F01T Grayhill
C1, C2 0 12pFCAP, CERM, 12 pF,50 V, ±5%, C0G/NP0,0805
0805 CC0805JRNP09BN120 Yageo America
C8, C9 0 22pFCAP, CERM, 22 pF,50 V, ±5%, C0G/NP0,0805
0805 GQM2195C1H220JB01D MuRata
C12 0 4.7uFCAP, CERM, 4.7 µF,10 V, +80/-20%, Y5V,0805
0805 CC0805ZRY5V6BB475 Yageo America
C17, C18 0 1000pFCAP, CERM, 1000 pF,50 V, ±1%, C0G/NP0,0805
0805 08055A102FAT2A AVX
FID1, FID2,FID3, FID4,FID5, FID6
0Fiducial mark. Thereis nothing to buy ormount.
N/A N/A N/A
Q1A, Q2A 0 Crystal, 12 MHz,18 pF, TH 11.5x5mm 9B-12.000MEEJ-B TXC Corporation
Q2 0 Crystal, 32.768 kHz,12.5pF, SMD 1.4x1.4x5.0mm SMD MS3V-T1R 32.768KHZ
±20PPM 12.5PF Micro Crystal AG
R4, R5, R6,R8, R9 0 0 RES, 0, 5%, 0.125 W,
0805 0805 CRCW08050000Z0EA Vishay-Dale
R13 0 47k RES, 47 k, 5%,0.125 W, 0805 0805 CRCW080547K0JNEA Vishay-Dale
R14, R15 0 0 RES, 0, 5%, 0.1 W,0603 0603 CRCW06030000Z0EA Vishay-Dale
R23, R24 0 200 RES, 200, 1%,0.125 W, 0805 0805 CRCW0805200RFKEA Vishay-Dale
TP1, TP2,TP3, TP4 0 Black Test Point, Miniature,
Black, THBlack MiniatureTestpoint 5001 Keystone
TP5, TP6,TP7, TP8 0 Test Point, Miniature,
Black, THBlack MiniatureTestpoint 5001 Keystone
Hardware www.ti.com
134 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.33 MSP-TS430PN80USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 Vlower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, torun the MCU at 3.0 V, set it to 3.3 V.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 135
Copyright © 2021 Texas Instruments Incorporated
A. R11 should be populated.
Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic
Hardware www.ti.com
136 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumper JP31-2 (int): Power supply from JTAG debug interface2-3 (ext): External power supply
Connector J5External power connectorJumper JP3 to "ext"
USB Connector
Button S3BSL invoke
Jumper JP4Close for USB bus powered device
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Connector JTAGFor JTAG Tool
Orient Pin 1 of MSP430 device
Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 137
Copyright © 2021 Texas Instruments Incorporated
Table B-34. MSP-TS430PN80USB Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
3 C5, C11, C13,C14 4 100nF, SMD0805 311-1245-2-ND
3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-NDDNP: headers andreceptacles enclosed with kit.Keep vias free of solder.
7.1 4 20-pin header, TH
DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.
SAM1213-20-ND : Header: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9JP5, JP6,
JP7, JP8,JP9,JP10
6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4 1 SAM1035-02-ND Place jumper only on one pin
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
12 10 Jumper 15-38-1024-NDPlace on: JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8, JP9,JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF
DNP: Q1 Keep vias free ofsolder
15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
17R1, R2, R4,R6, R8, R9,
R122 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 0 1M Ω, SMD0805 DNP
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
21 Rubberstandoff 4 Buerklin: 20H1724 Apply to corners at bottom
side
22 MSP430 2 MSP430F5529 DNP: Enclosed with kitsupplied by TI
23 Insulating diskto Q2 1 Insulating disk to Q2
http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121
27 C33 1 220n Buerklin: 53D2074
28 C35 1 10p Buerklin: 56D102
29 C36 1 10p Buerklin: 56D102
Hardware www.ti.com
138 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-34. MSP-TS430PN80USB Bill of Materials (continued)Pos. Ref Des No. per
Board Description Digi-Key Part No. Comment
30 C38 1 220n Buerklin: 53D2074
31 C39 1 4u7 Buerklin: 53D2086
32 C40 1 0.1u Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
34 IC7 1 TPD4E004 Manu: TI
36 LED 0 JP3QE SAM1032-03-ND DNP
37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP
39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP
40 R13, R15,R16 0 470R Buerklin: 07E564 DNP
41 R33 1 1k4 Buerklin: 07E612
42 R34 1 27R Buerklin: 07E444
43 R35 1 27R Buerklin: 07E444
44 R36 1 33k Buerklin: 07E740
45 S1 0 PB P12225STB-ND DNP
46 S2 0 PB P12225STB-ND DNP
46 S3 1 PB P12225STB-ND
47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 139
Copyright © 2021 Texas Instruments Incorporated
B.34 MSP-TS430PZ100
A. Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made.
Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic
Hardware www.ti.com
140 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector J5External power connection
Remove R8 and jumper R9
D1LED connected to pin 12
Jumper J6Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper J7Open to measure current
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 141
Copyright © 2021 Texas Instruments Incorporated
Table B-35. MSP-TS430PZ100 Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND
7 J1, J2, J3, J4 0 25-pin header, TH
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.
SAM1029-25-ND : HeaderSAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 2 Jumper 15-38-1024-ND Place on: J6, J7
11 JTAG 1 14-pin connector, male, TH HRP14H-ND
12 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
13 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
14 R3 1 330 Ω, SMD0805 541-330ATR-ND
15R1, R2, R4,R8, R9, R10,
R11, R123 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12
16 R5 1 47k Ω, SMD0805 541-47000ATR-ND
17 U1 1 Socket: IC201-1004-008 orIC357-1004-53N Manuf.: Yamaichi
18 PCB 1 82 × 90 mm 2 layers
19 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons
Part No. SJ-5302Apply to corners at bottomside
20 MSP430 2 MSP430FG4619IPZ DNP: enclosed with kitsupplied by TI
Hardware www.ti.com
142 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.35 MSP-TS430PZ100A
Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 143
Copyright © 2021 Texas Instruments Incorporated
Jumper JP1Open to measure current
Jumper JP2Open to disconnect LED
D1LED connected to P5.1
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Orient Pin 1 ofMSP430 Device
Connector J5External power connector
Jumper JP3 to "ext"
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB
Hardware www.ti.com
144 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-36. MSP-TS430PZ100A Bill of MaterialsPos. Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.
2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND
4 C8 1 10nF, SMD0805 478-1358-1-ND
5 C6 0 470nF, SMD0805 478-1403-2-ND DNP
6 D1 1 green LED, SMD0805 67-1553-1-ND
7 J1, J2, J3, J4 0 25-pin header, TH
DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.
