1 http://ewh.ieee.org/r10/malaysia/cpmt/

PROGRAM COMMUNICATION

36th International Electronics Manufacturing Technology Conference (IEMT 2014)

Renaissance Johor Bahru Hotel, Johor, Malaysia

11th – 13th Nov, 2014

2 36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

Program Highlights 5 technical courses offered by industry

leaders on 3D advanced packaging,

package reliability and mechanics,

advanced failure analysis techniques,

embedded technologies, power electronics

and high temperature power module design.

9 keynotes covering latest technology and

industry trend in electronics packaging

A panelist forum titled “IoT: Roles of

Packaging and Industry Trends”, will

touch on packaging cost and its margin in

product; 18” wafer investment versus

Panel/FOWLP; SiP versus SoC; and low cost

innovation.

Technical paper presentation tracks featuring

>90 technical papers & posters from around

the industry and academia

More than 15 exhibitors from the renowned microelectronics industries and supply chain

3 36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

SHORT COURSES: 11th November 2014, TUESDAY

0800-0830 Registration at Secretariat (Level 2)

Meeting Room 2 Meeting Room 3 Meeting Room 5

0830-1200 Introduction to Mechanics based Quality and Reliability Assessment Methodology

Failure Analysis on Modern Logic and Mixed-Signal IC’s: Tools and Methods

by Christian Burmer

High-Temperature Packaging with Emphasis on Power Electronic Module

by Prof. Simon S. Ang 1200-1330 Lunch

1330-1700 by Dr. Sane Sandeep &

Dr. Shubhada Sahasrabudhe

Advanced Stacked Die Packaging Technology: More than 2D

by Dr John Yuanlin Xie

Power Electronics and Embedding Technologies

by Rolf Aschenbrenner

36th IEMT 2014 PROGRAM OVERVIEW 11th – 13th Nov 2014

EXHIBITION – 12th November, 2014, WEDNESDAY

0950-1730 Tabletop display at Foyer (Level 2)

CONFERENCE SESSION: 12th November, 2014, WEDNESDAY

0730-1730 Registration at Secretariat (Level 2)

0815-0830 Welcome Speech, Grand Ballroom

by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair

0830-0910 Conference Opening Address: “Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices”

by Mr. Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration

0910-0950 Keynote Address I: “Packaging and Interconnection Trend”

by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics

0950-1045 Coffee Break / Exhibition / Poster Session I

1045-1125 Keynote Address II: “Automotive Power Packaging – Trends and Challenges”

by Dr. Andreas Knoblauch, Director, Package Development Automotive Power, Infineon Technologies AG

1125-1205 Keynote Address III: “Packaging Technology Challenges for Mobile Computing Electronics”

by Mr. Sow Yeek Kooi, Director, Technology Enabling and Start-up, Intel Malaysia

1205-1330 Lunch

1330-1510 Session A1, Meeting Room 2

Advanced Packaging Session B1, Meeting Room 3

Characterization & Test I Session C1, Meeting Room 5

Materials I Session D1, Meeting Room 6

Process I

1510-1545 Coffee Break / Exhibition

1545-1725 Session A2, Meeting Room 2

Advanced Materials Session B2, Meeting Room 3

Design Session C2, Meeting Room 5

Pb-free Technology Session D2, Meeting Room 6

Wirebond I

1830-2200 Dinner & Cultural Show

1830-1930 PANELIST FORUM: IoT: Role of packaging and industry trends

Panelists: Rolf Aschenbrenner, John Xie, Xavier Baraton, Byeong Cheon Koh; Moderator: Chee Choong Kooi

1930-1945 BANQUET DINNER ADDRESS

by Dr. Siow Kim Shyong, Chairman, IEEE-CPMT Malaysia Chapter

EXHIBITION – 13th November, 2014, THURSDAY

0950-1500 Tabletop display at Foyer (Level 2)

CONFERENCE SESSION: 13th November, 2014, THURSDAY

0800-1500 Registration at Secretariat (Level 2)

0830-0910 Keynote Address IV: “Innovation in Low Cost Packaging”

by Dr John Yuanlin Xie, Director, Packaging Technology R&D, Altera Corporation

0910-0950 Keynote Address V: “Challenges and Solutions in Modeling of Ultra-Fine Pitch Microelectronics Packages”

by Prof. Andrew A O Tay, Department of Mechanical Engineering, National University of Singapore

