MSP430™ Hardware Tools User’s Guide - TI

MSP430™ Hardware Tools

User’s Guide

Literature Number: SLAU278AHMAY 2009 – REVISED MARCH 2021

Read This First...........................................................................................................................................................................7How to Use This Manual.......................................................................................................................................................... 7Information About Cautions and Warnings...............................................................................................................................8Related Documentation From Texas Instruments.................................................................................................................... 8If You Need Assistance............................................................................................................................................................ 9

1 Get Started Now!...................................................................................................................................................................111.1 Kit Contents, MSP-TS430xx............................................................................................................................................ 121.2 Kit Contents, MSP-FET430xx.......................................................................................................................................... 141.3 Kit Contents, MSP-FET....................................................................................................................................................141.4 Kit Contents, MSP-FET430UIF........................................................................................................................................ 141.5 Kit Contents, MSP-FET430PIF........................................................................................................................................ 141.6 Kit Contents, eZ430-F2013.............................................................................................................................................. 141.7 Kit Contents, eZ430-T2012.............................................................................................................................................. 141.8 Kit Contents, eZ430-RF2500........................................................................................................................................... 151.9 Kit Contents, eZ430-RF2500T......................................................................................................................................... 151.10 Kit Contents, eZ430-RF2500-SEH.................................................................................................................................151.11 Kit Contents, eZ430-Chronos-xxx.................................................................................................................................. 151.12 Kit Contents, FET430F6137RF900................................................................................................................................161.13 Kit Contents, EM430Fx1x7RF900..................................................................................................................................161.14 Hardware Installation, MSP-FET and MSP-FET430UIF................................................................................................ 161.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900.......................171.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529........................... 171.17 Important MSP430 Documents on the Web...................................................................................................................17

2 Design Considerations for In-Circuit Programming..........................................................................................................192.1 Signal Connections for In-System Programming and Debugging....................................................................................202.2 External Power.................................................................................................................................................................242.3 Bootloader (BSL)..............................................................................................................................................................24

A Frequently Asked Questions and Known Issues..............................................................................................................25A.1 Hardware FAQs............................................................................................................................................................... 26A.2 Known Issues.................................................................................................................................................................. 28

MSP-FET430UIF................................................................................................................................................................ 28MSP-FET430PIF................................................................................................................................................................ 28

B Hardware...............................................................................................................................................................................29B.1 MSP-TS430D8.................................................................................................................................................................31B.2 MSP-TS430PW14........................................................................................................................................................... 34B.3 MSP-TS430L092............................................................................................................................................................. 37B.4 MSP-TS430L092 Active Cable........................................................................................................................................ 40B.5 MSP-TS430PW20........................................................................................................................................................... 43B.6 MSP-TS430RHL20.......................................................................................................................................................... 48B.7 MSP-TS430PW24........................................................................................................................................................... 51B.8 MSP-TS430RGE24A....................................................................................................................................................... 54B.9 MSP-TS430DW28........................................................................................................................................................... 57B.10 MSP-TS430PW28......................................................................................................................................................... 60B.11 MSP-TS430PW28A....................................................................................................................................................... 63B.12 MSP-TS430RHB32A..................................................................................................................................................... 66B.13 MSP-TS430DA38.......................................................................................................................................................... 69B.14 MSP-TS430QFN23x0....................................................................................................................................................72B.15 MSP-TS430RSB40........................................................................................................................................................75B.16 MSP-TS430RHA40A..................................................................................................................................................... 78B.17 MSP-TS430DL48...........................................................................................................................................................81

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B.18 MSP-TS430PT48...........................................................................................................................................................84B.19 MSP-TS430PT48A........................................................................................................................................................ 88B.20 MSP-TS430RGZ48B..................................................................................................................................................... 92B.21 MSP-TS430RGZ48C..................................................................................................................................................... 95B.22 MSP-TS430PM64..........................................................................................................................................................98B.23 MSP-TS430PM64A..................................................................................................................................................... 101B.24 MSP-TS430PM64D..................................................................................................................................................... 104B.25 MSP-TS430PM64F......................................................................................................................................................107B.26 MSP-TS430RGC64B................................................................................................................................................... 110B.27 MSP-TS430RGC64C...................................................................................................................................................113B.28 MSP-TS430RGC64USB.............................................................................................................................................. 117B.29 MSP-TS430PN80........................................................................................................................................................ 122B.30 MSP-TS430PN80A......................................................................................................................................................125B.31 MSP-TS430PN80B......................................................................................................................................................128B.32 MSP-TS430PN80C......................................................................................................................................................131B.33 MSP-TS430PN80USB.................................................................................................................................................135B.34 MSP-TS430PZ100.......................................................................................................................................................140B.35 MSP-TS430PZ100A.................................................................................................................................................... 143B.36 MSP-TS430PZ100B.................................................................................................................................................... 146B.37 MSP-TS430PZ100C.................................................................................................................................................... 149B.38 MSP-TS430PZ100D.................................................................................................................................................... 152B.39 MSP-TS430PZ100E.................................................................................................................................................... 156B.40 MSP-TS430PZ5x100...................................................................................................................................................160B.41 MSP-TS430PZ100USB............................................................................................................................................... 163B.42 MSP-TS430PZ100AUSB.............................................................................................................................................168B.43 MSP-TS430PEU128....................................................................................................................................................173B.44 EM430F5137RF900.................................................................................................................................................... 176B.45 EM430F6137RF900.................................................................................................................................................... 180B.46 EM430F6147RF900.................................................................................................................................................... 184

C Hardware Installation Guide..............................................................................................................................................189Revision History.................................................................................................................................................................... 190

List of FiguresFigure 2-1. Signal Connections for 4-Wire JTAG Communication.............................................................................................21Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx, MSP430G2xx,

and MSP430F4xx Devices.....................................................................................................................................................22Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable

Devices That are Not Part of F2xx, G2xx, F4xx Families...................................................................................................... 23Figure B-1. MSP-TS430D8 Target Socket Module, Schematic................................................................................................. 31Figure B-2. MSP-TS430D8 Target Socket Module, PCB...........................................................................................................32Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic............................................................................................ 34Figure B-4. MSP-TS430PW14 Target Socket Module, PCB..................................................................................................... 35Figure B-5. MSP-TS430L092 Target Socket Module, Schematic..............................................................................................37Figure B-6. MSP-TS430L092 Target Socket Module, PCB....................................................................................................... 38Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.........................................................................40Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB.................................................................................. 41Figure B-9. UART BSL Signal Select.........................................................................................................................................43Figure B-10. MSP-TS430PW20 Target Socket Module, Schematic.......................................................................................... 44Figure B-11. MSP-TS430PW20 Target Socket Module, PCB....................................................................................................45Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic.........................................................................................48Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB.................................................................................................. 49Figure B-14. MSP-TS430PW24 Target Socket Module, Schematic.......................................................................................... 51Figure B-15. MSP-TS430PW24 Target Socket Module, PCB................................................................................................... 52Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic......................................................................................54Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB............................................................................................... 55Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic..........................................................................................57Figure B-19. MSP-TS430DW28 Target Socket Module, PCB................................................................................................... 58Figure B-20. MSP-TS430PW28 Target Socket Module, Schematic.......................................................................................... 60Figure B-21. MSP-TS430PW28 Target Socket Module, PCB................................................................................................... 61Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic........................................................................................63Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)....................................................................................... 64

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Figure B-24. MSP-TS430RHB32A Target Socket Module, Schematic......................................................................................66Figure B-25. MSP-TS430RHB32A Target Socket Module, PCB............................................................................................... 67Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic...........................................................................................69Figure B-27. MSP-TS430DA38 Target Socket Module, PCB.................................................................................................... 70Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic.................................................................................... 72Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB..............................................................................................73Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic........................................................................................ 75Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB..................................................................................................76Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic......................................................................................78Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB............................................................................................... 79Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic........................................................................................... 81Figure B-35. MSP-TS430DL48 Target Socket Module, PCB.....................................................................................................82Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic........................................................................................... 84Figure B-37. MSP-TS430PT48 Target Socket Module, PCB.....................................................................................................85Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic.........................................................................................88Figure B-39. MSP-TS430PT48A Target Socket Module, PCB.................................................................................................. 89Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic......................................................................................92Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB............................................................................................... 93Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic......................................................................................95Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB............................................................................................... 96Figure B-45. MSP-TS430PM64 Target Socket Module, PCB....................................................................................................99Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic...................................................................................... 101Figure B-47. MSP-TS430PM64A Target Socket Module, PCB............................................................................................... 102Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic......................................................................................104Figure B-49. MSP-TS430PM64D Target Socket Module, PCB............................................................................................... 105Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic...................................................................................... 107Figure B-51. MSP-TS430PM64F Target Socket Module, PCB................................................................................................108Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic....................................................................................110Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB............................................................................................. 111Figure B-54. MSP-TS430RGC64C Target Socket Module, Schematic....................................................................................114Figure B-55. MSP-TS430RGC64C Target Socket Module, PCB.............................................................................................115Figure B-56. MSP-TS430RGC64USB Target Socket Module, Schematic...............................................................................118Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB........................................................................................ 119Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic.........................................................................................122Figure B-59. MSP-TS430PN80 Target Socket Module, PCB.................................................................................................. 123Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic...................................................................................... 125Figure B-61. MSP-TS430PN80A Target Socket Module, PCB................................................................................................126Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic...................................................................................... 128Figure B-63. MSP-TS430PN80B Target Socket Module, PCB................................................................................................129Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic...................................................................................... 131Figure B-65. MSP-TS430PN80C Target Socket Module, PCB................................................................................................132Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic................................................................................. 136Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB...........................................................................................137Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic....................................................................................... 140Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB.................................................................................................141Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic.....................................................................................143Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB.............................................................................................. 144Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic.....................................................................................146Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB.............................................................................................. 147Figure B-74. MSP-TS430PZ100C Target Socket Module, Schematic.....................................................................................149Figure B-75. MSP-TS430PZ100C Target Socket Module, PCB.............................................................................................. 150Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic.....................................................................................152Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB.............................................................................................. 153Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic.....................................................................................156Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB.............................................................................................. 157Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic................................................................................... 160Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB.............................................................................................161Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic................................................................................164Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB......................................................................................... 165Figure B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic............................................................................. 169Figure B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB.......................................................................................170

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Figure B-86. MSP-TS430PEU128 Target Socket Module, Schematic.................................................................................... 173Figure B-87. MSP-TS430PEU128 Target Socket Module, PCB..............................................................................................174Figure B-88. EM430F5137RF900 Target Board, Schematic................................................................................................... 176Figure B-89. EM430F5137RF900 Target board, PCB............................................................................................................. 177Figure B-90. EM430F6137RF900 Target Board, Schematic................................................................................................... 180Figure B-91. EM430F6137RF900 Target Board, PCB.............................................................................................................181Figure B-92. EM430F6147RF900 Target Board, Schematic................................................................................................... 184Figure B-93. EM430F6147RF900 Target Board, PCB.............................................................................................................185

List of TablesTable 1-1. Individual Kit Contents, MSP-TS430xx..................................................................................................................... 12Table B-1. MSP-TS430D8 Bill of Materials................................................................................................................................ 33Table B-2. MSP-TS430PW14 Bill of Materials...........................................................................................................................36Table B-3. MSP-TS430L092 Bill of Materials.............................................................................................................................39Table B-4. MSP-TS430L092 JP1 Settings.................................................................................................................................41Table B-5. MSP-TS430L092 Active Cable Bill of Materials....................................................................................................... 42Table B-6. MSP-TS430PW20 Bill of Materials...........................................................................................................................46Table B-7. MSP-TS430RHL20 Bill of Materials......................................................................................................................... 50Table B-8. MSP-TS430PW24 Bill of Materials...........................................................................................................................53Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)...........................................................................................................56Table B-10. MSP-TS430DW28 Bill of Materials.........................................................................................................................59Table B-11. MSP-TS430PW28 Bill of Materials......................................................................................................................... 62Table B-12. MSP-TS430PW28A Bill of Materials...................................................................................................................... 65Table B-13. MSP-TS430RHB32A Bill of Materials.....................................................................................................................68Table B-14. MSP-TS430DA38 Bill of Materials..........................................................................................................................71Table B-15. MSP-TS430QFN23x0 Bill of Materials................................................................................................................... 74Table B-16. MSP-TS430RSB40 Bill of Materials....................................................................................................................... 77Table B-17. MSP-TS430RHA40A Bill of Materials.....................................................................................................................80Table B-18. MSP-TS430DL48 Bill of Materials.......................................................................................................................... 83Table B-19. MSP-TS430PT48 Bill of Materials.......................................................................................................................... 86Table B-20. MSP-TS430PT48A Bill of Materials........................................................................................................................90Table B-21. MSP-TS430RGZ48B Bill of Materials.....................................................................................................................94Table B-22. MSP-TS430RGZ48C Bill of Materials.................................................................................................................... 97Table B-23. MSP-TS430PM64 Bill of Materials....................................................................................................................... 100Table B-24. MSP-TS430PM64A Bill of Materials.....................................................................................................................103Table B-25. MSP-TS430PM64D Bill of Materials.....................................................................................................................106Table B-26. MSP-TS430PM64F Bill of Materials (BOM)......................................................................................................... 109Table B-27. MSP-TS430RGC64B Bill of Materials...................................................................................................................112Table B-28. MSP-TS430RGC64C Bill of Materials.................................................................................................................. 116Table B-29. MSP-TS430RGC64USB Bill of Materials............................................................................................................. 120Table B-30. MSP-TS430PN80 Bill of Materials........................................................................................................................124Table B-31. MSP-TS430PN80A Bill of Materials..................................................................................................................... 127Table B-32. MSP-TS430PN80B Bill of Materials..................................................................................................................... 130Table B-33. MSP-TS430PN80C Bill of Materials..................................................................................................................... 133Table B-34. MSP-TS430PN80USB Bill of Materials................................................................................................................ 138Table B-35. MSP-TS430PZ100 Bill of Materials...................................................................................................................... 142Table B-36. MSP-TS430PZ100A Bill of Materials....................................................................................................................145Table B-37. MSP-TS430PZ100B Bill of Materials....................................................................................................................148Table B-38. MSP-TS430PZ100C Bill of Materials................................................................................................................... 151Table B-39. MSP-TS430PZ100D Bill of Materials................................................................................................................... 154Table B-40. MSP-TS430PZ100E Bill of Materials....................................................................................................................158Table B-41. MSP-TS430PZ5x100 Bill of Materials.................................................................................................................. 162Table B-42. MSP-TS430PZ100USB Bill of Materials...............................................................................................................166Table B-43. MSP-TS430PZ100AUSB Bill of Materials............................................................................................................ 171Table B-44. MSP-TS430PEU128 Bill of Materials................................................................................................................... 175Table B-45. EM430F5137RF900 Bill of Materials....................................................................................................................178Table B-46. EM430F6137RF900 Bill of Materials....................................................................................................................182Table B-47. EM430F6147RF900 Bill of Materials....................................................................................................................186

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This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is theprogram development tool for the MSP430™ ultra-low-power microcontrollers.

How to Use This ManualRead and follow the instructions in Chapter 1. This section lists the contents of the FET and provides instructionson installing the hardware and the software drivers. After you see how quick and easy it is to use thedevelopment tools, TI recommends that you read all of this manual.

This manual describes the setup and operation of the FET but does not fully describe the MSP430microcontrollers or the development software systems. For details of these items, see the appropriate TIdocuments listed in Section 1.17.

This manual applies to the following tools:

• MSP-FET430PIF – debug interface with parallel port connection, for all MSP430 flash-based devices• MSP-FET430UIF – debug interface with USB connection, for all MSP430 flash-based devices• MSP-FET – successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430 devices• eZ430-F2013 – USB stick form factor interface with attached MSP430F2013 target, for all MSP430F20xx,

MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices• eZ430-T2012 – three MSP430F2012 based target boards• eZ430-RF2500 – USB stick form factor interface with attached MSP430F2274 and CC2500 target, for

all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, andMSP430G2x31 devices

• eZ430-RF2500T – one MSP430F2274 and CC2500 target board including battery pack)• eZ430-RF2500-SEH – USB stick form factor interface with attached MSP430F2274 and CC2500 target and

solar energy harvesting module• eZ430-Chronos-xxx – USB stick form factor interface with CC430F6137 based development system

contained in a watch; includes <1 GHz RF USB access point

Stand-alone target-socket modules without debug interface are named as MSP-TS430TSxx.

Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective targetsocket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain also theUSB debug interface (MSP-FET430UIF):

• FET430F5137RF900 – for CC430F513x devices in 48-pin RGZ packages (green PCB)• FET430F6137RF900 – for CC430F612x and CC430F613x devices in 64-pin RGC packages (green PCB)

These tools contain the most up-to-date materials available at the time of packaging. For the latest materials(data sheets, user's guides, software, application information, and so on), visit the TI MSP430 website or contactyour local TI sales office.

PrefaceRead This First

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Information About Cautions and WarningsThis document may contain cautions and warnings.

CAUTION

This is an example of a caution statement.

A caution statement describes a situation that could potentially damage your software or equipment.

WARNING

This is an example of a warning statement.

A warning statement describes a situation that could potentially cause harm to you.

The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.

Related Documentation From Texas InstrumentsMSP430 development tools documentation:

MSP Debuggers User's Guide

Code Composer Studio IDE for MSP430 MCUs User's Guide

Code Composer Studio IDE

IAR Embedded Workbench for MSP430 User's Guide

IAR Embedded Workbench IDE

eZ430-F2013 Development Tool User's Guide

eZ430-RF2480 Demonstration Kit User's Guide

eZ430-RF2500 Development Tool User's Guide

eZ430-RF2500-SEH Development Tool User's Guide

eZ430-Chronos Development Tool User's Guide

Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide

MSP-EXP430F5529 Experimenter Board User's Guide

MSP-EXP430F5438 Experimenter Board User's Guide

MSP-EXP430G2 LaunchPad Development Kit User's Guide

MSP Gang Programmer (MSP-GANG) User's Guide

MSP430 Gang Programmer (MSP-GANG430) User's Guide

MSP430 device user's guides:

MSP430F1xx Family User's Guide

MSP430x2xx Family User's Guide

MSP430x3xx Family User's Guide

MSP430F4xx Family User's Guide

MSP430F5xx and MSP430F6xx Family User's Guide

CC430 Family User's Guide

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MSP430FR57xx Family User's Guide

MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide

If You Need AssistanceSupport for the MSP430 devices and the FET development tools is provided by the Texas Instruments ProductInformation Center (PIC). Contact information for the PIC can be found on the TI website at www.ti.com/support.The Texas Instruments E2E™ Community support forums for the MSP430 provide open interaction with peerengineers, TI engineers, and other experts. Additional device-specific information can be found on the MSP430website.

TrademarksMSP430™ and E2E™ are trademarks of Texas Instruments.All trademarks are the property of their respective owners.

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This chapter lists the contents of the FET and provides instruction on installing the hardware.

1.1 Kit Contents, MSP-TS430xx.......................................................................................................................................121.2 Kit Contents, MSP-FET430xx.....................................................................................................................................141.3 Kit Contents, MSP-FET...............................................................................................................................................141.4 Kit Contents, MSP-FET430UIF...................................................................................................................................141.5 Kit Contents, MSP-FET430PIF...................................................................................................................................141.6 Kit Contents, eZ430-F2013.........................................................................................................................................141.7 Kit Contents, eZ430-T2012.........................................................................................................................................141.8 Kit Contents, eZ430-RF2500...................................................................................................................................... 151.9 Kit Contents, eZ430-RF2500T....................................................................................................................................151.10 Kit Contents, eZ430-RF2500-SEH........................................................................................................................... 151.11 Kit Contents, eZ430-Chronos-xxx........................................................................................................................... 151.12 Kit Contents, FET430F6137RF900.......................................................................................................................... 161.13 Kit Contents, EM430Fx1x7RF900............................................................................................................................161.14 Hardware Installation, MSP-FET and MSP-FET430UIF..........................................................................................161.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900............... 171.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529..................... 171.17 Important MSP430 Documents on the Web........................................................................................................... 17

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1.1 Kit Contents, MSP-TS430xx• One READ ME FIRST document• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)• One target socket module• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• MSP430 MCU samples (see Table 1-1 for sample type)

Table 1-1. Individual Kit Contents, MSP-TS430xxPart Number Socket Type Supported Devices Included Devices Headers and Comment

MSP-TS430D8(green PCB)

8-pin D(TSSOP ZIF) MSP430G2210, MSP430G2230 1 x MSP430G2210ID and

1 x MSP430G2230IDTwo PCB 1×4-pin headers(two male and two female)

MSP-TS430PW14(green PCB)

14-pin PW(TSSOP ZIF)

MSP430F20xx, MSP430G2x01,MSP430G2x11, MSP430G2x21,

MSP430G2x312 × MSP430F2013IPW Four PCB 1×7-pin headers

(two male and two female)

MSP-TS430L092(green PCB)

14-pin PW(TSSOP ZIF) MSP430L092 2 × MSP430L092IPW

Four PCB 1×7-pin headers(two male and two female)A "Micro-MaTch" 10-pin femaleconnector is also present on the PCBwhich connects the kit with an 'ActiveCable' PCB. This 'Active Cable' PCBis connected by 14-pin JTAG cablewith the FET430UIF.



MSP430FR2311IPW20,MSP430FR2311IPW16

None. Free samples can beordered in the TI Store.

Four PCB 1×12-pin headers(two male and two female)

MSP-TS430RHL20(green PCB)

20-pin RHL(VQFN ZIF)

MSP430FR2522IRHL,MSP430FR2422IRHL

None. Free samples can beordered in the TI Store.



24-pin PW(TSSOP ZIF) MSP430AFE2xx 2 × MSP430AFE253IPW Four PCB 1×12-pin headers


MSP-TS430RGE24A(red PCB)

24-pin RGE(QFN ZIF) MSP430FR2433IRGE None. Free samples can be

ordered in the TI Store.Four PCB 1×6-pin headers(two male and two female)

MSP-TS430DW28(green PCB)

28-pin DW(SSOP ZIF)

MSP430F11x1, MSP430F11x2,MSP430F12x, MSP430F12x2,

MSP430F21xxSupports devices in 20- and 28-pin DA

packages

2 × MSP430F123IDW Four PCB 1×12-pin headers(two male and two female)



MSP430F11x1, MSP430F11x2,MSP430F12x, MSP430F12x2,

MSP430F21xx2 × MSP430F2132IPW Four PCB 1×12-pin headers


MSP-TS430PW28A(red PCB)


MSP430F20xx, MSP430G2xxx in 14-, 20-,and 28-pin PW packages, MSP430TCH5E

in PW package2 × MSP430G2452IPW20 Four PCB 1×12-pin headers


MSP-TS430RHB32A(red PCB)

32-pin RHB(QFN ZIF) MSP430i204x 2 × MSP430i2041TRHB Eight PCB 1×8-pin headers

(four male and four female)

MSP-TS430DA38(green PCB)

38-pin DA(TSSOP ZIF)

MSP430F22xx, MSP430G2x44,MSP430G2x55

2 × MSP430F2274IDA2 × MSP430G2744IDA2 × MSP430G2955IDA


MSP-TS430QFN23x0(green PCB)

40-pin RHA(QFN ZIF) MSP430F23x0 2 × MSP430F2370IRHA Eight PCB 1×10-pin headers


MSP-TS430RSB40(green PCB)

40-pin RSB(QFN ZIF) MSP430F51x1, MSP430F51x2 2 × MSP430F5172IRSB Eight PCB 1×10-pin headers


MSP-TS430RHA40A(red PCB)

40-pin RHA(QFN ZIF) MSP430FR572x, MSP430FR573x 2 × MSP430FR5739IRHA Eight PCB 1×10-pin headers


MSP-TS430DL48(green PCB)

48-pin DL(TSSOP ZIF) MSP430F42x0 2 × MSP430F4270IDL Four PCB 2×12-pin headers


MSP-TS430PT48(green PCB)

48-pin PT(QFP ZIF) MSP430FR235x None. Free samples can be

ordered in the TI Store.Eight PCB 1×12-pin headers(four male and four female)

MSP-TS430PT48A(red PCB)

48-pin PT(QFP ZIF) MSP430FR247x None. Free samples can be


MSP-TS430RGZ48B(blue PCB)

48-pin RGZ(QFN ZIF) MSP430F534x 2 × MSP430F5342IRGZ Eight PCB 1×12-pin headers


MSP-TS430RGZ48C(black PCB)

48-pin RGZ(QFN ZIF) MSP430FR58xx and MSP430FR59xx 2 × MSP430FR5969IRGZ Eight PCB 1×12-pin headers


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Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)Part Number Socket Type Supported Devices Included Devices Headers and Comment

MSP-TS430PM64(green PCB)

64-pin PM(QFP ZIF)

MSP430F13x, MSP430F14x,MSP430F14x1, MSP430F15x,MSP430F16x, MSP430F16x1,MSP430F23x, MSP430F24x,

MSP430F24xx, MSP430F261x,MSP430F41x, MSP430F42x,

MSP430F42xA, MSP430FE42x,MSP430FE42xA, MSP430FE42x2,

MSP430FW42x

TS Kit: 2 × MSP430F2618IPM;FET Kit: 2 × MSP430F417IPMand 2 × MSP430F169IPM

Eight PCB 1×16-pin headers(four male and four female)

MSP-TS430PM64A(red PCB)

64-pin PM(QFP ZIF) MSP430F41x2 2 × MSP430F4152IPM Eight PCB 1×16-pin headers


MSP-TS430PM64D(white PCB)

64-pin PM(QFP ZIF) MSP430FR413x, MSP430FR203x 2 × MSP430FR4133IPM Eight PCB 1×16-pin headers


MSP-TS430PM64F(purple PCB)

64-pin PM(QFP ZIF) MSP430FR6972 None. Free samples can be


MSP-TS430RGC64B(blue PCB)

64-pin RGC(QFN ZIF) MSP430F530x 2 × MSP430F5310IRGC Eight PCB 1×16-pin headers


MSP-TS430RGC64C(black PCB)

64-pin RGC(QFN ZIF)

MSP430F522x, MSP430F521x,MSP430F523x, MSP430F524x,

MSP430F525x2 × MSP430F5229IRGC Eight PCB 1×16-pin headers


MSP-TS430RGC64USB(green PCB)

64-pin RGC(QFN ZIF)

MSP430F550x, MSP430F551x,MSP430F552x

2 × MSP430F5510IRGC or 2× MSP430F5528IRGC

Eight PCB 1×16-pin headers(four male and four female)

MSP-TS430PN80(green PCB)

80-pin PN(QFP ZIF)

MSP430F241x, MSP430F261x,MSP430F43x, MSP430F43x1,MSP430FG43x, MSP430F47x,

MSP430FG47x

2 × MSP430FG439IPN Eight PCB 1×20-pin headers(four male and four female)

MSP-TS430PN80A(red PCB)

80-pin PN(QFP ZIF) MSP430F532x 2 × MSP430F5329IPN Eight PCB 1×20-pin headers


MSP-TS430PN80B(blue PCB)

80-pin PN(QFP ZIF) MSP430F599x 2 × MSP430F5994IPN Eight PCB 1×20-pin headers


MSP-TS430PN80C(black PCB)

80-pin PN(QFP ZIF) MSP430FR6043 None. Free samples can be


MSP-TS430PN80USB(green PCB)

80-pin PN(QFP ZIF) MSP430F552x, MSP430F551x 2 × MSP430F5529IPN Eight PCB 1×20-pin headers


MSP-TS430PZ100(green PCB)

100-pin PZ(QFP ZIF)

MSP430F43x, MSP430F43x1,MSP430F44x, MSP430FG461x,

MSP430F47xx2 × MSP430FG4619IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100A(red PCB)

100-pin PZ(QFP ZIF) MSP430F471xx 2 × MSP430F47197IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100B(blue PCB)

100-pin PZ(QFP ZIF) MSP430F67xx 2 × MSP430F6733IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100C(black PCB)

100-pin PZ(QFP ZIF)

MSP430F645x, MSP430F643x,MSP430F535x, MSP430F533x 2 × MSP430F6438IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100D(white PCB)

100-pin PZ(QFP ZIF) MSP430FR698x(1), MSP430FR688x(1) 2 × MSP430FR6989IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100E(yellow PCB)

100-pin PZ(QFP ZIF) MSP430FR604x(1), MSP430FR603x(1) 2 × MSP430FR6047IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ5x100(green PCB)

100-pin PZ(QFP ZIF)

MSP430F543x, MSP430BT5190,MSP430SL5438A 2 × MSP430F5438IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100USB(green PCB)

100-pin PZ(QFP ZIF)

MSP430F665x, MSP430F663x,MSP430F563x 2 × MSP430F6638IPZ Eight PCB 1×25-pin headers


MSP-TS430PZ100AUSB(blue PCB)

100-pin PZ(QFP ZIF) MSP430FG662x, MSP430FG642x None. Free samples can be


MSP-TS430PEU128(green PCB)

128-pin PEU(QFP ZIF)

MSP430F677x, MSP430F676x,MSP430F674x, MSP430F677x1,MSP430F676x1, MSP430F674x1

2 × MSP430F67791IPEU

Four PCB 1x26-pin headers(two male and two female)and four PCB 1x38-pin headers(two male and two female)

See the device data sheets for device specifications. Device errata can be found in the respective device productfolder on the web provided as a PDF document. Depending on the device, errata may also be found in thedevice bug database.








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1.2 Kit Contents, MSP-FET430xx• One READ ME FIRST document• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end of the

case, and a 2×7-pin male connector on the other end of the case.• One USB cable• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)• One 14-Pin JTAG conductor cable• One small box containing two MSP430 device samples (See table for Sample Type)• One target socket module. To determine the devices used for each board and a summary of the board, see

Table 1-1. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx kit; forexample, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.

See the device data sheets for device specifications. Device errata can be found in the respective device productfolder on the web provided as a PDF document. Depending on the device, errata may also be found in thedevice bug database at www.ti.com/sc/cgi-bin/buglist.cgi.