SAM1029-25-ND : HeaderSAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
12 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
15 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
16 R3 1 330 Ω, SMD0805 541-330ATR-ND
17
R1, R2, R4,R6, R7, R8,
R9, R10, R11,R12
2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R7, R8, R9,R10, R11, R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
20 PCB 1 90 x 82 mm 4 layers
21 Rubberstandoff 4 Select appropriate Apply to corners at bottom
side
22 MSP430 2 MSP430F47197IPZ DNP: Enclosed with kitsupplied by TI
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 145
Copyright © 2021 Texas Instruments Incorporated
B.36 MSP-TS430PZ100B
Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic
Hardware www.ti.com
146 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector J5External power connector
Jumper JP3 to "ext"
Jumper JP1Open to measure current
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCCor drive AUXVCCx externally
D1LED connected to P1.0
Jumper JP2Open to disconnect LED
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 147
Copyright © 2021 Texas Instruments Incorporated
Table B-37. MSP-TS430PZ100B Bill of MaterialsPosition Ref Des No. per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
2 C4, C5, C6 ,C7, C8, C9 6 100nF, SMD0805 311-1245-2-ND
3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND
4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP
5C13, C14,C16, C18,C19, C29
6 4.7 uF SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3,J4 0 25-pin header, TH
SAM1029-25-ND(Header) SAM1213-25-ND(Receptacle)
DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:
8 J5 1 3-pin header, male, TH
9
JP3, JP5,JP6, JP7,JP8, JP9,
JP10
7 3-pin header, male, TH SAM1035-03-NDplace jumpers on pins 2-3 on JP5, JP6,JP7, JP8, JP9, JP10 place jumpers onpins 1-2 on JP3,
10 JP1, JP2,JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 JP11, JP12,JP13 3 4-pin header, male, TH place jumper on header 1-2
12 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11
15 JTAG 1 14-pin connector, male,TH HRP14H-ND
16 BOOTST 0 10-pin connector, male,TH "DNP Keep vias free of solder"
17 Q1 0 Crystal DNP: Q1 Keep vias free of solder
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
22R1, R2, R4,
R6, R8,R10, R11
2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
25 PCB 1 90 x 82 mm 2 layers
26 Adhesiveplastic feet 4 Approximately 6mm width,
2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side
27 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI
Hardware www.ti.com
148 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.37 MSP-TS430PZ100C
DN
PD
NP
DN
P
DN
P
DN
P
DN
P
0R
12pF
12pF
47pF
47pF
GN
D
0R
100nF
330R
10 /6.3uF V
10 /6.3uF V
2.2
nF
PWR3
GN
D
GN
D
GN
D
GN
D0R
330R
47K
100nF
100nF
PT
RN
D516
-
470nF
100nF
100nF
0R
0R
0R
0R
GN
D
VCC
100nF
GN
D
100nF
100nF
GN
D
100nF
LL
A103
GN
D
4.7n
HCTC XTL_ _4
HCTC XTL_ _4
HCTC XTL_ _4
HCTC XTL_ _4
GN
D
0R
0R
GN
DG
ND
GN
D
4.7uF
GN
D
100nF
220nF
GN
D
VCC
LL A103
1.1
MS
PTa
rge
tS
ocke
tM
SP
TS
PZ
C430:
--
430
100
Socket:
Ya
maich
iIC
201-1
004-0
08
LFXTCLK
<-
SB
W
<-
JTA
G
Vccint
ext
DN
P
DN
P
DN
P
DN
P
DN
P
DN
P
BS
LR
x-
BS
LT
x-
DN
P
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
G
R2
C2
C1
C3
C4
R1
C5
R3
C6
C7
C8
123
J5
8079787776
75
74
73
72
71
70
69
68
67
66
65
60
59
58
57
56
55
54
53
52
51
504948474645
3635343332313029282726
25
24
23
22
21
16
15
14
13
12
11 10
9 8 7 6 5 4 3 2 1
64
63
62
61
44434241
37383940
17
18
19
20
81828384858687888990919293949596979899
100
U1
QF
P1
00
PZ
12345678910
1112
13
14
15
16
17
18
19
20
21
22
23
24
25
J1
26272829303132333435363738394041424344454647484950
J2
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J3
767778798081828384858687888990919293949596979899
100
J4
1JP
1
2
1
JP2
2
R4
123
JP
5123
JP
6123
JP
7123
JP
8123
JP
9123
JP
10
R7
R5
C11
C12
D1
C9
C13
C10
R6
R8
R9
R12
1 2 3
JP
3
C17
C18
C19
C14
D3
C16
1 2 3
JP
11
4
21Q G1 $1
43Q G1 $2
2 1
Q G2 $1
4 3
Q G2 $2
12
34
56
78
910
BO
OT
ST
R10
R11
C15
C20
C21
1JP
4
2
D4
123
J6
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
TD
O
XO
UT
VC
C
GND
GND
GN
D
XIN
P1.0
DV
CC
1
DV
CC
1
DV
CC
1
DVCC1
DV
CC
1
DVCC1
AV
CC
XT
OU
T2
AVSS
AVSS
AV
SS
M
M
I
I
O
O
XT
IN2
RS
TN
MI
/R
ST
NM
I/
TC
K
TC
K
TC
KC
C
TE
ST
SB
WT
CK
/
TE
ST
SB
WT
CK
/
TE
ST
SB
WT
CK
/
RS
T
RS
T
RS
T
XTLGND2
XTLGND1
PU.0
PU.1
P1.6P1.7
P8.0
P8.1
P8.2
VBAKVBAT
VBAT
VB
AT
P1.1
P1.1
P1.2
P1.2
LD
OI
LDOI
LD
OO
LDOO
BS
LIn
terfa
ce
LD
OI
LD
OO
Inte
rface
/
+
+
Note
Ifth
esys
tem
should
be
:supplie
dvia
LD
OI
Jclo
se
JP
(6)
4and
set
JP
toexte
rnal
3
Figure B-74. MSP-TS430PZ100C Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 149
Copyright © 2021 Texas Instruments Incorporated
If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to external
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Orient Pin 1 of MSP430 device
LDOI LDOO/
14
1
2
GN
D
GN
D
VC
C
12
55
10
15
20
26 5030 3540 45 51
75
55
60
65
70
76100 80859095
12
3
12
3
12
3
12
3
12
3
12
3
1231 2 3 4
10
1
2
1 2 3
1
JTA
GS
BW
Vcc
int
ext
GN
D
VB
AT
DV
CC
JTA
G
R2
C2
C1
C3
C4
R1
C5
R3
+C6
+
C7
C8
J5
U1
J1
J2
J3
J4
JP
1
JP2
R4
JP
5
JP
6
JP7
JP
8
JP
9
JP
10
R7
R5
C11
C1
2
D1
C9
C1
3
C10
R6
R8
R9
R1
2
JP3
C1
7
C1
8
C1
9
C1
4
D3
C16
JP11
Q1
Q2
BOOTSTR1
0
R1
1C
15
C20
C2
1
JP
4
D4
J6
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP1Open to measure current
Figure B-75. MSP-TS430PZ100C Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.
Hardware www.ti.com
150 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-38. MSP-TS430PZ100C Bill of Materials
Pos. Ref DesNumber
PerBoard
Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
3C5, C11,
C13, C14,C19, C20
6 100nF, SMD0805 311-1245-2-ND
3.1 C10, C12,C18,17 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.
7.1 4 25-pin header, TH SAM1213-25-ND DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.
8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND
9
JP5, JP6,JP7,
JP8,JP9,JP10
6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
12 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6,JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
15 Q1 0 CrystalDNP: Q1Keep vias free of solder
16 Q2 1 Crystal DNP: Q2 Keep vias free of solder
17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND
18
R1, R2, R4,R6, R8, R9,R10, R11,
R12
3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12
19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
20 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
21 PCB 1 79.5 x 99.5 mm MSP-TS430PZ100C Rev 1.0 2 layers
22 Rubber standoff 4 Buerklin: 20H1724 apply to corners at bottom side
23 MSP430 2 MSP430F643x DNP: enclosed with kit. Is supplied by TI.
24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042
26 D3, D4 2 LL103A Buerklin: 24S3406
27 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 2
28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430
29 C21 1 220nF, SMD0805 Buerklin 53 D 2381
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 151
Copyright © 2021 Texas Instruments Incorporated
B.38 MSP-TS430PZ100D
DN
P
Socket:
Yam
aic
hi IC
201-1
004-0
08
DN
P
DN
P
GN
D
GN
D
100nF
33
0R
-0R
GN
D
GN
D
1.1
nF
47
kG
ND
0R 0R
QU
AR
Z5
1uF
/10V
100nF
1uF
/10V
gre
en
DN
P
yello
w (D
NP
)
DN
P
red (D
NP
)
0R
GN
D
DN
P
DN
P
0R0R
QUARZ5
EV
Q11
0R
DNP
DN
P
MS
P4
30
FR
69
8X
PZ
FE
25-1
A1
FE25-1A2
FE
25-1
A3
FE25-1A4
100nF
GN
D
100nF
GN
D
1uF
/10V
100nF
GND
GN
D
470nF
GN
D
0R
4u7
GN
D
If exte
rnal s
upply
volta
ge:
rem
ove R
3 a
nd a
dd R
2 (0
Ohm
)
Ext_
PW
R
MS
P-T
S4
30
PZ
10
0D
Vcc
int
ext
Targ
et S
ocket B
oard
for M
SP
430F
R698xP
Z, F
R688xP
Z
DN
PD
NP
DN
P
DN
P
DN
P
JTA
G ->
SB
W ->
JTA
G-M
ode s
ele
ctio
n:
4-w
ire J
TA
G: S
et ju
mpers
JP
3 to
JP
8 to
positio
n 2
-32-w
ire "S
pyB
iWire
": Set ju
mpers
JP
3 to
JP
8 to
positio
n 1
-2
connectio
n b
y v
iaD
NP
DN
P
Pe
ters
en
10
99
/1/0
01
/01
.1
1.2
DN
P
DN
PD
NP
DN
P
DN
P
DN
PD
NP
1 3 5 7 9 11
13