0950-1020 Coffee Break / Exhibition

1020-1200 Session A3, Meeting Room 2

Process II Session B3, Meeting Room 3

Characterization & Test II Session C3, Meeting Room 5

Wirebond II

Session D3, Meeting Room 6 Reliability

1200-1300 Lunch

1300-1420 Session A4, Meeting Room 2

Copper Wire Session B4, Meeting Room 3

Interconnect Session C4, Meeting Room 5

Materials II

Session D4, Meeting Room 6 Modeling

1420-1500 Coffee Break / Exhibition / Poster Session II

1500-1540 Keynote Address VI: “Review of New MEMS Devices and their Manufacturing Technologies”

by Dr. Koh Byeong Cheon , Senior Executive Vice President (Retired), Samsung Electro-Mechanics

1540-1620 Keynote Address VII: “Test Point Selection Method for Mixed Signal Testing” by Prof. Simon S. Ang, High Density Electronics Center, University of Arkansas

1620-1700 Conference Closing Address: “It’s a Small World After All: Recent Advances on Nano-materials and Technologies for Advanced Electronic,

Photonics and MEMS Applications” by Prof. CP Wong, Dean of the Faculty of Engineering, The Chinese University of Hong Kong

1700-1730 Award Ceremony

5

11 NOVEMBER 2014, TUESDAY

0800-0830 Registration at Secretariat (Level 2)

0830-1200

Course I Meeting Room 2

Introduction to

Mechanics based Quality and Reliability

Assessment Methodology

by Dr. Sane Sandeep & Dr.

Shubhada Sahasrabudhe

Course II-A Meeting Room 3

Failure Analysis

on Modern Logic and

Mixed-Signal IC’s: Tools and

Methods by Christian

Burmer

Course III-A Meeting Room 5

High-

Temperature Packaging with

Emphasis on Power Electronic

Module by Prof. Simon S.

Ang

1200-1330 Lunch

1330-1700

Cont.’ Course II-B Meeting Room 3

Advanced

Stacked Die Packaging

Technology: More than 2D

by Dr John Yuanlin Xie

Course III-B Meeting Room 5

Power Electronics and Embedding

Technologies

by Rolf Aschenbrenner

36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

12 NOVEMBER 2014, WEDNESDAY

0730-1730 Registration at Secretariat (Level 2)

0815-0830 Welcome Speech

Grand Ballroom by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair

0830-0910

Conference Opening Address “Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices”

by Mr. Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration

0910-0950

Keynote Address I “Packaging and Interconnection Trend”

by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics

0950-1045 Coffee Break / Exhibition / Poster Session I

1045-1125

Keynote Address II “Automotive Power Packaging – Trends and Challenges”

by Dr. Andreas Knoblauch, Director, Package Development Automotive Power,

Infineon Technologies AG

1125-1205

Keynote Address III “Packaging Technology Challenges for Mobile

Computing Electronics” by Mr. Sow Yeek Kooi

Director, Technology Enabling and Start-up, Intel Malaysia

1205-1330 Lunch

6 36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

7

12 NOVEMBER 2014, WEDNESDAY

1330–1510

Session A1 Meeting Room 2

Advanced Packaging

Session Chairs: See Beng Keh &

Olivia Ng

Session B1 Meeting Room 3

Characterization & Test I

Session Chairs: Mario Bolanos & Phee Boon Hor

Session C1 Meeting Room 5

Materials I

Session Chairs: Vemal Raja Manikam &

Jamaliah Idris

Session D1 Meeting Room 6

Process I

Session Chairs:

Loke Mun Leong & Lily Khor

1510–1545

Coffee Break / Exhibition

1545–1725

Session A2 Meeting Room 2

Advanced Materials

Session Chairs: Yong Wae Chet & Cheong Kuan

Yew

Session B2 Meeting Room 3

Design

Session Chairs:

Andreas Knoblauch & Eu Poh Leng

Session C2 Meeting Room 5

Pb-free

Technology Session Chairs: Loh Jan Sing &

Siow Kim Shyong

Session D2 Meeting Room 6

Wirebond I

Session Chairs:

John Xie & Hew Ling Fong

1830–2200

Dinner & Cultural Show

1830–1930

PANELIST FORUM IoT: Role of packaging and industry trends

Panelists: Rolf Aschenbrenner, John Xie, Xavier Baraton, Byeong Cheon Koh

Moderator: Chee Choong Kooi

1930–1945

BANQUET DINNER ADDRESS by Dr. Siow Kim Shyong

Chairman, IEEE-CPMT Malaysia Chapter

8

13 NOVEMBER 2014, THURSDAY

0830-0910

Keynote Address IV “Innovation in Low Cost Packaging”

by Dr John Yuanlin Xie, Director, Packaging Technology R&D,

Altera Corporation

0910–0950

Keynote Address V “Challenges and Solutions in Modeling of Ultra-Fine Pitch

Microelectronics Packages” by Prof. Andrew A O Tay,

Department of Mechanical Engineering, National University of Singapore

0950–1020

Coffee Break / Exhibition

1020–1200

Session A3 Meeting Room 2

Process II

Session Chairs: Yik Yee Tan &

Khor Swee Har

Session B3 Meeting Room 3

Characterization & Test II

Session Chairs: Simon Ang & E. K. Pradeep

Session C3 Meeting Room 5

Wirebond II

Session Chairs: Wang Soon Wei & Angeline Fon

Session D3 Meeting Room 6

Reliability

Session Chairs:

Shubhada Sahasrabudhe &

Eu Poh Leng

1200–1300

Lunch

36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

9

13 NOVEMBER 2014, THURSDAY

1300 – 1420

Session A4 Meeting Room 2

Copper Wire Session Chairs: Tan Chee Eng &

Koh Byeong Cheon

Session B4 Meeting Room 3

Interconnect Session Chairs:

Ishak Abdul Azid & Lim

Siew Lan

Session C4 Meeting Room 5

Materials II

Session Chairs: Klaus Muller &

Mohd Foad Abdul Hamid

Session D4 Meeting Room 6

Modeling

Session Chairs: Siow Kim Shyong &

Sandeep Sane

1420 – 1500

Coffee Break / Exhibition / Poster Session II

1500 – 1540

Keynote Address VI “Review of New MEMS Devices and their Manufacturing

Technologies” by Dr. Koh Byeong Cheon ,

Senior Executive Vice President (Retired), Samsung Electro-Mechanics

1540 – 1620

Keynote Address VII “Test Point Selection Method for Mixed Signal Testing”

by Prof. Simon S. Ang, High Density Electronics Center, University of Arkansas

1620 – 1700

Conference Closing Address “It’s a Small World After All: Recent Advances on Nano-

materials and Technologies for Advanced Electronic, Photonics and MEMS Applications”

by Prof. CP Wong, Dean of the Faculty of Engineering,

The Chinese University of Hong Kong

1700 – 1730

Award Ceremony

10

CONFERENCE: 12 NOVEMBER 2014, WEDNESDAY [1330 – 1510]

Session A1 Advanced Packaging Meeting Room 2 Session Chairs: See Beng Keh & Olivia Ng

Session B1 Characterization & Test I Meeting Room 3 Session Chairs: Mario Bolanos & Phee Boon Hor

Session C1 Materials I Meeting Room 5 Session Chairs: Vemal Raja Manikiam & Jamaliah Idris

Session D1 Process I Meeting Room 6 Session Chairs: Loke Mun Leong & Lily Khor

1330 A1.1 Junctionless Sub-Micron Silicon Wire Device Fabricated by Atomic Force Microscope Lithography and Electrically Characterized for Gas Sensing Application at Room Temperature M.T. Asmah, et. al. Universiti Sains Malaysia

1330 B1.1 Prediction Of Electrostatic Discharge (ESD) Soft Error In Two-Way Radio Using ESD Simulation In CST And ESD Immunity Scanning Techniques Rosmah Antong, et al. Motorola Solution

1330 C1.1 (INVITED PAPER) Microwave Curing of Polymeric Materials for Microelectronics Applications Prof. Sung Yi Portland State University