1.3 Kit Contents, MSP-FET• One READ ME FIRST document• One MSP-FET interface module• One USB cable• One 14-conductor cable

1.4 Kit Contents, MSP-FET430UIF• One READ ME FIRST document• One MSP-FET430UIF interface module• One USB cable• One 14-conductor cable

1.5 Kit Contents, MSP-FET430PIF• One READ ME FIRST document• One MSP-FET430PIF interface module• One 25-conductor cable• One 14-conductor cable

NoteNOTE: This part is obsolete and is not recommended to use in new design.

1.6 Kit Contents, eZ430-F2013• One QUICK START GUIDE document• One eZ430-F2013 development tool including one MSP430F2013 target board

1.7 Kit Contents, eZ430-T2012• Three MSP430F2012-based target boards




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1.8 Kit Contents, eZ430-RF2500• One QUICK START GUIDE document• One eZ430-RF2500 CD-ROM• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)

1.9 Kit Contents, eZ430-RF2500T• One eZ430-RF2500T target board• One AAA battery pack with expansion board (batteries included)

1.10 Kit Contents, eZ430-RF2500-SEH• One MSP430 development tool CD containing documentation and development software• One eZ430-RF USB debugging interface• Two eZ430-RF2500T wireless target boards• One SEH-01 solar energy harvester board• One AAA battery pack with expansion board (batteries included)

1.11 Kit Contents, eZ430-Chronos-xxx'433, '868, '915

• One QUICK START GUIDE document• One ez430-Chronos emulator• One screwdriver• Two spare screws

eZ430-Chronos-433:– One 433-MHz eZ430-Chronos watch (battery included)– One 433-MHz eZ430-Chronos access point







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1.12 Kit Contents, FET430F6137RF900• One READ ME FIRST document• One legal notice• One MSP-FET430UIF interface module• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137 device

in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.• Two CC430EM battery packs• Four AAA batteries• Two 868-MHz or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2x4-pin headers• One USB cable• One 14-pin JTAG conductor cable

1.13 Kit Contents, EM430Fx1x7RF900• One READ ME FIRST document• One legal notice• Two target socket module

MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which issoldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present on thePCB

MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which issoldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present on thePCB

MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which issoldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present on thePCB

• Two CC430EM battery packs• Four AAA batteries• Two 868- or 915-MHz antennas• Two 32.768-kHz crystals• 18 PCB 2×4-pin headers

1.14 Hardware Installation, MSP-FET and MSP-FET430UIFSee the MSP Debuggers User’s Guide.





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1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,EM430Fx1x7RF900Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:

1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDEinstallation installs drivers automatically.

2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FETshould be recognized, as the USB device driver is installed automatically. If the driver has not been installedyet, the install wizard starts. Follow the prompts and point the wizard to the driver files.

3. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC. Usethe 14-conductor cable to connect the FET interface module to the supplied target socket module.

4. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a circularindentation on the top surface) aligns with the "1" mark on the PCB.

5. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Appendix Bincludes illustrations of the target socket modules and their parts.

1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,MSPEXP430F5529To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools:

1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDEinstallation installs drivers automatically.

2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FETshould be recognized, as the USB device driver is installed automatically. If the driver has not been installedyet, the install wizard starts. Follow the prompts and point the wizard to the driver files.

1.17 Important MSP430 Documents on the WebThe primary sources of MSP430 information are the device-specific data sheet and user's guide. The MSP430website contains the most recent version of these documents.

PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the librarian)are in the msp430\documentation folder. A Wiki page (FAQ) for the Code Composer Studio IDE is available, andthe Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provideadditional help besides the product help and Welcome page.

PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker, andthe librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the latestinformation) are available in HTML format in the same directories. An IAR-specific tool page is also available.







http://www.tiexpressdsp.com/index.php/Category:Code_Composer_Studio_v5

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http://www.ti.com/tool/iar-kickstart

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This chapter presents signal requirements for in-circuit programming of the MSP430.

2.1 Signal Connections for In-System Programming and Debugging.........................................................................202.2 External Power............................................................................................................................................................242.3 Bootloader (BSL)........................................................................................................................................................ 24

Chapter 2Design Considerations for In-Circuit Programming

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2.1 Signal Connections for In-System Programming and DebuggingMSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430

With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIFand MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the connectionsalso support the MSP-GANG430 or MSP-PRGS430 production programmers, thus providing an easy way toprogram prototype boards, if desired.

Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target devicerequired to support in-system programming and debugging for 4-wire JTAG communication. Figure 2-2 showsthe connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is supported on most MSP430devices, except devices with low pin counts (for example, MSP430G2230). The 2-wire JTAG mode is availableon selected devices only. See the Code Composer Studio IDE for MSP430 MCUs User's Guide or IAREmbedded Workbench IDE for MSP430 MCUs User's Guide for information on which interface method canbe used on which device.

The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430 areidentical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board (through pin 2).In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-sense feature that, if used,requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC presenton the target board (that is, a battery or other local power supply) and adjusts the output signals accordingly. Ifthe target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made,and not the connection to pin 2. This uses the VCC-sense feature and prevents any contention that might occurif the local on-board VCC were connected to the VCC supplied from the FET interface module, MSP-GANG orthe MSP-GANG430. If the VCC-sense feature is not necessary (that is, if the target board is to be powered fromthe FET interface module, MSP-GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAGheader, and no connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports bothscenarios of supplying VCC to the target board. If this flexibility is not required, the desired VCC connections maybe hard-wired to eliminate the jumper block. Pins 2 and 4 must not be connected at the same time.

The connection to the JTAG connector RST pin of Figure 2-1 is required when programming or debugging adevice that supports 2-wire JTAG communication, even when using 4-wire JTAG communication mode on thesedevices. However, this connection is optional on devices that do not support 2-wire JTAG communication. TheMSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gaincontrol over the device. However, if this is unsuccessful, the RST signal of the JTAG connector may be used bythe development tool or device programmer as an additional way to assert a device reset.

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2468101214

TDO/TDITDI/VPPTMSTCKGND

TEST/VPP

JTAG

VCC TOOLVCC TARGET

J1 (see Note A)

J2 (see Note A)

VCC

R147 kW

(see Note B)

C210 µF

C30.1 µF

V /AV /DVCC CC CC

RST/NMITDO/TDI

TDI/VPP

TMS

TCK

TEST/VPP (see Note C)

V /AV /DVSS SS SS

MSP430Fxxx

C110 nF/1.1 nF

(see Notes B and E)

RST (see Note D)

Important to connect

(see Note F)

A. If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connectionJ2.

B. The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family user's guide forthe recommended configuration.

C. The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data sheet todetermine if this pin is available.

D. The connection to the JTAG connector RST pin is required when programming or debugging a device that supports 2-wire JTAGcommunication, even when using 4-wire JTAG communication mode on these devices. However, this connection is optional on devicesthat do not support 2-wire JTAG communication.

E. When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should not exceed 2.2 nF.The typical value for SBW communication is shown. The range can vary between 0.1 nF and 2.2 nF depending on SBW speed, voltage,and board design. See the device-specific data sheet for device-specific recommendations.

F. For applications that are particularly concerned with excessive noise or ESD, a 500-Ω to 1-kΩ pulldown resistor can be added to theTEST pin, while still allowing proper programming of the target device.

Figure 2-1. Signal Connections for 4-Wire JTAG Communication





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TEST/SBWTCK

MSP430Fxxx

RST/NMI/SBWTDIOTDO/TDI

TCKGND

TEST/VPP

JTAG

VCC TOOLVCC TARGET

330ΩR2

J1 (see Note A)

J2 (see Note A)


V /AV /DVCC CC CC

V /AV /DVSS SS SS

R147 kΩ

C11.1 nF

(see Note B)

VCC

C210 µF

C30.1 µF

(see Note D)

A. If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connectionJ2.

B. The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, andany capacitance that is attached to this signal can affect the ability to establish a connection with the device. The upper limit for C1 is2.2 nF when using current TI tools. The typical value for SBW communication is shown. The range can vary between 0.1 nF and 2.2 nFdepending on SBW speed, voltage, and board design. See the device-specific data sheet for device-specific recommendations.

C. R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the TEST/VPP pin duringthe fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω) and do not connect TEST/VPP toTEST/SBWTCK.

D. For applications that are particularly concerned with excessive noise or ESD, a 500-Ω to 1-kΩ pulldown resistor can be added to theTEST pin, while still allowing proper programming of the target device.

Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx, and MSP430F4xx Devices




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TEST/SBWTCK

MSP430Fxxx

RST/NMI/SBWTDIOTDO/TDI

TCKGND

JTAG

R147 kΩ

VCC TOOLVCC TARGET

C11.1 nF

(see Note B)

J1 (see Note A)

J2 (see Note A)


V /AV /DVCC CC CC

V /AV /DVSS SS SS

VCC

C210 µF

C30.1 µF

(see Note C)

A. Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug orprogramming adapter.

B. The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, andany capacitance that is attached to this signal can affect the ability to establish a connection with the device. The upper limit for C1 is2.2 nF when using current TI tools. The typical value for SBW communication is shown. The range can vary between 0.1 nF and 2.2 nFdepending on SBW speed, voltage, and board design. See the device-specific data sheet for device-specific recommendations.

C. For applications that are particularly concerned with excessive noise or ESD, a 500-Ω to 1-kΩ pulldown resistor can be added to theTEST pin, while still allowing proper programming of the target device.

Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430SBW-Capable Devices That are Not Part of F2xx, G2xx, F4xx Families

NoteOn some Spy-Bi-Wire capable MSP430 devices, TEST/SBWTCK is very sensitive to rising signaledges that can cause the test logic to enter a state where an entry sequence (either 2‑wire or 4-wire)is not recognized correctly and JTAG access stays disabled. Unintentional edges on SBWTCK canoccur when the JTAG connector is connected to the target device.





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2.2 External PowerSee the MSP Debuggers User’s Guide.

2.3 Bootloader (BSL)The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices, thesepins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing maynot be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program(a "bootloader", formerly knows as the "bootstrap loader") that permits the flash memory to be erased andprogrammed using a reduced set of signals. MSP430™ Flash Device Bootloader (BSL) User's Guide describesthis interface. See the MSP430 website for the application reports and a list of MSP430 BSL tool developers.

TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests providingaccess to these signals by, for example, a header).

See FAQ 10 for a second alternative to sharing the JTAG and port pins.







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This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.

A.1 Hardware FAQs.......................................................................................................................................................... 26A.2 Known Issues.............................................................................................................................................................28

Appendix AFrequently Asked Questions and Known Issues

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A.1 Hardware FAQs1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information

Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN/P2.6(socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the LFXT1 low-frequencycrystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire (2-wire) JTAG configurationand only to the period while a debug session is active.Workarounds:• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG configuration.

This can be achieved by placing jumpers JP4 through JP9 accordingly.• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down menu (at

top of Debug View). This prevents the debugger from accessing the MSP430 device while the applicationis running. Note that, in this mode, a manual halt is required to see if a breakpoint was hit. See the IDEdocumentation for more information on this feature.

• Use an external clock source to drive XIN directly.2. With current interface hardware and software, there is a weakness when adapting target boards that

are powered externally. This leads to an accidental fuse check in the MSP430 device. This is valid for PIFand UIF but is seen most often on the UIF. A solution is being developed.Workarounds:• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the RST line,

which also resets the device internal fuse logic.• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down menu.

This prevents the debugger from accessing the MCU while the application is running. Note that in thismode, a manual halt is required to see if a breakpoint was hit. See the IDE documentation for moreinformation on this feature.

• Use an external clock source to drive XIN directly.3. The 14-conductor cable that connects the FET interface module and the target socket module must not

exceed 8 inches (20 centimeters) in length.4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the USB

FET.5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket

module. See the schematic of the target socket module to populate the capacitor according to the data sheetof the device.

6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on thetarget socket module. See the schematic of the target socket module to populate the capacitor according tothe data sheet of the device.

7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module. ForMSP430 devices that contain user-selectable loading capacitors, see the device and crystal data sheets forthe value of capacitance.

8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C-SPY(as any required clocking and timing is derived from the internal DCO and FLL).

9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.For C-SPY: "Release JTAG On Go" must be selected.

10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using anMSP430 device that is a "superset" of the smaller device. A very powerful feature of the MSP430 isthat the family members are code and architecturally compatible, so code developed on one device (forexample, one without shared JTAG and port pins) ports effortlessly to another (assuming an equivalent setof peripherals).

11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI. Customersshould erase the information memory before its first use. Main memory of packaged devices is blank whenthe device is delivered from TI.

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12. The device current is higher then expected. The device current measurement may not be accurate withthe debugger connected to the device. For accurate measurement, disconnect the debugger. Additionallysome unused pins of the device should be terminated. See the Connection of Unused Pins table in thedevice's family user's guide.

13. MSP-FETv2 – SBW may have issues with some target socket boards. Check the capacitance of theRST (SBWTDIO) line. If there is no capacitance, you may need to add at least 100 pF to the RST signal.The additional capacity on the RST line ensures that the timing between the SBWTDIO and SBWTCKsignals is synchronized.

14. The following ZIF sockets are used in the FET tools and target socket modules:• 8-pin device (D package): Yamaichi IC369-0082• 14-pin device (PW package): Enplas OTS-14-065-01• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02• 28-pin device (DW package): Wells-CTI 652 D028• 28-pin device (PW package): Enplas OTS-28-0.65-01• 38-pin device (DA package): Yamaichi IC189-0382-037• 40-pin device (RHA package): Enplas QFN-40B-0.5-01• 40-pin device (RSB package): Enplas QFN-40B-0.4• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001• 48-pin device (DL package): Yamaichi IC51-0482-1163• 64-pin device (PM package): Yamaichi IC51-0644-807• 64-pin device (RGC package): Yamaichi QFN11T064-006• 80-pin device (PN package): Yamaichi IC201-0804-014• 100-pin device (PZ package): Yamaichi IC201-1004-008• 128-pin device (PEU package): Yamaichi IC500-1284-009P

Enplas: www.enplas.com

Wells-CTI (Sensata Technologies): www.sensata.com

Yamaichi: www.yeu.com

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A.2 Known IssuesMSP-FET430UIFCurrent detection algorithm of the UIF firmware

Problem Description

If high current is detected, the ICC monitor algorithm stays in a loop of frequently switching on and off the targetpower supply. This power switching puts some MSP430 devices such as the MSP430F5438 in a state thatrequires a power cycle to return the device to JTAG control.

A side issue is that if the UIF firmware has entered this switch on and switch off loop, it is not possible to turn offthe power supply to the target by calling MSP430_VCC(0). A power cycle is required to remove the device fromthis state.

Solution

IAR KickStart and Code Composer Essentials that have the MSP430.dll version 2.04.00.003 and higher donot show this problem. Update the software development tool to this version or higher to update the MSP-FET430UIF firmware.

MSP-FET430PIFSome PCs do not supply 5 V through the parallel port

Problem Description

Device identification problems with modern PCs, because the parallel port often does not deliver 5 V as wascommon with earlier hardware.

1. When connected to a laptop, the test signal is clamped to 2.5 V.2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter through pin 4 (sense).

Solution

Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the VCC pads of the interface.The jumper on a the target socket must be switched to external power.

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This appendix contains information relating to the FET hardware, including schematics, PCB pictorials, and billsof materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-specific user'sguides.

Topic SectionMSP-TS430D8 Appendix B.1

MSP-TS430PW14 Appendix B.2

MSP-TS430L092 Appendix B.3

MSP-TS430L092 Active Cable Appendix B.4


MSP-TS430RHL20 Appendix B.6


MSP-TS430RGE24A Appendix B.8

MSP-TS430DW28 Appendix B.9


MSP-TS430PW28A Appendix B.11

MSP-TS430RHB32A Appendix B.12

MSP-TS430DA38 Appendix B.13

MSP-TS430QFN23x0 Appendix B.14

MSP-TS430RSB40 Appendix B.15

MSP-TS430RHA40A Appendix B.16

MSP-TS430DL48 Appendix B.17

MSP-TS430PT48 Appendix B.18

MSP-TS430PT48A Appendix B.19

MSP-TS430RGZ48B Appendix B.20

MSP-TS430RGZ48C Appendix B.21

MSP-TS430PM64 Appendix B.22

MSP-TS430PM64A Appendix B.23

MSP-TS430PM64D Appendix B.24

MSP-TS430PM64F Appendix B.25

MSP-TS430RGC64B Appendix B.26

MSP-TS430RGC64C Appendix B.27

MSP-TS430RGC64USB Appendix B.28

MSP-TS430PN80 Appendix B.29

MSP-TS430PN80A Appendix B.30

MSP-TS430PN80B Appendix B.31

MSP-TS430PN80C Appendix B.32

MSP-TS430PN80USB Appendix B.33

MSP-TS430PZ100 Appendix B.34

Appendix BHardware

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Topic SectionMSP-TS430PZ100A Appendix B.35

MSP-TS430PZ100B Appendix B.36

MSP-TS430PZ100C Appendix B.37

MSP-TS430PZ100D Appendix B.38

MSP-TS430PZ100E Appendix B.39

MSP-TS430PZ5x100 Appendix B.40

MSP-TS430PZ100USB Appendix B.41

MSP-TS430PZ100AUSB Appendix B.42

MSP-TS430PEU128 Appendix B.43

EM430F5137RF900 Appendix B.44



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B.1 MSP-TS430D8

GN

D

10

0n

F

330R

10

uF

/10

V

47K

2.2

nF

GN

D

330R

GN

D

GN

D

gre

en

FE

4L

FE

4H

GN

D

Ext_

PW

R

So

cke

t:YA

MA

ICH

ITyp

e:

IC3

69

-00

82

Vcc

ext

int

tom

ea

su

resu

pp

lycu

rren

tD

NP

1 3 5 7 9 11 13

2 4 6

12

148

10

SB

W

C5R

3

C7

R5

C8

1

2

3

J3

1

2J4

1 2

J6

1 2 3

J5

R2

D1

1234

J1

5 6 7 8

J2

DV

CC

1D

VS

S8

P1.2

/TA1/A

22

P1.5

/TA0/A

5/S

CLK

3

P1.6

/TA1/A

6/S

DO

/SC

L4

TS

T/S

BW

TC

K7

RS

T/S

BW

TD

IO6

P1.7

/A7/S

DI/S

DA

5

U1

MS

P-T

S4

30

D8

GN

D

VC

C

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

SB

WT

CK

VC

C4

30

TS

T/S

BW

TC

K

TS

T/S

BW

TC

K

TS

T/S

BW

TC

KP

1.5

P1

.6P

1.7

P1

.2

Da

te:

28

.07

.20

1111

:03

:35

Sh

ee

t:1/1

RE

V:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

D8

+

1.0

MS

P-T

S4

30

D8

Targ

et S

ocke

t Bo

ard

Figure B-1. MSP-TS430D8 Target Socket Module, Schematic

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Jumper J4Open to disconnect LED

D1LED connected to P1.2

Orient Pin 1 of MSP430 device

14-pin connector for debuggingin Spy-Bi-Wire mode only

(4-Wire JTAG not available)

Jumper J6Open to measure current

Jumper J51-2 (int): Power supply from JTAG interface2-3 (ext): External power supply

Connector J3External power connectorJumper J5 to “ext”

Figure B-2. MSP-TS430D8 Target Socket Module, PCB

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Table B-1. MSP-TS430D8 Bill of MaterialsPosition Ref Des No. per

Board Description Digi-Key Part No. Comment

1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

3 SBW 1 10-pin connector, male, TH HRP10H-ND

4 J3 1 3-pin header, male, TH SAM1035-03-ND

5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292

6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND

7 R5 1 47K, 0805 541-47000ATR-ND

8 C5 1 100nF, CSMD0805 311-1245-2-ND

9 R2, R3 2 330R, 0805 541-330ATR-ND

10 J1, J2 2 4-pin header, TH SAM1029-04-ND DNP: headers enclosed with kit.Keep vias free of solder.

10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit.

11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi

12 D1 1 red, LED 0603

13 MSP430 2 MSP430G2210, MSP430G2230 DNP: enclosed with kit. Is suppliedby TI

14 PCB 1 50,0mmx44,5mm MSP-TS430D8 Rev. 1.0

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B.2 MSP-TS430PW14

12pF

12pF

GN

D

100nF

330R

10uF

/10V

47K

2.2

nF

GN

D

330R

100nF

GN

D

GN

D

GN

D

gre

en

Ext_

PW

R

Socket: E

NP

LA

SType: O

TS

-14-0

65

Vcc

ext

int

to m

easure

supp

ly c

urre

nt

DN

P

DN

P

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

od

e s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mp

ers

J7

to J

12

to p

ositio

n 2

-3

2-w

ire "S

pyB

iWire

": Se

t jum

pe

rs J

7 to

J1

2 to

po

sitio

n 2

-1

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2

C1

C5R

3

C7

R5

C8

123

J3

Q1

8 910

11

12

13

14

J2

1234567

J1

12J

4

1 2

J6

J5

1 2 3

R2

C3

J7

1 2 3

J8

1 2 3

J9

1 2 3

J10

1 2 3

J11

1 2 3

J1

2

1 2 3

12345678 9 10

14

13

12

11

D1

P1.0

P1.3

P1.2

P1.1

XO

UT

XO

UT

GN

D

XIN

XIN

VC

C

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

VC

C430

P1.4

/TC

K

P1.4

/TC

K

P1.5

/TM

S

P1.5

/TM

S

P1.6

/TD

I

P1.6

/TD

I

P1.7

/TD

O

P1.7

/TD

O

TD

O/S

BW

TD

IO

RS

T/N

MI

TM

ST

DI

Da

te:

7/1

6/2

00

7 8

:22

:36

AM

Sh

ee

t:1

/1 RE

V:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PW

14

+

2.0

MS

P-T

S4

30

PW

14

Ta

rge

t So

cke

t Bo

ard

Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic

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Orient Pin 1 of MSP430 device Jumper J6Open to measure current

Connector J3External power connectorJumper J5 to "ext"D1

LED connected to P1.0

Jumpers J7 to J12Close 1-2 to debug in Spy-Bi-Wire mode.Close 2-3 to debug in 4-wire JTAG mode.


Connector JTAGFor JTAG Tool

Figure B-4. MSP-TS430PW14 Target Socket Module, PCB

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Table B-2. MSP-TS430PW14 Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND

3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3

4 C8 0 2.2nF, SMD0805 DNP

5 D1 1 green LED, SMD0603 475-1056-2-ND

6 J1, J2 0 7-pin header, TH

DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder

SAM1029-07-ND : HeaderSAM1213-07-ND : Receptacle

7J3, J5, J7,J8, J9, J10,

J11, J128 3-pin header, male, TH SAM1035-03-ND Place jumpers on headers J5, J7, J8, J9,

J10, J11, J12; Pos 1-2

8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2

10 JTAG 1 14-pin connector, male,TH HRP14H-ND

12 Q1 0 CrystalMicro Crystal MS1V-T1K32.768kHz, C(Load) =12.5pF

DNP: keep vias free of solder

13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas

17 PCB 1 56 x 53 mm 2 layers

18 Adhesiveplastic feet 4 Approximately 6mm width,

2mm height

For example, 3MBumpons Part No.SJ-5302

Apply to corners at bottom side

19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI

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B.3 MSP-TS430L092

Figure B-5. MSP-TS430L092 Target Socket Module, Schematic

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Settings of the MSP-TS430L092 Target Socket

Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is recommended:

• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device current

consumption. For default operation, they should be closed.

Connector J3External power connector

Jumper JP3Open to measure current

Jumper JP1Write enable for EPROM

Orient pin 1 ofMSP430 device

Figure B-6. MSP-TS430L092 Target Socket Module, PCB

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Table B-3. MSP-TS430L092 Bill of MaterialsPos. Ref Des No. No. Per Board Description Digi-Key Part No. Comment

1 C1, C2 2 330nF, SMD0603

2 C5 1 100n, SMD0603

3 C6 1 10u, SMD0805

4 C10 1 100n, SMD0603

5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND


DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.



9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder.

11 J13 1 MICRO_STECKV_10 Reichelt: MicroMaTch-Connector: MM FL 10G

12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header

15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557

16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065

17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC

18 R0, R6, R7 3 2K7, SMD0603

19 R1 1 1k, SMD0603

20 R2 1 47k, SMD0603

21 R4,R5, R8,R10, RC, RD 6 10k, SMD0603

22 RA 1 3.9k, SMD0603

23 RB 1 6.8k, SMD0603

24 U1 1 14 Pin Socket -IC189-0142-146 Manuf. Yamaichi

22 MSP430 2 MSP430L092PWR DNP: Enclosed with kit. Issupplied by TI.

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B.4 MSP-TS430L092 Active Cable

Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic

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Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:

• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.Table B-4. MSP-TS430L092 JP1 Settings

Jumper 1 Jumper 2 Description

Off Off The active cable has no power and does not function.

Off OnThe active cable receives power from target socket. For this option, thetarget socket must have its own power supply.

On Off The active cable receives power from the JTAG connector.

On OnThe JTAG connector powers the active cable and the target socket. Forthis option, the target socket must not have its own power source, asthis would cause a not defined state.

• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to high andcan also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.

Connector JTAG

For JTAG Tool

JP2

JP1

Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB

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Table B-5. MSP-TS430L092 Active Cable Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment

1 C1, C3, C5, C6 4 100nF, SMD0603

2 C2, C4 2 1uF, SMD0805

3 R1, R10 2 10K, SMD0603

4 R2 1 4K7, SMD0603

5 R5, R6, R7, R9 4 100, SMD0603

6 R8 1 680k, SMD0603

7 R11, R15 2 1K, SMD0603

8 R12 0 SMD0603 DNP

9 R13 0 SMD0603 DNP

10 R14 1 0, SMD0603

11 IC1 1 SN74AUC1G04DBVR Manu: TI

12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI

13 J2 1 MICRO_STECKV_10 Reichelt: MicroMaTch-Connector: MM FL 10G

14 JP1 1 2x2 Header JP2Q Put jumper on Position 1 and 2.Do not mix direction.

15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header

16 JTAG 1 14-pin connector, male, TH HRP14H-ND

17 Q1 1 BC817-25LT1SMD, SOT23-BEC

Digi-Key:BC817-25LT1GOSCT-ND

18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI

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B.5 MSP-TS430PW20The MSP-TS430PW20 microcontroller development board supports the MSP430FR23x and MSP430FR21xFRAM devices in both 20-pin and 16-pin TSSOP (TI package code PW) packages. No microcontroller devicesare included in the MSP-TS430PW20 kit, but can be ordered from the TI Store.

The MSP-TS430PW20 microcontroller development board has two jumpers on header J11 that direct the UARTBSL signals, depending on which device is being used (see Figure B-9).

Figure B-9. UART BSL Signal Select

• GROUP2: Jumpers on 3-5 and 4-6 for MSP430FR231x PW16• GROUP1: Jumpers on 1-3 and 2-4 for all other compatible devices, including MSP430FR231x PW20

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DN

P

I2C

UA

RT

P1.3

Jum

pers

JP

3 to

JP

8C

lose 1

-2 to

debug in

Spy-B

i-Wire

mode.

Clo

se 2

-3 to

debug in

4-w

ire J

TA

G m

ode.