2 4 6
12
148
10
JTA
G
C2
C1
C4
R1
12
34
56
78
91
0
BS
L
R2R3
123
J2
1 2 3
J1
1 2
JP
1
12J
P9
C5
R4
1 2 3JP
3
1 2 3JP
4
1 2 3JP
5
1 2 3JP
6
1 2 3JP
7
1 2 3JP
8
R5 R6
Q1
C3
C6
C7
D1
R1
0
12JP
10
D2
R11
12J
P11
D3
R1
2
1 2
JP
2
C8
C9
R8R9
Q2
SW
1
R1
3
TP2TP1
SW2
R1
4
P4
.3/U
CA
0S
OM
I/UC
A0
RX
D/U
CB
1S
TE
1
P1
.4/U
CB
0C
LK
/UC
A0
ST
E/T
A1
.0/S
12
P1
.5/U
CB
0S
TE
/UC
A0
CL
K/T
A0
.0/S
03
P1
.6/U
CB
0S
IMO
/US
B0
SD
A/T
A0
.14
P1
.7/U
CB
0S
OM
I/UC
B0
SC
L/T
A0
.25
R3
3/L
CD
CA
P6
P6
.0/R
23
7
P6
.1/R
13
/LC
DR
EF
8
P6
.2/C
OU
T/R
03
9
P6
.3/C
OM
01
0
P6
.4/T
B0
.0/C
OM
111
P6
.5/T
B0
.1/C
OM
21
2
P6
.6/T
B0
.2/C
OM
31
3
P2
.4/T
B0
.3/C
OM
4/S
43
14
P2
.5/T
B0
.4/C
OM
5/S
42
15
P2
.6/T
B0
.5/C
OM
6/S
41
16
P2
.7/T
B0
.6/C
OM
7/S
40
17
P1
0.2
/TA
1.0
/SM
CL
K/S
39
18
P5
.0/T
A1
.1/M
CL
K/S
38
19
P5
.1/T
A1
.2/S
37
20
P5
.2/T
A1
.0/T
A1
CL
K/A
CL
K/S
36
21
P5
.3/U
CB
1S
TE
/S3
52
2
P3
.0/U
CB
1C
LK
/S3
42
3
P3
.1/U
CB
1S
IMO
/UC
B1
SD
A/S
33
24
P3
.2/U
CB
1S
OM
I/UC
B1
SC
L/S
32
25
DVSS126
DVCC127
TEST/SBWTCK28
XRST/NMI/SBWTDIO29
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG130
PJ.1/TDI/TCLK/MCLK/SRSCG031
PJ.2/TMS/ACLK/SROSCOFF32
PJ.3/TCK/COUT/SRCPUOFF33
P6.7/TA0CLK/S3134
P7.5/TA0.2/S3035
P7.6/TA0.1/S2936
P10.1/TA0.0/S2837
P7.7/TA1.2/TB0OUTH/S2738
P3.3/TA1.1/TB0CLK/S2639
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2540
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2441
P3.6/UCA1CLK/TB0.2/S2342
P3.7/UCA1STE/TB0.3/S2243
P8.0/RTCCLK/S2144
P8.1/DMAE0/S2045
P8.2/S1946
P8.3/MCLK/S1847
P2.3/UCA0STE/TB0OUTH48
P2.2/UCA0CLK/TB0.4/RTCCLK49
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE050P
2.0
/UC
A0
SIM
O/U
CA
0T
XD
/TB
0.6
/TB
0C
LK
51
P7
.0/T
A0
CL
K/S
17
52
P7
.1/T
A0
.0/S
16
53
P7
.2/T
A0
.1/S
15
54
P7
.3/T
A0
.2/S
14
55
P7
.4/S
MC
LK
/S1
35
6D
VS
S2
57
DV
CC
25
8P
8.4
/A7
/C7
59
P8
.5/A
6/C
66
0P
8.6
/A5
/C5
61
P8
.7/A
4/C
46
2P
1.3
/ES
ITE
ST
4/T
A1
.2/A
3/C
36
3P
1.2
/TA
1.1
/TA
0C
LK
/CO
UT
/A2
/C2
64
P1
.1/T
A0
.2/T
A1
CL
K/C
OU
T/A
1/C
1/V
RE
F+
/VE
RE
F+ 6
5P
1.0
/TA
0.1
/DM
AE
0/R
TC
CL
K/A
0/C
0/V
RE
F-/V
ER
EF 6
6P
9.0
/ES
ICH
0/E
SIT
ES
T0
/A8
/C8
67
P9
.1/E
SIC
H1
/ES
ITE
ST
1/A
9/C
96
8P
9.2
/ES
ICH
2/E
SIT
ES
T2
/A1
0/C
10
69
P9
.3/E
SIC
H3
/ES
ITE
ST
3/A
11
/C11
70
P9
.4/E
SIC
I0/A
12
/C1
27
1P
9.5
/ES
ICI1
/A1
3/C
13
72
P9
.6/E
SIC
I2/A
14
/C1
47
3P
9.7
/ES
ICI3
/A1
5/C
15
74
ES
IVC
C7
5
ESIVSS 76ESICI 77
ESICOM 78AVCC1 79AVSS3 80
PJ.7/HFXOUT 81PJ.6/HFXIN 82
AVSS1 83
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100
DVCC3 99
DVSS3 98
P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97
P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96
P10.0/SMCLK/S4 95
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93
P4.5/UCB1CLK/TA1.0/S7 92
P4.4/UCB1STE/TA1CLK/S8 91
P5.7/UCA1STE/TB0CLK/S9 90
P5.6/UCA1CLK/S10 89
P5.5/UCA1SOMI/UCA1RXD/S11 88
P5.4/UCA1SIMO/UCA1TXD/S12 87
AVSS2 86
PJ.5/LFXOUT 85
PJ.4/LFXIN 84
IC1
12345678910
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
J3
26272829303132333435363738394041424344454647484950
J4
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J5
767778798081828384858687888990919293949596979899
100
J6
C10
C11
12
JP
12
C12
C13
C14
R7
C15
P1.0
P1.0
RS
T/N
MI
TM
ST
DI
VC
C
GN
D
P1.1
P1.1
TC
K/S
BW
TC
K
TD
O/S
BW
TD
IO
PJ.0
/TD
O
PJ.0/TDO
PJ.2
/TM
S
PJ.2/TMS
PJ.3
/TC
K
PJ.3/TCK
PJ.1
/TD
I
PJ.1/TDI
P1.2
P1.2
BS
LT
X
BS
LT
X
BS
LR
X
BSLRX
P1.3
P1.3
AV
CC
AVCC
AV
SS
AVSS
AVSS
AVSS
LF
XO
UT
LF
XIN
LF
GN
DH
FG
ND
HF
XIN
HF
XO
UT
DV
CC
DV
CC
DVCC
DVCC
DV
CC
DVCC
DV
CC
DV
CC
DV
CC
DV
SS
DVSS
DV
SS
DVSS
TE
ST
/SB
WT
CK
1
TE
ST
/SB
WT
CK
TEST/SBWTCK
TE
ST
/SB
WT
CK
LC
DC
APL
CD
CA
P
ES
IVC
C
ES
IVC
C
ESICOM
ES
ICO
M
ESIVSS
RST/SBWTDIO
RS
T/S
BW
TD
IO
RS
T/S
BW
TD
IO
1 2 3 4 5 6
1 2 3 4 5 6
Tite
l:
Da
tum
:
Be
arb
.:
Se
ite1
/1
MS
P-T
S4
30
PZ
10
0D
7/9
/20
13
5:2
3:2
5 P
MA
3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Do
k:
Re
v.:
Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic
Hardware www.ti.com
152 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
1
Vccext
int
Vcc
GND
GND
JTAG
SBW
RESET
Ext.
Pwr.
PW
R
DVCC
AVCC
TC
K
TM
S
TD
I
TD
O
RST/SBWTDIO
TE
ST
/SB
WT
CK
GND
GND
P1.3
ESIVCC
14
1
2
10
1
2
1
111111
12
55
10
15
20
2650 30354045
51
75
55
60
65
70
76 10080 85 90 95
MS
P-T
S4
30
PZ
10
0D
Re
v. 1
.2R
oH
S
Q2 Q1
P1
.0
P1
.1
P1
.2
JTAG
C2
C1
C4
R1
BSL
R2
R3
J2
J1
JP
1JP
9C5R
4
JP
3
JP
4
JP
5
JP
6
JP
7
JP
8
R5
R6
C3
C6C7
D1
R1
0JP
10
D2
R11
JP
11
D3
R12
JP2
C8
C9
R8
R9
SW
1
R1
3
TP2
TP1
SW
2
R14 IC1
J3
J4
J5
J6
C10
C11
JP12
C1
2C
13
C14
R7
C1
5 Orient Pin 1 of MSP430 deviceLEDs connected to
P1.0, P1.1, P1.2 throughJP9, JP10, JP11
(only D1 assembled)
Switch SW2Connected to P1.3
Jumper JP1Open to measure current
Connector J2External power connector
Jumper J1 to “ext”
Connector BSLFor Bootloader Tool
Connector JTAGFor JTAG Tool
Jumper JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper J11-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Switch SW1Device reset
HF and LF oscillators withcapacitors and resistorsto connect pinheads
Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 153
Copyright © 2021 Texas Instruments Incorporated
Table B-39. MSP-TS430PZ100D Bill of Materials
Pos. Ref DesNumber
PerBoard
Description Digi-Key Part No. Comment
1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100DRev 1.2
2 layers, white solder mask
2 JP1, JP2,JP9
3 2-pin header, male, TH SAM1035-02-ND place jumper on header
3 JP10, JP11,JP12
3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
4 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
5 JP3, JP4,JP5, JP6,JP7, JP8
6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
6 J2 1 3-pin header, male, TH SAM1035-03-ND
7 R2, R3, R5,R6, R8, R9
6 0R, 0805 541-0.0ATR-ND DNP
8 R7, R12,R13
3 0R, 0805 541-0.0ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND DNP
12 R4 1 47k, 0805 541-47KATR-ND
13 C4, C6, C10,C11
4 100nF, CSMD0805 490-1666-1-ND
14 C13 1 100nF, CSMD0805 490-1666-1-ND DNP
15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP
16 R1 1 330R, 0805 541-330ATR-ND
17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP
18 R10, R11 2 330R, 0805 541-330ATR-ND DNP
19 R14 1 47k, 0805 541-47KATR-ND DNP
20 C1, C2, C8,C9
4 DNP, CSMD0805 DNP
21 SW2 1 EVQ-11L05R P8079STB-ND DNP
22 SW1 1 EVQ-11L05R P8079STB-ND DNP
23 J3, J4, J5, J6 4 25-pin header, TH
SAM1029-25-ND
DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Header
24 J3, J4, J5, J6 4 25-pin receptacle, TH
SAM1213-25-ND
DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Receptacle
25 TP1, TP2 2 Testpoint DNP, keep pads free of solder
26 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
27 JTAG 1 14-pin connector, male, TH HRP14H-ND
28 IC1 1 Socket: IC201-1004-008 Manuf. Yamaichi
29 IC1 1 MSP430FR6989 DNP: enclosed with kit. Is supplied by TI
30 Q1 1 DNP: MS3V-TR1 (32768kHz/20ppm/12,5pF)
depends on application Micro Crystal, DNP, enclosed in kit, keepvias free of solder
31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder
32 D1 1 green LED, DIODE0805 P516TR-ND
33 D3 1 red (DNP), DIODE0805 DNP
34 D2 1 yellow (DNP), DIODE0805 DNP
Hardware www.ti.com
154 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-39. MSP-TS430PZ100D Bill of Materials (continued)
Pos. Ref DesNumber
PerBoard
Description Digi-Key Part No. Comment
35 Rubberstand off
4 Buerklin: 20H1724 apply to corners at bottom side
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 155
Copyright © 2021 Texas Instruments Incorporated
B.39 MSP-TS430PZ100E
Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic
Hardware www.ti.com
156 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector JTAGFor JTAG Tool
Connector BSLFor Bootloader Tool
Connector J2External power connector
Jumper J1 to External
Jumpers JP1 to JP4Open to measure current
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumpers JP11, JP12Open to disconnect LEDs D1 and D2
D1, D2LEDs connected to P1.0, P1.1
Orient Pin 1 of MSP430 device