1330 D1.1 Quantifying Solder Paste Printing Yield Improvements From The Use of Stencil Nanocoatings and Engineered Under Wipe Solvents Mike Bixenman, et. al. Kyzen Corporation

1350 A1.2 Analyzing Package-On-Package (PoP) Reflow Assembly Interfaces with Interconnect Gap Analysis Ken Chiavone, et. al. Akrometrix LLC

1350 B1.2 Maximizing Electrical Capabilities of Test Setup Resources to Enhance Detection of Set Up Problems(Test Set-up Mini Diagnostic) Jonathan Velsco ON Semiconductor

1350 C1.2 The Effect Of Organic Solvent (Ethanol) On Electroless Ni-P Deposition Norhayati Ahmad, et. al. Universiti Teknologi Malaysia

1350 D1.2 Methodology to Improve the Die Singulation Quality for Low-k and High TEG Saw Street Wafer Lam Kok Meng, et. al. Unisem

1410 A1.3 Packaging Technologies and Challenges on Using Fine Pitch Cu-Pillar M.J. Lee, et. al. Altera Corp.

1410 B1.3 Characterization of Electronic Materials Using Fundamental Parameter Micro X-ray Fluorescence Kim Kia Yong Fischer Instrumentation (S) Pte Ltd

1410 C1.3 Copper Descaling Capability and Material Decision Ronizan bin Mohd Salleh, et. al. Infineon Technologies

1410 D1.3 Copper Bonding on Thin Top Metal Bonding Pad Rodan Melanio, et. al. On Semiconductor

1430 A1.4 Ultrasonic Solder Writing, the Next Level Die Attach Process Lim Fong, et. al. Infineon Technologies

1430 B1.4 Adaptive Trimming Test Approach: The Efficient Way on Trimming Analog Trimmed Devices at Wafer Sort Rex Bullag, et. al. ON Semiconductor

1430 C1.4 The Effect of Nano Fillers in Electrical and Mechanical Properties of Isotropic Conductive Adhesive C. S. Chew, et. al. UTAR

1430 D1.4 Optimization and Characterization of Development Rate in Photolithography Process for Optical Biosensor K. Y. Lau, et. al. Universiti Malaysia Perlis

1450 A1.5 A Conceptual Assembly Study on Enhancing the Voltage Supply of The Clipbond Product Via Tandem Diodes Izzati Farhana Ab Aziz, et. al. NXP

1450 B1.5 Non-Fickian Moisture Uptake Characterization of Epoxy-based Moulding Compound With Thickness Effect K. J. Wong, et. al. Universiti Teknologi Malaysia

1450 C1.5 Effect of Ni Nanoparticle on IMC Compounds Formation in SAC305 Solder Joint Under High Current Density Muhammad Nasir Bashir, et. al., Universiti Malaya

1450 D1.5 Die Attach Film (DAF) for Breakthrough in Manufacturing (BIM) Application Premila Krishnan, et. al. NXP

11

CONFERENCE: 12 NOVEMBER 2014, WEDNESDAY [1545 – 1725]

Session A2 Advanced Materials Meeting Room 2 Session Chairs: Yong Wae Chet & Cheong Kuan Yew

Session B2 Design Meeting Room 3 Session Chairs: Andreas Knoblauch & LC Tan

Session C2 Pb-free Technology Meeting Room 5 Session Chairs: Loh Jan Sing & Eu Poh Leng

Session D2 Wirebond I Meeting Room 6 Session Chairs: John Xie & Adrian Tong

1545 A2.1 A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP Ming Hu, et. al. Indium Corporation

1545 B2.1 Design and Optimization of Package Inductor for Efficient Power Rail Merger Fern Nee Intel

1545 C2.1 Assessment of High Temperature, Lead Free Paste Alternatives for Semiconductor Packaging G. P. Neoh Carsem

1545 D2.1 Challenges of Ultimate Ultra-Fine Pitch Process with Gold Wire & Copper Wire in QFN Packages C. E. Tan, et. al. On Semiconductor

1605 A2.2 Effect of Sintering Environment on Silver-Copper Die-Attach Nanopaste Kim Seah et al Universiti Sains Malaysia

1605 B2.2 Copper Power Pad Design Challenges for High Robustness and Energy Efficient Packages H. J. Chong, et. al. ON Semiconductor