BS

LTool S

ele

ct:

Open =

BS

LC

onnecto

rC

losed =

JTA

G C

onnecto

r

DN

P

DN

P

12p

12p

GN

D

GN

D

33

0R

0R0R

GN

D

GN

D

1.1

nF

47

kG

ND

0R0R

QU

AR

Z5

10

0n

F

1uF/10V

gre

en

GN

D

EV

Q11

0R

DNP

DN

P

10

0n

FGN

D

10

k1

0k

33

0R

yello

w D

NP3

30

R

red D

NP

MS

P430F

R231X

IPW

20

SA

M1029-1

0-N

D/1

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SA

M1029-1

0-N

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1-2

0

If exte

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upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

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Ext_

PW

R

MS

P-T

S4

30

PW

20

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

1.1

DN

P

P1

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Socket: E

npla

s O

TS

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5-0

07

PW

16

PW

20

DN

P

DN

P

Ta

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for M

SP

43

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R2

31

x d

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1 3 5 7 9 11

13

2 4 6

12

148

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C9

C8

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9R8

Q2

C11

C7

D1

SW

1

R1

3

TP2TP1

SW2

R1

4

C6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

R5

12J

P2

D2

R6

12J

P10

D3

TP

3

P1

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CB

0C

LK

/AC

LK

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/A1

1

P1

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CB

0S

TE

/SM

CL

K/C

0/A

0/V

ER

EF

+2

TE

ST

/SB

WT

CK

3

RS

T/N

MI/S

BW

TD

IO4

DV

CC

5

DV

SS

6

P2

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B0

CL

K/X

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P2

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CL

K/X

OU

T8

P2

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CB

0S

OM

I/UC

B0

SC

L9

P2

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CB

0S

IMO

/UC

B0

SD

A1

0

P1

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CB

0S

IMO

/UC

B0

SD

A/T

B0

TR

G/O

A0

-/A2

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RE

F-

20

P1

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CB

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I/UC

B0

SC

L/O

A0

O/A

31

9

P1

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CA

0S

TE

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K/O

A0

+/A

41

8

P1

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CA

0C

LK

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S/T

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51

7

P1

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CA

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A0

SO

MI/T

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DI/T

CL

K/T

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P1

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14

1

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10

1

2

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Jumpers JP9, JP2, JP10Open to disconnect LEDs

D1 to D3LEDs connected to P1.0 to P1.2


Jumper J1 to "ext"

Jumpers JP3 to JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode


Connector BSLFor ToolBootloader


SW1Close to reset


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Table B-6. MSP-TS430PW20 Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment

1 PCB 1 90.0 x 92.5 mm "MSP-TS430PW20" Rev. 1.1 2 layers, green solder mask

2JP1, JP9,

JP13, JP14,JP15

5 2-pin header, male, TH SAM1035-02-ND place jumper on header

3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only

4 JP2, JP10 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder

5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2

6 JP3, JP4, JP5,JP6, JP7, JP8 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2

7 JP16 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3


9 JP11 1 2x3pin header, male, TH SAM1034-03-ND

PW20: Place jumpers on pins1-3 and 2-4PW16: Place jumpers on pins3-5 and 4-6

10 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP

11 R3, R13 2 0R, 0805 541-0.0ATR-ND

12 C5 1 1.1nF, CSMD0805 490-1623-2-ND

13 C7 1 1uF/10V, CSMD0805 490-1702-2-ND

14 R7, R15 1 10k, 0805 541-10KATR-ND

15 R4 1 47k, 0805 541-47KATR-ND

16 C6, C11 2 100nF, CSMD0805 490-1666-1-ND

17 C8, C9 2 12p, DNP, CSMD0805 BC1257TR-ND DNP

18 R1 1 330R, 0805 541-330ATR-ND

19 R5, R6 2 330R, 0805 541-330ATR-ND DNP

20 R14 1 47k, 0805 541-47KATR-ND DNP

21 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder

22 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder

23 J3, J4 2 10-pin header, TH SAM1029-10-NDDNP: headers are enclosedwith kit.Keep vias free of solder.

24 J3, J4 2 10-pin receptacle, TH SAM1213-10-NDDNP: Receptacles areenclosed with kit.Keep vias free of solder.

25 TP1, TP2, TP3 3 Test point DNP, keep pads free of solder

26 BSL 1 10-pin connector, male, TH HRP10H-ND


28 IC1 1 Socket: OTS-20S-0.65-007 Manuf. Enplas

29 IC1 1 MSP430FR2311IPW20 DNP: Free samples can beordered in the TI Store

30 Q2 1 4MHz Crystal 4MHz Buerklin: 78D134 DNP: Crystal is enclosed withkit

31 Q2 1 MSV3V-T1R (32.768kHz /20ppm / 12.5pF)

DNP: Crystal is enclosed withkit

32 D1 1 green LED, HSMG-C170DIODE0805 516-1434-1-ND Avago, Farnell 5790852

33 D3 1 red LED, DIODE0805 DNP

34 D2 1 yellow LED, DIODE0805 DNP

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Table B-6. MSP-TS430PW20 Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment

35 Rubber standoff 4 Buerklin: 20H1724 apply to corners at bottom side

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B.6 MSP-TS430RHL20

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Figure B-12. MSP-TS430RHL20 Target Socket Module, Schematic

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Connector JTAG ForJTAG Tool


Jumper J1 to External


Jumpers JP5 to JP10Close 1-2 to debug in Spy-Bi Wire modeClose 2-3 to debug in 4-wire JTAG mode


Jumper J11-2 (Debugger): Power supply from JTAG interface

2-3 (External): External power supplyConnector BLSFor Bootloader Tool

BSL Interface SwitchesSelect which BSL interface toconnect to connector BSL

I2C pullup enable switchSwitch On to connect I2C pullupresistors

Jumpers JP11, JP12Open to disconnect LEDs D1 and D2

LEDs D1, D2LEDs connector to P1.0 and P2.3

Figure B-13. MSP-TS430RHL20 Target Socket Module, PCB

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Table B-7. MSP-TS430RHL20 Bill of MaterialsItem No. Designator Quantity Description Supplier Part Number Note

1 !PCB 1 Printed Circuit Board

2 BSL 1 Header(Shrouded), 2.54mm,5x2, Gold, TH AWHW-10G-0202-T-ND

3 C1 1 CAP, CERM, 1 µF, 10 V, ±10%,X7R, 0805 490-1695-1-ND

4 C5 1 CAP, CERM, 1100 pF, 50 V,±5%, C0G/NP0, 0805 490-1623-1-ND

5 C6 1 CAP, CERM, 0.1 µF, 50 V,±10%, X7R, 0805 490-1666-1-ND

6 C7 1 CAP, CERM, 10 µF, 16 V,±10%, X5R, 0805 478-5165-1-ND

7 C8, C9 0 CAP, CERM, 22 pF, 50 V, ±5%,C0G/NP0, 0805 490-3608-1-ND DNP

8 D1 1 LED, Green, SMD 754-1939-1-ND

9 D2 1 LED, Blue, SMD 732-4982-1-ND

10 H5, H6, H7, H8 4 Bumpon, Cylindrical, 0.312 X0.200, Black SJ5746-0-ND

11 IC1 1 Socket, QFN-20, 0.5 mm Pitch use IC564-020-130 socket

12 J1, J2, JP5, JP6, JP7,JP8, JP9, JP10 8 Header, 100mil, 3x1, Gold, TH SAM1029-03-ND

13 J3, J4 2 Header, 100mil, 10x1, Gold, TH SAM1029-10-ND DNP: Headers are enclosedin kit. Keep vias free of solder

14 J3, J4 2 Receptacle, 100mil, 10x1, Gold,TH SAM1213-12-ND

DNP: Receptacles areenclosed in kit. Keep vias freeof solder

15 JP1, JP11, JP12 3 Header, 100mil, 2x1, Gold, TH SAM1029-02-ND

16 JTAG 1 Header (shrouded), 100 mil,7x2, Gold, TH S9170-ND

17 Q1 1 Crystal, 32.768 KHz, 12.5 pF,SMD X1A0001410014 DNP: One Epson Crystal

Included in kit

18 R1 1 RES, 330, 5%, 0.125 W, 0805 541-330ACT-ND

19 R2 1 RES, 200, 5%, 0.125 W, 0805 541-200ACT-ND

20 R3, R10, R19, R20,R21 5 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND

21 R4, R8, R9 0 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND DNP

22 R7 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND

23 R13 0 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND DNP

24 R16, R17 2 RES, 4.7 k, 5%, 0.125 W, 0805 541-4.7KACT-ND

25

SH‑J1, SH‑JP1,SH‑JP5, SH‑JP6,SH‑JP7, SH‑JP8,SH‑JP9, SH‑JP10,SH‑JP11, SH‑JP12

10 Shunt, 100mil, Gold plated,Black 3M9580-ND

J1: 1-2, JP1: 1-2, JP5: 2-3,JP6: 2-3, JP7: 2-3, JP8: 2-3,JP9: 2-3, JP10: 2-3, JP11:1-2, JP12: 1-2

26 SW1, SW2 2 Switch Tactile SPST-NO 0.02A15V P8079STB-ND

27 SW3, SW4, SW5 3 Switch, DPST, Slide, Off-On, 1Pos, 0.15A, 30V, TH GH7727-ND

Install with arrow on partmatching arrow on PCB. SW3and SW4 should be in theOFF position, SW5 should bein the ON position

28 TP1, TP2, TP3, TP4,TP5, TP6 0 Test Point, Miniature, Black, TH 36-5001-ND DNP

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B.7 MSP-TS430PW24


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Jumper JP3Open to disconnect LED

Connector J5External power connectorJumper JP1 to "ext"


Jumper JP11-2 (int): Power supply from JTAG interface

2-3 (ext): External power supply



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Table B-8. MSP-TS430PW24 Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C5 1 2.2nF, SMD0805

3 C3, C7 2 10uF, 10V, SMD0805

4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND

5 D1 1 green LED, SMD0805 P516TR-ND

6 J1, J2 0 12-pin header, TH SAM1029-07-NDSAM1213-07-ND

DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder.(Header and Receptacle)

7

J5, JP1,JP4, JP5,JP6, JP7,JP8, JP9

8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9Place on 1-2 on JP1

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND see Pos 7 and 8


11 Q1 0 Crystal DNP: keep vias free of solder

12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

13 R5, R6, R8,R9, 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6

14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND

15 U1 1 Socket: OTS24(28)-065-02-00 Manuf.: Enplas

16 PCB 1 68.5 x 61 mm 2 layers


2mm heightfor example, 3M BumponsPart No. SJ-5302 Apply to corners at bottom side

18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI

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B.8 MSP-TS430RGE24A

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DN

P

10

0n

F

GN

D1

0k

10

k

MS

P430F

R2433IR

GE

SA

M1029-0

6-N

D1-6

SAM1029-06-ND7-12

SA

M1029-0

6-N

D13-1

8

SAM1029-06-ND19-24

33

0R

yello

w D

NP3

30

R

red D

NP

If exte

rnal s

upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

)

Ext_

PW

R

MS

P-T

S4

30

RG

E2

4A

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

1.0

DN

P

P1

.3

Ta

rge

t So

cke

t Bo

ard

for M

SP

43

0F

R2

43

3 d

evic

e

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C9

C8

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9 R8

Q2

C11

C7

D1

SW

1

R1

3

TP2TP1

SW2

R1

4

C6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

RS

T/N

MI/S

BW

TD

IO1

TE

ST

/SB

WT

CK

2

P1.4

/UC

A0T

XD

/UC

A0S

IMO

/TA

1.2

/TC

K/A

43

P1.5

/UC

A0R

XD

/UC

A0S

OM

I/TA

1.1

/TM

S/A

54

P1.6

/UC

A0C

LK

/TA

1C

LK

/TD

I/TC

LK

/A6

5

P1.7

/UC

A0S

TE

/SM

CLK

/TD

O/A

76

P2.3

13

P3.1

/UC

A1S

TE

14

P2.4

/UC

A1C

LK

15

P2.5

/UC

A1R

XD

/UC

A1S

OM

I16

P2.6

/UC

A1T

XD

/UC

A1S

IMO

17

DV

SS

18

P1.0/UCB0STE/TA0CLK/A07

P1.1/UCB0CLK/TA0.1/A18

P1.2/UCB0SIMO/UCB0SDA/TA0.2/A29

P1.3/UCB0SOMI/UCB0SCL/MCLK/A310

P2.2/ACLK11

P3.012

P2.719

P3.220

P2.0/XOUT21

P2.1/XIN22

DVSS23

DVCC24

IC1

123456

J3

7

8

9

10

11

12

J4

13

14

15

16

17

18

J5

192021222324

J6

R5

12J

P2

D2

R6

12J

P10

D3

TP

3P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

P1.1

P1

.1 TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

P1.7

/TD

O

P1.7

/TD

O

P1.5

/TM

S

P1.5

/TM

S

P1.5

/TM

S

P1.4

/TC

K

P1.4

/TC

K

P1.4

/TC

K

P1.6

/TD

I

P1.6

/TD

I

P1.2

P1.2

P1

.2

XO

UT

XOUT

XIN

XIN

XTLGNDD

VC

C

DV

CC

DVCC

DVCC

DV

CC

DV

SS

DV

SS

DVSS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RX

D/S

IMO

RX

D/S

IMO

TX

D/S

OM

I/SD

A

TX

D/S

OM

I/SD

A

SP

ICLK

/SC

L

SP

ICLK

/SC

LS

PIC

LK

/SC

L1

SPICLK/SCL1

SP

ICLK

/SC

L1

TX

D/S

OM

I/SD

A1

1 2 3 4 5 6

1 2 3 4 5 6

Title

:

Da

te:

Pa

ge

1/1

MS

P-T

S4

30

RG

E2

4A

4/2

8/2

01

5 3

:52

:36

PM

A3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Re

v.:

Figure B-16. MSP-TS430RGE24A Target Socket Module, Schematic

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Connector JTAGFor JTAG tool

Connector BSLFor bootloader tool




Jumper J1 to “ext”


Figure B-17. MSP-TS430RGE24A Target Socket Module, PCB

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Table B-9. MSP-TS430RGE24A Bill of Materials (BOM)Position Ref Des No. per


1 PCB 1 90.0 x 92.5 mm "MSP-TS430RGE24A" Rev.1.0 2 layers, red solder mask

2JP1, JP9,

JP13, JP14,JP15


3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one pin only



6

JP3, JP4,JP5, JP6,JP7, JP8,

JP16

7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3


8 R2, R8, R9 3 0R, 0805 541-0.0ATR-ND DNP

9 R3, R13 2 0R, 0805 541-0.0ATR-ND

10 C5 1 1.1nF, CSMD0805 490-1623-2-ND

11 C7 1 1uF/10V, CSMD0805 490-1702-2-ND

12 R7, R15 1 10k, 0805 541-10KATR-ND

13 R4 1 47k, 0805 541-47KATR-ND

14 C6, C11 2 100nF, CSMD0805 490-1666-1-ND

15 R1 1 330R, 0805 541-330ATR-ND

16 R5, R6 2 330R, 0805 541-330ATR-ND DNP

17 R14 1 47k, 0805 541-47KATR-ND DNP

18 C8, C9 2 DNP, CSMD0805 DNP

19 SW2 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder.Lacon: 1251459

20 SW1 1 EVQ-11L05R P8079STB-ND DNP, Keep vias free of solder,Lacon: 1251459

21 J3, J4, J5, J6 4 6-pin header, TH SAM1029-06-ND DNP: headers enclosed in kit.Keep vias free of solder.

22 J3, J4, J5, J6 4 6-pin receptacle, TH SAM1213-06-NDDNP: receptacles enclosed inkit.Keep vias free of solder.

23 TP1, TP2,TP3 3 Test point DNP, keep pads free of solder



26 IC1 1 Socket:QFN-24B-0.5-0.1c Manuf. Enplas

27 IC1 1 MSP430FR2433IRGER DNP: Free samples can beordered in the TI Store

28 Q2 1 DNP: MS3V-TR1 (32,768kHz/20ppm/12,5pF) depends on application DNP: Micro Crystal, enclosed

in kit. Keep vias free of solder


30 D3 1 red (DNP), DIODE0805 DNP

31 D2 1 yellow (DNP), DIODE0805 DNP

32 Rubber standoff 4 Buerklin: 20H1724 Apply to corners at bottom

side

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B.9 MSP-TS430DW28

ML

14

LE

D3

12

pF

12

pF

GN

D

GND

10

0n

F

56

0R

ML

10

JP

1Q

JP

1Q

10

uF

/10

V

50

K1

0n

F

0R

0R

0R

-

-0R

-

U1

SO

CK

28

DW

F1

23

FE

14

HF

E1

4L

0R

GN

D

rem

ove

R8

an

d a

dd

R9

(0 O

hm

)

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

SM

D-F

oo

tprin

t

So

cke

t:Y

am

aic

hi

2.0

MS

P-T

S4

30

DW

28

Ta

rge

t So

cke

t DW

28

Typ

e: IC

18

9-0

28

2-0

42

If exte

rna

l su

pp

ly v

olta

ge

:

R1

, C1

, C2

no

t asse

mb

led

no

t asse

mb

led

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

D1

C2

C1

C5

R3

BO

OT

ST

12

34

56

78

91

0

1 2

J5

J4

12

C7

R5

C8

R6

R7

R8

R9

R1

0

R11

R1

12345678910

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

U2

15

16

17

18

19

20

21

22

23

24

25

26

27

28

J2

J1

12345678910

11

12

13

14

R2

123

J3

Q1

QUARZ3

P1

.0

P1

.0

P1

.3

P1

.3

P1

.2

P1

.2

P1

.1

P1

.1R

ST

/NM

I

RS

T/N

MI

RS

T/N

MIRS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

K

TM

S

TM

S

TM

S

TD

I

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

XO

UT

VC

C

GN

D

GN

D

GN

D

P2

.3

P2

.3

P2

.4

P2

.4

XIN

XIN

P2

.5

P2

.5

P2

.2

P2

.2P

2.1

P2

.1

P2

.0

P2

.0

TS

T/V

PP

TS

T/V

PP

TS

T/V

PP

P3

.0

P3

.0

P3

.1

P3

.1

P3

.2

P3

.2

P3

.3

P3

.3

P3

.7

P3

.7

P3

.6

P3

.6

P3

.5

P3

.5

P3

.4

P3

.4

VC

C4

30

Ext_

PW

R

Da

te:

11

/14

/20

06

1:2

6:0

4 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

DW

28

+

VC

C4

30

Figure B-18. MSP-TS430DW28 Target Socket Module, Schematic

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Orient Pin 1 ofMSP430 device



Remove R8 and jumper R9



Connector BOOTSTFor Bootloader Tool

Figure B-19. MSP-TS430DW28 Target Socket Module, PCB

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Table B-10. MSP-TS430DW28 Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2, Cover holes whilesoldering

2 C5 1 100nF, SMD0805

3 C7 1 10uF, 10V Tantal Elko B

4 C8 1 10nF SMD0805

5 D1 1 LED3 T1 3mm yellow RS: 228-4991

6 Q1 0 QUARZ, CrystalMicro Crystal MS1V-T1K32.768kHz, C(Load) =12.5pF

DNP: Cover holes while soldering

7 J1, J2 2 14-pin header, TH male

DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle

7.1 2 14-pin header, TH female

DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle

8 J3 1 3-Pin Connector, male

9 J4, J5 2 2-Pin Connector, male With jumper

10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering

11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121

12R1, R2, R6,R7, R8,R9,R10, R11

4 0R, SMD0805 DNP: R1, R2, R9, R10

13 R3 1 560R, SMD0805

14 R5 1 47K, SMD0805

15 U1 1 SOP28DW socket Yamaichi: IC189-0282-042

16 U2 0 TSSOP DNP

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B.10 MSP-TS430PW28

12pF

12pF

GN

D

GN

D

100nF

33

0R

10uF

/10V

-

0R

GN

D

GN

D

gre

en

2.2

nF

47

kG

ND

0R

0R

33

0R

MS

P430F

12xx

If exte

rnal s

upply

volta

ge:

rem

ove R

11 a

nd a

dd R

10 (0

Ohm

)

3.1

MS

P-T

S4

30

PW

28

:

OT

S-2

8-0

.65-0

1S

ocket: E

npla

s

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430

's in

PW

28 p

ackage

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

4 to

JP

9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 1

-2

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2C1

C4

R1

12

34

56

78

91

0

BO

OT

ST

C3

R2

R3

123

J5

JP

1

1 2 3

JP

2

1 212J

P3

D1

C5

R4

JP

4

1 2 3

JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

JP

9

1 2 3

R5

R6

21

Q1

R7

J1

12345678910

11

12

13

14

J2

1 2 3 4 5 6 7 8 91

011

12

13

14

U1 TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

GN

D

VC

C430

VC

C430

P2.0

P1.1

P1.1

P3.3

P3.2

P3.1

P3.0

P2.2

P2.2

XIN

/P2.6

XIN

/P2.6

XO

UT

/P2.7

XO

UT

/P2.7

P2.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

P3.4

P3.5

P3.6

P3.7

P2.3

P2.4

P1.2

P1.3

P1.4

/TC

K

P1.4

/TC

K

P1.5

/TM

S

P1.5

/TM

S

P1.6

/TD

I

P1.6

/TD

I

P1.7

/TD

O

P1.7

/TD

O

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

P2.5

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

XT

LG

ND

Ext_

PW

R

+


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Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode




Connector J5External power connectorJumper JP1 to “ext”


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Table B-11. MSP-TS430PW28 Bill of MaterialsPos.(1) Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2 , Cover holeswhile soldering

2 C3 1 10uF, 10V Tantal Elko B

3 C4 1 100nF, SMD0805

4 C5 0 2.2nF, SMD0805 DNP

5 D1 1 LED green SMD0603

6 Q1 0 QUARZ, Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF

DNP: Cover holes andneighboring holes whilesoldering

7 J1, J2 2 14-pin header, TH male

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.: Header: Receptacle

7.1 2 14-pin header, TH female

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.: Header: Receptacle

8 J5, IP1 1 3-Pin Connector , male

8aJP1, JP4,JP5, JP6,

JP7, JP8, JP97 3-Pin Connector , male Jumper on Pos 1-2

9 JP2, JP3 2 2-Pin Connector , male with Jumper

10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 DNP: Cover holes whilesoldering

11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121

12 R1, R7 2 330R, SMD0805

12 R2, R3, R5,R6 0 0R, SMD0805 DNP

14 R4 1 47K, SMD0805

15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01

(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces

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B.11 MSP-TS430PW28A

JTAG Mode selection:

4-wire JTAG: Set jumpers J4 to J9 to position 2-3

2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1

Figure B-22. MSP-TS430PW28A Target Socket Module, Schematic

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Figure B-23. MSP-TS430PW28A Target Socket Module, PCB (Red)

Note

For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be populated. Ifthe board is supplied internally, R3 (0 Ω) must be assembled. If the board is supplied externally, R2 (0Ω) must be assembled, and R3 must be removed.

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Table B-12. MSP-TS430PW28A Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C5 1 2.2nF, SMD0805

3 C3 1 10uF, 10V, SMD0805

4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND


6 J1, J2 0 14-pin header, THDNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:(Header and Receptacle)

7


8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9 Placeon 1-2 on JP1


9 9 Jumper 15-38-1024-ND see Pos 7 an 8


11 BOOTST 0 DNP Keep vias free of solder

12 Q1 0 CrystalMicro Crystal MS3V32.768kHz, C(Load) =12.5pF

DNP: keep vias free of solder

13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

14 R2, R3,R5,R6, 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas

17 PCB 1 63.5 x 64.8 mm 2 layers



19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI

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B.12 MSP-TS430RHB32A

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

GN

D

0R

330R

2.2

nF

PWR3

GN

D

GN

D

0R

47K

470nF

100nF

100nF

10uF

GN

D

GND

20k/0

.1%

10k

10k

10k

10k

GN

DAV

SS

AVSS

10k

10k

10k

10k

GN

D

SA

M1

02

9-0

8-N

D1

-8

SA

M1

02

9-0

8-N

D9

-16

MS

P4

30

I20

40

TR

HB

QF

N11

T0

32

-00

3

SA

M1

02

9-0

8-N

D1

7-2

41

7-2

4

SA

M1

02

9-0

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26

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17

18

19

20

21

22

23

24

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25

26

27

28

29

30

31

32

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S

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S

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I

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P1

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P2

.0P

2.1

P2

.2P

2.3

P2

.4P

2.5

P2

.6P

2.7

Figure B-24. MSP-TS430RHB32A Target Socket Module, Schematic

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https://www.ti.com





Connector J5External power connectorJumper JP3 to “ext”


Jumper JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode

Jumper JP31-2 (int): Power supply from JTAG interface2-3 (ext): External power supply


P1

.4

14

1

2

GN

D

GN

D

VC

C

12

3

123

15

8

916

17

24

20

25 3230

Vccext int

MS

P-T

S4

30

RH

B3

2A

Re

v.:1

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S

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1

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ea

s.

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R3

C8

J5

JP

1

JP

2

R4

JP

4

JP

9

JP

8

JP

7

JP

6

JP

5

R5

D1

C9

JP

3

C1

4

C13

C12

R2

R6

R8

R9

R10

R11

R12

R13

R14

J1

J2

U1

J3

J4

12

3

12

3

12

3

12

3

12

3

Figure B-25. MSP-TS430RHB32A Target Socket Module, PCB

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Table B-13. MSP-TS430RHB32A Bill of MaterialsPos. Ref Des No. per


1 PCB 1 76.9 x 67.6 mm MSP‐TS430RHB32A Rev. 1 2 layers, red solder mask

2 D1 1 green LED, DIODE0805 P516TR‐ND

3 JP1, JP2 2 2‐pin header, male, TH SAM1035‐02‐ND place jumper on header

4 JP3, JP4,JP5, JP6,JP7, JP8, JP9

7 3‐pin header, male, TH SAM1035‐03‐ND place jumpers on pins 1‐2(SBW)

5 R1, R4 2 0R, 0805 541‐0.0ATR‐ND

6 C8 1 2.2nF, CSMD0805 490‐1628‐2‐ND DNP

7 R6, R8, R9,R10, R11,R12, R13,R14

8 10k, 0805 311‐10KARTR‐ND DNP

8 C12 1 10uF, CSMD0805 445‐1371‐2‐ND

9 R2 1 20k/0.1%, 0805 P20KDACT‐ND

10 R5 1 47K, 0805 311‐47KARTR‐ND

11 C13, C14 2 100nF, CSMD0805 311‐1245‐2‐ND

12 R3 1 330R, 0805 541‐330ATR‐ND

13 C9 1 470nF, CSMD0805 445‐1357‐2‐ND

14 J1, J2, J3, J4 1 8‐pin header, TH SAM1029‐08‐ND DNP: headers andreceptacles, enclosed with kit.Keep vias free of solder.

15 J1, J2, J3, J4 1 8‐pin receptable, TH SAM1213‐08‐ND DNP: headers andreceptacles, enclosed with kit.Keep vias free of solder.

16 JTAG 1 14‐pin connector, male, TH HRP14H‐ND

17 U1 1 Socket QFN11T032‐003 Manuf.: Yamaichi

18 U1 1 MSP430i2041TRHB DNP: enclosed with kit.Is supplied by TI

19 J5 1 3‐pin header, male, TH SAM1035‐03‐ND

20 Rubber standoff

4 Buerklin: 20H1724 apply to corners at bottomside

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B.13 MSP-TS430DA38

12

pF

12

pF

GN

D

GN

D

10

0n

F

560R

10

uF

/10

V

47k

10nF

-

0R

GN

D

MS

P4

30

F2

27

4ID

A

GN

D330R

GN

D

ye

llow

If exte

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l su

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ly v

olta

ge

:re

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ve

R11

an

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dd

R1

0 (0

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82

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7

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cke

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ire J

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G:

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ire "S

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e s

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Se

t jum

pe

rs J

P4

to J

P9

to p

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n 2

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t jum

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P4

to J

P9

to p

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27

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CC

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4

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24

P3.7

28

AV

SS

15

AV

CC

16

P3.0

11

P3.1

12

P3.2

13

P3.3

14

P4.0

17

P4.1

18

P4.2

19

P3.4

25

P2.5

3

P2.4

30

P2.3

29

P2.2

10

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P2.6

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P4.6

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P4.5

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P4.4

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P4.3

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P1.2

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12

13

14

15

16

17

18

19

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21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

20

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P1

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P1

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P1

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P1

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P2

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P3

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8/2

008 1

1:0

4:5

6A

MS

heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

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43

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IDA

Figure B-26. MSP-TS430DA38 Target Socket Module, Schematic

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Orient pin 1 of MSP430 device



Jumper JP1 to "ext"








Figure B-27. MSP-TS430DA38 Target Socket Module, PCB

Hardware www.ti.com



https://www.ti.com


Table B-14. MSP-TS430DA38 Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP


3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 0 2.2nF, SMD0805 DNP

5 D1 1 green LED, SMD0603 475-1056-2-ND


DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.


7

"J3, JP1, JP4,JP5, JP6,JP7, JP8,

JP9"

8 3-pin header, male, TH SAM1035-03-NDPlace jumpers on headersJP1, JP4,JP5, JP6, JP7, JP8,JP9; Pos 1-2


9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1-2


11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder

12 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder

13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND

14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi


18 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons

Part No. SJ-5302Apply to corners at bottomside

19 MSP430 2 MSP430F2274IDA DNP: enclosed with kitsupplied by TI

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B.14 MSP-TS430QFN23x0

Figure B-28. MSP-TS430QFN23x0 Target Socket Module, Schematic

Hardware www.ti.com



https://www.ti.com











Figure B-29. MSP-TS430QFN23x0 Target Socket Module, PCB

Note


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https://www.ti.com


Table B-15. MSP-TS430QFN23x0 Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP


3 C4 1 100nF, SMD0805 478-3351-2-ND

4 C5 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 green LED, SMD0603 475-1056-2-ND

6 J1, J2, J3, J4 0 10-pin header, TH

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.


7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1;Pos 1-2.


9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3




13 R1 1 330 Ω, SMD0805 541-330ATR-ND

14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas




19 MSP430 2 MSP430F2370IRHA DNP: enclosed with kitsupplied by TI

Hardware www.ti.com



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B.15 MSP-TS430RSB40

Figure B-30. MSP-TS430RSB40 Target Socket Module, Schematic

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https://www.ti.com









Connector BOOTSTFor ToolBootloader



Figure B-31. MSP-TS430RSB40 Target Socket Module, PCB

Note


Hardware www.ti.com



https://www.ti.com


Table B-16. MSP-TS430RSB40 Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

2 C3, C7, C10,C12 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12

3 C4, C6, C8,C11 3 100nF, SMD0805 311-1245-2-ND DNP C11

4 C5 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805



DNP: headers and receptaclesenclosed with kit. Keep viasfree of solder.: Header: Receptacle

7.1 4 10-pin header, TH


8JP1, JP4,JP5,JP6, JP7, JP8,JP9, J5, JP10

9 3-pin header, male, TH SAM1035-03-ND Jumper: 1-2 on JP1, JP10; 2-3on JP4-JP9

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header


11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder

12 U1 1 QFN-40B-0.4_ENPLAS_SOCKET Enplas

13 Q1 0 Crystal Micro Crystal MS3V-T1R32.768kHz, C(Load) = 12.5pF

DNP: Q1. Keep vias free ofsolder

15 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8, JP9, JP10

16 R1,R7 2 330R SMD0805

17R2, R3, R5,R6, R8, R9,

R103 0R SMD0805 DNP R2, R3, R5, R6

18 R4 1 47k SMD0805

19 MSP430 2 MSP430F5132 DNP: enclosed with kit. Issupplied by TI

20 Rubber standoff 4 select appropriate; for example,

Buerklin: 20H1724 apply to corners at bottom side

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B.16 MSP-TS430RHA40A

Figure B-32. MSP-TS430RHA40A Target Socket Module, Schematic

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https://www.ti.com












Figure B-33. MSP-TS430RHA40A Target Socket Module, PCB

www.ti.com Hardware




https://www.ti.com


Table B-17. MSP-TS430RHA40A Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

2 C5 0 2.2nF, SMD0805 DNP C12

3 C3, C7 2 10uF, 10V, SMD0805 5 DNP C11

4 C4, C6 2 100nF, SMD0805 478-3351-2-ND

5 C9 1 470nF, SMD0805


7 J1, J2, J3,J4 4 10-pin header, TH

DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle


DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Header: Receptacle

8


8 3-pin header, male, TH SAM1035-03-ND Place jumper on 1-2 of JP4-JP9; Placeon 1-2 on JP1


10 9 Jumper 15-38-1024-ND see Pos 8 an 9


12 BOOTST 0 10-pin connector, male,TH DNP. Keep vias free of solder

13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas

14 Q1 0 CrystalMicro Crystal MS3V-T1R

32.768kHz, C(Load) =12.5pF

DNP: Q1. Keep vias free of solder

15 R1,R7 2 330R SMD0805 541-330ATR-ND

16 R2, R3, R5,R6, R8, R9, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6

17 R4 1 47k SMD0805


19 Rubberstand off 4

select appropriate;for example, Buerklin:

20H1724apply to corners at bottom side

20 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI

Hardware www.ti.com



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B.17 MSP-TS430DL48

ML

14

LE

D3 1

2p

F

12

pF

GN

D

GND

10

0n

F

560R

ML

10

JP

1Q

JP

1Q

10

uF

/10

V

47K

10nF

0R

0R

GN

D

0R

0R

10

uF

/10

V

GN

D

IC51-1

387.K

S-1

5186

100nF

1.3

MS

P-T

S430D

L48

Targ

et S

ocket D

L48

Q1

, C1

, C2

no

t asse

mb

led

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

D1

C2

C1

C5

R3

BO

OT

ST

12

34

56

78

910

1 2

J5

J4

12

C7

R5

C8

R6 R

7

123

J3

Q1

QUARZ3

J2

135

24679

810

11

13

15

12

14

16

17

19

18

20

21

23

22

24

135

24679

810

11

13

15

12

14

16

17

19

18

20

21

23

22

24

J1

R12

R4

JP

1

1 2 3

123

JP

2

C4

U1

TD

O/T

DI

1

TD

I/TC

LK

2

TM

S3

TC

K4

RS

T/N

MI

5

DV

CC

6

DV

SS

7

XIN

8

XO

UT

9

AV

SS

10

AV

CC

11

VR

EF

+12

P6.0

13

P6.1

14

P6.2

15

P6.3

16

P6.4

17

P6.5

18

P6.6

19

P6.7

20

P2.5

39

P2.4

40

P2.3

41

P2.2

42

P2.1

43

P2.0

44

CO

M0

45

P5.2

46

P5.3

47

P5.4

48

LC

DR

EF

29

LC

DC

AP

30

P5.1

31

P5.0

32

P5.5

33

P5.6

34

P5.7

35

S5

36

P2.7

37

P2.6

38

P1.7

21

P1.6

22

P1.5

23

P1.4

24

P1.0

28

P1.1

27

P1.2

26

P1.3

25

C3

P1

.0

P1

.0

RS

T/N

MI

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

K

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

XO

UT

XO

UT

GN

D

GN

DG

ND

XIN

XIN

BS

L_

TX

VC

C

BS

L_

RX

Ext_

PW

R

Date

:11/1

4/2

006 1

:24:4

4 P

MS

heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

S430D

L48

+

+

Vcc

ext

int

int

ext Vcc

Figure B-34. MSP-TS430DL48 Target Socket Module, Schematic

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Jumper JP2 to "ext"




Figure B-35. MSP-TS430DL48 Target Socket Module, PCB

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Table B-18. MSP-TS430DL48 Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND

3 C3, C5 2 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND


DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.