BSL Interface SwitchesSelect which BSL interface to connectto connector BSL
I2C pullup enable switchSwitch On to connect I2C pullup resistors
Jumper J11-2 (Debugger): Power supply from JTAG interface
2-3 (External): External power supply
Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 157
Copyright © 2021 Texas Instruments Incorporated
Table B-40. MSP-TS430PZ100E Bill of MaterialsItem No. Designator Quantity Description Supplier Part Number Note
1 PCB1 1 PCB, 3.20" x 4.50" 2 layers, yellow soldermask
2 BSL 1 Header(Shrouded), 2.54mm, 5x2,Gold, TH AWHW-10G-0202-T-ND
3 C1, C2 2 CAP, CERM, 12 pF, 50 V, ±5%, C0G/NP0, 0805 311-1100-1-ND DNP
4 C3, C7 2 CAP, CERM, 1 µF, 10 V, ±10%, X5R,0805 490-1702-1-ND
5 C4, C6, C10, C11 4 CAP, CERM, 0.1 µF, 50 V, ±10%,X7R, 0805 490-1666-1-ND
6 C5 1 CAP, CERM, 1100 pF, 50 V, ±5%,C0G/NP0, 0805 490-1623-1-ND
7 C8, C9 2 CAP, CERM, 22 pF, 50 V, ±5%, C0G/NP0, 0805 490-3608-1-ND DNP
8 C12 1 CAP, CERM, 4.7 µF, 10 V, +80/-20%,Y5V, 0805 311-1371-2-ND DNP
9 C13 1 CAP, CERM, 1000 pF, 50 V, ±5%,C0G/NP0, AEC-Q200 Grade 1, 0805 490-8032-1-ND
10 C14, C15 2 CAP, CERM, 27 pF, 50 V, ±5%, C0G/NP0, 0603 490-1413-1-ND
11 C16 1 CAP, CERM, 47 µF, 6.3 V, ±20%,X5R, 0805 490-9960-1-ND
12 D1 1 LED, Green, SMD 754-1939-1-ND
13 D2 1 LED, Blue, SMD 732-4982-1-ND
14 H1, H2, H3, H4 4 125mil Mounting Hole
15 H5, H6, H7, H8 4 Bumpon, Cylindrical, 0.312 X 0.200,Black SJ5746-0-ND
16 IC1 1 Socket, QFP-100, 0.5 mm Pitch
17 J1, J2, JP5, JP6, JP7,JP8, JP9, JP10 8 Header, 100mil, 3x1, Gold, TH SAM1029-03-ND
18 J3, J4, J5, J6 4 Header, 100mil, 25x1, Gold, TH SAM1029-25-NDDNP: Headers areenclosed in kit. Keepvias free of solder
19 J3, J4, J5, J6 4 Receptacle, 100mil, 25x1, Gold, TH SAM1213-25-NDDNP: Receptacles areenclosed in kit. Keepvias free of solder
20 JP1, JP2, JP3, JP4,JP11, JP12, JP13, JP14 8 Header, 100mil, 2x1, Gold, TH SAM1029-02-ND
21 JTAG 1 Header (shrouded), 100 mil, 7x2,Gold, TH S9170-ND
22 Q1, Q2 2 32.768kHz ±20ppm 12.5pF 94M8466 DNP: Keep holes free ofsolder
23 Q3 1 ZTACS Crystal Resonator 77D9806 DNP
24 R1 1 RES, 330, 5%, 0.125 W, 0805 541-330ACT-ND
25 R2 1 RES, 200, 5%, 0.125 W, 0805 541-200ACT-ND
26 R3, R10, R11, R12,R18, R19, R20, R21 8 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND
27 R4, R5, R6, R8, R9,R14, R15 7 RES, 0, 5%, 0.1 W, 0603 541-0.0GCT-ND DNP
28 R7 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND
29 R13 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND DNP
30 R16, R17 2 RES, 4.7 k, 5%, 0.125 W, 0805 541-4.7KACT-ND
Hardware www.ti.com
158 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-40. MSP-TS430PZ100E Bill of Materials (continued)Item No. Designator Quantity Description Supplier Part Number Note
31 R22 1 RES, 22, 5%, 0.1 W, 0603 541-22GCT-ND
32
SH‑J1, SH‑JP1,SH‑JP2, SH‑JP3,SH‑JP4, SH‑JP5,SH‑JP6, SH‑JP7,SH‑JP8, SH‑JP9,
SH‑JP10, SH‑JP11,SH‑JP12, SH‑JP13,
SH‑JP14
15 Shunt, 100mil, Gold plated, Black 3M9580-ND
J1: 1-2, JP1: 1-2, JP2:1-2, JP3: 1-2, JP4: 1-2,JP5: 2-3, JP6: 2-3, JP7:2-3, JP8: 2-3, JP9: 2-3,JP10: 2-3, JP11: 1-2,JP12: 1-2, JP13: 1-2,JP14: 1-2
33 SW1, SW2 2 Switch Tactile SPST-NO 0.02A 15V P8079STB-ND
34 SW3, SW4, SW5 3 Switch, DPST, Slide, Off-On, 1 Pos,0.15A, 30V, TH GH7727-ND
Install with arrowmatching arrow onPCB. S5 should be"ON", S3 and S4 shouldbe "OFF"
35 TP1, TP2, TP3, TP4,TP5, TP6 6 Test Point, Miniature, Black, TH 36-5001-ND DNP
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 159
Copyright © 2021 Texas Instruments Incorporated
B.40 MSP-TS430PZ5x100
Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic
Hardware www.ti.com
160 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Connector J5External power connector
Jumper JP3 to "ext"
Jumper JP1Open to measure current
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Orient Pin 1 ofMSP430 device
Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 161
Copyright © 2021 Texas Instruments Incorporated
Table B-41. MSP-TS430PZ5x100 Bill of MaterialsPos. Ref Des No. Per
Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP
1b C3, C4 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.
2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5, C10, C11,C12, C13, C14 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14
4 C8 0 2.2nF, SMD0805 DNP
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 67-1553-1-ND
7 J1, J2, J3, J4 0 25-pin header, TH
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.
SAM1029-25-ND : HeaderSAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9JP5, JP6, JP7,
JP8, JP9,JP10
6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
12 9 Jumper 15-38-1024-ND Place on JP1, JP2, JP3, JP5,JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
15 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
17R1, R2, R4,R6, R8, R9,
R10, R11, R123 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,
R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
20 PCB 1 90 x 82 mm 2 layers
21 Rubberstandoff 4 Select appropriate Apply to corners at bottom side
22 MSP430 2 MSP430F5438IPZ DNP: Enclosed with kit suppliedby TI
Hardware www.ti.com
162 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.41 MSP-TS430PZ100USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 Vlower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, torun the MCU at 3.0 V, set it to 3.3 V.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 163
Copyright © 2021 Texas Instruments Incorporated
Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic
Hardware www.ti.com
164 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE
LED1, D2, D3LEDs connected to P8.0,
LE LEP8.1, P8.2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
USB1USB connector
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 165
Copyright © 2021 Texas Instruments Incorporated
Table B-42. MSP-TS430PZ100USB Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
3 C5, C11, C13,C14, C19 5 100nF, SMD0805 311-1245-2-ND
3.1 C10, C12,C18, C17 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND
7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.: Header: Receptacle
7.1 4 25-pin header, TH SAM1213-25-ND
DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.: Header: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9JP5, JP6, JP7,
JP8, JP9,JP10
6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
12 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF
DNP: Q1. Keep vias free ofsolder
15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
17R1, R2, R4,R6, R8, R9,
R123 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0603 not existing in Rev 1.0
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
21 Rubber standoff 4 Buerklin: 20H1724 apply to corners at bottom side
22 MSP430 2 MSP430F6638IPZ DNP: enclosed with kit. Issupplied by TI
23 Insulating diskto Q2 1 Insulating disk to Q2
http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121
24 C16 1 4.7 nF SMD0603
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35, C36 2 10p SMD0603 Buerklin: 56D102
Hardware www.ti.com
166 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-42. MSP-TS430PZ100USB Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
34 IC7 1 TPD4E004 Manu: TI
35 LED 0 JP3QE SAM1032-03-ND DNP
36 LED1, LED2,LED3 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
37 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612
39 R34 1 27R SMD0603 Buerklin: 07E444
40 R35 1 27R SMD0603 Buerklin: 07E444
41 R36 1 33k SMD0603 Buerklin: 07E740
42 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)
43 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
44 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 167
Copyright © 2021 Texas Instruments Incorporated
B.42 MSP-TS430PZ100AUSBThe development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642xflash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-TS430PZ100AUSB kit. Free samples can be ordered from www.ti.com/product/MSP430FG6626/samplebuy.