1605 C2.2 Ball Shear Strength and Fracture Mode of Lead-Free Solder Joints Prepared Using Nickel Nanoparticle Doped Flux G. K. Sujana, et. al. Universiti Malaya

1605 D2.2 Impact of High Transducer Frequency on Capillary Design Tan Kim Guan Infineon Technologies

1625 A2.3 Effect of Sintering Atmosphere on the Shear Properties of Pressureless Sintetered Silver Joint S. T. Chua, et. al. Universiti Kebangsaan Malaysia

1625 B2.3 Dual FET Packaging Advancement Through Innovative Source Down Chong Chooi Mei, et. al. Infineon Technologies

1625 C2.3 Effect Of Microwave Hybrid Heating On The Formation Of Intermetallic Compound Of Sn-Ag-Cu Solder Joints Maisarah Lutfi, et. al Universiti Malaya

1625 D2.3 Characterization Studies of Non-Stick On Pad (NSOP) Using AES, XPS and TOF-SIMS Hua Younan, et. al. WinTech Nano-Technology Services Pte. Ltd.

1645 A2.4 A Comparison Study of Wafer Backside Coating Technologies Loh Kian Hwa Carsem

1645 B2.4 Comprehensive Study in Mold Compound, Thermal Residual Stress, Package & Leadframe Geometry Influence towards Convex Cavity Package Warpage Ng Seng Pau, et. al. Infineon Technologies

1645 C2.4 Addition of Porous Cu Interlayer to Sn-3.0Ag-0.5Cu Lead-free Solder Joint for High Temperature Applications Nashrah Hani Jamadon, et. al. Universiti Malaya

1645 D2.4 Methodology to Characterize the Capillary Tip Ultrasonic Vibration With Laser Doppler Vibrometer Ong Chen Ho Infineon Technologies

1705 A2.5 High-Performance Carbon Nanotubes Thermal Interface Materials Jamilah Idris et. al Universiti Teknologi Malaysia

1705 B2.5 Single-Sided Cap Solution for Thinner Z-Height Po-Loong Chin, et. al Intel

1705 C2.5 The Effect of Nickel Doping on SAC305 Lead-free Solders and EN(B)EPIG Surface Finish Salize Azlina, et. al UTHOM

1705 D2.5 Next Level of Productivity Through Capillary life Extension With Automatic Capillary Cleaning Sivalingam Thevan, et. al. Infineon Technologies

12

CONFERENCE: 13 NOVEMBER 2014, THURSDAY [1020 – 1200]

Session A3 Process II Meeting Room 2 Session Chairs: Chin Ping Wong & Khor Swee Har

Session B3 Characterization & Test II Meeting Room 3 Session Chairs: Simon Ang & E.K. Pradeep

Session C3 Wirebond II Meeting Room 5 Session Chairs: Wang Soon Wei & Angeline Fon

Session D3 Reliability Meeting Room 6 Session Chairs: Shubhada Sahasrabudhe & Siow Kim Shyong

1020 A3.1 Crack Block: A Pro Active Activity on Die Crack Resolution For Thin Dies Richard Chay Tan, et. al. ON Semiconductor

1020 B3.1 (INVITED PAPER) Comprehensive Solution for Post-saw Inspection Rajiv Roy, Matt Wilson Rudolph Technologies

1020 C3.1 3mil Copper Wire Capability

Study in 4m Aluminum Top Metal by Thermosonic Bonding Edsel De Jesus, et. al. ON Semiconductor

1020 D3.1 Challenges to Product Reliability in High Aggressive Operating Environment Haley Fu iNEMI

1040 A3.2 Characterization of Resolution for Integrated Optical Mach-Zehnder Interferometer with Optimization of Photolithography Process K. Y. Lau, et. al. Universiti Malaysia Perlis

1040 B3.2 Winchester-Banana Platform for High-Temperature and High-Voltage Reliability Testing with Voltage Monitoring Capability Ronald Rey Molina Pendor ON Semiconductor