7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Place jumper on header JP1;Pos 1-2. DNP: JP2


9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5




13 R3 1 560 Ω, SMD0805 541-560ATR-ND

14 R4, R6, R7,R12 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: IC51-1387 KS-15186 Manuf.: Yamaichi




19 MSP430 2 MSP430F4270IDL DNP: Enclosed with kitsupplied by TI

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B.18 MSP-TS430PT48

Figure B-36. MSP-TS430PT48 Target Socket Module, Schematic

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Connector JTAGFor JTAG tool

Connector BSLFor bootloader tool


2-3 (External): External power supply






I2C pullup enable switchSwitch on to connectI2C pullup resistors


Jumpers JP11 and JP12Open to disconnect LEDs D1 and D2

D1, D2LEDs connected to P1.0, P1.1

Figure B-37. MSP-TS430PT48 Target Socket Module, PCB

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Table B-19. MSP-TS430PT48 Bill of MaterialsRef Des No. per

Board Value Description PackageReference Part Number Manufacturer

!PCB 1 Printed circuit board MCU061 Any

BSL 1 Header(Shrouded),2.54mm, 5x2, Gold, TH

Header, 2.54mm,5x2, TH AWHW-10G-0202-T Assman WSW

C5 1 1100pF CAP, CERM, 1100 pF, 50V, +/- 5%, C0G/NP0, 0805 0805 GRM2165C1H112JA01D MuRata

C6 1 0.1uF CAP, CERM, 0.1 µF, 50 V,+/- 10%, X7R, 0805 0805 GRM21BR71H104KA01L MuRata

C7 1 10uF CAP, CERM, 10 µF, 16 V,+/- 10%, X5R, 0805 0805 0805YD106KAT2A AVX

D1 1 Green LED, Green, SMD LED_0805 APT2012LZGCK Kingbright

D2 1 Blue LED, Blue, SMD LED_0805 150080BS75000 Wurth Elektronik

H5, H6, H7,H8 4 Bumpon, Cylindrical,

0.312 X 0.200, Black Black Bumpon SJ61A1 3M

IC1 1 Socket, QFP-48, 0.5 mmPitch

Socket, QFP-48,0.5 mm Pitch IC357-0484-142P-2 Yamaichi

Electronics

J1, J2, JP5,JP6, JP7,JP8, JP9,

JP10

8 Header, 100mil, 3x1, Gold,TH 3x1 Header TSW-103-07-G-S Samtec

J3, J4, J5,J6 4 Header, 100mil, 12x1,

Gold, TH 12x1 Header TSW-112-07-G-S Samtec

J3A, J4A,J5A, J6A 4 Receptacle, 2.54mm,

12x1, Gold, THReceptacle,2.54mm, 12x1, TH PPPC121LFBN-RC Sullins Connector

Solutions

JP1, JP11,JP12 3 Header, 100mil, 2x1, Gold,

TH 2x1 Header TSW-102-07-G-S Samtec

JTAG 1 Header (shrouded), 100mil, 7x2, Gold, TH

7x2 ShroudedHeader SBH11-PBPC-D07-ST-BK Sullins Connector

Solutions

R1 1 330 RES, 330, 5%, 0.125 W,0805 0805 CRCW0805330RJNEA Vishay-Dale

R2 1 200 RES, 200, 5%, 0.125 W,0805 0805 CRCW0805200RJNEA Vishay-Dale

R3, R10,R19, R20,

R215 0 RES, 0, 5%, 0.125 W,

0805 0805 CRCW08050000Z0EA Vishay-Dale

R7 1 47k RES, 47 k, 5%, 0.125 W,0805 0805 CRCW080547K0JNEA Vishay-Dale

R16, R17 2 4.7k RES, 4.7 k, 5%, 0.125 W,0805 0805 CRCW08054K70JNEA Vishay-Dale

SH-J1, SH-JP1, SH-JP5, SH-JP6, SH-JP7, SH-JP8, SH-JP9, SH-JP10, SH-JP11, SH-

JP12

10 1x2 Shunt, 100mil, Goldplated, Black Shunt

SNT-100-BK-GAlternate part number:969102-0000-DA

Samtec

SW1, SW2 2 Switch, SPST-NO, Off-Mom, 0.02 A, 15 VDC, TH 6x6mm EVQ-11A04M Panasonic

SW3, SW4,SW5 3 Switch, DPST, Slide, Off-

On, 1 Pos, 0.15A, 30V, TH 9.65x7.12mm 78F01T Grayhill

C8, C9 0 12pF CAP, CERM, 12 pF, 50 V,+/- 5%, C0G/NP0, 0805 0805 C0805C120J5GACTU Kemet

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Table B-19. MSP-TS430PT48 Bill of Materials (continued)Ref Des No. per

Board Value Description PackageReference Part Number Manufacturer

FID1, FID2,FID3 0 Fiducial mark. There is

nothing to buy or mount. N/A N/A N/A

Q1A 0 Crystal, 4MHz, 18 pF, TH 11.5x5mm 9B-4.000MAAJ-B TXC Corporation

Q1B 0 Crystal, 32.768 kHz,12.5pF, SMD

1.4x1.4x5.0mmSMD

MS3V-T1R 32.768KHZ+/-20PPM 12.5PF Micro Crystal AG

R4, R8, R9 0 0 RES, 0, 5%, 0.125 W,0805 0805 CRCW08050000Z0EA Vishay-Dale

R13 0 47k RES, 47 k, 5%, 0.125 W,0805 0805 CRCW080547K0JNEA Vishay-Dale

TP1, TP2,TP3, TP4 0 Black Test Point, Miniature,

Black, THBlack miniaturetestpoint 5001 Keystone

TP5, TP6 0 Test Point, Miniature,Black, TH

Black miniaturetestpoint 5001 Keystone

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B.19 MSP-TS430PT48A

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20

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23

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43

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22

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31

30

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C6

Figure B-38. MSP-TS430PT48A Target Socket Module, Schematic

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Connector JTAG

For JTAG ToolConnector BSL

For Bootloader Tool

Jumper J1

1-2 (Debugger): Power supply from JTAG Interface


Connector J2

External power connector



Jumper JP1

Open to measure current


I2C pullup enable switchSwitch On to connectI2C pullup resistors


Jumpers JP11 and JP12

Open to disconnect LEDs D1 and D2

D1, D2

LEDs connected to P1.0, P4.7

Figure B-39. MSP-TS430PT48A Target Socket Module, PCB

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Table B-20. MSP-TS430PT48A Bill of MaterialsRef Des Quantity Value Description Package

Reference Part Number Manufacturer

!PCB 1 Printed Circuit Board MCU046 Any


Header, 2.54mm,5x2, TH AWHW-10G-0202-T Assman WSW

C5 1 1100pF CAP, CERM, 1100 pF, 50V, +/- 5%, C0G/NP0, 0805 0805 GRM2165C1H112JA01D MuRata

C6 1 0.1uF CAP, CERM, 0.1 uF, 16 V,+/- 10%, X7R, 0603 0603 C0603X104K4RACTU Kemet

C7 1 10uF CAP, CERM, 10 uF, 16 V,+/- 10%, X5R, 0805 0805 0805YD106KAT2A AVX

CONN1,CONN2,CONN3,CONN4

4 Header, 100mil, 12x1,Gold, TH 12x1 Header TSW-112-07-G-S Samtec

CONN5,CONN6,CONN7,CONN8

4 Receptacle, 2.54mm,12x1, Gold, TH

Receptacle,2.54mm, 12x1, TH PPPC121LFBN-RC Sullins Connector

Solutions





IC1 1 Socket, QFP-48, 0.5 mmPitch, www.yamaichi.com

Socket, QFP-48,0.5 mm Pitch IC357-0484-142P-2 Yamaichi

Electronics


JP10

8 Header, 100mil, 3x1, Gold,TH 3x1 Header TSW-103-07-G-S Samtec

JP1, JP11,JP12 3 Header, 100mil, 2x1, Gold,

TH 2x1 Header TSW-102-07-G-S Samtec

JTAG 1 Header (shrouded), 100mil, 7x2, Gold, TH

7x2 ShroudedHeader SBH11-PBPC-D07-ST-BK Sullins Connector

Solutions

R1 1 330 RES, 330, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW0805330RJNEA Vishay-Dale

R2 1 200 RES, 200, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW0805200RJNEA Vishay-Dale

R3, R10,R19, R20,

R215 0 RES, 0, 5%, 0.333 W,

AEC-Q200 Grade 0, 0805 0805 CRCW08050000Z0EAHP Vishay-Dale

R7 1 47k RES, 47 k, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW080547K0JNEA Vishay-Dale

R16, R17 2 4.7k RES, 4.7 k, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW08054K70JNEA Vishay-Dale

SH-J1, SH-JP1, SH-JP5, SH-JP6, SH-JP7, SH-JP8, SH-JP9, SH-JP10, SH-JP11, SH-

JP12

10 1x2 Shunt, 100mil, Goldplated, Black Shunt

SNT-100-BK-GAlternate part number:969102-0000-DA

Samtec

SW1, SW2 2 Switch, SPST-NO, Off-Mom, 0.02 A, 15 VDC, TH 6x6mm EVQ-11A04M Panasonic

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Table B-20. MSP-TS430PT48A Bill of Materials (continued)Ref Des Quantity Value Description Package

Reference Part Number Manufacturer

SW3, SW4,SW5 3 Switch, DPST, Slide, Off-

On, 1 Pos, 0.15A, 30V, TH 9.65x7.12mm 78F01T Grayhill

X1 1 Crystal, 32.768 kHz,12.5pF, SMD

1.4x1.4x5.0mmSMD


C8, C9 0 12pF CAP, CERM, 12 pF, 50 V,+/- 5%, C0G/NP0, 0805 0805 C0805C120J5GACTU Kemet

C10 0 1uF CAP, CERM, 1 uF, 50 V,+/- 10%, X5R, 0603 0603 GRM188R61H105KAALD MuRata

FID1, FID2,FID3 0 Fiducial mark. There is

nothing to buy or mount. N/A N/A N/A

J3, J4, J5,J6 0 Header, 100mil, 12x1,

Gold, TH 12x1 Header TSW-112-07-G-S Samtec

Q1A 0 Crystal, 4 MHz, 18 pF, TH 11.5x5mm 9B-4.000MAAJ-B TXC Corporation

Q1B 0 Crystal, 32.768 kHz,12.5pF, SMD

1.4x1.4x5.0mmSMD


R4, R8, R9 0 0 RES, 0, 5%, 0.333 W,AEC-Q200 Grade 0, 0805 0805 CRCW08050000Z0EAHP Vishay-Dale

R13 0 47k RES, 47 k, 5%, 0.125 W,AEC-Q200 Grade 0, 0805 0805 CRCW080547K0JNEA Vishay-Dale

TP1, TP2,TP3, TP4,TP5, TP6

0 Test Point, Miniature,Black, TH

Black MiniatureTestpoint 5001 Keystone

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B.20 MSP-TS430RGZ48B

Figure B-40. MSP-TS430RGZ48B Target Socket Module, Schematic

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Figure B-41. MSP-TS430RGZ48B Target Socket Module, PCB

Note

For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be populated. Ifthe board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R10(0 Ω) must be assembled, and R11 must be removed.

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Table B-21. MSP-TS430RGZ48B Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

3 C6, C7, C12 3 10uF, 6.3V, SMD0805

4 C5, C11,C13, C14 4 100nF, SMD0805 311-1245-2-ND

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND



SAM1029-12-ND(Header) SAM1213-12-ND(Receptacle)

DNP: Headers and receptacles enclosedwith kit. Keep vias free of solder:

9 J5 1 3-pin header, male, TH

10


JP10

7 3-pin header, male, TH SAM1035-03-NDplace jumpers on pins 2-3 on JP5, JP6,JP7, JP8, JP9, JP10 place jumpers onpins 1-2 on JP3,


12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11


14 BOOTST 0 10-pin connector, male,TH "DNP Keep vias free of solder"

15 Q1 0 CrystalMicro Crystal MS3V-T1R32.768kHz, C(Load) =12.5pF

DNP: Q1 Keep vias free of solder

16 Q2 0 Crystal Q2: 4MHz Buerklin:78D134 DNP: Q2 Keep vias free of solder

17 Insulatingdisk to Q2 0 Insulating disk to Q2

http://www.ettinger.de/Art_Detail.cfm?ART_ARTNUM=70.08.121

18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

19

R1, R2, R4,R6, R8,R9,R10,R11, R12

3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

20 R5 1 47k Ω, SMD0805 541-47000ATR-ND

21 U1 1Socket:QFN11T048-008_A101121_RGZ48

Manuf.: Yamaichi




24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI

Hardware www.ti.com



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B.21 MSP-TS430RGZ48C

DN

P

DN

P

DN

P

GN

D

GN

D

100nF

330R

-0R

GN

D

GN

D

1.1

nF

47k

GN

D

0R 0R

0R

QU

AR

Z5

1uF

/10V

100nF

1uF

/10V

gre

en

DN

P

yello

w (D

NP

) DN

P

red (D

NP

)

0R

GN

D

DN

P

DN

P

0R0R

QUARZ5

EV

Q11

0R

DNP

DN

P

If exte

rnal s

upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

)

1.2

Ext_

PW

R

MS

P-T

S4

30

RG

Z4

8C

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430F

R58xx, F

R59xx IR

GZ

DN

PD

NP

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

4 to

JP

9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 1

-2

connectio

n b

y v

ia

DN

P

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2

C1

C4

R1

12

34

56

78

910

BO

OT

ST

R2R3

123

J2

J1

1 2 3

JP

1

1 2

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R5 R6

R7

Q1

C3

C6

C7

D1

R10

12J

P10

D2

R11

12J

P11

D3

R12

JP

2

1 2

C8

C9

R8R9

Q2

SV

4

12345678910

11

12

SV1

123456789

101112

SV

2

1 2 3 4 5 6 7 8 910

11

12

SV3

123456789101112

1_P

1.0

1

2_P

1.1

2

3_P

1.2

3

4_P

3.0

4

5_P

3.1

5

6_P

3.2

6

7_P

3.3

7

8_P

4.7

8

9_P

1.3

9

10_P

1.4

10

11_P

1.5

11

12_P

J.0

_T

DO

12

13_PJ.1_TDI13

14_PJ.2_TMS14

15_PJ.3/TCK15

16_P4.016

17_P4.117

18_P4.218

19_P4.319

20_P2.520

21_P2.621

22_TEST/SBWTCK22

23_RST/SBWTDIO23

24_P2.024

25_P

2.1

25

26_P

2.2

26

27_P

3.4

27

28_P

3.5

28

29_P

3.6

29

30_P

3.7

30

31_P

1.6

31

32_P

1.7

32

33_P

4.4

33

34_P

4.5

34

35_P

4.6

35

36_D

VS

S36

37_DVCC 3738_P2.7 3839_P2.3 3940_P2.4 40

41_AVSS 4142_HFXIN 42

43_HFXOUT 4344_AVSS 4445_LFXIN 45

46_LFXOUT 4647_AVSS 4748_AVCC 48

U1

SW

1

R13

TP2TP1

SW2

R14

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IORST/SBWTDIO

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0

/TD

O

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

P2.0

P2.0

P2.1

P2.1

P1.3

P1.3

P1.4

P1.5

AVCC

AV

CC

AVSS

AV

SS

AVSS

AVSS

LF

XO

UT

LF

XIN

LF

GN

DH

FG

ND

HF

XO

UT

HF

XIN

P2.4P2.3P2.7DVCC

DV

CC

DV

CC

DVCC

DV

SS

DV

SS

P4.6

P4.5

P4.4

P1.7

P1.6

P3.7

P3.6

P3.5

P3.4

P2.2

P2.6P2.5P4.3P4.2P4.1P4.0

P4.7

P3.3

P3.2

P3.1

P3.0

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

1

TEST/SBWTCK

TE

ST

/SB

WT

CK

Figure B-42. MSP-TS430RGZ48C Target Socket Module, Schematic

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Connector J2External power connectorJumper J1 to "ext"


Switch SW1Device reset

LEDs connected toP1.0, P1.1, P1.2 viaJP9, JP10, JP11(only D1 assembled)




Jumper J11-2 (int): Power supply from JTAG interface


Jumper JP2Analog/digital power

Switch SW2Connected to P1.3

HF ands LF oscillators with capacitorsand resistors to connect pinheads

1

Vccext

int

Vcc

GND

GND

JTAG

SBW

5

10

1520

25

30

35

40 45

RESET

Ext.Pwr.

PWR

DVCCAVCC

TCK TMS TDI TDO

RST/SBWTDIO TEST/SBWTCK

GND

GND

P1

.3

14

1

2

10

1

2

12

3

12

3

12

3

12

3

12

3

12

3

12

3

QFN11T048-008 A101121

Clamshell

MSP-TS430RGZ48CRev. 1.2 RoHS

Q2

Q1

P1

.0

P1

.1

P1

.2

JTA

G

C2

C1

C4

R1

BO

OT

ST

R2

R3

J2

J1

JP

1

JP

9

C5

R4

JP3JP4JP5JP6JP7JP8

R5

R6

R7

C3

C6

C7

D1

R1

0JP

10

D2

R11

JP

11

D3

R1

2

JP

2

C8

C9

R8

R9

U1

SW

1

R1

3

TP2

TP1

SW

2

R1

4

Figure B-43. MSP-TS430RGZ48C Target Socket Module, PCB

Note

LFOSC and HFOSC pins are swapped at SV1.42_HFXIN (pin 42) → SV1 (pin 7)43_HFXOUT (pin 43) → SV1 (pin 6)45_LFXIN (pin 45) → SV1 (pin 10)46_LFXOUT (pin 46) → SV1 (pin 9)

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Table B-22. MSP-TS430RGZ48C Bill of Materials

Pos Ref DesNumber

PerBoard

Description Digi-Key Part Number Comment

1 SV1, SV2, SV3,SV4

4 12-pin header, TH DNP: headers and receptacles enclosed with kit.Keep vias free of solder.

SAM1029-12-ND : Header

: Receptacle

1.1 SV1, SV2, SV3,SV4

4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.Keep vias free of solder.

: Header

SAM1213-12-ND : Receptacle

2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP

4 J1, JP3, JP4, JP5,JP6, JP7, JP8

7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3


6 JP1, JP2, JP9, J1,JP3, JP4, JP5, JP6,JP7, JP8

10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,JP7, JP8

7 R2, R3, R5, R6, R8,R9, R10, R11, R14

9 DNP, 0805 DNP

8 R12, R13, R7 3 0R, 0805 541-000ATR-ND

9 C5 1 1.1nF, CSMD0805 490-1623-2-ND

10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND

11 R4 1 47k, 0805 541-47000ATR-ND

12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND

13 R1 1 330R, 0805 541-330ATR-ND

14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP

15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP

16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder


18 Q1 1 DNP: MS3V-TR1 (32768kHz,20ppm, 12.5pF)

depends on application Micro Crystal, DNP, enclosed in kit, keep vias free ofsolder

19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder

20 U1 1 Socket: QFN11T048-008A101121-001

Manuf.: Yamaichi

20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.

21 D1 1 green LED, DIODE0805 P516TR-ND



24 TP1, TP2 2 Testpoint DNP, keep pads free of solder

25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side

26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48CRev. 1.2

2 layers, black solder mask

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B.22 MSP-TS430PM64

ML

14

LED3

0R

12pF

12pF

12pF

12pF

GN

D

GND

0R

100nF

560R

ML

10

JP1Q

JP

1Q

10uF/6,3V

10uF/10V

47K10nF

0R

0R

0R

-

-

0R

-

0R

0R

FE

16

-1-1

FE16-1-2

FE

16

-1-3

FE16-1-4

PWR3

GN

DG

ND

-

MS

P64P

M

not assembled

not a

ssem

ble

d

not a

ssem

ble

d

not a

ssem

ble

d

enhancement

reserved forfuture

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

D1

R2

C2

C1

C3

C4

R1

C5

R3

BO

OT

ST

12

34

56

78

910

J71 2

J6

12

C6

C7

R5C8

R6

R7

R8

R9

R10

R11

R12

R13

R14

12345678910

11

12

13

14

15

16

J1

J2

17181920212223242526272829303132

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

R4

Q1

LFXTCLK

XTCLK

U2

DV

CC

234567XIN

XO

UT

10

11

12

13

14

15

16

17181920212223242526272829303132

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

4950515253

TDOTDI

TMSTCKRST

596061

AVSSDVSSAVCC

RS

T/N

MI

TC

KT

MS

TD

IT

DO

VC

C

Date

:3/1

4/2

006 1

0:4

6:3

0A

MS

heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

S430P

M64

+

+

1

MS

P-T

S430P

M64

Targ

et S

ocket P

M64

Ya

ma

ich

iIC

51

-06

44

-80

7

So

cke

t:

1.2

for F

14x a

nd F

41x

Op

en

J6

if LC

D

is c

on

ne

cte

d

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R8

an

d a

dd

R9

(0 O

hm

)

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

Fo

r BS

Lu

sa

ge

ad

d:

R6

R7

R1

3 R

14

MS

P4

30

F1

4x : 0

0 o

pe

n o

pe

nM

SP

43

0F

41

x : o

pe

n o

pe

n 0

0

Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made.

Figure B-44. MSP-TS430PM64 Target Socket Module, Schematic

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Connector J5External power connectionRemove R8 and jumper R9

D1LED connected to pin 12






Figure B-45. MSP-TS430PM64 Target Socket Module, PCB

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Table B-23. MSP-TS430PM64 Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6

3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 C9 1 470nF, SMD0805 478-1403-2-ND



DNP: Headers and receptaclesenclosed with kit.Keep vias freeof solder.




11 2 Jumper 15-38-1024-ND Place on: J6, J7



14 Q1, Q2 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF DNP: Keep vias free of solder

15 R3 1 330 Ω, SMD0805 541-330ATR-ND

16

R1, R2, R4,R6, R7, R8,

R9, R10, R11,R12, R13, R14

3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R7, R9, R10, R11,R12, R13, R14

17 R5 1 47k Ω, SMD0805 541-47000ATR-ND

18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi


20 Rubberstandoff 4 select appropriate Apply to corners at bottom side

21 MSP430 22 MSP430F2619IPMMSP430F417IPM

DNP: Enclosed with kit suppliedby TI

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B.23 MSP-TS430PM64A

0R

12

pF

12

pF

GN

D

GN

D

0R

10

0n

F

33

0R

10

uF

/6.3

V

0R

0R

0R

0R

PWR3

GN

D

47

k

2.2

nF

33

0R

GN

D

GN

D

10

0n

F

GN

D

0R

0R

MS

P-T

S4

30

PM

64

ATa

rge

t So

cke

t

DN

P

Yam

aic

hi

IC51-0

644-8

07

Socket:

DN

P

1.1

for F

41

52

Open J

P1 if L

CD

is c

onnecte

d

JTA

G ->

SB

W ->

DN

P

DN

P

DN

P

DN

PD

NP

DN

PD

NP

Vccext

int

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IOP

7.0

/TD

OP

7.1

/TD

IP

7.2

/TM

SP

7.3

/TC

K

AD

D L

CD

-CA

P!

DN

PDN

P

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

R2

C2

C1 R

1

C5

R3

BO

OT

ST

12

34

56

78

91

0

C6

R1

0R

11

R1

3R

14

12345678910

11

12

13

14

15

16

J1

17181920212223242526272829303132

J2

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32313029282726252423222120191817

16 12345678911

12

13

14

15

10

64636261605958575655545352515049

21

Q1

R4

C3

1 2 3JP

4JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

R6

JP

9

1 2 3

12

JP

1

JP

2

1 2

JP

3

1 2 3

D1

C4R

5

R7

RS

T/N

MI

TM

ST

DI

VC

C

GN

D XT

LG

ND

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

VC

C43

0

VC

C430

VC

C430

P5.1

P5.1 A

VC

C

AV

CC

AV

SS

AV

SS

P1.0

P1.1

XIN

XO

UT

A

AA

B

BB

C

C

D

D

E

E

F

F

Da

te:

3/2

9/2

011

3:0

7:0

2 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PM

64

A

+

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IO

If supplie

d lo

cally

: popula

te R

10 (0

R), re

move R

11

If supplie

d b

y in

terfa

ce: p

opula

te R

11 (0

R), re

move R

10

Figure B-46. MSP-TS430PM64A Target Socket Module, Schematic

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Figure B-47. MSP-TS430PM64A Target Socket Module, PCB

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Table B-24. MSP-TS430PM64A Bill of MaterialsPos. Ref Des No. per Board Description Digi-Key Part No. Comment

1 C1, C2, 0 12pF, SMD0805 DNP

2 C3 0 2.2nF, SMD0805 DNP

3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND

4 C4, C5 2 100nF, SMD0805 478-3351-2-ND



DNP: Headers and receptaclesenclosed with kit. Keep viasfree of solder.


7J5, JP3, JP4,

JP5, JP6, JP7,JP8, JP9

8 3-pin header, male, TH SAM1035-03-ND






13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND

14R1, R2, R5,R7, R9, R10,

R11, R13, R142 0 Ω, SMD0805 541-000ATR-ND DNP: R5, R7, R9, R10, R11,

R13, R14

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND



18 Rubber standoff 4 select appropriate Apply to corners at bottom side

19 MSP430 2 MSP430F4152IPM DNP: Enclosed with kit suppliedby TI

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B.24 MSP-TS430PM64D

DN

P

DN

PD

NP

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

Socket:

Yam

aic

hi IC

51-0

644-8

07

12pF

12pF

100nF

33

0R

47

K

1.1nF

QUARZ5

10uF

/10V

0R

0R

LE

D_G

reen

33

0R

LE

D_G

reen

33

0R

LE

D_G

reen

EV

Q11

EV

Q11

MS

P430F

R413xIP

M / M

SP

430F

R203xIP

M

0R

0R

10

0n

F

10

0n

F

10

0n

F

10

0n

F

Ext_

PW

R

Vcc

ext

int

to m

easure

supply

curre

nt

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

J4 to

J9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 2

-1

DN

P

DN

P

BS

LT

XB

SLR

X

MS

P-T

S430P

M64D

Targ

et S

ocket B

oard

for M

SP

430F

R413xIP

M a

nd M

SP

430F

R203xIP

M

1.0

Disconnect JP3 andJP4 before BSL use.