Hardware www.ti.com
168 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
0R
12pF
12pF
47pF
47pF
GN
D
0R
100nF
330R
10uF
/6,3
V
10uF/6,3V
2.2
nF
PWR3
GN
D
GN
D
GN
D
GN
D0R
47K
100nF
100nF
470nF
100nF
100nF
0R0
R
0R
0R
GN
D
GN
DG
ND
GN
DG
ND
1k4
10p
10p
27R
27R
33k
4u7
GN
D
LL103A
TPD4E004
0.1
u
220n
220n
GN
D
GN
D
VCC
GN
DG
ND
470R
GN
D
470R
GN
D
470R
100nF
GN
D 100nF
100nF
GN
D
100R
100nF
LL103A
1M
GN
D
4.7
n
HCTC_XTL_4
HCTC_XTL_4
MS
P4
30
FG
66
26
IPZ
0R22nF
QU
AR
Z5
DN
P
1.1
for
MS
P4
30
FG
66
26
IPZ
de
vic
e
Ta
rge
tso
cke
tb
oa
rdM
SP
-TS
43
0P
Z1
00
AU
SB
Socket:
Ya
maic
hi
IC357-1
004-0
53N
DN
P
<-
SB
W
<-
JTA
G
Vcc
int
ext
GN
D
DN
P
DN
PD
NP
DN
P
DN
P
DN
P
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
G
R2
C2
C1
C3
C4
R1
C5
R3
C6
C7
C8
J5123
12345678910
1112
13
14
15
16
17
18
19
20
21
22
23
24
25
J1
26272829303132333435363738394041424344454647484950
J2
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J3
767778798081828384858687888990919293949596979899
100
J4
JP
112
JP2
12
R4
123
JP
5123
JP
6123
JP
7123
JP
8123
JP
9123 JP
10
R5
C11
C12
D1
C9
C13
C10
R6
R8
R9
R12
1 2 3
JP
3
US
B1
VB
US
1
GN
D4
D-
2
D+
3
SH
IELD
5
SH
IELD
16
R33
C35
C36
R34
R35
R36
C39
D2
IC7
IO11
IO22
GND3
VCC6
IO45
IO34
C40
C33
C38
JP
412
LED3
S1
1 2
S2
1 2
R13
LED1
R15
LED2
R16
LE
D-1
12
LE
D-2
34
LE
D-3
56
C17
C18
C19
R10S3
1 2
C14
D4
R11
C16
JP
11
1 2 3 4
Q2G$1
2 1
Q2G$2
4 3
P6.4
/CB
4/A
D0+
/OA
0O
1
P6.5
/CB
5/A
D0-/O
A0N
2
P6.6
/CB
6/A
D1+
/GS
W0A
3
P6.7
/CB
7/A
D1-/G
SW
0B
4
P7.4
/CB
8/A
D2+
/OA
1O
5
P7.5
/CB
9/A
D2-/O
A1N
6
P7.6
/CB
10/A
D3+
/GS
W1A
7
P7.7
/CB
11/A
D3-/G
SW
1B
8
P5.0
/VR
EF
+/V
ER
EF
+9
P5.1
//A4/D
AC
010
P5.6
/A5/D
AC
111
NR
12
AV
SS
113
XO
UT
14
XIN
15
AV
CC
16
CP
CA
P17
P2.0
/P2M
AP
0/D
AC
018
P2.1
/P2M
AP
1/D
AC
119
P2.2
/P2M
AP
220
P2.3
/P2M
AP
321
P2.4
/P2M
AP
4/R
03
22
P2.5
/P2M
AP
523
P2.6
/P2M
AP
6/L
CD
RE
F/R
13
24
P2.7
/P2M
AP
7/R
23
25
DVCC126
DVSS127
VCORE28
LCDCAP/R3329
COM030
P5.3/COM1/S4231
P5.4/COM2/S4132
P5.5/COM3/S4033
P1.0/TA0CLK/ACLK/S3934
P1.1/TA0.0/S3835
P1.2/TA0.1/S3736
P1.3/TA0.2/S3637
P1.4/TA0.3/S3538
P1.5/TA0.4/S3439
P1.6/TA0.1/S3340
P1.7/TA0.2/S3241
P3.0/TA1CLK/CBOUT/S3142
P3.1/TA1.0/S3043
P3.2/TA1.1/S2944
P3.3/TA1.2/S2845
P3.4/TA2CLK/SMCLK/S2746
P3.5/TA2.0/S2647
P3.6/TA2.1/S2548
P3.7/TA2.2/S2449
P4.0/TB0.0/S2350
P4.1
/TB
0.1
/S22
51
P4.2
/TB
0.2
/S21
52
P4.3
/TB
0.3
/S20
53
P4.4
/TB
0.4
/S19
54
P4.5
/TB
0.5
/S18
55
P4.6
/TB
0.6
/S17
56
P4.7
/TB
0O
UT
H/S
VM
OU
T/S
16
57
P8.0
/TB
0C
LK
/S15
58
P8.1
/UC
B1S
TE
/UC
A1C
LK
/S14
59
P8.2
/UC
A1T
XD
/UC
A1S
IMO
/S13
60
P8.3
/UC
A1R
XD
/UC
A1S
OM
I/S12
61
P8.4
/UC
B1C
LK
/UC
A1S
TE
/S11
62
DV
SS
263
DV
CC
264
P8.5
/UC
B1S
IMO
/UC
B1S
DA
/S10
65
P8.6
/UC
B1S
OM
I/UC
B1S
CL/S
966
P8.7
/S8
67
P9.0
/S7
68
P9.1
/S6
69
P9.2
/S5
70
P9.3
/S4
71
P9.4
/S3
72
P9.5
/S2
73
P9.6
/S1
74
P9.7
/S0
75
VSSU76
PU.0/DP77
PUR78
PU.1/DM79
VBUS80
VUSB81
V1882
AVSS283
P7.2/XT2IN84
P7.3/XT2OUT85
VBAK86
VBAT87
P5.7/DMAE0/RTCCLK88
DVCC389
DVSS390
TEST/SBWTCK91
PJ.0/TDO92
PJ.1/TDI/TCLK93
PJ.2/TMS94
PJ.3/TCK95
RST/NMI/SBWTDIO96
P6.0/CB0/A097
P6.1/CB1/A198
P6.2/CB2/A2/OA0IP099
P6.3/CB3/A3/OA1IP0100
U1
R14
C15
TP2TP1
Q3
TM
S
TM
S
TD
I
TD
I
TD
O
TD
O
TD
O
XIN
XIN
VC
C
GND
GN
D
GND
GN
D
GN
DGND
XO
UT
XO
UT
P1.0
P1.0
DV
CC
1
DV
CC
1
DV
CC
1
DV
CC
1
DV
CC
1
DV
CC
1
DVCC1
AV
CC
AV
CC
XT
2O
UT
AVSS
AVSS
AV
SS
AV
SS
M
M
I
I
O
O
XT
2IN
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
KC
C
TE
ST
/SB
WT
CK
1
RS
T
RS
T
XTLGND2
XTLGND1
PU
.0/D
P
PU.0/DP
PU.0/DP
PU
R
PUR
PUR
PU
.1/D
M
PU.1/DM
PU.1/DM
VBUS
VBUS
VB
US
D-
D+
VUSB
VU
SB
VUSB
V18
V18
P1.6
P1.6
P1.7
P1.7
P8.0
P8.0
P8.1
P8.1
P8.2
P8.2
VBAK
VB
AK
VBATV
BA
T
CP
CA
P
NR
NR
TE
ST
/SB
WT
CK
US
BIn
terfa
ce
Mis
ce
llan
eo
us
DN
P
+
+
Figure B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 169
Copyright © 2021 Texas Instruments Incorporated
Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE
LED1, D2, D3LEDs connected to P8.0,
LE LEP8.1, P8.2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
Jumper JP31-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAGFor JTAG Tool
USB1USB connector
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP2Open to disconnect LED
D1LED connected to P1.0
Jumper JP1Open to measure current
141
2
GN
D
GN
D
VC
C
125
510
15
20
26 5030 35 40 45 51
75
55
60
65
70
76100 80859095
12
3
12
3
12
3
12
3
12
3
12
3
123
1 2 3
1 2 3 4
+
+
J1 J2
U1
Figure B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB
Hardware www.ti.com
170 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-43. MSP-TS430PZ100AUSB Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment
1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask
2 C1, C2 2 12pF, SMD0805 DNP: C1, C2
3 C10, C12,C17, C18 9 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
4 C15 1 22nF, CSMD0805 311-1242-1-ND
5 C16 1 4.7 nF SMD0603 311-1250-1-ND
6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND
7 C33, C38 2 220n SMD0603 Buerklin: 53D2074
8 C35, C36 2 10p SMD0603 Buerklin: 56D102
9 C39 1 4u7 SMD0603 Buerklin: 53D2086
10 C40 1 0.1u SMD0603 Buerklin: 53D2068
11 C5, C11, C13,C14, C19 5 100nF, SMD0805 311-1245-2-ND
12 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND
13 C8 1 2.2nF, CSMD0805 709-1339-1-ND
14 C9 1 470nF, SMD0805 478-1403-2-ND
15 D1 1 green LED, HSMG-C170DIODE0805 516-1434-1-ND Avago, Farnell 5790852
16 D2, D4 2 LL103A, SOD-80 Buerklin: 24S3406
17 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI
18 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: Headers enclosed in kit.Keep vias free of solder.
19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND DNP: Receptacles enclosed inkit. Keep vias free of solder.
20 J5 1 3-pin header, male, TH SAM1035-03-ND
21 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 2
23 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
24JP5, JP6, JP7,
JP8, JP9,JP10
6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
25
Jumpers forJP1, JP2, JP3,JP4, JP5, JP6,JP7, JP8, JP9,
JP10, JP11
11 Jumper 15-38-1024-ND
26 JTAG 1 14-pin connector, male, TH HRP14H-ND
27 LED 1 JP3QE SAM1032-03-ND DNP
28 LED1, LED2,LED3 3 FARNELL: 852-9833 DNP
29 MSP430 2 MSP430FG6626IPZ DNP: Free samples can beordered in the TI Store
30 Q2 1 Crystal Q2: 4MHzBuerklin: 78D134
31 Q3 1 MS3V-T1R (32.768kHz/20ppm/12.5pF)
32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND
33 R10 1 100R, R0603 541-100GCT-ND
34 R11 1 1M, R0603 541-1.0MGCT-ND
35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 DNP
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 171
Copyright © 2021 Texas Instruments Incorporated
Table B-43. MSP-TS430PZ100AUSB Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND
37 R3 1 330 Ohm, SMD0805 541-330ATR-ND
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612
39 R34, R35 2 27R SMD0603 Buerklin: 07E444
40 R36 1 33k SMD0603 Buerklin: 07E740
41 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
42 R6, R8, R9,R12 4 0 Ohm, SMD0805 541-000ATR-ND DNP
43 S1, S2 1 PB P12225STB-ND DNP
44 S3 1 PB P12225STB-ND
45 TP1, TP2 2 Test point DNP, Keep vias free of solder
46 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
47 USB1 1 USB Receptacle FARNELL: 117-7885
48 Insulating diskfor Q2 1 Insulating disk for Q2 ettinger.de 70.08.121
49 Rubber standoff 4 Buerklin: 20H1724 Apply to corners at bottom side
Hardware www.ti.com
172 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
B.43 MSP-TS430PEU128
0R
12pF
12pF
GN
D
GN
D
0R
100nF
330R
2.2
nF
0R
0R
PWR3
GN
D
330R
47K
0R
0R
100nF
4.7
uF
GN
D
GN
D
100nF470nF
0R
QUARZ5
100nF
10uF
/6,3
V
10uF
/6,3
V
100nF
4.7
uF
4.7
uF
100nF
4.7uF
4.7
uF
4.7
uF
470nF
FE
04-1
VC
C
GN
D
GN
D
100nF
4.7uF
GN
D
GN
D
GN
D
GN
D
GN
D
VCC1
VC
C1
VC
C1
VC
C1
VC
C1
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
AV
SS
AV
SS
AV
CC
DV
CC
GND
VC
C
VCC
GN
D
MS
P4
30
:Ta
rge
t-So
cke
t
MS
P-T
S4
30
PE
U1
28
for
F6
77
9
Pe
ters
en
10
80
/1/0
01
/01
.1
DN
P
LF
XT
CL
K
DN
P
<-
SB
W
<-
JTA
G
DN
P
Vcc
int
ext
DN
P
DN
P
DN
P
DNP
DN
P
DN
P
DN
P
DV
DS
YS
1.1
12345678910
1112
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
J1
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J2
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
J3
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126127
128
J4
1 3 5 7 9 11 13
2 4 6
12
148
10
JTA
G
R2
C2
C1
R1
C5
R3
12
34
56
78
910
BO
OT
ST
C3
R10
R11
J51
2
3
12
JP
1
JP
2
1 2
123
JP
5123
JP
6123
JP
7123
JP
8123
JP
9123 JP
10
R7
R5
D1
R6
R8
C6
C29
C7
C10
R4
Q1
JP
12
1234
1234
JP
11
JP
13
1234
C4
C11
C12
C8
C13
C14
C9
C16
C19
C18
C26
1
2
JP
4
JP
3
1 2 3 4
C15
C17
TP1 TP2
IC1
MS
P430F
677X
IPE
U#
XIN
1
XO
UT
2
AU
XV
CC
33
RT
CC
AP
14
RT
CC
AP
05
P1.5
/SM
CLK
/CB
0/A
56
P1.4
/MC
LK
/SD
CLK
/CB
1/A
47
P1.3
/AD
C10C
LK
/TA
CLK
/RT
CC
LK
/A3
8
P1.2
/AC
LK
/TA
3.1
/A2
9
P1.1
/TA
2.1
/VE
RE
F+
/A1
10
P1.0
/TA
1.1
/TA
0.0
/VE
RE
F-/A
011
P2.4
/PM
_TA
2.0
12
P2.5
/PM
_U
CB
0S
OM
I/PM
_U
CB
0S
CL
13
P2.6
/PM
_U
SB
0S
IMO
/PM
_U
CB
0S
DA
14
P2.7
/PM
_U
CB
0C
LK
15
P3.0
/PM
_U
CA
0R
XD
/PM
_U
CA
0S
OM
I16
P3.1
/PM
_U
CA
0T
XD
/PM
_U
CA
0S
IMO
17
P3.2
/PM
_U
CA
0C
LK
18
P3.3
/PM
_U
CA
1C
LK
19
P3.4
/PM
_U
CA
1R
XD
/PM
_U
CA
1S
OM
I20
P3.5
/PM
_U
CA
1T
XD
/PM
_U
CA
1S
IMO
21
CO
M0
22
CO
M1
23
P1.6
/CO
M2
24
P1.7
/CO
M3
25
P5.0
/CO
M4
26
P5.1
/CO
M5
27
P5.2
/CO
M6
28
P5.3
/CO
M7
29
LC
DC
AP
/R33
30
P5.4
/SD
CLK
/R23
31
P5.5
/SD
0D
IO/L
CD
RE
F/R
13
32
P5.6
/SD
1D
IO/R
03
33
P5.7
/SD
2D
IO/C
B2
34
P6.0
/SD
3D
IO35
P3.6
/PM
_U
CA
2R
XD
/PM
_U
CA
2S
OM
I36
P3.7
/PM
_U
CA
2T
XD
/PM
_U
CA
2S
IMO
37
P4.0
/PM
_U
CA
2C
LK
38
P4.1/PM_UCA3RXD/PM_UCA3SOMI39
P4.2/PM_UCA3TXD/PM_UCA3SIMO40
P4.3/PM_UCA3CLK41
P4.4/PM_UCB1SOMI/PM_UCB1SCL42
P4.5/PM_UCB1SIMO/PM_UCB1SDA43
P4.6/PM_UCB1CLK44
P4.7/PM_TA3.045
P6.1/SD4DIO/S3946
P6.2/SD5DIO/S3847
P6.3/SD6DIO/S3748
P6.4/S3649
P6.5/S3550
P6.6/S3451
P6.7/S3352
P7.0/S3253
P7.1/S3154
P7.2/S3055
P7.3/S2956
P7.4/S2857
P7.5/S2758
P7.6/S2659
P7.7/S2560
P8.0/S2461
P8.1/S2362
P8.2/S2263
P8.3/S2164
P8.4
/S20
65
P8.5
/S19
66
P8.6
/S18
67
P8.7
/S17
68
DV
SY
S69
DV
SS
270
P9.0
/S16
71
P9.1
/S15
72
P9.2
/S14
73
P9.3
/S13
74
P9.4
/S12
75
P9.5
/S11
76
P9.6
/S10
77
P9.7
/S9
78
P10.0
/S8
79
P10.1
/S7
80
P10.2
/S6
81
P10.3
/S5
82
P10.4
/S4
83
P10.5
/S3
84
P10.6
/S2
85
P10.7
/S1
86
P11
.0/S
087
P11
.1/T
A3.1
/CB
388
P11
.2/T
A1.1
89
P11
.3/T
A2.1
90
P11
.4/C
BO
UT
91
P11
.5/T
AC
LK
/RT
CC
LK
92
P2.0
/PM
_TA
0.0
93
P2.1
/PM
_TA
0.1
94
P2.2
/PM
_TA
0.2
95
P2.3
/PM
_TA
1.0
96
TE
ST
/SB
WT
CK
97
PJ.0
/TD
O98
PJ.1
/TD
I/TC
LK
99
PJ.2
/TM
S100
PJ.3
/TC
K101
~R
ST
/NM
I/SB
WT
DIO
102
SD0P0103
SD0N0104
SD1P0105
SD1N0106
SD2P0107
SD2N0108
SD3P0109
SD3N0110
VASYS2111
AVSS2112
VREF113
SD4P0114
SD4N0115
SD5P0116
SD5N0117
SD6P0118
SD6N0119
AVSS1120
AVCC121
VASYS1122
AUXVCC2123
AUXVCC1124
VDSYS125
DVCC126
DVSS1127
VCORE128
P1.0
P1.0
P2.0
P2.0
P2.1
P2.1
SD0P0SD0N0SD1P0SD1N0SD2P0SD2N0SD3P0SD3N0
SD4P0SD4N0SD5P0SD5N0SD6P0SD6N0
VA
SY
S1/2
VASYS1/2
VASYS1/2
VA
SY
S1/2
TM
ST
MS
TD
I
TD
I
TD
O
TD
O
TD
O
XO
UT
GN
D
GND
XIN
DVCC
AVCC
DV
DS
YS
DV
DS
YS
DV
DS
YS
DVDSYS
AVSS
AVSS
PJ.2
PJ.2
PJ.1
PJ.1
PJ.0
PJ.0
RS
T/N
MI
RS
T/N
MI
TC
K
TC
K
TC
KP
J.3
PJ.3
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
TE
ST
/SB
WT
CK
RS
T
RS
T
RS
T
RS
T
LC
DC
AP
LC
DC
AP
VR
EF
VREF
VE
RE
F+
VE
RE
F+
VCORE
AU
XV
CC
2
AUXVCC2
AU
XV
CC
1
AUXVCC1
AU
XV
CC
3
AU
XV
CC
3
1 2 3 4 5 6
1 2 3 4 5 6
Tite
l:
Da
tum
:
Be
arb
.:
Se
ite1
/1
MS
P-T
S4
30
PE
U1
28
22
.05
.20
12
09
:37
:33
A3
IH
GF
ED
CB
A AB
CD
EF
GH
I
File
:
Do
k:
Re
v.:
Figure B-86. MSP-TS430PEU128 Target Socket Module, Schematic
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 173
Copyright © 2021 Texas Instruments Incorporated
1
P1.0
SB
W
JTA
G
DVDSYS
ext
int
MSP-TS430PEU128Rev. 1.1 RoHS
DVCC
AUXVCC
GND
AU
XV
CC
1
AU
XV
CC
2
AU
XV
CC
3
GND
GND
RST/NMI
TCK
TDI
TDO
TEST/SBWTCK
TMS
12
55
10
15
20
30
35
6040 45 50 55 64
65
90
70
75
80
85
95
10
0
125 105110115120128
14
12
10
12G
ND
GN
D
VC
C
123
123
123
123
123
123
12
34
12
34
12
34
1
J1
J2
J3
J4
JTA
G
R2
C2
C1R
1C
5R3
BOOTST
C3
R1
0R
11
J5
JP
1
JP
2
JP5
JP6
JP7
JP8
JP9
JP
10
R7
R5
D1
R6
R8
C6
C29
C7
C1
0
R4
JP
12
JP
11
JP
13
C4
C11
C1
2
C8
C1
3
C1
4
C9
C1
6
C1
9
C1
8
C2
6
JP
4
JP3
C1
5C
17
TP1
TP2
IC1
Connector J5External power connectorJumper JP3 to "ext"
Jumper JP1Open to measure current
Orient Pin 1 ofMSP430 device
Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode
JP11, JP12, JP13Connect 1-2 to connect AUXVCCx with DVCC or
drive AUXVCCx externally
D1LED connected to P1.0
Jumper JP2Open to disconnect LED
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply
Figure B-87. MSP-TS430PEU128 Target Socket Module, PCB
Note
For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.
Note
The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:• R7 value is changed to 0 Ω instead of 330 Ω.• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.• JP5 pin 2 is connected to IC1 pin 97.• BOOTST pin 7 is connected to IC1 pin 97.
Hardware www.ti.com
174 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-44. MSP-TS430PEU128 Bill of MaterialsPos. Ref Des No. Per
Board Description Digi-Key Part No. Comment
1 PCB 1 94x119.4mm, 4 layers MSP-TS430PEU128Rev. 1.1
4 layers, green solder mask
2 D1 1 green LED, DIODE0805 516-1434-1-ND
3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
4 JP5, JP6, JP7, JP8,JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)
5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)
6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2
7
JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8,
JP9, JP10, JP11,JP12, JP13
13
Jumper WM4592-ND
8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND
9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP
10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP
11 C13, C14, C16, C17,C18, C19, C29 7 4.7uF, 6.3V, CSMD0805 587-1302-2-ND
12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND
13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP
14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP
15 R5 1 47K, 0805 311-47KARTR-ND
16 C4, C5, C6, C7, C8,C15 6 100nF, CSMD0805 311-1245-2-ND
17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP
18 R3, R7 2 330R, 0805 541-330ATR-ND
19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND
20 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
21 JTAG 1 14-pin connector, male, TH HRP14H-ND
22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi
23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI
24 J5 1 3-pin header, male, TH SAM1035-03-ND
25 Q1 1 Crystal: MS3V-T1R 32.768kHz12.5pF ±20ppm
DNP: Crystal enclosed with kit. Keep vias freeof solder
26 TP1, TP2 2 Test point DNP, keep vias free of solder
27 J2,J4 2 26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias freeof solder.
28 J2,J4 2 26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep viasfree of solder.
29 J1, J3 2 38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias freeof solder.
30 J1, J3 2 38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep viasfree of solder.
31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 175
Copyright © 2021 Texas Instruments Incorporated
B.44 EM430F5137RF900
Figure B-88. EM430F5137RF900 Target Board, Schematic
Hardware www.ti.com
176 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
CON12External power connector
Jumper JP2 to "EXT" GND
GND
VCC
Jumpers JP5, JP10Open to disconnect LEDs
D2LED (red) connectedto P3.6 through JP10
D1LED (green) connected
to P1.0 through JP5
Crystal Q1RF - 26 MHz
X1RF - Signal SMA
Button S1Reset
Push-button S2Connected to P1.7
Jumper JP1 in Spy-Bi-Wire mode
Q3Footprint for 32-kHz crystal
R431 and R441
Use 0- resistor to make XIN and XOUTavailable on connector Port 5
W
Jumper JP3Open to measure current
Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Jumper JP1
Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode
Figure B-89. EM430F5137RF900 Target board, PCB
The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure correctbattery insertion regarding the polarity as indicated in battery holder.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 177
Copyright © 2021 Texas Instruments Incorporated
Table B-45. EM430F5137RF900 Bill of MaterialsItem Reference No. per
Board Description Value Manufacturer's PartNumber Manufacturer Comment
1 Q1 1 ( CUSTOMER SUPPLY )CRYSTAL, SMT, 4P, 26MHz 26M ASX-531(CS) AKER
ELECTRONIC
2
C1-C5, C082,C222, C271,C281, C311,C321, C341,C412, C452
14 CAPACITOR, SMT, 0402, CER,16V, 10%, 0.1uF 0.1uF 0402YC104KAT2A AVX
3 C071 1CAPACITOR, SMT, 0603,CERAMIC, 0.47uF, 16V, 10%,X5R
0.47uF 0603YD474KAT2A AVX
4 R401 1 RES0402, 47.0K 47kΩ CRCW04024702F100 DALE
5 CON11 1 HEADER, THU, MALE, 14P, 2X7,25.4x9.2x9.45mm 09 18 514 6323 HARTING
6 CON10 0 HEADER, THU, MALE, 10P, 2X5,20.32x9.2x9.45mm 09 18 510 6323 HARTING DNP
7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT
9 Q3 0 UNINSTALLED CRYSTAL, SMT,3P, MS1V (Customer Supply) 32.768k MS1V-T1K (UN) MICRO CRYSTAL DNP
10 CON12 1 HEADER, THU, MALE, 3P, 1x3,9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA
12 L341 1 FERRITE, SMT, 0402, 1.0kΩ,250mA 1kΩ BLM15HG102SN1D MURATA
13 C293 1CAPACITOR, SMT, 0402,CERAMIC, 100pF, 50V, 0.25pF,C0G(NP0)
100pF GRM1555C1H101JZ01 MURATA
14 L304 1 INDUCTOR, SMT, 0402, 2.2nH,0.1nH, 220mA, 500MHz
0.0022uH LQP15MN2N2B02 MURATA
15 L303, L305 2 INDUCTOR, SMT, 0402, 15nH,2%, 450mA, 250MHz 0.015uH LQW15AN15NG00 MURATA
16 L292, L302 2 INDUCTOR, SMT, 0402, 18nH,2%, 370mA, 250MHz 0.018uH LQW15AN18NG00 MURATA
17 C291 1CAPACITOR, SMT, 0402,CERAMIC, 1pF, 50V, 0.05pF,C0G(NP0)
1pF GRM1555C1H1R0WZ01 MURATA
18 C303 1CAPACITOR, SMT, 0402,CERAMIC, 8.2pF, 50V, 0.05pF,C0G(NP0)
8.2pF GRM1555C1H8R2WZ01 MURATA
19 C292, C301-C302, C304 4
CAPACITOR, SMT, 0402,CERAMIC, 1.5pF, 50V, 0.05pF,C0G(NP0)
1.5pF GRM1555C1H1R5WZ01 MURATA
20 L291, L301 2 INDUCTOR, SMT, 0402, 12nH,2%, 500mA, 250MHz 0.012uH LQW15AN12NG00 MURATA
21C282, C312,C351, C361,
C3715 CAPACITOR, SMT, 0402,
CERAMIC, 2pF, 50V, 0.1pF, C0G 2.0pF GRM1555C1H2R0BZ01 Murata
22 L1 1 INDUCTOR, SMT, 0402, 6.2nH,0.1nH, 130mA, 500MHz 6.2nH LQP15MN6N2B02 Murata
23 S1-S2 2ULTRA-SMALL TACTILESWITCH, SMT, 2P, SPST-NO,1.2x3x2.5mm, 0.05A, 12V
B3U-1000P OMRON
Hardware www.ti.com
178 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-45. EM430F5137RF900 Bill of Materials (continued)Item Reference No. per
Board Description Value Manufacturer's PartNumber Manufacturer Comment
24R4-R5, R051,R061, R431,
R4410
UNINSTALLED RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,1/16W
0Ω ERJ-2GE0R00X PANASONIC DNP
24a R7 1 RESISTOR/JUMPER, SMT,0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC
25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICKFILM, 5%, 1/16W, 330 330Ω ERJ-2GEJ331 PANASONIC
26 C431, C441 0 CAPACITOR, SMT, 0402, CER,12pF, 50V, 5%, NPO 12pF ECJ-0EC1H120J PANASONIC
27 C401 1 CAPACITOR, SMT, 0402, CER,2200pF, 50V, 10%, X7R 0.0022uF ECJ-0EB1H222K PANASONIC
28 R331 1 RESISTOR, SMT, THICK FILM,56K, 1/16W, 5% 56kΩ ERJ-2GEJ563 PANASONIC
29 C081, C221,C411, C451 4 CAPACITOR, SMT, 0603,
CERAMIC, 10uF, 6.3V, 20%, X5R 10uF ECJ-1VB0J106M PANASONIC
30 R1 1 RESISTOR/JUMPER, SMT,0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC
31 C041 0 UNINSTALLED CAP CERAMIC4.7UF 6.3V X5R 0603 4.7uF ECJ-1VB0J475K Panasonic DNP
32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP
34 U1 1DUT, SMT, PQFP, RGZ-48,0.5mmLS, 7.15x7.15x1mm,THRM.PAD
CC430F5137 TI
35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP
37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH
38 JP3, JP5,JP10 3 Pin Connector 1x2pin 61300211121 WUERTH
38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP
39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP
40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 179
Copyright © 2021 Texas Instruments Incorporated
B.45 EM430F6137RF900
Figure B-90. EM430F6137RF900 Target Board, Schematic
Hardware www.ti.com
180 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
CON12External power connector
Jumper JP2 to "EXT"
Jumpers JP5, JP10Open to disconnect LEDs
D2LED (red) connectedto P3.6 JP10through
D1LED (green) connected
to P1.0 JP5through
Crystal Q1RF - 26 MHz
X1RF - Signal SMA
Button S1Reset
Push-button S2Connected to P1.7
Q2/Q3Footprint for 32-kHz crystal
Jumper JP3Open to measure current
GND
GND
VCC
C392C422
L451
Jumper JP1 in Spy-Bi-Wire mode
Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)
Jumper JP1
Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode
R541 and R551
Use 0- resistor to make P5.0 and P5.1available on connector Port 5
W
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
Figure B-91. EM430F6137RF900 Target Board, PCB
The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure correctbattery insertion regarding the polarity as indicated in battery holder.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 181
Copyright © 2021 Texas Instruments Incorporated
Table B-46. EM430F6137RF900 Bill of MaterialsPos. Ref Des No. per
Board Description Part No. Manufacturer
1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P,26MHz ASX-531(CS) AKER ELECTRONIC
2
C1-C5, C112,C252, C381,C391, C421,C431, C451,C522, C562
14 CAPACITOR, SMT, 0402, CER, 16V, 10%,0.1uF 0402YC104KAT2A AVX
3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,16V, 10%, X5R 0603YD474KAT2A AVX
4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
5 CON11 1 HEADER, THU, MALE, 14P, 2X7,25.4x9.2x9.45mm, 90deg 09 18 514 6323 HARTING
7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT
10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA
12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA
13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H101JZ01 MURATA
14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,1000mA, 250MHz LQW15AN2N2C10 MURATA
15 L413, L415 2 INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,250MHz LQW15AN15NJ00 MURATA
16 L402, L412 2 INDUCTOR, SMT, 0402, 18nH, ±5%, 370mA,250MHz LQW15AN18NJ00 MURATA
17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V,±0.25pF, NP0 GJM1555C1H1R0CB01D MURATA
18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA
19 C402, C411-C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
50V, ±0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA
20 L401, L411 2 INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,250MHz LQW15AN12NJ00 MURATA
21 C46-C48, C392,C422 5 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,
50V, ±0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 Murata
22 L1 1 INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,250MHz LQW15AN6N2D00 Murata
23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P,SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON
24 R7 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,1/16W ERJ-2GE0R00X (UN) PANASONIC
25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%,1/16W, 330 ERJ-2GEJ331 PANASONIC
27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V,10%, X7R ECJ-0EB1H222K PANASONIC
28 C111, C251,C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 10uF,
6.3V, 20%, X5R ECJ-1VB0J106M PANASONIC
28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC
29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,1/16W ERJ-2GE0R00X PANASONIC
31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
Hardware www.ti.com
182 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-46. EM430F6137RF900 Bill of Materials (continued)Pos. Ref Des No. per
Board Description Part No. Manufacturer
33 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS,9.15x9.15x1mm, THRM.PAD CC430F6137 TI
34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH
36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH
38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 183
Copyright © 2021 Texas Instruments Incorporated
B.46 EM430F6147RF900
Figure B-92. EM430F6147RF900 Target Board, Schematic
Hardware www.ti.com
184 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Orient pin 1 of MSP430 device
D1LED (green) connected
to P1.0 JP5through
Jumpers JP5 and JP10Open to disconnect LEDs
D2LED (red) connectedto P3.6 through JP10
Jumpers JP6 and JP8Close 1-2 for Bypass modeClose 2-3 for TPS modeJumper JP9
TPS status
Connector JTAGFor JTAG Tool
Connector BOOTSTFor Bootloader Tool
TPS62730
Jumper JP2Close INT: Power supply from JTAG interfaceClose EXT: External power supply
Button S2Connected to P1.7
32-kHz crystal
R554 and R551
Use 0- resistor to make P5.0 and P5.1available on connector Port 5
W
Button S1Reset
Jumper JP3Open to measure current
CON12External poser connector
Jumper JP2 to "EXT"
Crystal Q1RF - 26 MHz
SMA1RF - Signal SMA
Jumper JP1Close JTAG position to debug in JTAG modeClose SBW position to debug in Spy-BI-Wire mode
Figure B-93. EM430F6147RF900 Target Board, PCB
The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure correctbattery insertion regarding the polarity as indicated in battery holder.
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 185
Copyright © 2021 Texas Instruments Incorporated
Table B-47. EM430F6147RF900 Bill of MaterialsPos. Ref Des No. per
Board Description Part No. Manufacturer
1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P,26MHz ASX-531(CS) AKER ELECTRONIC
2
C1-5 C112C252 C381C391 C421C431 C451C522 C562
14 CAPACITOR, SMT, 0402, CER, 16V, 10%,0.1uF 0402YC104KAT2A AVX
3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,16V, 10%, X5R 0603YD474KAT2A AVX
4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
5 CON11 1 HEADER, THU, MALE, 14P, 2X7,25.4x9.2x9.45mm, 90deg 09 18 514 6323 HARTING
7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT
10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA
12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA
13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H101JZ01 MURATA
14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,1000mA, 250MHz LQW15AN2N2C10 MURATA
15 L413 1 Inductor, SMD, 0402, 15nH, 5%, 370mA,250MHz LQW15AN15NJ00 MURATA
15 L415 1 INDUCTOR,SMT,0402,15nH,±5%,460mA,250MHz LQW15AN15NJ00 MURATA
16 L402, L412 2 Inductor, SMD, 0402, 18nH, 5%, 460mA,250MHz LQW15AN18NJ00 MURATA
17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V,±0.25pF, NP0 GJM1555C1H1R0CB01D MURATA
18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA
19 C402, C411-C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
50V, ±0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA
20 L1, L401, L411 3 INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,250MHz LQW15AN12NJ00 MURATA
21 C46-C48, C392 4 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 MURATA
22 L2 1 Inductor, SMD, 0805, 2.2uH, 20%, 600mA,50MHz LQM21PN2R2MC0 MURATA
23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P,SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON
24 R1, R7, R551,R554 4 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
1/16W ERJ-2GE0R00X (UN) PANASONIC
25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%,1/16W, 330 ERJ-2GEJ331 PANASONIC
27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V,10%, X7R ECJ-0EB1H222K PANASONIC
28 C111, C251,C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,
20%, X5R ECJ-1VB0J105K PANASONIC
28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC
29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
30 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
Hardware www.ti.com
186 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Table B-47. EM430F6147RF900 Bill of Materials (continued)Pos. Ref Des No. per
Board Description Part No. Manufacturer
31 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS,9.15x9.15x1mm, THRM.PAD CC430F6147 TI
33 U2 1 IC, Step Down Converter with Bypass Mode forLow Power Wireless TPS62370 TI
34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH
36a JP3, JP5, JP9,JP10 4 Pin Connector 1x2pin 61300211121 WUERTH
38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA
38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA
38 C041 1 CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,X5R MURATA
www.ti.com Hardware
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 187
Copyright © 2021 Texas Instruments Incorporated
Hardware www.ti.com
188 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
This page intentionally left blank.
For instructions on how to install the following USB debug interfaces on a PC, see the MSP Debuggers User’sGuide.
• MSP-FET430UIF• eZ430-F2013• eZ430-RF2500• eZ430-Chronos• eZ430-RF2780• eZ430-RF2560• MSP-WDSxx "Metawatch"• MSP-EXP430G2 LaunchPad development kit• MSP-EXP430FR5739• MSP-EXP430F5529
Appendix CHardware Installation Guide
www.ti.com Hardware Installation Guide
SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
MSP430™ Hardware Tools 189
Copyright © 2021 Texas Instruments Incorporated
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from December 2, 2020 to March 19, 2021 Page• Changed the note that begins "For applications that are particularly concerned with excessive noise or
ESD..." in Figure 2-1, Figure 2-2, and Figure 2-3 ............................................................................................ 20
Revision History www.ti.com
190 MSP430™ Hardware Tools SLAU278AH – MAY 2009 – REVISED MARCH 2021Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCEDESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANYIMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRDPARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriateTI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicablestandards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants youpermission to use these resources only for development of an application that uses the TI products described in the resource. Otherreproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third partyintellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available eitheron ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’sapplicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2021, Texas Instruments Incorporated