1040 C3.2 Aluminum Oxide Thickness Impact on Wire Bond Shear Ong Cheng Nee, et. al. X-FAB Sarawak

1040 D3.2 Improving Reliability for Electronic Power Modules Vemal Raja Manikam, et. al. ON Semiconductor

1100 A3.3 Operator Efficiency Improvement Through Thinking 6 Sigma + Lean Problem Solving Approach in IFX OP BE - A Case Study Lim Chun Pei, et. al. Infineon Technologies

1100 B3.3 Front End Wafer Scanning Infrared Depolarization (SIRD) Measurement Correlation to Back End Wafer Backside Finishing Cheeyang Ng STMicrolectronics

1100 C3.3 Characterization of 0.6mil Ag Alloy Wire in BGA Package Toh Lee Chew STMicrolectronics

1100 D3.3 Characterization Study for Polymer Core Solder Balls under AC and TC Reliability Test Caihui Freescale

1120 A3.4 Multi Beam Laser Grooving Process Parameter Development and Die Strength Characterization for 40nm Node Low-K/ULK Wafer Koh Wen Shi, et. al. Freescale

1120 B3.4 Grain Structure and Roughness Characterization of Electrolytic Ni-P, Electrolytic Ni and Electroless Ni-P on Cu by FIB Voltage Contrast Ronizam bin Mohd Salleh, et. al. Infineon Technologies

1120 C3.4 Silver Alloy Wire for IC Packaging Solution Tan Boo Wei, et. al. Carsem

1120 D3.4 TCoB Reliability For Epad LQFP 176 in Automotive Application Cha Chan Lam, et. al. Infineon Technologies

1140 A3.5 Prevention on Tilted Units for Small Size Wafer Level Package in Taping Yong Wei Wei, et. al. Infineon Technologies

1140 B3.5 Six Sigma: Systematic Approach in Probe Damage Reduction Glenn T. Placido ON Semiconductor

1140 C3.5

1140 D3.5 Effect of Copper Particle Size on Creep Deformation in Copper Paste Film S. Fukufa Fine Ceramics Research Association

13

CONFERENCE: 13 NOVEMBER 2014, THURSDAY [1300 – 1420]

Session A4 Copper Wire Meeting Room 2 Session Chairs: Tan Chee Eng & Koh Byeong Cheon

Session B4 Interconnect Meeting Room 3 Session Chairs: Ishak Abdul Azid & Lim Siew Lan

Session C4 Materials II Meeting Room 5 Session Chairs: Christian Burmer & Mohd. Foad Abdul Hamid

Session D4 Modeling Meeting Room 6 Session Chairs: Siow Kim Shyong & Sandeep Sane

1300 A4.1 Ultra Low Loop Wire Bonding of 20 μm Palladium Coated Copper Wire for Very Thin Packages Loh Kian Hwa Carsem

1300 B4.1 Incomplete fill for FlipChip design in MAP mold package Chong Chee Chiew, et. al. Infineon Technologies

1300 C4.1 Study On Electrodeposited Ni-Mo Alloy Barrier Films For Electronic Interconnects C. W. Tan, et. al. Universiti Malaya

1300 D4.1 A Review of Computational Damage Mechanics of Mass Transport in Solder Joint Mohd Foad Abdul Hamid Universiti Teknologi Malaysia

1320 A4.2 Challenges and Resolution of Insulated PdCu Wire Bond for TBGA HVM Robustness Siong Chin Teck, et. al. Freescale

1320 B4.2 Microstructure Evolution at the Solder Joint During Isothermal Aging A.M. Zetty Akhtar, et. al. Universiti Malaysia Pahang

1320 C4.2 New Die Attach Adhesives for Low-Stress MEMS Packaging Jooi Liang See DELO Industrial Adhesives Pte Ltd

1320 D4.2 Finite Element Analysis Of Stress Intensity Factor Of Pre-Cracked Coated Substrate Under Contact Sliding M. L. Mohsin, et. al. Universiti Teknologi Malaysia

1340 A4.3 Low Cost & High Quality Copper Wire Bonding in Increasing Market Growth C. E. Tan, et. al. ON Semiconductor

1340 B4.3 Nanomechanical Properties of Intermetallic Compounds Formed in Electrodeposited Cu/Sn and Cu/Ni/Sn Multilayer Interconnects Abu Zayed Mohammad Saliqur Rahman Universiti Malaya