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2

C1

C4

R1

R4

C5

123

J5

12J

P3

1 2

JP

2

JP

1

1 2 3

JP

10

1 2 3

JP

9

1 2 3

JP

8

1 2 3

JP

7

1 2 3

JP

6

1 2 3

JP

5

1 2 3

Q1

C3

12

34

56

78

91

0

BS

LR

10

R11

D1

R5

D2

R6

D3

SW

1

SW

2

P4

.7/R

13

1

P4

.6/R

23

2

P4

.5/R

33

3

P7.5/L5 59

DV

SS

8

DV

CC

9

TE

ST

/SB

WT

CK

111

RS

T/N

MI/S

BW

TD

IO1

0

P1.0/UCA0TXD/UCA0SIMO/A024P1.1/UCA0RXD/UCA0SOMI/A123P1.2/UCA0CLK/A222P1.3/UCA0STE/A321P1.4/MCLK/TCK/A420P1.5/TA0CLK/TMS/A519P1.6/TA0.2/TDI/TCLK/A618P1.7/TA0.1/TDO/A717

P7.1/L1 63

P7.2/L2 62

P7.3/L3 61

P7.4/L4 60

P7.0/L0 64

P4

.4/L

CD

C2

4

P4

.3/L

CD

C1

5

P4

.2/X

OU

T6

P4

.1/X

IN7

P4

.0/T

A1

.11

2

P8

.3/T

A1

.21

3

P8

.2/T

A1

CL

K1

4

P5.5/L3727

P5.4/L3628

P5.3/UCB0SOMI/UCB0SCL/L3529

P5.2/UCB0SIMO/UCB0SDA/L3430

P5.1/UCB0CLK/L3331

P5.0/UCB0STE/L3232

P3.0/L8 56

P3.1/L9 55

P3.2/L10 54

P3.3/L11 53

P3.4/L12 52

P3.5/L13 51

P3.6/L14 50

P3.7/L15 49

P6

.0/L

16

48

P6

.1/L

17

47

P6

.2/L

18

46

P6

.3/L

19

45

P6

.4/L

20

44

P6

.5/L

21

43

P2

.0/L

24

40

P2

.1/L

25

39

P2

.2/L

26

38

P2

.3/L

27

37

P2

.4/L

28

36

P2

.5/L

29

35

P2

.6/L

30

34

P2

.7/L

31

33

P8

.1/A

1C

LK

/A9

15

P8

.0/S

MC

LK

/A8

16

P5.6/L3826P5.7/L3925

P6

.6/L

22

42

P6

.7/L

23

41

P7.6/L6 58

P7.7/L7 57

U1

12345678910

11

12

13

14

15

16

J1

17181920212223242526272829303132

J2

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

J3

49505152535455565758596061626364

J4

R2

R3

C6

C7

C8

C9

TP2TP1

12J

P4

XO

UT

XO

UT

GND

GND

GN

D

XIN

XIN

VC

C

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

TC

K

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

VC

C430

VC

C430

P1.4

/TC

K

P1.4/TCK

P1.5

/TM

S

P1.5/TMS

P1.6

/TD

I

P1.6/TDI

P1.7

/TD

O

P1.7/TDO

TD

O/S

BW

TD

IO

RS

T/N

MI

TM

ST

DI

P1.0

P1.0

P1.0

P1.1

P1.1

P1.1

P1.2

P1.2

P1.3

P1.3

P4.7

P4.7

P4.6

P4.6

P4.5

P4.5

P4.4

P4.4

P4.3

P4.3

BS

LIn

terfa

ce

1 2 3 4 5 6

1 2 3 4 5 6

Tite

l:

Datu

m:

Seite

1/1

MS

P-T

S430P

M64D

9/3

/2014 3

:08:1

8 P

MA

3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Rev.:

Figure B-48. MSP-TS430PM64D Target Socket Module, Schematic

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P1.2

P1.1

P1.0

P1.3

RESET

VCCint

ext

JTAG->

SBW->

MS

P-T

S4

30

PM

64

DR

ev.

1.0

Ro

HS

Cu

rr.

Me

as. GND

GND

Disconnect JP3 andJP4 before BSL use!

14

1

2

GND

GND

VCC

12

3

12

3

12

3

12

3

12

3

12

3

12

3

10

1

2

IC51-0644-807

Clamshell

116

510

32 17202530

33

48

35

40

45

49 6455 60

JTA

GC2

C1

C4

R1

R4 C5

J5

JP3

JP

2JP

1

JP

10

JP

9

JP

8

JP

7

JP

6

JP

5

Q1

C3

BS

L

R1

0

R11

D1

R5 D2

R6 D3

SW

1S

W2U1

J1

J2

J3

J4

R2

R3

C6

C7

C8

C9

TP2

TP1

JP4


Jumper JP1 to "ext"










Figure B-49. MSP-TS430PM64D Target Socket Module, PCB

Note


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Table B-25. MSP-TS430PM64D Bill of MaterialsPos. Ref Des No. per


1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white soldermask

2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder

3 D1 1 Green LED, HSMG-C170,DIODE0805

516-1434-1-ND Avago, Farnell 5790852

4 D2, D3 2 LED, DIODE0805 DNP

5 JP2, JP3,JP4


6 JP1, JP5,JP6, JP7,JP8, JP9,JP10

7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG)

7 R1 1 330R, 0805 541-330ATR-ND

8 R5, R6 2 330R, 0805 541-330ATR-ND DNP

9 R2, R3,R10, R11

4 0R, 0805 541-0.0ATR-ND DNP

10 R4 1 47K, 0805 311-47KARTR-ND

11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND

12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND

13 C4 1 100nF, CSMD0805 311-1245-2-ND

14 C6, C7, C8,C9

4 100nF, CSMD0805 311-1245-2-ND DNP

15 C5 1 1.1nF, CSMD0805 490-1623-2-ND

16 J1, J2, J3,J4

1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles,enclosed with kit. Keep vias freeof solder.

17 J1, J2, J3,J4

1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles,enclosed with kit. Keep vias freeof solder.


19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi

20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Issupplied by TI.


22 Q1 1 Microcrystal 32768Hz, MS3V-T1R (32.768kHz, 20ppm, 12.5pF)

23 SW1, SW2 2 Panasonic EVQ11 P8079STB-ND DNP, Lacon: 1251459

24 Rubberstand off

4 Buerklin: 20H1724 apply to corners at bottom side

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B.25 MSP-TS430PM64F

DN

P

Socket:

Yam

aic

hi C

51-0

644-8

07

I2C

UA

RT

P1.7

P2.1

Jum

pers

JP

3 to

JP

8C

lose 1

-2 to

debug in

Spy-B

i-Wire

mode.

Clo

se 2

-3 to

debug in

4-w

ire J

TA

G m

ode.

BS

LTool S

ele

ct:

Open =

BS

LC

onnecto

rC

losed =

JTA

G C

onnecto

r

DN

P

DN

P

GN

D

GN

D

100nF

33

0R

0R0R

GN

D

GN

D

1.1

nF

47

kG

ND

0R 0R

QU

AR

Z5

1uF

/10V

100nF

1uF/10V

gre

en

DN

P

yello

w (D

NP

) DN

P

red (D

NP

)

0R

GN

DD

NP

DN

P

0R0R

QUARZ5

EV

Q11

0R

DNP

DN

P

100nF

GN

D

10

0nF

GN

D

4u

7

GN

D

MS

P4

30

FR

69

7X

PM

/RG

C

SAM1129-16-ND

SA

M1129-1

6-N

D

SAM1129-16-ND

SA

M1129-1

6-N

D

10

k1

0k

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R3

an

d a

dd

R2

(0 O

hm

)

Ext_

PW

R

MS

P-T

S4

30

PM

64

F

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

DN

P

DN

P

1.0

DN

P

DN

PD

NP

connectio

n b

y v

ia

Ta

rge

t So

cke

t Bo

ard

for M

SP

43

0F

R6

97

x/6

87

x d

evic

es

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C9

C8

C4

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9 R8

Q2

C3

C11

C7

D1

R1

0

12J

P10

D2

R11

12J

P11

D3

R1

2

1 2

JP

2

C1

C2

R6R5

Q1

SW

1

R1

3

TP2TP1

SW2

R1

4

C10

C6

C15

P4

.3/U

CA

0S

OM

I/UC

A0

RX

D/U

CB

1S

TE

/S4

1

P1

.4/U

CB

0C

LK

/UC

A0

ST

E/T

A1

.0/S

32

P1

.5/U

CB

0S

TE

/UC

A0

CL

K/T

A0

.0/S

23

P1

.6/U

CB

0S

IMO

/UC

B0

SD

A/T

A0

.1/S

14

P1

.7/U

CB

0S

OM

I/UC

B0

SC

L/T

A0

.2/S

05

R3

3/L

CD

CA

P6

P6

.0/R

23

7

P6

.1/R

13

/LC

DR

EF

8

P6

.2/C

OU

T/R

03

9

P6

.3/C

OM

01

0

P6

.4/T

B0

.0/C

OM

1/S

30

11

P6

.5/T

B0

.1/C

OM

2/S

29

12

P6

.6/T

B0

.2/C

OM

3/S

28

13

P3

.0/U

CB

1C

LK

/TA

3.2

/S2

71

4

P3

.1/U

CB

1S

IMO

/UC

B1

SD

A/T

A3

.3/S

26

15

P3

.2/U

CB

1S

OM

I/UC

B1

SC

L/T

A3

.4/S

25

16

DVSS117

DVCC118

TEST/SBWTCK19

RST/NMI/SBWTDIO20

PJ.0/TDO/TB0OUTH/SMCLK/SRSCG121

PJ.1/TDI/TCLK/MCLK/SRSCG022

PJ.2/TMS/ACLK/SROSCOFF23

PJ.3/TCK/COUT/SRCPUOFF24

P3.3/TA1.1/TB0CLK/S2425

P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2326

P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2227

P3.6/UCA1CLK/TB0.2/S2128

P3.7/UCA1STE/TB0.3/S2029

P2.3/UCA0STE/TB0OUTH/S1930

P2.2/UCA0CLK/TB0.4/RTCCLK/S1831

P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S1732

P2

.0/U

CA

0S

IMO

/UC

A0

TX

D/T

B0

.6/T

B0

CL

K/S

16

33

P7

.0/T

A0

CL

K/S

15

34

P7

.1/T

A0

.0/S

14

35

P7

.2/T

A0

.1/S

13

36

P7

.3/T

A0

.2/S

12

37

P7

.4/S

MC

LK

/S11

38

DV

SS

239

DV

CC

240

P1

.3/T

A1

.2/A

3/C

341

P1

.2/T

A1

.1/T

A0

CL

K/C

OU

T/A

2/C

242

P1

.1/T

A0

.2/T

A1

CL

K/C

OU

T/A

1/C

1/V

RE

F+

/VE

RE

F+

43

P1

.0/T

A0

.1/D

MA

E0

/RT

CC

LK

/A0

/C0

/VR

EF

-/VE

RE

F-

44

P9

.4/A

12

/C1

245

P9

.5/A

13

/C1

346

P9

.6/A

14

/C1

447

P9

.7/A

15

/C1

548

AVCC149

AVSS150

PJ.4/LFXIN51

PJ.5/LFXOUT52

AVSS253

PJ.7/HFXOUT54

PJ.6/HFXIN55

AVSS356

P5.7/UCA1STE/TB0CLK/S1057

P4.4/UCB1STE/TA1CLK/S958

P4.5/UCB1CLK/TA1.0/S859

P4.6/UCB1SIMO/UCB1SDA/TA1.1/S760

P4.7/UCB1SOMI/UCB1SCL/TA1.2/S661

DVSS362

DVCC363

P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S564

U1

12345678910

11

12

13

14

15

16

J3

17181920212223242526272829303132

J433

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

J5

49505152535455565758596061626364

J6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0/TDO

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

P1.3

P1.3

AV

CC

AVCC

AV

SS

AVSS

AVSS

AVSS

HF

XO

UT

HF

XIN

HF

GN

D

LF

XIN

LF

XO

UT

DV

CC

DV

CC

DVCC

DVCC

DV

CC

DVCC

DV

CC

DV

CC

DV

SS

DVSS

DV

SS

DVSS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TEST/SBWTCK

TE

ST

/SB

WT

CK

LC

DC

AP

LC

DC

AP

RST/SBWTDIO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

ST

E

ST

E

RX

D/S

IMO

RX

D/S

IMO

TX

D/S

OM

I/SD

A

TX

D/S

OM

I/SD

A

SP

ICLK

/SC

L

SP

ICLK

/SC

LS

PIC

LK

/SC

L1

SP

ICLK

/SC

L1

RX

D/S

IMO

1

RXD/SIMO1

TX

D/S

OM

I/SD

A1

P1.6

P1.6

P2.0

P2.0

LF

GN

D

1 2 3 4 5 6

1 2 3 4 5 6

Title

:

Da

te:

Pa

ge

1/1

MS

P-T

S4

30

PM

64

F

10

/20

/20

14

4:3

8:5

3 P

MA

3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Re

v.:

Figure B-50. MSP-TS430PM64F Target Socket Module, Schematic

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1412

1012

IC51-0644-807

Clamshell

15

10

15

2025303

54

04

5

50 55 60

R1

C11

D1

R1

0D

2

R11

D3

U1

J3

J4J5

J6

R7

R15



LEDs connected toP1.0, P1.1, P1.2 from

JP9, JP10, JP11(only D1 assembled)





HF and LF oscillators with capacitorsand resistors to connect pinheads


Connector BSLFor Bootloader

Jumper JP1, JP2Open to measure

digital or analog current


BSL Tool SelectJumper JP13 to JP15Open = BSL ConnectorClose = JTAG Connector

Close JP17 and JP18to enable BSL pullups

BSL Interface SelectJumper J16

Close 1-2 for I CClose 2-3 for UART

2

Jumper Configuration UART BSL Configuration I C BSL Configuration2

JP17 and JP18 Open Close

JP16 Close 2-3 (UART) Close 1-2 (I2C)

This target board supports UART or I C BSL configuration. To select the configuration to use, set thejumpers as shown in the following table.

2

Figure B-51. MSP-TS430PM64F Target Socket Module, PCB

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Table B-26. MSP-TS430PM64F Bill of Materials (BOM)

Pos. Ref DesNumber

perBoard

Description DigiKey Part Number Comment

1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask

2 JP1, JP2, JP9, JP13,JP14, JP15, 6 2-pin header, male, TH SAM1035-02-ND place jumper on header

3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only



6 JP3, JP4, JP5, JP6,JP7, JP8, JP16 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3


8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP

9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND

10 C5 1 1.1nF, CSMD0805 490-1623-2-ND

11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND

12 C15 1 4u7, CSMD0805 445-1370-1-ND DNP

13 R7, R15 1 10k, 0805 541-10KATR-ND

14 R4 1 47k, 0805 541-47KATR-ND

15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND

16 R1 1 330R, 0805 541-330ATR-ND

17 R10, R11 2 330R, 0805 541-330ATR-ND DNP

18 R14 1 47k, 0805 541-47KATR-ND DNP

19 C1, C2, C8, C9 4 DNP, CSMD0805 DNP

20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459

21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459

22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND DNP: headers enclosed with kit.Keep vias free of solder.

23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND DNP: receptacles enclosed with kit.Keep vias free of solder.




27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi

28 U1 2 MSP430FR6972IPMR DNP: enclosed with kit.Is supplied by TI.

29 Q1 1 DNP: MS3V-TR1(32,768kHz/ 20ppm/12,5pF) depends on application Micro Crystal, DNP, enclosed in kit,

keep vias free of solder

30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder




34 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side

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B.26 MSP-TS430RGC64B

Figure B-52. MSP-TS430RGC64B Target Socket Module, Schematic

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Connector J5External power connectorJumper JP3 to "ext"Jumpers JP5 to JP10

Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode


If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to "ext"







Figure B-53. MSP-TS430RGC64B Target Socket Module, PCB

Note


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Table B-27. MSP-TS430RGC64B Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

3 C6, C7, C10 3 10uF, 6.3V, SMD0805

4C5, C11,

C13, C14,C15

5 100nF, SMD0805 311-1245-2-ND

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND

7 C16 1 4.7uF, SMD0805

8 C17 1 220nF, SMD0805


10 J1, J2, J3, J4 0 16-pin header, THSAM1029-16-ND(Header) SAM1213-16-ND(Receptacle)


11 J5 , J6 2 3-pin header, male, TH

12


JP10

7 3-pin header, male, TH SAM1035-03-NDplace jumpers on pins 2-3 on JP5, JP6,JP7, JP8, JP9, JP10 place jumpers on pins1-2 on JP3,

13 JP1, JP2,JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13


16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"



18 Q2 0 Crystal Q2: 4MHz Buerklin: 78D134 DNP: Q2 Keep vias free of solder



20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

21

R1, R2, R4,R6, R8,

R9,R10, R11,R12


22 R5 1 47k Ω, SMD0805 541-47000ATR-ND

23 U1 1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi




26 D3,D4

27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI

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B.27 MSP-TS430RGC64CThe MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIOinput voltage supplied via header J6 (see Figure B-54). This development platform does not supply the 1.8-VDVIO rail on board and it MUST be provided by external power supply for proper device operation. For correctJTAG connection, programming, and debug operation, it is important to follow this procedure:

1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to0 V.

2. Enable the 1.8-V external DVIO power supply.3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-

FET430UIF JTAG debugger interface).4. Connect the MSP-FET430UIF JTAG connector to the target board.5. Start the debug session using IAR or CCS IDE.

For more information on debugging the MSP430F522x and MSP430F525x, see the device-specific data sheets(MSP430F522x and MSP430F525x) and Designing with MSP430F522x and MSP430F521x Devices.

For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain, short JP4with the jumper.

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https://www.ti.com/lit/pdf/SLAS903

https://www.ti.com/lit/pdf/SLAA558

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18 P1.0/TA0CLK/ACLK

19 P1.1/TA0.0

20 P1.2/TA0.1

21 P1.3/TA0.2

22 P1.4/TA0.3

23 P1.5/TA0.4

24 P1.6/TA1CLK/CBOUT

25 P1.7/TA1.0

26 P2.0/TA1.1

27 P2.1/TA1.2

28 P2.2/TA2CLK/SMCLK

29 P2.3/TA2.0

30 P2.4/TA2.1

31 P2.5/TA2.2

32 P2.6/RTCCLK/DMAE0

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51P7.2/TB0.2

52P7.3/TB0.3

53P7.4/TB0.4

54P7.5/TB0.5

55BSLEN

56RST/NMI

57P5.2/XT2IN

58P5.3/XT2OUT

59TEST/SBWTCK

60PJ.0/TDO

61PJ.1/TDI/TCLK

62PJ.2/TMS

63PJ.3/TCK

64RSTDVCC/SBWTDIO

65 THERMAL_1

66 THERMAL_2

67 THERMAL_3

68 THERMAL_4

69 THERMAL_5

70 THERMAL_6

71 THERMAL_7

72 THERMAL_8

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0

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C5

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R80R

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SH

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TC

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ST

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AV

SS

Figure B-54. MSP-TS430RGC64C Target Socket Module, Schematic

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Connector J5External power connector for DVCCSet jumper JP3 to "ext"

IMPORTANT NOTE:Rev1.0 of the board does not haveconnection from pin 4 of BOOTST topin 64 of MCU. To use BSL, these pinsshould be connected by a wire.




Jumper JP4For F524x devices, close.For F522x, F523x, and F525x devices,close only if one power supply is usedfor VCC and DVIO, and if VCC is nothigher then 1.98 V. Otherwise, supplyDVIO over J6.Do not close if VCC > 1.98 V, as it maydamage the chip.

Connector J6External power connectorto supply DVIO





2-3 (ext): External power supplyJumper JP1Open to measure current

Figure B-55. MSP-TS430RGC64C Target Socket Module, PCB

Note


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Table B-28. MSP-TS430RGC64C Bill of MaterialsItem Qty Reference Value Description Comment Supplier No.

1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2

2 0 C3, C4 CAP, SMD, Ceramic, 0805 DNP C3 C4

4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805

5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 Digi-Key: 311-1245-2-ND

5 5 C8 2.2nF CAP, SMD, Ceramic, 0805

6 1 C9 470nF CAP, SMD, Ceramic, 0805 Digi-Key: 478-1403-2-ND

7 1 C16 4.7uF CAP, SMD, Ceramic, 0805

8 1 D1 Green LED LED, SMD, 0805

9 4 J1-J4 16-pin header Pin header 1x16: Grid: 100mil(2.54 mm)

DNP: headers andreceptacles enclosed withkit. Keep vias free of solder.: Header: Receptacle

SAM1029-16-NDSAM1213-16-ND

10 2 J5, J6 3-pin header, male, TH Pin header 1x3: Grid: 100mil(2.54 mm) SAM1035-03-ND

11 JP5, JP6, JP7,JP8, JP9, JP10 3-pin header, male, TH Pinheader 1x3: Grid: 100mil

(2.54 mm) place jumpers on pins 2-3 SAM1035-03-ND

12 JP3 3-pin header, male, TH Pin header 1x3: Grid: 100mil(2.54 mm) place jumper on pins 1-2 SAM1035-03-ND

13 JP1, JP2, JP4 2-pin header, male, TH Pin header 1x2; Grid: 100mil(2.54 mm) place jumper on header SAM1035-02-ND

14 10 JumperPlace on: JP1, JP2, JP3,JP4, JP5, JP6, JP7, JP8,JP9, JP10

15-38-1024-ND

15 1 JTAG 2x7Pin,Wanne Header, THD, Male 2x7 Pin,Wanne, 100mil spacing HRP14H-ND

16 0 BOOTST 2x5Pin,Wanne Header, THD, Male 2x5 Pin,Wanne, 100mil spacing DNP

17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit.

18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND

19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406

20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND

21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND

22R1, R2, R4, R6,

R8, R9, R10,R11, R12

0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% DNP: R6, R8, R9, R10,R11,R12 541-000ATR-ND

23 1 U1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi

24 2 MSP430 MSP430F5229IRGCR IC, MCU, SMD, 9.15x9.15mmThermal Pad with Socket

25 4 Rubber stand off Rubber stand off apply to corners at bottomside Buerklin: 20H1724

26 1 PCB 84 x 76 mm 84 x 76 mm

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B.28 MSP-TS430RGC64USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 Vlower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, torun the MCU at 3.0 V, set it to 3.3 V.

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Figure B-56. MSP-TS430RGC64USB Target Socket Module, Schematic

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141

2

GN

D

GN

D

VC

C

12

3

12

3

12

3

12

3

12

3

12

3

123

123

4964

116

3217

33

48

QFN11T064-006

Clamshell

Vccext int

MSP-TS430RGC64USBRev.: 1.4 RoHS

SBW ->

JTAG ->

1

JTA

G

R2

C2C1

C3

C4

R1

C5

R3

+

C6

+C

7

C8

J5

JP

1

JP

2

R4

JP

5

JP

6

JP

7

JP

8

JP

9

JP

10

R7R

5

C11C12

D1

C9

C13

C10

R6

R8R

9

R12

JP3

US

B1

R33

C35

C36

R34

R35

R36

C39

D2

IC7

C40

C33

C38

JP4

LE

D3

S1

S2

R13 LE

D1

R15

LE

D2

R16

LED

S3

R10

C14

R11

D3

D4

J4

J1

J2

J3

U1

Q1

Q2






USB1USB connector





Figure B-57. MSP-TS430RGC64USB Target Socket Module, PCB

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Table B-29. MSP-TS430RGC64USB Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805

2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND

3 C5, C11, C13,C14 4 100nF, SMD0805 311-1245-2-ND

3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12

4 C8 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 478-1403-2-ND




SAM1029-16-ND : Header

SAM1213-16-ND : Receptacle


9JP5, JP6, JP7,

JP8, JP9,JP10


10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header

11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2



14 Q1 0 Crystal Q1: Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF

DNP: Q1Keep vias free of solder

15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

17R1, R2, R4,R6, R8, R9,

R122 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500

18 R11 1 1M Ω, SMD0805

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND

19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi


21 Rubber standoff 4 Buerklin: 20H1724 Apply to corners at bottom side

22 MSP430 2 MSP430F5509 RGC DNP: enclosed with kit. Issupplied by TI

23 Insulating diskto Q2 1 Insulating disk to Q2


27 C33 1 220n SMD0603 Buerklin: 53D2074

28 C35 1 10p SMD0603 Buerklin: 56D102

29 C36 1 10p SMD0603 Buerklin: 56D102

30 C38 1 220n SMD0603 Buerklin: 53D2074

31 C39 1 4u7 SMD0603 Buerklin: 53D2086

32 C40 1 0.1u SMD0603 Buerklin: 53D2068

33 D2, D3, D4 3 LL103A Buerklin: 24S3406

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Table B-29. MSP-TS430RGC64USB Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment34 IC7 1 TPD4E004 Manu: TI

36 LED 0 JP3QE SAM1032-03-ND DNP

37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP



40 R13, R15, R16 0 470R Buerklin: 07E564 DNP

41 R33 1 1k4 / 1k5 Buerklin: 07E612

42 R34 1 27R Buerklin: 07E444

43 R35 1 27R Buerklin: 07E444

44 R36 1 33k Buerklin: 07E740

45 S1 0 PB P12225STB-ND DNP


46 S3 1 PB P12225STB-ND

47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885

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B.29 MSP-TS430PN80

A. For MSP430F47x and MSP430FG47x devices:Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).

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Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.

Figure B-58. MSP-TS430PN80 Target Socket Module, Schematic









Figure B-59. MSP-TS430PN80 Target Socket Module, PCB

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Table B-30. MSP-TS430PN80 Bill of MaterialsPos. Ref Des No. per Board Description Digi-Key Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.


3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 green LED, SMD0603 475-1056-2-ND


DNP: Headers and receptaclesenclosed with kit.Keep vias freeof solder.


7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND

8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-2




13 R3 1 560 Ω, SMD0805 541-560ATR-ND

14R1, R2, R4,R6, R7, R10,

R11, R122 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R7, R10, R11,

R12

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND



18 AdhesivePlastic feet 4 ~6mm width, 2mm height for example, 3M Bumpons Part

No. SJ-5302 Apply to corners at bottom side

19 MSP430 2 MSP430FG439IPN DNP: Enclosed with kit suppliedby TI

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B.30 MSP-TS430PN80A

Figure B-60. MSP-TS430PN80A Target Socket Module, Schematic

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Connector J6If the system is supplied from LDOI,close JP4 and set JP3 to external




2-3 (ext): External power supplyJumper JP1Open to measure current

Figure B-61. MSP-TS430PN80A Target Socket Module, PCB

Note


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Table B-31. MSP-TS430PN80A Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

3 C6, C7,C10, C12 3 10uF, 6.3V, SMD0805 DNP C10

4C5, C11,

C13, C14,C15

5 100nF, SMD0805 311-1245-2-ND

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND

7 C16 1 4.7uF, SMD0805

8 C17 1 220nF, SMD0805





11 J5 , J6 2 3-pin header, male, TH

12


JP10



14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13





18 Q2 0 Crystal Q2: 4MHz Buerklin:78D134 DNP: Q2 Keep vias free of solder



20 D3,D4 2 LL103A Buerklin: 24S3406

21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

22

R1, R2, R4,R6, R8,R9,R10,R11, R12


23 R5 1 47k Ω, SMD0805 541-47000ATR-ND

24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi




27 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI

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B.31 MSP-TS430PN80B

DN

P

So

cke

t:Y

am

aic

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20

1-0

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P

DN

P

DN

P

DN

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GN

D

GN

D

100nF

33

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D

GN

D

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47

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SA

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0-N

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02

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D

1uF/10V

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R3

an

d a

dd

R2

(0 O

hm

)

Ext_

PW

R

MS

P-T

S4

30

PN

80

B

Vcc

int

ext

DN

PD

NP

DN

P

JTA

G ->

SB

W ->

DN

PD

NP

1.0

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PD

NP

co

nn

ectio

n b

y v

ia

Ta

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cke

t bo

ard

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SP

43

0F

R5

99

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evic

e

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C9

C8

C4

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

112J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R9 R8

Q2

C11

C7

D1

R1

0

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0

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P11

D3

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2

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2

C1 C2

R6R5

Q1

SW

1

R1

3

TP2TP1

SW2

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4

C10

C6

12

JP

13

12

JP

14

12

JP

15

123

JP

16

1 2

JP17

1 2

JP18

R7

R1

5

P1

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CC

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EF

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F-

1

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CL

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T/A

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RE

F+

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RE

F+

2

P1

.2/T

A1

.1/T

A0

CL

K/C

OU

T/A

2/C

23

P3

.0/A

12

/C1

24

P3

.1/A

13

/C1

35

P3

.2/A

14

/C1

46

P3

.3/A

15

/C1

57

P6

.0/U

CA

3T

XD

/UC

A3

SIM

O8

P6

.1/U

CA

3R

XD

/UC

A3

SO

MI

9

P6

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CA

3C

LK

10

P6

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CA

3S

TE

11

P7

.0/U

CB

2S

IMO

/UC

B2

SD

A1

3

P7

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CB

2S

OM

I/UC

B2

SC

L1

4

P8

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5

P1

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A1

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CB

0S

TE

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/C3

16

P1

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B0

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CA

0S

TE

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17

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18

DV

SS

19

DV

CC

20

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2

PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C621

PJ.1/TDI/TCLK/MCLK/SRSCG0/C722

PJ.2/TMS/ACLK/SROSCOFF/C823

PJ.3/TCK/SRCPUOFF/C924

P7.2/UCB2CLK25

P7.3/UCB2STE/TA4.126

P7.4/TA4.0/A1627

P7.5/A1728

P7.6/A1829

P7.7/A1930

P4.0/A831

P4.1/A932

P4.2/A1033

P4.3/A1134

P2.5/TB0.0/UCA1TXD/UCA1SIMO35

P2.6/TB0.1/UCA1RXD/UCA1SOMI36

TEST/SBWTCK37

RST/NMI/SBWTDIO38

DVSS39

DVCC40P

2.0

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0.6

/UC

A0

TX

D/U

CA

0S

IMO

/TB

0C

LK

/AC

LK 41

P2

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B0

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CA

0R

XD

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A0

SO

MI 4

2P

2.2

/TB

0.2

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B0

CL

K4

3P

8.1

44

P8

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5P

8.3

46

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OU

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0.5

49

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1.6

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0.3

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B0

SIM

O/U

CB

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DA

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0.0 5

1P

1.7

/TB

0.4

/UC

B0

SO

MI/U

CB

0S

CL

/TA

1.0 5

2P

5.0

/UC

B1

SIM

O/U

CB

1S

DA

53

P5

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CB

1S

OM

I/UC

B1

SC

L5

4P

5.2

/UC

B1

CL

K/T

A4

CL

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5P

5.3

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B1

ST

E5

6P

4.4

/TB

0.5

57

P4

.55

8P

4.6

59

DV

SS

60

AVCC 80

AVSS 79

PJ.5/LFXOUT 78

PJ.4/LFXIN 77

AVSS 76

PJ.7/HFXOUT 75

PJ.6/HFXIN 74

AVSS 73

P6.7/UCB3STE 72

P6.6/UCB3CLK 71

P6.5/UCB3SOMI/UCB3SCL 70

P6.4/UCB3SIMO/UCB3SDA 69

P5.7/UCA2STE/TA4.1/MCLK 68

P5.6/UCA2CLK/TA4.0/SMCLK 67

P5.5/UCA2RXD/UCA2SOMI/ACLK66

P5.4/UCA2TXD/UCA2SIMO/TB0OUTH65

P2.4/TA1.0/UCA1CLK/A7/C11 64

P2.3/TA0.0/UCA1STE/A6/C10 63

P2.7 62

DVCC 61

U1

12345678910

11

12

13

14

15

16

17

18

19

20

J3

2122232425262728293031323334353637383940

J4

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

J5

6162636465666768697071727374757677787980

J6

C3

P1

.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1

.1

P1.1

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0/TDO

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1

.2

P1.2

P1

.3

P1.3

AV

CC

AVCC

AV

SS

AVSS

AVSS

AVSS

HF

XO

UT

HFXOUT

HF

XIN

HFXIN

HF

GN

D

LF

XIN

LFXIN

LF

XO

UT

LFXOUT

DV

CC

DV

CC

DVCC

DV

CC

DV

CC

DV

CC

DVCC

DV

CC

DVCC

DV

SS

DV

SS

DVSS

DV

SS

TE

ST

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CK

1

TE

ST

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CK

TEST/SBWTCK

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RST/SBWTDIO

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T/S

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BW

TD

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E

ST

E

RX

D/S

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RX

D/S

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TX

D/S

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I/SD

A

TX

D/S

OM

I/SD

A

SP

ICL

K/S

CL

SP

ICL

K/S

CL

SP

ICL

K/S

CL

1

SP

ICL

K/S

CL

1

RX

D/S

IMO

1

RX

D/S

IMO

1

TX

D/S

OM

I/SD

A1

P1

.6

P1

.6

P2

.0

P2

.0

LF

GN

D

1 2 3 4 5 6

1 2 3 4 5 6

Title

:

Da

te:

Pa

ge

1/1

MS

P-T

S4

30

PN

80

B

10

/5/2

01

5 2

:54

:53

PM

A3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Re

v.:

Figure B-62. MSP-TS430PN80B Target Socket Module, Schematic

Hardware www.ti.com



https://www.ti.com


141

2

101

2


Jumper JP3 to "ext"

Orient Pin 1 ofMSP device

Jumpers JP3 JP8Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode

through

D1 D3LEDs connected toP1.0 through P1.2

through

Jumpers JP9 JP11Open to disconnect LEDs

through


Connector BSLFor Bootloader Tool


Jumpers JP1 and JP2Open to measure current

Figure B-63. MSP-TS430PN80B Target Socket Module, PCB

www.ti.com Hardware




https://www.ti.com


Table B-32. MSP-TS430PN80B Bill of MaterialsPosition Ref Des No. per


1 PCB 1 90.0 x 92.5 mm "MSP-TS430PN80B" Rev.1.0 2 layers, blue solder mask

2JP1, JP2,JP9, JP13,JP14, JP15


3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on one side of header



6


JP16



8 R2, R5, R6,R8, R9 5 0R, 0805 541-0.0ATR-ND DNP

9 R3, R12,R13 3 0R, 0805 541-0.0ATR-ND

10 C5 1 1.1nF, CSMD0805 490-1623-2-ND

11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND

12 R7, R15 2 10k, 0805 541-10KATR-ND

13 R4 1 47k, 0805 541-47KATR-ND

14 C4, C6,C10, C11 4 100nF, CSMD0805 490-1666-1-ND

15 R1 1 330R, 0805 541-330ATR-ND

16 R10, R11 2 330R, 0805 541-330ATR-ND DNP

17 R14 1 47k, 0805 541-47KATR-ND DNP

18 C1, C2, C8,C9 4 DNP, CSMD0805 DNP

19 SW2 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder

20 SW1 1 EVQ-11L05R P8079STB-ND DNP, keep pads free of solder

21 TP1, TP2 2 Test point DNP, keep pads free of solder

22 BSL 1 10-pin connector, male,TH HRP10H-ND


24 U1 1 Socket IC201-0804-014 Manuf. Yamaichi

25 MSP device 1 MSP430FR5994 DNP: Not enclosed in kit

26 Q1 1DNP: MS3V-TR1(32768kHz, 20ppm,12.5pF)

depends on application Micro Crystal, DNP, enclosed in kit, keepvias free of solder

Hardware www.ti.com



https://www.ti.com


B.32 MSP-TS430PN80C

1 1

2 2

3 3

4 4

5 5

6 6

DD

CC

BB

AA

12

2/1

6/2

018

MC

U022A

_M

SP

-TS

430P

N80C

_S

chem

atic

.SchD

oc

SheetT

itle:

Siz

e:

Mod. D

ate

:

File

:S

heet:

ofB

http

://ww

w.ti.c

om

Conta

ct:

http

://ww

w.ti.c

om

/support

MS

P-T

S430P

N80C

Pro

jectT

itle:

Desig

ned fo

r:P

ublic

Rele

ase

Assem

bly

Varia

nt:

001

©Te

xa

s In

stru

me

nts

20

17

Dra

wn B

y:

Engin

eer:

Mik

e P

ridgen

Texas In

stru

ments

and/o

r its lic

ensors

do n

ot w

arra

nt th

e a

ccura

cy o

r com

ple

teness o

f this

specifi

catio

n o

r any in

form

atio

n c

onta

ined th

ere

in.Texas In

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ments

and/o

r its lic

ensors

do n

ot

warra

nt th

at th

is d

esig

n w

ill meet th

e s

pecifi

catio

ns, w

ill be s

uita

ble

for y

our a

pplic

atio

n o

rfit fo

r any p

artic

ula

r purp

ose, o

r will o

pera

te in

an im

ple

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tion.

Texas In

stru

ments

and/o

r itslic

ensors

do n

ot w

arra

nt th

at th

e d

esig

n is

pro

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n w

orth

y.Y

ou s

hould

com

ple

tely

valid

ate

and te

styour d

esig

n im

ple

menta

tion to

confirm

the sy

ste

m fu

nctio

nality

for

your a

pplic

atio

n.

Vers

ion c

ontro

l dis

able

dS

VN

Rev: M

CU

022

Num

ber:

Rev:

AT

ID #

:N

/AO

rdera

ble

:M

SP

-TS

430P

N80C

1 2 3

J1

1

2

3

J2

1 2 3

JP

9

1 2 3

JP

10

1 2 3

JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2

JP

1

1

2

JP11

1

2

JP

12

ext

int

VC

C

JTA

G ->

SB

W ->

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

GN

D

47k

R7

1100pF

C5

RS

T/S

BW

TD

IOP

J.0

/TD

OP

J.1

/TD

IP

J.2

/TM

SP

J.3

/TC

K

DV

SS

TM

ST

DI

TD

O/S

BW

TD

IO

VC

C

Ext_

PW

R

GN

D

GN

D

TE

ST

/SB

WT

CK

BS

L_R

XB

SL_T

X

0.1

μF

C6

0.1

μF

C11

AV

SS

DV

SS

330

R1

Gre

en

12

D1

P1.0

P1.1

47k

R13

DN

P

DVCC

P1.3

0 R12

0 R10

AV

SS

GN

D

4.7

uF

C12

DN

P

DVSSDVCC

AV

SS

Connectio

n b

y v

ia

AV

CC

0 R8

DN

P

0 R9

DN

P

22pF

C8

DN

P

22pF

C9

DN

P

DV

CC

AV

SS

HF

GN

D

12pF

C2

DN

P

12pF

C1

DN

P

Connectio

n b

y v

ia

AV

SS

DV

SS

DV

CC

DV

SS

DV

SS

0 R11

PV

SS

1 2

JP

4

PV

SS

PV

CC

1 2

JP

14

1 2

JP

13

PV

SS

Ch0IN

Ch1IN

RS

T/S

BW

TD

IO

BS

L_S

CL

BS

L_S

DA

UA

RT

BS

LC

onnectio

n

I2C

BS

LC

onnectio

n

I2C

Pullu

ps

BS

LR

XB

SLT

XB

SL_T

XB

SL_R

X

BS

LS

CL

BS

LS

DA

BS

L_S

DA

BS

L_S

CL

Connectio

n b

y v

ia

VC

C

DV

CC

0 R18

LC

DC

AP

Use L

CD

_C

Module

No L

CD

_C

Module

R18

C12

DN

P

DN

P0

ohm

4.7

uF

TP

1D

NP

TP

2D

NP

TP

3D

NP

TP

4D

NP

1 2

JP

2

1 2

JP

3

VC

C C

urre

nt

Measure

ment

Pow

er R

ail

Connectio

ns

4.7

k

R16

4.7

k

R17

DV

CC

0.1

μF

C4

BS

L_T

X

BS

L_R

X

BS

L_S

DA

BS

L_S

CL

RS

T/N

MI

TC

K/S

BW

TC

K

0 R21

0 R20

0 R19

1234

TP

5D

NP

TP

6

DN

P

Blu

e

21

D2

200

R2

12

34

56

78

910

1112

13

14

JTA

G

12

34

SW

3

12

34

SW

4

12

34

SW

5

HF

XIN

_ext

HF

XIN

HF

XO

UT

HF

XO

UT

_ext

LF

XO

UT

0 R5

DN

P

0 R6

DN

PLF

XIN

_ext

LF

XO

UT

_ext

US

SX

TIN

USSXTOUT_extUSSXTIN_ext

US

SX

TIN

_ext

US

SX

TO

UT

_ext

0 R3

0 R4

DN

P

DVSS1DVCC1

AVSS

AVSS

12

34

56

78

910

BS

L

US

SX

TO

UT

22

R22

0 R14

DN

P

0 R15

DN

P

If exte

rnal s

upply

volta

ge:

rem

ove R

3 a

nd a

dd R

4 (0

ohm

)

27pF

C14

27pF

C15

1000pF

C13

47μ

FC

16

5 4 123678910

1112

13

14

15

16

17

18

19

20

J3

5

4

1

2

3

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

J4

HF

XIN

_ext

HF

XO

UT

_ext

TE

ST

/SB

WT

CK

LF

XIN

_ext

LF

XO

UT

_ext

AV

SS

AV

SS

AV

CC

1P

2.2

/CO

UT

/UC

A0C

LK

/A14/C

14

P2.3

/TA

0.0

/UC

A0S

TE

/A15/C

15

P1.0

/UC

A1C

LK

/TA

1.0

/A0/C

0/V

RE

F-/V

eR

EF

-P

1.1

/UC

A1S

TE

/TA

4.0

/A1/C

1/V

RE

F+

/VeR

EF

+A

VS

S2

PJ.4

/LF

XIN

PJ.5

/LF

XO

UT

AV

SS

3P

J.6

/HF

XIN

/US

SX

T_B

OU

TP

J.7

/HF

XO

UT

P2.4

/TA

0C

LK

/TB

0C

LK

/TA

1C

LK

/LC

DS

24

P2.6

/UC

A0S

IMO

/UC

A0T

XD

/TA

1.2

/TA

1.2

C/L

CD

S23

P2.7

/UC

A0S

OM

I/UC

A0R

XD

/TA

4.1

/TA

4.1

C/L

CD

S22

TE

ST

/SB

WT

CK

RS

T/N

MI/S

BW

TD

IOP

J.0

/UC

A2C

LK

/SR

SC

G1/D

MA

E0/C

10/T

DO

PJ.1

/UC

A2S

TE

/SR

SC

G0/T

A4C

LK

/C11

/TD

I/TC

LK

PJ.2

/UC

A2S

IMO

/UC

A2T

XD

/SR

OS

CO

FF

/TB

0O

UT

H/C

12/T

MS

PJ.3

/UC

A2S

OM

I/UC

A2R

XD

/SR

CP

UO

FF

/TB

0.6

/C13/T

CK

RS

T/S

BW

TD

IO

P2.5/TA0.2/TA4.0/LCDS21P3.0/TB0.0/LCDS20P1.2/UCA1SIMO/UCA1TXD/TA1.0/A8/C8P1.3/UCA1SOMI/UCA1RXD/TA1.1/A9/C9P2.0/UCA1CLK/UCA3SIMO/UCA3TXD/LCDS19P2.1/UCA1STE/UCA3SOMI/UCA3RXD/LCDS18P1.6/UCA3STE/UCB0SIMO/UCB0SDA/LCDS17P1.7/USSTRG/UCA3CLK/UCB0SOMI/UCB0SCL/LCDS16P1.4/TB0.4/UCB0STE/A2/C2P1.5/TB0.5/UCB0CLK/A3/C3P3.1/TA1CLK/TB0.1/MTIF_OUT_INP4.0/RTCCLK/TA4.1/MTIF_PIN_ENP4.1/UCA0CLK/TB0.4/UCA3SOMI/UCA3RXD/LCDS15P4.2/UCA0STE/TB0.5/UCA3SIMO/UCA3TXD/LCDS14P4.3/UCA0SIMO/UCA0TXD/LCDS13P4.4/UCA0SOMI/UCA0RXD/LCDS12P4.5/TA0CLK/TA1CLK/LCDS11P4.6/TB0CLK/TA4CLK/LCDS10

P1.3

541 2 3 6 7 8 9

10

11 12

13

14

15

16

17

18

19

20

J5

5

4

1

2

3

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

J6

PVSSPVCC

Ch0IN

PVCCPVSS

Ch1IN

LCDCAP

P6.3

/CO

M7/R

23

DV

CC

3D

VS

S3

P6.2

/TB

0C

LK

/R13/L

CD

RE

F/L

CD

S32

P6.1

/RT

CC

LK

/R03/L

CD

S33

P7.0

/TA

1.0

/TA

1.2

/XP

B0/L

CD

S30

P6.6

/AC

LK

/CO

M2/L

CD

S31

P6.5

/SM

CLK

/CO

M1/L

CD

S34

P6.4

/MC

LK

/CO

M0

P5.7

/TA

0.2

/UC

B1S

TE

/LC

DS

1P

6.0

/TA

0C

LK

/CO

UT

/LC

DS

0

P5.6

/TB

0O

UT

H/U

CB

1S

OM

I/UC

B1S

CL/L

CD

S2

P5.5

/TA

4.1

/UC

B1S

IMO

/UC

B1S

DA

/LC

DS

3P

5.4

/TA

0.0

/UC

B1C

LK

/TA

4.0

/LC

DS

4P

5.3

/TB

0.3

/UC

A2S

TE

/LC

DS

5P

5.2

/TB

0.2

/UC

A2C

LK

/LC

DS

6P

5.1

/TB

0.1

/UC

A2S

OM

I/UC

A2R

XD

/LC

DS

7P

5.0

/TB

0.0

/UC

A2S

IMO

/UC

A2T

XD

/LC

DS

8P

4.7

/DM

AE

0/L

CD

S9

DV

SS

2

USSXTINUSSXTOUTAVSS1

AVSS4

CH0_IN

PVCCPVSSPVCC

CH1_IN

PVSS

P3.5/ACLK/COM3/COUT/LCDS26P3.4/SMCLK/COM6/DMAE0/LCDS27P3.3/MCLK/TB0.3/XPB1/LCDS25P3.2/TA1.1/COM5/LCDS28P6.7/TA0.1/COM4/LCDS29R33/LCDCAP

P3.7/UCB1SOMI/UCB1SCL/TB0.2/TB0OUTH/LCDS36P3.6/UCB1SIMO/UCB1SDA/TB0.6/USSXT_BOUT/LCDS35BSLTX

BSLRXBSLSDABSLSCL

PJ.0

/TD

OP

J.1

/TD

IP

J.2

/TM

SP

J.3

/TC

K

Ch0OUT

Ch1OUT

1000pF

C17

DN

P

1000pF

C18

DN

P200

R23

DN

P200

R24

DN

PC

h0O

UT

Ch1O

UT

TP

7

DN

P

TP

8

DN

P

123456789

10

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

IC1

IC357-0

804-0

96P

-1

P1.0

P1.1

BS

LS

DA

BS

LS

CL

Ground pad not used

LF

XIN

LF

XO

UT

HF

XIN

HF

XO

UT

AV

CC

Q1A

DN

PQ

1

Q2A

DN

P

Q2

DN

P

LF

XIN

Popula

te e

ither Q

1 o

r Q1A

if a c

rysta

l is n

eeded

Popula

te e

ither Q

2 o

r Q2A

if a c

rysta

l is n

eeded

SW

1

SW

2

DV

CC

AV

CC

DV

SS

DV

SS

DV

CC

PVCC

CH1_OUT

CH0_OUT

VCC_Meas

VC

C

US

SX

T_O

UT

1uF

C7

1uF

C3

Q3

Figure B-64. MSP-TS430PN80C Target Socket Module, Schematic

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Jumper J11-2 (Debugger): Power supply from JTAG Interface





Jumpers JP1 to JP4Open to measure current

BSL Interface SwitchesSelect which BSL interface to connect toconnector BSL

I2C pullup enable switchSwitch On to connect I2C pullup resistors


Jumpers JP11 and JP12Open to disconnect LEDs D1 and D2


Figure B-65. MSP-TS430PN80C Target Socket Module, PCB

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Table B-33. MSP-TS430PN80C Bill of MaterialsDesignator Quantity Value Description Package Reference Part Number Manufacturer Comments

!PCB 1 Printed Circuit Board MCU022 Any


Header, 2.54mm, 5x2,TH AWHW-10G-0202-T Assman WSW

C3, C7 2 1uF CAP, CERM, 1 uF, 10V, ±10%, X5R, 0805 0805 GRM216R61A105KA01D MuRata

C4, C6, C11 3 0.1uFCAP, CERM, 0.1 µF,50 V, ±10%, X7R,0805

0805 GRM21BR71H104KA01L MuRata

C5 1 1100pFCAP, CERM, 1100 pF,50 V, ±5%, C0G/NP0,0805

0805 GRM2165C1H112JA01D MuRata

C13 1 1000pF

CAP, CERM, 1000 pF,50 V, ±5%, C0G/NP0,AEC-Q200 Grade 1,0805

0805 GCM2165C1H102JA16D MuRata

C14, C15 2 27pFCAP, CERM, 27 pF,50 V, ±5%, C0G/NP0,0603

0603 GRM1885C1H270JA01D MuRata

C16 1 47uFCAP, CERM, 47 µF,6.3 V, ±20%, X5R,0805

0805 GRM21BR60J476ME15L MuRata





IC1 1 Socket, QFP-80,0.5 mm Pitch

Socket, QFN-80,0.5 mm Pitch IC357-0804-096P-1 Yamaichi Electronics


JP10


J3, J4, J5, J6 4 Header, 100mil, 20x1,Gold, TH 20x1 Header TSW-120-07-G-S Samtec Not installed,

included in kit

J3A, J4A,J5A, J6A 4 Receptacle, 2.54 mm,

20x1, Gold, THReceptacle, 2.54mm,20x1, TH PPPC201LFBN-RC Sullins Connector

SolutionsNot installed,included in kit

JP1, JP2,JP3, JP4,

JP11, JP12,JP13, JP14


JTAG 1 Header (shrouded),100 mil, 7x2, Gold, TH 7x2 Shrouded Header SBH11-PBPC-D07-ST-BK Sullins Connector

Solutions

Q1 1 Crystal, 32.768 kHz,12.5pF, SMD 1.4x1.4x5.0mm SMD MS3V-T1R 32.768KHZ

±20PPM 12.5PF Micro Crystal AG Not installed,included in kit

Q3 1 Crystal, 8MHz, SMD 4.7x4.1mm R- 8,00M-ZTACS/MT-0,5-0,4-H-30/30-TR Auris-GmbH

R1 1 330 RES, 330, 5%,0.125 W, 0805 0805 CRCW0805330RJNEA Vishay-Dale

R2 1 200 RES, 200, 5%,0.125 W, 0805 0805 CRCW0805200RJNEA Vishay-Dale

R3, R10,R11, R12,R18, R19,R20, R21

8 0 RES, 0, 5%, 0.125 W,0805 0805 CRCW08050000Z0EA Vishay-Dale

R7 1 47k RES, 47 k, 5%,0.125 W, 0805 0805 CRCW080547K0JNEA Vishay-Dale

R16, R17 2 4.7k RES, 4.7 k, 5%,0.125 W, 0805 0805 CRCW08054K70JNEA Vishay-Dale

R22 1 22 RES, 22, 5%, 0.1 W,0603 0603 CRCW060322R0JNEA Vishay-Dale

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Table B-33. MSP-TS430PN80C Bill of Materials (continued)Designator Quantity Value Description Package Reference Part Number Manufacturer Comments

SH‑J1,SH‑JP1,SH‑JP2,SH‑JP3,SH‑JP4,SH‑JP5,SH‑JP6,SH‑JP7,SH‑JP8,SH‑JP9,SH‑JP10,SH‑JP11,SH‑JP12,SH‑JP13,SH‑JP14

15 1x2 Shunt, 100mil, Goldplated, Black Shunt SNT-100-BK-G Samtec

Alternate partnumber:969102-0000-DA

SW1, SW2 2Switch, SPST-NO, Off-Mom, 0.02 A, 15 VDC,TH

6x6mm EVQ-11A04M Panasonic

SW3, SW4,SW5 3

Switch, DPST, Slide,Off-On, 1 Pos, 0.15A,30V, TH

9.65x7.12mm 78F01T Grayhill


0805 CC0805JRNP09BN120 Yageo America


0805 GQM2195C1H220JB01D MuRata

C12 0 4.7uFCAP, CERM, 4.7 µF,10 V, +80/-20%, Y5V,0805

0805 CC0805ZRY5V6BB475 Yageo America


0805 08055A102FAT2A AVX

FID1, FID2,FID3, FID4,FID5, FID6

0Fiducial mark. Thereis nothing to buy ormount.

N/A N/A N/A

Q1A, Q2A 0 Crystal, 12 MHz,18 pF, TH 11.5x5mm 9B-12.000MEEJ-B TXC Corporation

Q2 0 Crystal, 32.768 kHz,12.5pF, SMD 1.4x1.4x5.0mm SMD MS3V-T1R 32.768KHZ

±20PPM 12.5PF Micro Crystal AG

R4, R5, R6,R8, R9 0 0 RES, 0, 5%, 0.125 W,

0805 0805 CRCW08050000Z0EA Vishay-Dale

R13 0 47k RES, 47 k, 5%,0.125 W, 0805 0805 CRCW080547K0JNEA Vishay-Dale

R14, R15 0 0 RES, 0, 5%, 0.1 W,0603 0603 CRCW06030000Z0EA Vishay-Dale

R23, R24 0 200 RES, 200, 1%,0.125 W, 0805 0805 CRCW0805200RFKEA Vishay-Dale

TP1, TP2,TP3, TP4 0 Black Test Point, Miniature,

Black, THBlack MiniatureTestpoint 5001 Keystone

TP5, TP6,TP7, TP8 0 Test Point, Miniature,

Black, THBlack MiniatureTestpoint 5001 Keystone

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B.33 MSP-TS430PN80USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 Vlower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, torun the MCU at 3.0 V, set it to 3.3 V.

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A. R11 should be populated.

Figure B-66. MSP-TS430PN80USB Target Socket Module, Schematic

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Jumper JP31-2 (int): Power supply from JTAG debug interface2-3 (ext): External power supply


USB Connector

Button S3BSL invoke

Jumper JP4Close for USB bus powered device







Figure B-67. MSP-TS430PN80USB Target Socket Module, PCB

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Table B-34. MSP-TS430PN80USB Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805


3 C5, C11, C13,C14 4 100nF, SMD0805 311-1245-2-ND

3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12

4 C8 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 478-1403-2-ND


7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-NDDNP: headers andreceptacles enclosed with kit.Keep vias free of solder.


DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.

SAM1213-20-ND : Header: Receptacle


9JP5, JP6,

JP7, JP8,JP9,JP10



JP4 1 SAM1035-02-ND Place jumper only on one pin

11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2

12 10 Jumper 15-38-1024-NDPlace on: JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8, JP9,JP10


14 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF

DNP: Q1 Keep vias free ofsolder

15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

17R1, R2, R4,R6, R8, R9,

R122 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500

18 R11 0 1M Ω, SMD0805 DNP

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND



21 Rubberstandoff 4 Buerklin: 20H1724 Apply to corners at bottom

side

22 MSP430 2 MSP430F5529 DNP: Enclosed with kitsupplied by TI



27 C33 1 220n Buerklin: 53D2074

28 C35 1 10p Buerklin: 56D102

29 C36 1 10p Buerklin: 56D102

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Table B-34. MSP-TS430PN80USB Bill of Materials (continued)Pos. Ref Des No. per


30 C38 1 220n Buerklin: 53D2074

31 C39 1 4u7 Buerklin: 53D2086

32 C40 1 0.1u Buerklin: 53D2068


34 IC7 1 TPD4E004 Manu: TI





40 R13, R15,R16 0 470R Buerklin: 07E564 DNP

41 R33 1 1k4 Buerklin: 07E612

42 R34 1 27R Buerklin: 07E444

43 R35 1 27R Buerklin: 07E444

44 R36 1 33k Buerklin: 07E740



46 S3 1 PB P12225STB-ND


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B.34 MSP-TS430PZ100

A. Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made.

Figure B-68. MSP-TS430PZ100 Target Socket Module, Schematic

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Connector J5External power connection

Remove R8 and jumper R9







Figure B-69. MSP-TS430PZ100 Target Socket Module, PCB

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Table B-35. MSP-TS430PZ100 Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6

3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 C9 1 470nF, SMD0805 478-1403-2-ND

6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND





9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header





14 R3 1 330 Ω, SMD0805 541-330ATR-ND

15R1, R2, R4,R8, R9, R10,

R11, R123 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12

16 R5 1 47k Ω, SMD0805 541-47000ATR-ND

17 U1 1 Socket: IC201-1004-008 orIC357-1004-53N Manuf.: Yamaichi

18 PCB 1 82 × 90 mm 2 layers



20 MSP430 2 MSP430FG4619IPZ DNP: enclosed with kitsupplied by TI

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B.35 MSP-TS430PZ100A

Figure B-70. MSP-TS430PZ100A Target Socket Module, Schematic

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Orient Pin 1 ofMSP430 Device


Jumper JP3 to "ext"



Figure B-71. MSP-TS430PZ100A Target Socket Module, PCB

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Table B-36. MSP-TS430PZ100A Bill of MaterialsPos. Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

1b C3, C4 0 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.


3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND

4 C8 1 10nF, SMD0805 478-1358-1-ND

5 C6 0 470nF, SMD0805 478-1403-2-ND DNP

6 D1 1 green LED, SMD0805 67-1553-1-ND





10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header


12 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3




16 R3 1 330 Ω, SMD0805 541-330ATR-ND

17

R1, R2, R4,R6, R7, R8,

R9, R10, R11,R12

2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R7, R8, R9,R10, R11, R12

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND

19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi


21 Rubberstandoff 4 Select appropriate Apply to corners at bottom

side

22 MSP430 2 MSP430F47197IPZ DNP: Enclosed with kitsupplied by TI

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B.36 MSP-TS430PZ100B

Figure B-72. MSP-TS430PZ100B Target Socket Module, Schematic

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Jumper JP3 to "ext"




JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCCor drive AUXVCCx externally







Figure B-73. MSP-TS430PZ100B Target Socket Module, PCB

Note


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Table B-37. MSP-TS430PZ100B Bill of MaterialsPosition Ref Des No. per


1 C1, C2 0 12pF, SMD0805 DNP

2 C4, C5, C6 ,C7, C8, C9 6 100nF, SMD0805 311-1245-2-ND

3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND

4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP

5C13, C14,C16, C18,C19, C29

6 4.7 uF SMD0805





8 J5 1 3-pin header, male, TH

9


JP10



11 JP11, JP12,JP13 3 4-pin header, male, TH place jumper on header 1-2

12 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11



17 Q1 0 Crystal DNP: Q1 Keep vias free of solder

21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

22R1, R2, R4,

R6, R8,R10, R11

2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11

23 R5 1 47k Ω, SMD0805 541-47000ATR-ND





27 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI

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B.37 MSP-TS430PZ100C

DN

PD

NP

DN

P

DN

P

DN

P

DN

P

0R

12pF

12pF

47pF

47pF

GN

D

0R

100nF

330R

10 /6.3uF V

10 /6.3uF V

2.2

nF

PWR3

GN

D

GN

D

GN

D

GN

D0R

330R

47K

100nF

100nF

PT

RN

D516

-

470nF

100nF

100nF

0R

0R

0R

0R

GN

D

VCC

100nF

GN

D

100nF

100nF

GN

D

100nF

LL

A103

GN

D

4.7n

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

GN

D

0R

0R

GN

DG

ND

GN

D

4.7uF

GN

D

100nF

220nF

GN

D

VCC

LL A103

1.1

MS

PTa

rge

tS

ocke

tM

SP

TS

PZ

C430:

--

430

100

Socket:

Ya

maich

iIC

201-1

004-0

08

LFXTCLK

<-

SB

W

<-

JTA

G

Vccint

ext

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

BS

LR

x-

BS

LT

x-

DN

P

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3

C6

C7

C8

123

J5

8079787776

75

74

73

72

71

70

69

68

67

66

65

60

59

58

57

56

55

54

53

52

51

504948474645

3635343332313029282726

25

24

23

22

21

16

15

14

13

12

11 10

9 8 7 6 5 4 3 2 1

64

63

62

61

44434241

37383940

17

18

19

20

81828384858687888990919293949596979899

100

U1

QF

P1

00

PZ

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

J1

26272829303132333435363738394041424344454647484950

J2

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

J3

767778798081828384858687888990919293949596979899

100

J4

1JP

1

2

1

JP2

2

R4

123

JP

5123

JP

6123

JP

7123

JP

8123

JP

9123

JP

10

R7

R5

C11

C12

D1

C9

C13

C10

R6

R8

R9

R12

1 2 3

JP

3

C17

C18

C19

C14

D3

C16

1 2 3

JP

11

4

21Q G1 $1

43Q G1 $2

2 1

Q G2 $1

4 3

Q G2 $2

12

34

56

78

910

BO

OT

ST

R10

R11

C15

C20

C21

1JP

4

2

D4

123

J6

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

VC

C

GND

GND

GN

D

XIN

P1.0

DV

CC

1

DV

CC

1

DV

CC

1

DVCC1

DV

CC

1

DVCC1

AV

CC

XT

OU

T2

AVSS

AVSS

AV

SS

M

M

I

I

O

O

XT

IN2

RS

TN

MI

/R

ST

NM

I/

TC

K

TC

K

TC

KC

C

TE

ST

SB

WT

CK

/

TE

ST

SB

WT

CK

/

TE

ST

SB

WT

CK

/

RS

T

RS

T

RS

T

XTLGND2

XTLGND1

PU.0

PU.1

P1.6P1.7

P8.0

P8.1

P8.2

VBAKVBAT

VBAT

VB

AT

P1.1

P1.1

P1.2

P1.2

LD

OI

LDOI

LD

OO

LDOO

BS

LIn

terfa

ce

LD

OI

LD

OO

Inte

rface

/

+

+

Note

Ifth

esys

tem

should

be

:supplie

dvia

LD

OI

Jclo

se

JP

(6)

4and

set

JP

toexte

rnal

3

Figure B-74. MSP-TS430PZ100C Target Socket Module, Schematic

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If the system shouldbe supplied from LDOI (J6),close JP4 and set JP3 to external




LDOI LDOO/

14

1

2

GN

D

GN

D

VC

C

12

55

10

15

20

26 5030 3540 45 51

75

55

60

65

70

76100 80859095

12

3

12

3

12

3

12

3

12

3

12

3

1231 2 3 4

10

1

2

1 2 3

1

JTA

GS

BW

Vcc

int

ext

GN

D

VB

AT

DV

CC

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3

+C6

+

C7

C8

J5

U1

J1

J2

J3

J4

JP

1

JP2

R4

JP

5

JP

6

JP7

JP

8

JP

9

JP

10

R7

R5

C11

C1

2

D1

C9

C1

3

C10

R6

R8

R9

R1

2

JP3

C1

7

C1

8

C1

9

C1

4

D3

C16

JP11

Q1

Q2

BOOTSTR1

0

R1

1C

15

C20

C2

1

JP

4

D4

J6








Figure B-75. MSP-TS430PZ100C Target Socket Module, PCB

Note


Hardware www.ti.com



https://www.ti.com


Table B-38. MSP-TS430PZ100C Bill of Materials

Pos. Ref DesNumber

PerBoard

Description Digi-Key Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4


3C5, C11,

C13, C14,C19, C20

6 100nF, SMD0805 311-1245-2-ND

3.1 C10, C12,C18,17 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17

4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292

5 C9 1 470nF, SMD0805 478-1403-2-ND


7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.

7.1 4 25-pin header, TH SAM1213-25-ND DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.

8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND

9

JP5, JP6,JP7,

JP8,JP9,JP10



10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header


12 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3, JP4, JP5, JP6,JP7, JP8, JP9, JP10



15 Q1 0 CrystalDNP: Q1Keep vias free of solder

16 Q2 1 Crystal DNP: Q2 Keep vias free of solder

17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND

18

R1, R2, R4,R6, R8, R9,R10, R11,

R12

3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12

19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND


21 PCB 1 79.5 x 99.5 mm MSP-TS430PZ100C Rev 1.0 2 layers


23 MSP430 2 MSP430F643x DNP: enclosed with kit. Is supplied by TI.

24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042

26 D3, D4 2 LL103A Buerklin: 24S3406

27 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 2

28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430

29 C21 1 220nF, SMD0805 Buerklin 53 D 2381

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B.38 MSP-TS430PZ100D

DN

P

Socket:

Yam

aic

hi IC

201-1

004-0

08

DN

P

DN

P

GN

D

GN

D

100nF

33

0R

-0R

GN

D

GN

D

1.1

nF

47

kG

ND

0R 0R

QU

AR

Z5

1uF

/10V

100nF

1uF

/10V

gre

en

DN

P

yello

w (D

NP

)

DN

P

red (D

NP

)

0R

GN

D

DN

P

DN

P

0R0R

QUARZ5

EV

Q11

0R

DNP

DN

P

MS

P4

30

FR

69

8X

PZ

FE

25-1

A1

FE25-1A2

FE

25-1

A3

FE25-1A4

100nF

GN

D

100nF

GN

D

1uF

/10V

100nF

GND

GN

D

470nF

GN

D

0R

4u7

GN

D

If exte

rnal s

upply

volta

ge:

rem

ove R

3 a

nd a

dd R

2 (0

Ohm

)

Ext_

PW

R

MS

P-T

S4

30

PZ

10

0D

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430F

R698xP

Z, F

R688xP

Z

DN

PD

NP

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

3 to

JP

8 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

3 to

JP

8 to

positio

n 1

-2

connectio

n b

y v

iaD

NP

DN

P

Pe

ters

en

10

99

/1/0

01

/01

.1

1.2

DN

P

DN

PD

NP

DN

P

DN

P

DN

PD

NP

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2

C1

C4

R1

12

34

56

78

91

0

BS

L

R2R3

123

J2

1 2 3

J1

1 2

JP

1

12J

P9

C5

R4

1 2 3JP

3

1 2 3JP

4

1 2 3JP

5

1 2 3JP

6

1 2 3JP

7

1 2 3JP

8

R5 R6

Q1

C3

C6

C7

D1

R1

0

12JP

10

D2

R11

12J

P11

D3

R1

2

1 2

JP

2

C8

C9

R8R9

Q2

SW

1

R1

3

TP2TP1

SW2

R1

4

P4

.3/U

CA

0S

OM

I/UC

A0

RX

D/U

CB

1S

TE

1

P1

.4/U

CB

0C

LK

/UC

A0

ST

E/T

A1

.0/S

12

P1

.5/U

CB

0S

TE

/UC

A0

CL

K/T

A0

.0/S

03

P1

.6/U

CB

0S

IMO

/US

B0

SD

A/T

A0

.14

P1

.7/U

CB

0S

OM

I/UC

B0

SC

L/T

A0

.25

R3

3/L

CD

CA

P6

P6

.0/R

23

7

P6

.1/R

13

/LC

DR

EF

8

P6

.2/C

OU

T/R

03

9

P6

.3/C

OM

01

0

P6

.4/T

B0

.0/C

OM

111

P6

.5/T

B0

.1/C

OM

21

2

P6

.6/T

B0

.2/C

OM

31

3

P2

.4/T

B0

.3/C

OM

4/S

43

14

P2

.5/T

B0

.4/C

OM

5/S

42

15

P2

.6/T

B0

.5/C

OM

6/S

41

16

P2

.7/T

B0

.6/C

OM

7/S

40

17

P1

0.2

/TA

1.0

/SM

CL

K/S

39

18

P5

.0/T

A1

.1/M

CL

K/S

38

19

P5

.1/T

A1

.2/S

37

20

P5

.2/T

A1

.0/T

A1

CL

K/A

CL

K/S

36

21

P5

.3/U

CB

1S

TE

/S3

52

2

P3

.0/U

CB

1C

LK

/S3

42

3

P3

.1/U

CB

1S

IMO

/UC

B1

SD

A/S

33

24

P3

.2/U

CB

1S

OM

I/UC

B1

SC

L/S

32

25

DVSS126

DVCC127

TEST/SBWTCK28

XRST/NMI/SBWTDIO29

PJ.0/TDO/TB0OUTH/SMCLK/SRSCG130

PJ.1/TDI/TCLK/MCLK/SRSCG031

PJ.2/TMS/ACLK/SROSCOFF32

PJ.3/TCK/COUT/SRCPUOFF33

P6.7/TA0CLK/S3134

P7.5/TA0.2/S3035

P7.6/TA0.1/S2936

P10.1/TA0.0/S2837

P7.7/TA1.2/TB0OUTH/S2738

P3.3/TA1.1/TB0CLK/S2639

P3.4/UCA1SIMO/UCA1TXD/TB0.0/S2540

P3.5/UCA1SOMI/UCA1RXD/TB0.1/S2441

P3.6/UCA1CLK/TB0.2/S2342

P3.7/UCA1STE/TB0.3/S2243

P8.0/RTCCLK/S2144

P8.1/DMAE0/S2045

P8.2/S1946

P8.3/MCLK/S1847

P2.3/UCA0STE/TB0OUTH48

P2.2/UCA0CLK/TB0.4/RTCCLK49

P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE050P

2.0

/UC

A0

SIM

O/U

CA

0T

XD

/TB

0.6

/TB

0C

LK

51

P7

.0/T

A0

CL

K/S

17

52

P7

.1/T

A0

.0/S

16

53

P7

.2/T

A0

.1/S

15

54

P7

.3/T

A0

.2/S

14

55

P7

.4/S

MC

LK

/S1

35

6D

VS

S2

57

DV

CC

25

8P

8.4

/A7

/C7

59

P8

.5/A

6/C

66

0P

8.6

/A5

/C5

61

P8

.7/A

4/C

46

2P

1.3

/ES

ITE

ST

4/T

A1

.2/A

3/C

36

3P

1.2

/TA

1.1

/TA

0C

LK

/CO

UT

/A2

/C2

64

P1

.1/T

A0

.2/T

A1

CL

K/C

OU

T/A

1/C

1/V

RE

F+

/VE

RE

F+ 6

5P

1.0

/TA

0.1

/DM

AE

0/R

TC

CL

K/A

0/C

0/V

RE

F-/V

ER

EF 6

6P

9.0

/ES

ICH

0/E

SIT

ES

T0

/A8

/C8

67

P9

.1/E

SIC

H1

/ES

ITE

ST

1/A

9/C

96

8P

9.2

/ES

ICH

2/E

SIT

ES

T2

/A1

0/C

10

69

P9

.3/E

SIC

H3

/ES

ITE

ST

3/A

11

/C11

70

P9

.4/E

SIC

I0/A

12

/C1

27

1P

9.5

/ES

ICI1

/A1

3/C

13

72

P9

.6/E

SIC

I2/A

14

/C1

47

3P

9.7

/ES

ICI3

/A1

5/C

15

74

ES

IVC

C7

5

ESIVSS 76ESICI 77

ESICOM 78AVCC1 79AVSS3 80

PJ.7/HFXOUT 81PJ.6/HFXIN 82

AVSS1 83

P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100

DVCC3 99

DVSS3 98

P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97

P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96

P10.0/SMCLK/S4 95

P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94

P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93

P4.5/UCB1CLK/TA1.0/S7 92

P4.4/UCB1STE/TA1CLK/S8 91

P5.7/UCA1STE/TB0CLK/S9 90

P5.6/UCA1CLK/S10 89

P5.5/UCA1SOMI/UCA1RXD/S11 88

P5.4/UCA1SIMO/UCA1TXD/S12 87

AVSS2 86

PJ.5/LFXOUT 85

PJ.4/LFXIN 84

IC1

12345678910

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

J3

26272829303132333435363738394041424344454647484950

J4

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

J5

767778798081828384858687888990919293949596979899

100

J6

C10

C11

12

JP

12

C12

C13

C14

R7

C15

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

P1.1

P1.1

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

PJ.0

/TD

O

PJ.0/TDO

PJ.2

/TM

S

PJ.2/TMS

PJ.3

/TC

K

PJ.3/TCK

PJ.1

/TD

I

PJ.1/TDI

P1.2

P1.2

BS

LT

X

BS

LT

X

BS

LR

X

BSLRX

P1.3

P1.3

AV

CC

AVCC

AV

SS

AVSS

AVSS

AVSS

LF

XO

UT

LF

XIN

LF

GN

DH

FG

ND

HF

XIN

HF

XO

UT

DV

CC

DV

CC

DVCC

DVCC

DV

CC

DVCC

DV

CC

DV

CC

DV

CC

DV

SS

DVSS

DV

SS

DVSS

TE

ST

/SB

WT

CK

1

TE

ST

/SB

WT

CK

TEST/SBWTCK

TE

ST

/SB

WT

CK

LC

DC

APL

CD

CA

P

ES

IVC

C

ES

IVC

C

ESICOM

ES

ICO

M

ESIVSS

RST/SBWTDIO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

1 2 3 4 5 6

1 2 3 4 5 6

Tite

l:

Da

tum

:

Be

arb

.:

Se

ite1

/1

MS

P-T

S4

30

PZ

10

0D

7/9

/20

13

5:2

3:2

5 P

MA

3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Do

k:

Re

v.:

Figure B-76. MSP-TS430PZ100D Target Socket Module, Schematic

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1

Vccext

int

Vcc

GND

GND

JTAG

SBW

RESET

Ext.

Pwr.

PW

R

DVCC

AVCC

TC

K

TM

S

TD

I

TD

O

RST/SBWTDIO

TE

ST

/SB

WT

CK

GND

GND

P1.3

ESIVCC

14

1

2

10

1

2

1

111111

12

55

10

15

20

2650 30354045

51

75

55

60

65

70

76 10080 85 90 95

MS

P-T

S4

30

PZ

10

0D

Re

v. 1

.2R

oH

S

Q2 Q1

P1

.0

P1

.1

P1

.2

JTAG

C2

C1

C4

R1

BSL

R2

R3

J2

J1

JP

1JP

9C5R

4

JP

3

JP

4

JP

5

JP

6

JP

7

JP

8

R5

R6

C3

C6C7

D1

R1

0JP

10

D2

R11

JP

11

D3

R12

JP2

C8

C9

R8

R9

SW

1

R1

3

TP2

TP1

SW

2

R14 IC1

J3

J4

J5

J6

C10

C11

JP12

C1

2C

13

C14

R7

C1

5 Orient Pin 1 of MSP430 deviceLEDs connected to

P1.0, P1.1, P1.2 throughJP9, JP10, JP11

(only D1 assembled)










HF and LF oscillators withcapacitors and resistorsto connect pinheads

Figure B-77. MSP-TS430PZ100D Target Socket Module, PCB

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Table B-39. MSP-TS430PZ100D Bill of Materials

Pos. Ref DesNumber

PerBoard


1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100DRev 1.2

2 layers, white solder mask

2 JP1, JP2,JP9


3 JP10, JP11,JP12

3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder


5 JP3, JP4,JP5, JP6,JP7, JP8



7 R2, R3, R5,R6, R8, R9

6 0R, 0805 541-0.0ATR-ND DNP

8 R7, R12,R13

3 0R, 0805 541-0.0ATR-ND

9 C5 1 1.1nF, CSMD0805 490-1623-2-ND

10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND

11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND DNP

12 R4 1 47k, 0805 541-47KATR-ND

13 C4, C6, C10,C11

4 100nF, CSMD0805 490-1666-1-ND

14 C13 1 100nF, CSMD0805 490-1666-1-ND DNP

15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP

16 R1 1 330R, 0805 541-330ATR-ND

17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP

18 R10, R11 2 330R, 0805 541-330ATR-ND DNP

19 R14 1 47k, 0805 541-47KATR-ND DNP

20 C1, C2, C8,C9

4 DNP, CSMD0805 DNP

21 SW2 1 EVQ-11L05R P8079STB-ND DNP

22 SW1 1 EVQ-11L05R P8079STB-ND DNP


SAM1029-25-ND

DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Header

24 J3, J4, J5, J6 4 25-pin receptacle, TH

SAM1213-25-ND

DNP: headers and receptacles enclosedwith kit. Keep vias free of solder.: Receptacle


26 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder


28 IC1 1 Socket: IC201-1004-008 Manuf. Yamaichi

29 IC1 1 MSP430FR6989 DNP: enclosed with kit. Is supplied by TI

30 Q1 1 DNP: MS3V-TR1 (32768kHz/20ppm/12,5pF)

depends on application Micro Crystal, DNP, enclosed in kit, keepvias free of solder

31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder

32 D1 1 green LED, DIODE0805 P516TR-ND



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Table B-39. MSP-TS430PZ100D Bill of Materials (continued)

Pos. Ref DesNumber

PerBoard


35 Rubberstand off

4 Buerklin: 20H1724 apply to corners at bottom side

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B.39 MSP-TS430PZ100E

Figure B-78. MSP-TS430PZ100E Target Socket Module, Schematic

Hardware www.ti.com



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Jumpers JP1 to JP4Open to measure current


Jumpers JP11, JP12Open to disconnect LEDs D1 and D2



BSL Interface SwitchesSelect which BSL interface to connectto connector BSL

I2C pullup enable switchSwitch On to connect I2C pullup resistors



Figure B-79. MSP-TS430PZ100E Target Socket Module, PCB

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Table B-40. MSP-TS430PZ100E Bill of MaterialsItem No. Designator Quantity Description Supplier Part Number Note

1 PCB1 1 PCB, 3.20" x 4.50" 2 layers, yellow soldermask

2 BSL 1 Header(Shrouded), 2.54mm, 5x2,Gold, TH AWHW-10G-0202-T-ND

3 C1, C2 2 CAP, CERM, 12 pF, 50 V, ±5%, C0G/NP0, 0805 311-1100-1-ND DNP

4 C3, C7 2 CAP, CERM, 1 µF, 10 V, ±10%, X5R,0805 490-1702-1-ND

5 C4, C6, C10, C11 4 CAP, CERM, 0.1 µF, 50 V, ±10%,X7R, 0805 490-1666-1-ND

6 C5 1 CAP, CERM, 1100 pF, 50 V, ±5%,C0G/NP0, 0805 490-1623-1-ND

7 C8, C9 2 CAP, CERM, 22 pF, 50 V, ±5%, C0G/NP0, 0805 490-3608-1-ND DNP

8 C12 1 CAP, CERM, 4.7 µF, 10 V, +80/-20%,Y5V, 0805 311-1371-2-ND DNP

9 C13 1 CAP, CERM, 1000 pF, 50 V, ±5%,C0G/NP0, AEC-Q200 Grade 1, 0805 490-8032-1-ND

10 C14, C15 2 CAP, CERM, 27 pF, 50 V, ±5%, C0G/NP0, 0603 490-1413-1-ND

11 C16 1 CAP, CERM, 47 µF, 6.3 V, ±20%,X5R, 0805 490-9960-1-ND

12 D1 1 LED, Green, SMD 754-1939-1-ND

13 D2 1 LED, Blue, SMD 732-4982-1-ND

14 H1, H2, H3, H4 4 125mil Mounting Hole

15 H5, H6, H7, H8 4 Bumpon, Cylindrical, 0.312 X 0.200,Black SJ5746-0-ND

16 IC1 1 Socket, QFP-100, 0.5 mm Pitch

17 J1, J2, JP5, JP6, JP7,JP8, JP9, JP10 8 Header, 100mil, 3x1, Gold, TH SAM1029-03-ND

18 J3, J4, J5, J6 4 Header, 100mil, 25x1, Gold, TH SAM1029-25-NDDNP: Headers areenclosed in kit. Keepvias free of solder

19 J3, J4, J5, J6 4 Receptacle, 100mil, 25x1, Gold, TH SAM1213-25-NDDNP: Receptacles areenclosed in kit. Keepvias free of solder

20 JP1, JP2, JP3, JP4,JP11, JP12, JP13, JP14 8 Header, 100mil, 2x1, Gold, TH SAM1029-02-ND

21 JTAG 1 Header (shrouded), 100 mil, 7x2,Gold, TH S9170-ND

22 Q1, Q2 2 32.768kHz ±20ppm 12.5pF 94M8466 DNP: Keep holes free ofsolder

23 Q3 1 ZTACS Crystal Resonator 77D9806 DNP

24 R1 1 RES, 330, 5%, 0.125 W, 0805 541-330ACT-ND

25 R2 1 RES, 200, 5%, 0.125 W, 0805 541-200ACT-ND

26 R3, R10, R11, R12,R18, R19, R20, R21 8 RES, 0, 5%, 0.125 W, 0805 541-0.0ACT-ND

27 R4, R5, R6, R8, R9,R14, R15 7 RES, 0, 5%, 0.1 W, 0603 541-0.0GCT-ND DNP

28 R7 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND

29 R13 1 RES, 47 k, 5%, 0.125 W, 0805 541-47KACT-ND DNP

30 R16, R17 2 RES, 4.7 k, 5%, 0.125 W, 0805 541-4.7KACT-ND

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Table B-40. MSP-TS430PZ100E Bill of Materials (continued)Item No. Designator Quantity Description Supplier Part Number Note

31 R22 1 RES, 22, 5%, 0.1 W, 0603 541-22GCT-ND

32

SH‑J1, SH‑JP1,SH‑JP2, SH‑JP3,SH‑JP4, SH‑JP5,SH‑JP6, SH‑JP7,SH‑JP8, SH‑JP9,

SH‑JP10, SH‑JP11,SH‑JP12, SH‑JP13,

SH‑JP14

15 Shunt, 100mil, Gold plated, Black 3M9580-ND

J1: 1-2, JP1: 1-2, JP2:1-2, JP3: 1-2, JP4: 1-2,JP5: 2-3, JP6: 2-3, JP7:2-3, JP8: 2-3, JP9: 2-3,JP10: 2-3, JP11: 1-2,JP12: 1-2, JP13: 1-2,JP14: 1-2

33 SW1, SW2 2 Switch Tactile SPST-NO 0.02A 15V P8079STB-ND

34 SW3, SW4, SW5 3 Switch, DPST, Slide, Off-On, 1 Pos,0.15A, 30V, TH GH7727-ND

Install with arrowmatching arrow onPCB. S5 should be"ON", S3 and S4 shouldbe "OFF"

35 TP1, TP2, TP3, TP4,TP5, TP6 6 Test Point, Miniature, Black, TH 36-5001-ND DNP

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B.40 MSP-TS430PZ5x100

Figure B-80. MSP-TS430PZ5x100 Target Socket Module, Schematic

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Jumper JP3 to "ext"









Figure B-81. MSP-TS430PZ5x100 Target Socket Module, PCB

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Table B-41. MSP-TS430PZ5x100 Bill of MaterialsPos. Ref Des No. Per


1 C1, C2 0 12pF, SMD0805 DNP

1b C3, C4 47pF, SMD0805 DNP: Only recommendation.Check your crystal spec.


3 C5, C10, C11,C12, C13, C14 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14

4 C8 0 2.2nF, SMD0805 DNP

5 C9 1 470nF, SMD0805 478-1403-2-ND

6 D1 1 green LED, SMD0805 67-1553-1-ND





9JP5, JP6, JP7,

JP8, JP9,JP10




12 9 Jumper 15-38-1024-ND Place on JP1, JP2, JP3, JP5,JP6, JP7, JP8, JP9, JP10




16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

17R1, R2, R4,R6, R8, R9,

R10, R11, R123 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,

R12

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND



21 Rubberstandoff 4 Select appropriate Apply to corners at bottom side

22 MSP430 2 MSP430F5438IPZ DNP: Enclosed with kit suppliedby TI

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B.41 MSP-TS430PZ100USBDue to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately 0.3 Vlower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for example, torun the MCU at 3.0 V, set it to 3.3 V.

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Figure B-82. MSP-TS430PZ100USB Target Socket Module, Schematic

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Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE

LED1, D2, D3LEDs connected to P8.0,

LE LEP8.1, P8.2






USB1USB connector





Figure B-83. MSP-TS430PZ100USB Target Socket Module, PCB

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Table B-42. MSP-TS430PZ100USB Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805


3 C5, C11, C13,C14, C19 5 100nF, SMD0805 311-1245-2-ND

3.1 C10, C12,C18, C17 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17

4 C8 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 478-1403-2-ND


7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND


7.1 4 25-pin header, TH SAM1213-25-ND



9JP5, JP6, JP7,

JP8, JP9,JP10






14 Q1 0 Crystal Micro Crystal MS1V-T1K32.768kHz, C(Load) = 12.5pF

DNP: Q1. Keep vias free ofsolder

15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

17R1, R2, R4,R6, R8, R9,

R123 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500

18 R11 1 1M Ω, SMD0603 not existing in Rev 1.0

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND




22 MSP430 2 MSP430F6638IPZ DNP: enclosed with kit. Issupplied by TI



24 C16 1 4.7 nF SMD0603

27 C33 1 220n SMD0603 Buerklin: 53D2074

28 C35, C36 2 10p SMD0603 Buerklin: 56D102

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Table B-42. MSP-TS430PZ100USB Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment30 C38 1 220n SMD0603 Buerklin: 53D2074

31 C39 1 4u7 SMD0603 Buerklin: 53D2086

32 C40 1 0.1u SMD0603 Buerklin: 53D2068


34 IC7 1 TPD4E004 Manu: TI


36 LED1, LED2,LED3 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP

37 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP

38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612

39 R34 1 27R SMD0603 Buerklin: 07E444

40 R35 1 27R SMD0603 Buerklin: 07E444

41 R36 1 33k SMD0603 Buerklin: 07E740

42 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)


44 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1

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B.42 MSP-TS430PZ100AUSBThe development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642xflash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-TS430PZ100AUSB kit. Free samples can be ordered from www.ti.com/product/MSP430FG6626/samplebuy.

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0R

12pF

12pF

47pF

47pF

GN

D

0R

100nF

330R

10uF

/6,3

V

10uF/6,3V

2.2

nF

PWR3

GN

D

GN

D

GN

D

GN

D0R

47K

100nF

100nF

470nF

100nF

100nF

0R0

R

0R

0R

GN

D

GN

DG

ND

GN

DG

ND

1k4

10p

10p

27R

27R

33k

4u7

GN

D

LL103A

TPD4E004

0.1

u

220n

220n

GN

D

GN

D

VCC

GN

DG

ND

470R

GN

D

470R

GN

D

470R

100nF

GN

D 100nF

100nF

GN

D

100R

100nF

LL103A

1M

GN

D

4.7

n

HCTC_XTL_4

HCTC_XTL_4

MS

P4

30

FG

66

26

IPZ

0R22nF

QU

AR

Z5

DN

P

1.1

for

MS

P4

30

FG

66

26

IPZ

de

vic

e

Ta

rge

tso

cke

tb

oa

rdM

SP

-TS

43

0P

Z1

00

AU

SB

Socket:

Ya

maic

hi

IC357-1

004-0

53N

DN

P

<-

SB

W

<-

JTA

G

Vcc

int

ext

GN

D

DN

P

DN

PD

NP

DN

P

DN

P

DN

P

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3

C6

C7

C8

J5123

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

J1

26272829303132333435363738394041424344454647484950

J2

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

J3

767778798081828384858687888990919293949596979899

100

J4

JP

112

JP2

12

R4

123

JP

5123

JP

6123

JP

7123

JP

8123

JP

9123 JP

10

R5

C11

C12

D1

C9

C13

C10

R6

R8

R9

R12

1 2 3

JP

3

US

B1

VB

US

1

GN

D4

D-

2

D+

3

SH

IELD

5

SH

IELD

16

R33

C35

C36

R34

R35

R36

C39

D2

IC7

IO11

IO22

GND3

VCC6

IO45

IO34

C40

C33

C38

JP

412

LED3

S1

1 2

S2

1 2

R13

LED1

R15

LED2

R16

LE

D-1

12

LE

D-2

34

LE

D-3

56

C17

C18

C19

R10S3

1 2

C14

D4

R11

C16

JP

11

1 2 3 4

Q2G$1

2 1

Q2G$2

4 3

P6.4

/CB

4/A

D0+

/OA

0O

1

P6.5

/CB

5/A

D0-/O

A0N

2

P6.6

/CB

6/A

D1+

/GS

W0A

3

P6.7

/CB

7/A

D1-/G

SW

0B

4

P7.4

/CB

8/A

D2+

/OA

1O

5

P7.5

/CB

9/A

D2-/O

A1N

6

P7.6

/CB

10/A

D3+

/GS

W1A

7

P7.7

/CB

11/A

D3-/G

SW

1B

8

P5.0

/VR

EF

+/V

ER

EF

+9

P5.1

//A4/D

AC

010

P5.6

/A5/D

AC

111

NR

12

AV

SS

113

XO

UT

14

XIN

15

AV

CC

16

CP

CA

P17

P2.0

/P2M

AP

0/D

AC

018

P2.1

/P2M

AP

1/D

AC

119

P2.2

/P2M

AP

220

P2.3

/P2M

AP

321

P2.4

/P2M

AP

4/R

03

22

P2.5

/P2M

AP

523

P2.6

/P2M

AP

6/L

CD

RE

F/R

13

24

P2.7

/P2M

AP

7/R

23

25

DVCC126

DVSS127

VCORE28

LCDCAP/R3329

COM030

P5.3/COM1/S4231

P5.4/COM2/S4132

P5.5/COM3/S4033

P1.0/TA0CLK/ACLK/S3934

P1.1/TA0.0/S3835

P1.2/TA0.1/S3736

P1.3/TA0.2/S3637

P1.4/TA0.3/S3538

P1.5/TA0.4/S3439

P1.6/TA0.1/S3340

P1.7/TA0.2/S3241

P3.0/TA1CLK/CBOUT/S3142

P3.1/TA1.0/S3043

P3.2/TA1.1/S2944

P3.3/TA1.2/S2845

P3.4/TA2CLK/SMCLK/S2746

P3.5/TA2.0/S2647

P3.6/TA2.1/S2548

P3.7/TA2.2/S2449

P4.0/TB0.0/S2350

P4.1

/TB

0.1

/S22

51

P4.2

/TB

0.2

/S21

52

P4.3

/TB

0.3

/S20

53

P4.4

/TB

0.4

/S19

54

P4.5

/TB

0.5

/S18

55

P4.6

/TB

0.6

/S17

56

P4.7

/TB

0O

UT

H/S

VM

OU

T/S

16

57

P8.0

/TB

0C

LK

/S15

58

P8.1

/UC

B1S

TE

/UC

A1C

LK

/S14

59

P8.2

/UC

A1T

XD

/UC

A1S

IMO

/S13

60

P8.3

/UC

A1R

XD

/UC

A1S

OM

I/S12

61

P8.4

/UC

B1C

LK

/UC

A1S

TE

/S11

62

DV

SS

263

DV

CC

264

P8.5

/UC

B1S

IMO

/UC

B1S

DA

/S10

65

P8.6

/UC

B1S

OM

I/UC

B1S

CL/S

966

P8.7

/S8

67

P9.0

/S7

68

P9.1

/S6

69

P9.2

/S5

70

P9.3

/S4

71

P9.4

/S3

72

P9.5

/S2

73

P9.6

/S1

74

P9.7

/S0

75

VSSU76

PU.0/DP77

PUR78

PU.1/DM79

VBUS80

VUSB81

V1882

AVSS283

P7.2/XT2IN84

P7.3/XT2OUT85

VBAK86

VBAT87

P5.7/DMAE0/RTCCLK88

DVCC389

DVSS390

TEST/SBWTCK91

PJ.0/TDO92

PJ.1/TDI/TCLK93

PJ.2/TMS94

PJ.3/TCK95

RST/NMI/SBWTDIO96

P6.0/CB0/A097

P6.1/CB1/A198

P6.2/CB2/A2/OA0IP099

P6.3/CB3/A3/OA1IP0100

U1

R14

C15

TP2TP1

Q3

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

TD

O

XIN

XIN

VC

C

GND

GN

D

GND

GN

D

GN

DGND

XO

UT

XO

UT

P1.0

P1.0

DV

CC

1

DV

CC

1

DV

CC

1

DV

CC

1

DV

CC

1

DV

CC

1

DVCC1

AV

CC

AV

CC

XT

2O

UT

AVSS

AVSS

AV

SS

AV

SS

M

M

I

I

O

O

XT

2IN

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

KC

C

TE

ST

/SB

WT

CK

1

RS

T

RS

T

XTLGND2

XTLGND1

PU

.0/D

P

PU.0/DP

PU.0/DP

PU

R

PUR

PUR

PU

.1/D

M

PU.1/DM

PU.1/DM

VBUS

VBUS

VB

US

D-

D+

VUSB

VU

SB

VUSB

V18

V18

P1.6

P1.6

P1.7

P1.7

P8.0

P8.0

P8.1

P8.1

P8.2

P8.2

VBAK

VB

AK

VBATV

BA

T

CP

CA

P

NR

NR

TE

ST

/SB

WT

CK

US

BIn

terfa

ce

Mis

ce

llan

eo

us

DN

P

+

+

Figure B-84. MSP-TS430PZ100AUSB Target Socket Module, Schematic

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Jumpers LED 1, 2, 3Open to disconnect LED1, D2, D3LE LE

LED1, D2, D3LEDs connected to P8.0,

LE LEP8.1, P8.2






USB1USB connector





141

2

GN

D

GN

D

VC

C

125

510

15

20

26 5030 35 40 45 51

75

55

60

65

70

76100 80859095

12

3

12

3

12

3

12

3

12

3

12

3

123

1 2 3

1 2 3 4

+

+

J1 J2

U1

Figure B-85. MSP-TS430PZ100AUSB Target Socket Module, PCB

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Table B-43. MSP-TS430PZ100AUSB Bill of MaterialsPos. Ref Des No. Per Board Description Digi-Key Part No. Comment

1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask

2 C1, C2 2 12pF, SMD0805 DNP: C1, C2

3 C10, C12,C17, C18 9 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17

4 C15 1 22nF, CSMD0805 311-1242-1-ND

5 C16 1 4.7 nF SMD0603 311-1250-1-ND

6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND

7 C33, C38 2 220n SMD0603 Buerklin: 53D2074

8 C35, C36 2 10p SMD0603 Buerklin: 56D102

9 C39 1 4u7 SMD0603 Buerklin: 53D2086

10 C40 1 0.1u SMD0603 Buerklin: 53D2068

11 C5, C11, C13,C14, C19 5 100nF, SMD0805 311-1245-2-ND

12 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND

13 C8 1 2.2nF, CSMD0805 709-1339-1-ND

14 C9 1 470nF, SMD0805 478-1403-2-ND


16 D2, D4 2 LL103A, SOD-80 Buerklin: 24S3406

17 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI

18 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND DNP: Headers enclosed in kit.Keep vias free of solder.

19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND DNP: Receptacles enclosed inkit. Keep vias free of solder.



22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 2


24JP5, JP6, JP7,

JP8, JP9,JP10


25

Jumpers forJP1, JP2, JP3,JP4, JP5, JP6,JP7, JP8, JP9,

JP10, JP11

11 Jumper 15-38-1024-ND



28 LED1, LED2,LED3 3 FARNELL: 852-9833 DNP

29 MSP430 2 MSP430FG6626IPZ DNP: Free samples can beordered in the TI Store

30 Q2 1 Crystal Q2: 4MHzBuerklin: 78D134

31 Q3 1 MS3V-T1R (32.768kHz/20ppm/12.5pF)

32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND

33 R10 1 100R, R0603 541-100GCT-ND

34 R11 1 1M, R0603 541-1.0MGCT-ND

35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 DNP

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Table B-43. MSP-TS430PZ100AUSB Bill of Materials (continued)Pos. Ref Des No. Per Board Description Digi-Key Part No. Comment36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND

37 R3 1 330 Ohm, SMD0805 541-330ATR-ND

38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612

39 R34, R35 2 27R SMD0603 Buerklin: 07E444

40 R36 1 33k SMD0603 Buerklin: 07E740

41 R5 1 47k Ohm, SMD0805 541-47000ATR-ND

42 R6, R8, R9,R12 4 0 Ohm, SMD0805 541-000ATR-ND DNP

43 S1, S2 1 PB P12225STB-ND DNP

44 S3 1 PB P12225STB-ND

45 TP1, TP2 2 Test point DNP, Keep vias free of solder


47 USB1 1 USB Receptacle FARNELL: 117-7885

48 Insulating diskfor Q2 1 Insulating disk for Q2 ettinger.de 70.08.121

49 Rubber standoff 4 Buerklin: 20H1724 Apply to corners at bottom side

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B.43 MSP-TS430PEU128

0R

12pF

12pF

GN

D

GN

D

0R

100nF

330R

2.2

nF

0R

0R

PWR3

GN

D

330R

47K

0R

0R

100nF

4.7

uF

GN

D

GN

D

100nF470nF

0R

QUARZ5

100nF

10uF

/6,3

V

10uF

/6,3

V

100nF

4.7

uF

4.7

uF

100nF

4.7uF

4.7

uF

4.7

uF

470nF

FE

04-1

VC

C

GN

D

GN

D

100nF

4.7uF

GN

D

GN

D

GN

D

GN

D

GN

D

VCC1

VC

C1

VC

C1

VC

C1

VC

C1

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

AV

SS

AV

SS

AV

CC

DV

CC

GND

VC

C

VCC

GN

D

MS

P4

30

:Ta

rge

t-So

cke

t

MS

P-T

S4

30

PE

U1

28

for

F6

77

9

Pe

ters

en

10

80

/1/0

01

/01

.1

DN

P

LF

XT

CL

K

DN

P

<-

SB

W

<-

JTA

G

DN

P

Vcc

int

ext

DN

P

DN

P

DN

P

DNP

DN

P

DN

P

DN

P

DV

DS

YS

1.1

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

J1

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

J2

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

J3

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126127

128

J4

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

R1

C5

R3

12

34

56

78

910

BO

OT

ST

C3

R10

R11

J51

2

3

12

JP

1

JP

2

1 2

123

JP

5123

JP

6123

JP

7123

JP

8123

JP

9123 JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C10

R4

Q1

JP

12

1234

1234

JP

11

JP

13

1234

C4

C11

C12

C8

C13

C14

C9

C16

C19

C18

C26

1

2

JP

4

JP

3

1 2 3 4

C15

C17

TP1 TP2

IC1

MS

P430F

677X

IPE

U#

XIN

1

XO

UT

2

AU

XV

CC

33

RT

CC

AP

14

RT

CC

AP

05

P1.5

/SM

CLK

/CB

0/A

56

P1.4

/MC

LK

/SD

CLK

/CB

1/A

47

P1.3

/AD

C10C

LK

/TA

CLK

/RT

CC

LK

/A3

8

P1.2

/AC

LK

/TA

3.1

/A2

9

P1.1

/TA

2.1

/VE

RE

F+

/A1

10

P1.0

/TA

1.1

/TA

0.0

/VE

RE

F-/A

011

P2.4

/PM

_TA

2.0

12

P2.5

/PM

_U

CB

0S

OM

I/PM

_U

CB

0S

CL

13

P2.6

/PM

_U

SB

0S

IMO

/PM

_U

CB

0S

DA

14

P2.7

/PM

_U

CB

0C

LK

15

P3.0

/PM

_U

CA

0R

XD

/PM

_U

CA

0S

OM

I16

P3.1

/PM

_U

CA

0T

XD

/PM

_U

CA

0S

IMO

17

P3.2

/PM

_U

CA

0C

LK

18

P3.3

/PM

_U

CA

1C

LK

19

P3.4

/PM

_U

CA

1R

XD

/PM

_U

CA

1S

OM

I20

P3.5

/PM

_U

CA

1T

XD

/PM

_U

CA

1S

IMO

21

CO

M0

22

CO

M1

23

P1.6

/CO

M2

24

P1.7

/CO

M3

25

P5.0

/CO

M4

26

P5.1

/CO

M5

27

P5.2

/CO

M6

28

P5.3

/CO

M7

29

LC

DC

AP

/R33

30

P5.4

/SD

CLK

/R23

31

P5.5

/SD

0D

IO/L

CD

RE

F/R

13

32

P5.6

/SD

1D

IO/R

03

33

P5.7

/SD

2D

IO/C

B2

34

P6.0

/SD

3D

IO35

P3.6

/PM

_U

CA

2R

XD

/PM

_U

CA

2S

OM

I36

P3.7

/PM

_U

CA

2T

XD

/PM

_U

CA

2S

IMO

37

P4.0

/PM

_U

CA

2C

LK

38

P4.1/PM_UCA3RXD/PM_UCA3SOMI39

P4.2/PM_UCA3TXD/PM_UCA3SIMO40

P4.3/PM_UCA3CLK41

P4.4/PM_UCB1SOMI/PM_UCB1SCL42

P4.5/PM_UCB1SIMO/PM_UCB1SDA43

P4.6/PM_UCB1CLK44

P4.7/PM_TA3.045

P6.1/SD4DIO/S3946

P6.2/SD5DIO/S3847

P6.3/SD6DIO/S3748

P6.4/S3649

P6.5/S3550

P6.6/S3451

P6.7/S3352

P7.0/S3253

P7.1/S3154

P7.2/S3055

P7.3/S2956

P7.4/S2857

P7.5/S2758

P7.6/S2659

P7.7/S2560

P8.0/S2461

P8.1/S2362

P8.2/S2263

P8.3/S2164

P8.4

/S20

65

P8.5

/S19

66

P8.6

/S18

67

P8.7

/S17

68

DV

SY

S69

DV

SS

270

P9.0

/S16

71

P9.1

/S15

72

P9.2

/S14

73

P9.3

/S13

74

P9.4

/S12

75

P9.5

/S11

76

P9.6

/S10

77

P9.7

/S9

78

P10.0

/S8

79

P10.1

/S7

80

P10.2

/S6

81

P10.3

/S5

82

P10.4

/S4

83

P10.5

/S3

84

P10.6

/S2

85

P10.7

/S1

86

P11

.0/S

087

P11

.1/T

A3.1

/CB

388

P11

.2/T

A1.1

89

P11

.3/T

A2.1

90

P11

.4/C

BO

UT

91

P11

.5/T

AC

LK

/RT

CC

LK

92

P2.0

/PM

_TA

0.0

93

P2.1

/PM

_TA

0.1

94

P2.2

/PM

_TA

0.2

95

P2.3

/PM

_TA

1.0

96

TE

ST

/SB

WT

CK

97

PJ.0

/TD

O98

PJ.1

/TD

I/TC

LK

99

PJ.2

/TM

S100

PJ.3

/TC

K101

~R

ST

/NM

I/SB

WT

DIO

102

SD0P0103

SD0N0104

SD1P0105

SD1N0106

SD2P0107

SD2N0108

SD3P0109

SD3N0110

VASYS2111

AVSS2112

VREF113

SD4P0114

SD4N0115

SD5P0116

SD5N0117

SD6P0118

SD6N0119

AVSS1120

AVCC121

VASYS1122

AUXVCC2123

AUXVCC1124

VDSYS125

DVCC126

DVSS1127

VCORE128

P1.0

P1.0

P2.0

P2.0

P2.1

P2.1

SD0P0SD0N0SD1P0SD1N0SD2P0SD2N0SD3P0SD3N0

SD4P0SD4N0SD5P0SD5N0SD6P0SD6N0

VA

SY

S1/2

VASYS1/2

VASYS1/2

VA

SY

S1/2

TM

ST

MS

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

GN

D

GND

XIN

DVCC

AVCC

DV

DS

YS

DV

DS

YS

DV

DS

YS

DVDSYS

AVSS

AVSS

PJ.2

PJ.2

PJ.1

PJ.1

PJ.0

PJ.0

RS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

KP

J.3

PJ.3

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

RS

T

RS

T

RS

T

RS

T

LC

DC

AP

LC

DC

AP

VR

EF

VREF

VE

RE

F+

VE

RE

F+

VCORE

AU

XV

CC

2

AUXVCC2

AU

XV

CC

1

AUXVCC1

AU

XV

CC

3

AU

XV

CC

3

1 2 3 4 5 6

1 2 3 4 5 6

Tite

l:

Da

tum

:

Be

arb

.:

Se

ite1

/1

MS

P-T

S4

30

PE

U1

28

22

.05

.20

12

09

:37

:33

A3

IH

GF

ED

CB

A AB

CD

EF

GH

I

File

:

Do

k:

Re

v.:

Figure B-86. MSP-TS430PEU128 Target Socket Module, Schematic

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1

P1.0

SB

W

JTA

G

DVDSYS

ext

int

MSP-TS430PEU128Rev. 1.1 RoHS

DVCC

AUXVCC

GND

AU

XV

CC

1

AU

XV

CC

2

AU

XV

CC

3

GND

GND

RST/NMI

TCK

TDI

TDO

TEST/SBWTCK

TMS

12

55

10

15

20

30

35

6040 45 50 55 64

65

90

70

75

80

85

95

10

0

125 105110115120128

14

12

10

12G

ND

GN

D

VC

C

123

123

123

123

123

123

12

34

12

34

12

34

1

J1

J2

J3

J4

JTA

G

R2

C2

C1R

1C

5R3

BOOTST

C3

R1

0R

11

J5

JP

1

JP

2

JP5

JP6

JP7

JP8

JP9

JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C1

0

R4

JP

12

JP

11

JP

13

C4

C11

C1

2

C8

C1

3

C1

4

C9

C1

6

C1

9

C1

8

C2

6

JP

4

JP3

C1

5C

17

TP1

TP2

IC1





JP11, JP12, JP13Connect 1-2 to connect AUXVCCx with DVCC or

drive AUXVCCx externally






Figure B-87. MSP-TS430PEU128 Target Socket Module, PCB

Note


Note

The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:• R7 value is changed to 0 Ω instead of 330 Ω.• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.• JP5 pin 2 is connected to IC1 pin 97.• BOOTST pin 7 is connected to IC1 pin 97.

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Table B-44. MSP-TS430PEU128 Bill of MaterialsPos. Ref Des No. Per


1 PCB 1 94x119.4mm, 4 layers MSP-TS430PEU128Rev. 1.1

4 layers, green solder mask

2 D1 1 green LED, DIODE0805 516-1434-1-ND

3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

4 JP5, JP6, JP7, JP8,JP9, JP10 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)

5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)

6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2

7

JP1, JP2, JP3, JP4,JP5, JP6, JP7, JP8,

JP9, JP10, JP11,JP12, JP13

13

Jumper WM4592-ND

8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND

9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP

10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP

11 C13, C14, C16, C17,C18, C19, C29 7 4.7uF, 6.3V, CSMD0805 587-1302-2-ND

12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND

13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP

14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP

15 R5 1 47K, 0805 311-47KARTR-ND

16 C4, C5, C6, C7, C8,C15 6 100nF, CSMD0805 311-1245-2-ND

17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP

18 R3, R7 2 330R, 0805 541-330ATR-ND

19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND



22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi

23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI


25 Q1 1 Crystal: MS3V-T1R 32.768kHz12.5pF ±20ppm

DNP: Crystal enclosed with kit. Keep vias freeof solder

26 TP1, TP2 2 Test point DNP, keep vias free of solder

27 J2,J4 2 26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias freeof solder.

28 J2,J4 2 26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep viasfree of solder.

29 J1, J3 2 38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias freeof solder.

30 J1, J3 2 38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep viasfree of solder.

31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners

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B.44 EM430F5137RF900

Figure B-88. EM430F5137RF900 Target Board, Schematic

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CON12External power connector

Jumper JP2 to "EXT" GND

GND

VCC

Jumpers JP5, JP10Open to disconnect LEDs

D2LED (red) connectedto P3.6 through JP10

D1LED (green) connected

to P1.0 through JP5

Crystal Q1RF - 26 MHz

X1RF - Signal SMA

Button S1Reset

Push-button S2Connected to P1.7

Jumper JP1 in Spy-Bi-Wire mode

Q3Footprint for 32-kHz crystal

R431 and R441

Use 0- resistor to make XIN and XOUTavailable on connector Port 5

W


Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)



Jumper JP1

Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode

Figure B-89. EM430F5137RF900 Target board, PCB

The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure correctbattery insertion regarding the polarity as indicated in battery holder.

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Table B-45. EM430F5137RF900 Bill of MaterialsItem Reference No. per

Board Description Value Manufacturer's PartNumber Manufacturer Comment

1 Q1 1 ( CUSTOMER SUPPLY )CRYSTAL, SMT, 4P, 26MHz 26M ASX-531(CS) AKER

ELECTRONIC

2

C1-C5, C082,C222, C271,C281, C311,C321, C341,C412, C452

14 CAPACITOR, SMT, 0402, CER,16V, 10%, 0.1uF 0.1uF 0402YC104KAT2A AVX

3 C071 1CAPACITOR, SMT, 0603,CERAMIC, 0.47uF, 16V, 10%,X5R

0.47uF 0603YD474KAT2A AVX

4 R401 1 RES0402, 47.0K 47kΩ CRCW04024702F100 DALE

5 CON11 1 HEADER, THU, MALE, 14P, 2X7,25.4x9.2x9.45mm 09 18 514 6323 HARTING

6 CON10 0 HEADER, THU, MALE, 10P, 2X5,20.32x9.2x9.45mm 09 18 510 6323 HARTING DNP

7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT

9 Q3 0 UNINSTALLED CRYSTAL, SMT,3P, MS1V (Customer Supply) 32.768k MS1V-T1K (UN) MICRO CRYSTAL DNP

10 CON12 1 HEADER, THU, MALE, 3P, 1x3,9.9x4.9x5.9mm 22-03-5035 MOLEX

11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA

12 L341 1 FERRITE, SMT, 0402, 1.0kΩ,250mA 1kΩ BLM15HG102SN1D MURATA

13 C293 1CAPACITOR, SMT, 0402,CERAMIC, 100pF, 50V, 0.25pF,C0G(NP0)

100pF GRM1555C1H101JZ01 MURATA

14 L304 1 INDUCTOR, SMT, 0402, 2.2nH,0.1nH, 220mA, 500MHz

0.0022uH LQP15MN2N2B02 MURATA

15 L303, L305 2 INDUCTOR, SMT, 0402, 15nH,2%, 450mA, 250MHz 0.015uH LQW15AN15NG00 MURATA


17 C291 1CAPACITOR, SMT, 0402,CERAMIC, 1pF, 50V, 0.05pF,C0G(NP0)

1pF GRM1555C1H1R0WZ01 MURATA

18 C303 1CAPACITOR, SMT, 0402,CERAMIC, 8.2pF, 50V, 0.05pF,C0G(NP0)

8.2pF GRM1555C1H8R2WZ01 MURATA

19 C292, C301-C302, C304 4

CAPACITOR, SMT, 0402,CERAMIC, 1.5pF, 50V, 0.05pF,C0G(NP0)

1.5pF GRM1555C1H1R5WZ01 MURATA


21C282, C312,C351, C361,

C3715 CAPACITOR, SMT, 0402,

CERAMIC, 2pF, 50V, 0.1pF, C0G 2.0pF GRM1555C1H2R0BZ01 Murata

22 L1 1 INDUCTOR, SMT, 0402, 6.2nH,0.1nH, 130mA, 500MHz 6.2nH LQP15MN6N2B02 Murata

23 S1-S2 2ULTRA-SMALL TACTILESWITCH, SMT, 2P, SPST-NO,1.2x3x2.5mm, 0.05A, 12V

B3U-1000P OMRON

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Table B-45. EM430F5137RF900 Bill of Materials (continued)Item Reference No. per

Board Description Value Manufacturer's PartNumber Manufacturer Comment

24R4-R5, R051,R061, R431,

R4410

UNINSTALLED RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,1/16W

0Ω ERJ-2GE0R00X PANASONIC DNP

24a R7 1 RESISTOR/JUMPER, SMT,0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC

25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICKFILM, 5%, 1/16W, 330 330Ω ERJ-2GEJ331 PANASONIC

26 C431, C441 0 CAPACITOR, SMT, 0402, CER,12pF, 50V, 5%, NPO 12pF ECJ-0EC1H120J PANASONIC

27 C401 1 CAPACITOR, SMT, 0402, CER,2200pF, 50V, 10%, X7R 0.0022uF ECJ-0EB1H222K PANASONIC

28 R331 1 RESISTOR, SMT, THICK FILM,56K, 1/16W, 5% 56kΩ ERJ-2GEJ563 PANASONIC

29 C081, C221,C411, C451 4 CAPACITOR, SMT, 0603,

CERAMIC, 10uF, 6.3V, 20%, X5R 10uF ECJ-1VB0J106M PANASONIC

30 R1 1 RESISTOR/JUMPER, SMT,0402, 0 Ω, 5%, 1/16W 0Ω ERJ-2GE0R00X PANASONIC

31 C041 0 UNINSTALLED CAP CERAMIC4.7UF 6.3V X5R 0603 4.7uF ECJ-1VB0J475K Panasonic DNP

32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER

33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP

34 U1 1DUT, SMT, PQFP, RGZ-48,0.5mmLS, 7.15x7.15x1mm,THRM.PAD

CC430F5137 TI

35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH

36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP


38 JP3, JP5,JP10 3 Pin Connector 1x2pin 61300211121 WUERTH

38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP

39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP

40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH

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B.45 EM430F6137RF900


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CON12External power connector

Jumper JP2 to "EXT"

Jumpers JP5, JP10Open to disconnect LEDs

D2LED (red) connectedto P3.6 JP10through


to P1.0 JP5through


X1RF - Signal SMA

Button S1Reset

Push-button S2Connected to P1.7

Q2/Q3Footprint for 32-kHz crystal


GND

GND

VCC

C392C422

L451

Jumper JP1 in Spy-Bi-Wire mode

Jumper JP2Close INT for power supply from JTAG interfaceClose EXT to external power supply (CON12)

Jumper JP1

Close SBW position to debug in Spy-Bi-Wire modeClose JTAG position to debug in 4-wire JTAG mode

R541 and R551

Use 0- resistor to make P5.0 and P5.1available on connector Port 5

W



Figure B-91. EM430F6137RF900 Target Board, PCB

The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure correctbattery insertion regarding the polarity as indicated in battery holder.

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Table B-46. EM430F6137RF900 Bill of MaterialsPos. Ref Des No. per

Board Description Part No. Manufacturer

1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P,26MHz ASX-531(CS) AKER ELECTRONIC

2

C1-C5, C112,C252, C381,C391, C421,C431, C451,C522, C562

14 CAPACITOR, SMT, 0402, CER, 16V, 10%,0.1uF 0402YC104KAT2A AVX

3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,16V, 10%, X5R 0603YD474KAT2A AVX

4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

5 CON11 1 HEADER, THU, MALE, 14P, 2X7,25.4x9.2x9.45mm, 90deg 09 18 514 6323 HARTING

7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT

10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX

11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA

12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA

13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H101JZ01 MURATA

14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,1000mA, 250MHz LQW15AN2N2C10 MURATA

15 L413, L415 2 INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,250MHz LQW15AN15NJ00 MURATA


17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V,±0.25pF, NP0 GJM1555C1H1R0CB01D MURATA

18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA

19 C402, C411-C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,

50V, ±0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA


21 C46-C48, C392,C422 5 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,

50V, ±0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 Murata

22 L1 1 INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,250MHz LQW15AN6N2D00 Murata

23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P,SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON

24 R7 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,1/16W ERJ-2GE0R00X (UN) PANASONIC

25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%,1/16W, 330 ERJ-2GEJ331 PANASONIC

27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V,10%, X7R ECJ-0EB1H222K PANASONIC

28 C111, C251,C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 10uF,

6.3V, 20%, X5R ECJ-1VB0J106M PANASONIC

28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC

29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC

30 R1 1 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,1/16W ERJ-2GE0R00X PANASONIC


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Table B-46. EM430F6137RF900 Bill of Materials (continued)Pos. Ref Des No. per


33 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS,9.15x9.15x1mm, THRM.PAD CC430F6137 TI



36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH


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B.46 EM430F6147RF900


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to P1.0 JP5through

Jumpers JP5 and JP10Open to disconnect LEDs

D2LED (red) connectedto P3.6 through JP10

Jumpers JP6 and JP8Close 1-2 for Bypass modeClose 2-3 for TPS modeJumper JP9

TPS status



TPS62730

Jumper JP2Close INT: Power supply from JTAG interfaceClose EXT: External power supply

Button S2Connected to P1.7

32-kHz crystal

R554 and R551

Use 0- resistor to make P5.0 and P5.1available on connector Port 5

W

Button S1Reset


CON12External poser connector

Jumper JP2 to "EXT"


SMA1RF - Signal SMA

Jumper JP1Close JTAG position to debug in JTAG modeClose SBW position to debug in Spy-BI-Wire mode

Figure B-93. EM430F6147RF900 Target Board, PCB

The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure correctbattery insertion regarding the polarity as indicated in battery holder.

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Table B-47. EM430F6147RF900 Bill of MaterialsPos. Ref Des No. per


1 Q1 1 ( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P,26MHz ASX-531(CS) AKER ELECTRONIC

2

C1-5 C112C252 C381C391 C421C431 C451C522 C562

14 CAPACITOR, SMT, 0402, CER, 16V, 10%,0.1uF 0402YC104KAT2A AVX

3 C101 1 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,16V, 10%, X5R 0603YD474KAT2A AVX

4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

5 CON11 1 HEADER, THU, MALE, 14P, 2X7,25.4x9.2x9.45mm, 90deg 09 18 514 6323 HARTING

7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT

10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX

11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA

12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA

13 C403 1 CAPACITOR, SMT, 0402, CERAMIC, 100pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H101JZ01 MURATA

14 L414 1 INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,1000mA, 250MHz LQW15AN2N2C10 MURATA

15 L413 1 Inductor, SMD, 0402, 15nH, 5%, 370mA,250MHz LQW15AN15NJ00 MURATA

15 L415 1 INDUCTOR,SMT,0402,15nH,±5%,460mA,250MHz LQW15AN15NJ00 MURATA

16 L402, L412 2 Inductor, SMD, 0402, 18nH, 5%, 460mA,250MHz LQW15AN18NJ00 MURATA

17 C401 1 CAPACITOR, SMT, 0402, CER, 1pF, 50V,±0.25pF, NP0 GJM1555C1H1R0CB01D MURATA

18 C413 1 CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H8R2CZ01 MURATA

19 C402, C411-C412, C414 4 CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,

50V, ±0.25pF, C0G(NP0) GRM1555C1H1R5CZ01 MURATA

20 L1, L401, L411 3 INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,250MHz LQW15AN12NJ00 MURATA

21 C46-C48, C392 4 CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,50V, ±0.25pF, C0G(NP0) GRM1555C1H2R0CZ01 MURATA

22 L2 1 Inductor, SMD, 0805, 2.2uH, 20%, 600mA,50MHz LQM21PN2R2MC0 MURATA

23 S1-S2 2 ULTRA-SMALL TACTILE SWITCH, SMT, 2P,SPST-NO, 1.2x3x2.5mm, 0.05A, 12V B3U-1000P OMRON

24 R1, R7, R551,R554 4 RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,

1/16W ERJ-2GE0R00X (UN) PANASONIC

25 R2-R3, R6 3 RESISTOR, SMT, 0402, THICK FILM, 5%,1/16W, 330 ERJ-2GEJ331 PANASONIC

27 C511 1 CAPACITOR, SMT, 0402, CER, 2200pF, 50V,10%, X7R ECJ-0EB1H222K PANASONIC

28 C111, C251,C521, C561 4 CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,

20%, X5R ECJ-1VB0J105K PANASONIC

28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC

29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC


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Table B-47. EM430F6147RF900 Bill of Materials (continued)Pos. Ref Des No. per


31 U1 1 DUT, SMT, PQFP, RGC-64, 0.5mmLS,9.15x9.15x1mm, THRM.PAD CC430F6147 TI

33 U2 1 IC, Step Down Converter with Bypass Mode forLow Power Wireless TPS62370 TI


35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH

36a JP3, JP5, JP9,JP10 4 Pin Connector 1x2pin 61300211121 WUERTH


38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA

38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA

38 C041 1 CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,X5R MURATA

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For instructions on how to install the following USB debug interfaces on a PC, see the MSP Debuggers User’sGuide.

• MSP-FET430UIF• eZ430-F2013• eZ430-RF2500• eZ430-Chronos• eZ430-RF2780• eZ430-RF2560• MSP-WDSxx "Metawatch"• MSP-EXP430G2 LaunchPad development kit• MSP-EXP430FR5739• MSP-EXP430F5529

Appendix CHardware Installation Guide

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Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from December 2, 2020 to March 19, 2021 Page• Changed the note that begins "For applications that are particularly concerned with excessive noise or

ESD..." in Figure 2-1, Figure 2-2, and Figure 2-3 ............................................................................................ 20

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