1340 C4.3 Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Copper Pillar Flip-Chip Sze Pei Lim Indium Corporation

1340 D4.3 Modelling Investigation of the Influence of Polycrystalline Grain Size on the Electrical Characteristics of Polysilicon Diode and Resistor Ke Kian Seng Joseph Infineon Technologies

1400 A4.4 Palladium Coated Copper wire – Characteristics and Wire Behavior in BSOB Process and its Reliability Performance SW Wang and Jose Palagud Jr. ON Semiconductor

1400 B4.4 Strain Rate-Dependent Deformation and Failure Process of Adhesive Joints M. Johar, et. al. Universiti Teknologi Malaysia

1400 C4.4

1400 D4.4 Structural Analysis of an Electronic Module Incorporating Hybrid Microcircuits in Power Distribution Package of Satellites Abhiram B. Aithal, et. al. M. S. Ramaiah Institute of Technology

14

POSTER PAPERS

12 November, Wednesday 1000 - 1045

Poster Session I FOYER

Session Chairs: Shaw Fong Wong & Tze Yang Hin

P1 Vertical Hi-C Capacitor for eVBW in RF Power Amplifiers Aznita Abdul Aziz Freescale Semiconductor

P6 Multichannel Module Characterization of Optical Sensors Employed in Photoplethysmography Ammar Younis Kadhim Universiti Kebangsaan Malaysia

P2 Effect of pH on Electroless Nickel Deposition on Alumina Substrates for Chip Resistor Application Nor Akmal Fadil, et. al. Universiti Teknologi Malaysia

P7 Effective Maintenance Strategy to Improve Performance Through RCM Concept Sivakumar S.Nadarajan On Semiconductor

P3 Contamination Elimination at ISO Side of Smart Card Tape Zheng Zhirong, et. al. Infineon China

P8 Saw Chipping Improvement to Achieve Defect Free Bare Die Products C.E.Tan, et. al On Semiconductor

P4 Prediction and Prevention of Mold Compound Chipping Using Empirical and Simulation Methods Beh Shiao Lin, et.al Infineon Malaysia

P9 Study On Reduction of Adhesive Pb Flakes on Lead Free Solder Paste through Oven Reflow Temperature in Clip Bond Package Hamrija Ariffin, et. al NXP

P5 Develop Solution of Permissible Package Warpage for Board Assembly Eng Hoo Leow, et. al. Altera Corporation

15

POSTER PAPERS

13 November, Thursday 1420 - 1500

Poster Session II FOYER

Session Chairs: Shaw Fong Wong & Tze Yang Hin

P10 Robust Wirebonding for Power Packages with Ball Shear Test and FEM Modeling Dr. Xueren Zhang STMicroelectronics

P14 Comparison Study Between Insulated PdCu Wire and PdCu Wire on TBGA Eu Poh Leng, et. al. Freescale Semiconductor

P11 Performance of Dye-Sensitized Solar Cell Based on Varied Dye Thermal Extraction S.Z.Mohamed Siddick, et. al. Universiti Malaysia Perlis

P15 Factors Contributing to Non-Sticking on Ground Ring for Copper Wire Bonding Tan Kian Heong Infineon Malaysia

P12 Process Controls For Robust Solderability Performance Of IC On Pre-Plated Frames Dennis Remolacio, et. al. On Semiconductor Philippines

P16 Package Mounting Considerations From Product Thinking to System Understanding (P2S) to Create Greater Value for Customers Tan Chee Voon, et. al. Infineon Malaysia

P13 Schottky Barrier Lowering in Al/Si/Al Back-to-Back Schottky Contacts by Embedded Gold Nanoparticles Mohammad Saleh Gorji, et. al. Universiti Sains Malaysia

P17 Design and Development of Tiny Package for High Voltage Integrated Circuit Device (HVIC) in QFN Suhaimi Azizan On Semiconductor

16 36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

HOTEL LAYOUT

17 36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia

SEE YOU IN JOHOR BAHRU!

18

Further enquiry, please contact: • Fadzilatul Husna Adnan

(FadzilatulHusna.Adnan@onsemi.com ), Secretariat • Dr. Tze Yang Hin (tyhin@altera.com), Program Chair

36th International Electronics Manufacturing Technology Conference

11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia