Advanced Packaging Platforms

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Advanced Packaging Platforms: Equipment & Materials

Advanced Packaging & Manufacturing Team

YOLE DEVELOPPEMENT

COLLABORATION

INNOVATION

NEW PERSPECTIVES

FROM TECHNOLOGIES TO MARKET

A comprehensive curvey of Equipment & Materials business, Covering main trends, industry / market structures and market metrics


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Report Scope & Definitions………………………………………….....….3 Glossary……………………………………………….….…..4

Companies Cited in this Report…………………..…7

Definitions, Limitations & Methodology…….…8-9

Analysis Comparison: 2011 vs. 2014 …………..…10

Who should be interested in this report?.........11

Executive summary……………………………………………….....12

Overall Equipment Market Forecasts ($M) ……..30 Breakdown by Advanced Packaging Platform

Breakdown by type of equipment

Equipment market forecast for 3D & WLP...……. 37 Overview of the technologies

Current status

Overview of the major equipment suppliers

Positioning of the Different Equipment Suppliers, by Technology

Challenges/unmet needs

Trends of the technology

2013 – 2019 Market forecast from 2013 to 2019 (in $M, units)

Market share (2013)

Breakdown details for permanent wafer bonders/ C2W Bonders / DRIE etching & other drilling tools / CVD / PVD / ECD Plating / Exposure & Lithography / Spray coating / Cleaning / Temporary Bonding & De-Bonding / Grinding-Thinning-CMP / Wafer-molding / Inspection & Metrology /

Presentation Outline

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2From TECHNOLOGIES to MARKET

Copyright @ Yole Developpement SA.. All rights reserved

Materials market forecast for 3D & WLP...……………………………………………….…. 213

2013 – 2019 Market forecast from 2013 to 2019 (in $M)

Market share (2013)

Breakdown details for Photoresist & coatings / Adhesive tapes / pre-applied & wafer-level underfills/ Molding compounds / Plating & cleaning chemistries / Slurries for CMP / Temporary bonding materials/ Gas & precursors / sputtering targets

3DIC & WLP Technologies Process Flows & Manufacturing Trends Analysis……………………………………...287 Focus on Flip-Chip Wafer Bumping

Introduction & background

Typical manufacturing process flows

Equipment & Materials suppliers involved

Key process challenges and issues

Focus on WL CSP Packaging

Focus on FO WLP Packaging

Focus on 2.5D Silicon Interposers

Case of “Via first” TSVfor WLP MEMS Oscillator with TSV

Focus on 3D WLP Platform

Case of 3DIC & TSV ‘Via Middle’

Conclusions & Perspectives …...…………………….. 289


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From TECHNOLOGIES to MARKET


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Advanced Packaging Platforms

Wafer-Level Electrical Redistribution

Flip-chip & Wafer-LevelStacking / Integration

WL CSP‘Fan-in’

FOWLP‘Fan-out’

2.5DInterposer

FC wafer bumping on BGA

3D IC & TSV

Embedded die in PCB /

laminate

Wafer-Level Interface / Encapsulation

3D WLPFor MEMS & sensors(also called 3D SiP)

LED & SensorsWLOptics

Wafer-level-packages have emerged in many different varieties




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Report Objectives This is a research update on the Equipment & Materials markets for 3D &

WLP applications

This report’s objectives are to:• Provide detailed information regarding equipment & materials used in 3D IC & WLP

‒ to update the market status of the Equipment & Materials markets for 3D & WLP applications

• Better understand WLP manufacturing technological trends

• Better understand equipment & materials industries for each process step in the 3D IC & WLP applications

• Provide an overview of who is doing what, specificities and market share of each market

• Gives market metrics both at equipment/material levels for 3D IC & WLP applications

• Gather and update all the information necessary to benchmark and compare all the different alternatives offered by the current equipment and material toolbox for wafer level packaging

• Provide an overview of the technological trends of the equipment & materials technologies

The following applications are not included:• Leadframe-based Packages

• Thinned, Stacked WB Packages

• Wire-Bond Ball Grid Array Packages & PoP/PiP

• Equipment & materials used

‒ for Wafer Level Optics

• Panel will be mentioned in the report but forecast related to this field will not be included


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Transforming IC Packaging Supply Chain*

System / Product

Sub-Module /Sub-systems

Design & Assembly

Design of chip & package

Wafer LevelPackaging

« Middle -end »

SiliconManufacturing

« Front-end »

Package Assembly & Final test

« Back-end »

Front-end relatedmaterials suppliers

OEMs(Original

Equipment Makers)

FE relatedequipment suppliers

BE Packaging materials suppliers

BE Packaging equipment suppliers

Fab-lessIC players

IDMs (Integrated Device Manufacturers)

Integrated wafer / package manufacturing foundries

OSATs (Open Source Assembly & Test houses)

WLP houses (no need for traditional substrate)

PWB suppliers(motherboard)

ODM / EMS / DMS

(electronic design &

manufacturing services)

Passive comp. & SMT materials

SMT equipment suppliers

SiP design houses

Package substratelaminate suppliers

Substrate material suppliers(FR4, BT resin, Cu clad, etc…)

* Existing business models represented in red, new business

models in orange

Wafer foundries

Fab-light players (outsourcing + focused investment in manufacturing & critical IP)

Wafer Bumping houses PCB / PWB houses with Embedded die capability

http://www.philips.fr/index.html

http://www.philips.fr/index.html

http://www.broadcom.com/

http://www.broadcom.com/

http://www.appliedmaterials.com/

http://www.appliedmaterials.com/

http://www.sumitomocorp.co.jp/english/

http://www.sumitomocorp.co.jp/english/

http://www.toray.co.id/

http://www.toray.co.id/


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Involvement of the FE and BE equipment suppliers All the companies from R&D institutes to IP providers, equipment and materials suppliers, foundries, OSATs, IDMs, OEMs, substrate

makers have strategically positioned themselves in the “Middle-End” due to its high growth potential.

This evolution will lead to more investment in new equipment and materials

The motivations for introducing new manufacturing tools to fulfill 3D technology’s requirements drive considerably the entrance of a lot of equipment coming from the front-end and back-end areas in the ‘Middle-End’ space and create a battlefield between both equipment vendors coming from Front-End and Back-End area who are willing to gain market share in the “Middle-End” space

migration for equipment suppliers towards Middle-End space

Depending on the products and applications needs, a trade-off between performance and cost will be needed for the processes that have applications in both front-end and back-end and adopted in 3D integration process flow as well (for instance, lithography, cleaning, deposition, etching etc),

• Supporting the trends of miniaturization, front-end tools would be preferred for achieving more aggressive features; however, they are typically more expensive.

• On the other side, the back-end equipment generally exhibits lower cost but can face scaling issues when semiconductor ICs continue to reduce in chip and feature size


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$0 M

$500 M

$1 000 M

$1 500 M

$2 000 M

$2 500 M

$3 000 M

2013 2014 2015 2016 2017 2018 2019

Sale

s fo

reca

sts

(M$

)

Global Equipment & Material market forecastfor 3DIC & Wafer-Level-Packaging (in M$)

Equipment market

Material market

Yole Developpement © November 2014

Equipment & Material Demand in the ‘Mid-End’

The wafer-level-packaging market remains a huge business opportunity and shows thegreatest potential for significant future growth in the semiconductor industry.

• That can be explained by the fact that devices are becoming more an more complex which drivesthe investment in new equipment modifications and new materials development


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2013 Global Equipment Market for 3D TSV & WLP

TOTAL: $932M

Wafer bonding

$XM

TB & Debond

$XM

Spin coating/ Developer

~$XM

Dicing

~$XMECD Plating

$XM

DRIE

$XMCVD

~$XMPVD

~$XM

Inspection/Metrology

~$XM

Lithography~$XM

Others

Ultratech$XMX%

Canon~$XM; X%

SUSS~$XMX%

Others: ~$XM

Grinding &CMP

~$XM

Nikon~$XM, X%

SMEE~$XM; X%

Rudolph~$XM; X%


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Competitive environmentMajor suppliers of other type of equipment are also included in this report Y

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Major competitors for Mask aligners*

Major competitors for projection (steppers +

scanner) Major competitors for Laser

Direct Imaging

*SUSS provides Projection scanner which is between mask aligner and projection stepper

Only supplier providing laser ablation


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Lithography Equipment Market 3D & WLP Market share per equipment supplier

XXX


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Main materials for Advanced Packaging

Assembly Materials Dielectric materials Metallization materials

Underfill

Dielectricmaterials

Dielectricmaterials

RDL

Copper TSV

Bump plating


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2013 Global Materials Market for 3D TSV & WLP

Others$XM, X%

JSR Micro$XM; X%

Sumito Bakelite/

Promerus

$XM; X%

DOW Chemical$XMX%

HD Microsystems/

Dupont$XMX%

Fujifilm$XM; X%

AZ Electronic Materials

$XXM; X%

Permanent dielectricresists$XXM

Wafer Moldingcompound

$XXM

Solder paste$XXM

Platingchemistries

$XXM

Slurries for CMP$XXM

Cleaning chemistries$XXM

Strippable plating resists$XXM

TOTAL: $789M

Shin Etsu

$XM; X%


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PI$91,9 M

55%

BCB$25,4 M

15%

PBO$34,0 M

20%

Silicone$10,5 M

6%

Epoxy$3,7 M

2%

WPR$3,4 M

2%

Others$0,2 M

0%

WLP Dielectric Materials 2013 revenues Breakdown by Dielectric material type

Yole Developpement © November 2014

*AL-X

2013 Dielectric materials MarketBreakdown per type of dielectric material

Main dielectric passivation applied to all Advanced Packaging platforms applications are Polyimide (PI) and BCB.

• PI is the key polymer material used for Wafer-Level-Packaging applications, mainly driven by flip chip applications.

‒ Flip-chip wafer bumping with electroplated solder and copper pillars which are in high volume in the CPU / GPU / ASIC / FPGA space and today entering in high volume the mobile baseband / APE / RF PA Transceiver / PMU spaces

BCB is also a very popular material in WLP applications, mainly supported by the WLCSP applications.

However, PBO becomes a promising material for WLCSP and we are expecting demand for PBO to keep growing for WLCSP and 2.5D/3D IC applications

WPR is being replaced because off its thermal stability issues

MXXX$


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More slides extracts


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Who Should be Interested in this Report?

Equipment & material suppliers: • Identify new business opportunities and prospects• Understand the differentiated value of your products and technologies

in this market• Identify technology trends, challenges and precise requirements related

to permanent bonding• Evaluate the market potential of your permanent bonding technologies• Position your company in the market• Monitor and benchmark your competitors

IDMs, CMOS foundries and OSAT players: • Understand technology trends related to permanent bonding when used

in MEMS, LED, CIS and Advanced Packaging• Spot new opportunities and define diversification strategies

R&D organizations and investors:• Monitor the global activity and consolidation currently occurring in the

semiconductor equipment and material business in order to identify new partners and targets, and make the right decisions before committing to one particular supplier


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Organizations Cited in the Report

Advantest, AGC, AI TEchnology Inc, Aimsolder, AIR LIQUIDE, Air Products, AJI – dvanced Jisso Technology, Ajinomoto Fine Techno Co Inc., Akrion systems, AkroMetrix LLC, Alchimer, ALSI, Altatech Semiconductor, AMEC, Amicra Microtechnologies GmbH, AML, Anji Microelectronics, Applied Materials, Applied Relay Testing, Applied Spectra, Asahi Kasei E-Materials Corporation, ASM Pacific Technologies, ASML Netherlands B.V., Assembleon, AST (Samurai), ASYS GmbH, ATI, ATMI, ATOTECH, Auros Tech, Austin American Technology Corp, Axcelis Technologies, Ayumi Industry Co. Ltd., AZ Electronic Materials, Azores

Corp, Barth Electronics, BASF, Bergquist Company, Berliner Glass, Blue-M, Boschman Technologies B.V., Brewer Science, Bruker AXS , Cabot electronics, CAMTEK USA, Canon ANELVA, Cascade Microtech, CHAPMAN, Chomerics, Corning, Corning Incorporated, CSM Instruments, Cyantek, Cyber-Technologies,

Daxin Materials Corporation, Datacon Technology GmbH (BESI), DCG Systems, DEK semiconductor, DELO, Delta Design, Denka, Disco Corporation, DJ DevCorp, Dai Nippon SCREEN, Dongjin Semichem Co., Doublecheck Semiconductors, Dow Corning Corporation, Dow Electronic Materials, DRY PLASMA

SYSTEMS, D-Tek Technology Co.,Ltd, DuPont Electronic Technologies, Dynaloy, DYNATEX International, Eastman Chemical, EBARA Technologies Corp., EbinaDenka, ECI Technology, EEJA, Electroglas Inc, ENF Technology Co .Ltd, Enterprix, Enthone (Cookson Electronics), Epoxy Technology Inc., ERS – gmbh, ESEC AG, ESI, Etched in Time Inc, EV Group, Evest Corp., EXCICO, Exelsius, FASSE CO., LTD., Fico molding (BESI), Finetech, FOGALE Nanotech, Frontier Semiconductor,

Frt Of America, FSI International, Fuji Polymers, FUJIFILM Electronic Materials, Furukawa America GE Sensing & Inspection, Gore, GPD Global, Inc., Hamamatsu, HamaTech APE GmbH & Co. KG, HD MicroSystems, Henkel Corporation, Heraeus GmbH, Hesse & Knipps, Hitachi Chemical Co., Ltd., Hitachi

High Technologies Corporation, Honeywell Electronic Materials, HORIBA Semiconductor, Hoya, IceMOS Technology, ICOS Vision Systems NV, Ikonix Imaging, Indium Corporation, Ishihara Chemical , Ismeca Europe Semiconductor SA, JENOPTIK, Jet Metal, JSR Micro, Kester, KiyoKawa Plating industry, KLA-TENCOR,

Koh Young Technology Inc., Kulicke & Soffa, Kyzen Corporation, Laird Technologies, LAM Research Corporation , Laserod, Lasertec Corporation, LaufferPresses, Leybold Optics USA Inc, LG Chem., Ltd., Life Bioscience, LincoTec, Linde Gas, Lintec, Loadpoint, LORD Corporation, Mapper Lithography, Materion,

Mattson Technology, Mechatronic Systemtechnik, MECO, MEMC Electronic Materials, Inc. , Metryx, MicroChem, MicroFab Technologies Inc, Micronic Laser Systems AB, Micronics Japan Co., Mitshubishi Gas Chemical, Mitsubishi Chemical Corporation, Mitsubishi Electric, Mitsubishi Heavy Industry (MHI),

Mitsubishi Materials, Mitsubishi Materials Corporation, Mitsui Chemicals, Momentive performance material, MSG Lithoglas AG, MTK Co, Ltd., Mühlbauer, Nagase & Co., Ltd., Namics, Nanda Tech GmbH, NANOPLAS, Nanovea, NEC / SCHOTT, Newport, NEXX Systems, Nikko Metal, Nikon Corporation, Nippon Electric Glass – NEG, Nippon Kayaku Co., Ltd., Nippon Sheet Glass – NSG, Nissan Chemical Industries, Nitta Haas Inc., Nitto Denko Corporation, NorcomSystems Inc, Nordson ASYMTEK, Inc., Nordson dage, Nordson March, nScrypt Inc., Nusil Silicone Technology, Nypro Inc., oak-mitsui technologies, OEM

group, Oerlikon, Okmetic, Olympus-ITA, Inc., OM Group Ultra Pure Chemicals Pte. Ltd., OPµS, Orbotech Ltd., Oxford Instrument, Pac Tech, Palomar Technologies Inc., Panasonic Denko, PANASONIC Factory Solutions, Philips Applied Technologies, picoDRILL, Plan Optik AG GmbH, Polymatech, Potomac

Laser, Praxair.com, Promerus LLC, Protavic America, Inc., PVA TePla AG, Ramgraber GmbH, rasco, REC Silicon, RENA GmbH, Replisaurus Technologies, Ricmar Technology GmbH, Rorze, Rudolph Technologies, Saint-Gobain, SAMCO Inc. , Siconnex, Schmoll Machinen, Schott AG, SCS - Speciality Coating

Systems, Sekisui Chemical Co., Ltd., Semiconductor Technologies & Instruments (ASTI), Semprius, Senju Metal Industry Co., Ltd., SENTECH Instruments, SET -Smart Equipment Technology, Seto Engineering Co., Ltd., Shanghai Micro Electronics Equipment , Shanghai Sinyang, Shibaura Mechatronics Corporation,

Shibuya Kogyo, Shin-Etsu Chemical Co.,Ltd. , Shin-Etsu MicroSi, Inc, SHINKAWA LTD., Shinko Seiki, Silecs, Singulus, SOITEC, Sokudo Co. Ltd., SolMateS, Solvay, SolVision, SONIX, SONOSCAN, SPP (Sumitomo Precision Products Co., Ltd.), SPTS, SSEC - Solid State Equipment Corporation, Starfire Systems Inc.,

STIL SA, Strasbaugh, Sumco Corporation, Sumitomo Bakelite, Sumitomo Chemicals, Surface Science Integartion, SUSS Microtec, Sysmelec, Takada, TakatoriLtd., Tamar Technology, Tamarack Scientific, Tango Systems, tecnisco, TEGAL, TEL (Tokyo Electron LTD.), Teradyne, Thin materials AG, Timbre Technologies,

tok, TOK (Tokyo Ohka Kogyo Co., LTD), Toray engineering Co.Ltd, Toray Industries, Inc, TOWA Corporation, TRESKY, TRIOPTICS, Ultraspray, Ultratech , ULVAC Inc., Umicore, Uyemura Co.Ltd, Uyemura International Corporation, Veeco, Verigy, Viscom AG, West-Bond, Inc., Xradia, YAMADA CORPORATION,

Young Chang Chemical, YoungTek Electronics Corp., Zebra Optical, Zeon Chemicals L.P., Zetta Core, Zygo Corporation, Zymet, Inc.


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About the author of this report

Amandine Pizzagalli– Amandine is in charge of equipment & material fields for the Advanced Packaging &

Manufacturing team at Yole Développement after graduating as an engineer in Electronics,with a specialization in Semiconductors and Nano Electronics Technologies. She worked inthe past for Air Liquide with an emphasis on CVD and ALD processes for semiconductorapplications.

Contact: [email protected]


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Our latest market reports…

ComingSoon

Nokia

3D IC Business Update2014

FO WLP & Embedded Die Packages2014

http://www.yole.fr/pagesAn/products/Report_sample/3DIC.pdf



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Our report in 2015

Comingin 2015


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Our Global Presence

Yole Inc.

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MEDIANews feed / Webcasts

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Patent Investigation

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WORKSHOPSFocused seminars

Yole Group Activities


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The company is involved in the following areas:

30 full time global analysts with technical, marketing and management background

35000 interviews per year

Field of Research

Advanced Packaging Photovoltaics LED & Compound Semi Power Electronics

Microfluidics & Bio Tech MEMS & Sensors Semiconductor Manufacturing: Equipment & Materials

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Overview of Our Main Services

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Detailed analysis of the cost structure of a specific technology

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costing analysis

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Breadth of the analysis

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Yole Developpement consultants provide market analysis, technology evaluation, and business plan along the entire value chain

Institutions, Investors

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Materialsand

EquipmentSuppliers

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Device Makers

Integrators and

End Users

Serving the Entire Value Chain


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….Some of our Customers

Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TsV interconnects, an area offering opportunities for new developments in equipment modification—equipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TsV stacks since the memory manufacturers, such as samsung, sk Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year.

In addition, logic manufacturers will diversify investments from System-on-Chip to Package-on-Package and will benefit from Advanced Packaging platforms such as 2.5D interposer and FO WLP to stimulate their high-volume production.

The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%. Growth will mainly be driven by the expansion of the next generation Wafer-level-packaging platforms (3D TsV stacked memories, multi-layer RDL for FO WLP & WLCSP), which are becoming more complex and requiring additional and various thin layers, as well as advanced materials, to achieve better performance.

This report will present a comprehensive overview of the main equipment and materials used in the 3D & WLP applications. In addition, it includes insights on a number of equipment tools, breakdown by wafer size & revenue, by type of equipment & materials and advanced packaging applications. Moreover, it also provides details about key suppliers, market share and technological highlights that impact the 3D & WLP industry.

Equipment & materials market forecasts are calculated for 2013–2019.

Advanced Packaging Platforms: Equipment & Materials Equipment & Materials for 3DIC & Wafer-Level Packaging Applications

TSV INTEGRATION IS CREATING GROWTh AND SIGNIFICANT INTEREST IN ThE EqUIPMENT & MATERIALS INDUSTRy

REPORT OuTLINE• Title: Equipment & Materials

for 3DIC & WLP Applications• November 2014• Market & Technology Report• PDF • €5,990 - Multi user license

(320+ slides)• €3,990 - One user license

(320+ slides)

kEY FEATuREs OF THE REPORT• 3D & WLP equipment and material

market metrics (units and value): forecast 2013–2019

• Market share of major equipment suppliers

• key technical insights and detailed analysis on equipment & materials solutions, trends, requirements and challenges

• Detailed WLP & other technologies process flows and scenarios analysis, including evidence of the critical steps related to each wafer-level-packaging platform, and what the available technology alternatives are in the equipment & materials toolbox

• Technology roadmap for adoption of new technology

Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term growth of the equipment & materials business will be supported by the expansion of 3D TSV stack platforms.

Market & Technology Report

WHAT’s NEW COMPARED TO LAsT EDITION?• update of market forecast from

2013 to 2019• New analysis based on the

competitive landscape and market share for all main equipment and materials suppliers for 3D TSV & WLP applications

• More in-depth analysis on the different equipment & materials technologies already available on the market and technology trends

• Update of 2013 key equipment & materials suppliers

• key technical insights and detailed analysis on equipment & materials solutions, trends, requirements and challenges

INCREASE COMPETITION IN ThE PACkAGING AREA: BATTLE IN ThE EqUIPMENT & MATERIALS INDUSTRy

Global Equipment & Material market forecast for 3DIC & Wafer-Level-Packaging (in M$)

(Yole Développement, November 2014)

The packaging area has driven significant activity throughout the entire supply chain to solve 3D technology manufacturing challenges.

Starting in 2015, the strong growth of TSV adoption will result in significant investments in new equipment and materials to meet the key requirements of 3D technology. Fabrication of

TSV requires several processing steps, each with their own specifications, depending on the needs of each application. In addition, robust integration of all the steps will be critical for the successful implementation of TSV technology.

Today, there are still many unresolved challenges: remaining technical issues, standardization for

2013 2014 2015 2016 2017 2018 2019 $ 0 M

$ 500 M

$1 000 M

$1 500 M

$2 000 M

$2 500 M

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Equipment market Material market

collaborative business models and more importantly cost, especially for consumer and mobile applications.

The 3D TsV business has been of central interest to the packaging area that has enabled the entry of equipment suppliers coming from the Front-End and Back-End (PCB) areas. Both of which are looking to fi nd business opportunities in the Middle-End.

Supporting the trends of miniaturization, front-end tools would be preferred for achieving more aggressive features; however, they are typically more expensive.

Back-end equipment generally exhibits lower cost but can face scaling issues when semiconductor ICs continue to reduce in chip and function size.

As a result, to support the 3D integration process fl ow, a trade-off between performance and cost will be necessary.

In addition to existing tools to support all the different 3D activities and processing needs, several equipment and materials vendors have emerged. A result of the various steps involved in 3D technology is that the equipment market has become quite diversifi ed.

Several dif ferent groups of players, each providing different expertise, have been formed:• Top-tier semiconductor equipment suppliers

coming from the Front-End area

• Specialist equipment suppliers that have developed knowledge and expertise in very specifi c equipment lines. They are looking to further increase their market share in their fi eld of expertise through differentiation from Top-tier equipment suppliers.

On the other hand, the last acquisitions—SPTS acquired by Orbotech and the merger between AMAT and TEL—show an interest by these companies to provide equipment tools for the Advanced Packaging industry and thus, support as much as possible the Middle-End area.

Since the competition has increased between equipment and materials suppliers, strategic partnerships will probably be necessary to support as much as possible the current and future needs of 3D stacking.

This big change in the equipment & materials market is creating a new battle in the Middle-End area, which is going to be very interesting over the next 5 years.

This report presents a detailed analysis on the packaging industry, highlighting new strategies developed by the equipment & materials suppliers. It gives future evolution of the packaging industry and detailed analysis on the impact of the latest acquisitions on the evolution of the equipment & materials markets.

Equipment & Materials for 3DIC & Wafer-Level Packaging Applications

2013 global equipment market for 3D TSV WLP


INCREASED COMPETITION IN ThE LIThOGRAPhy MARkET

The lithography market has gained signifi cant interest within the equipment market. This fi eld has driven the entrance of new equipment suppliers.

Today if ultratech and suss micro tech focused on gaining a large portion of market share in the lithography area, they might be challenged by equipment suppliers coming from the Front-End area, such as Nikon and Canon, that represent Top-tier semiconductor equipment and equipment vendors coming from the PCB industry (such as Orbotech, Ushio).

The lithography market is quite diversifi ed andsegmented into several different types of equipment suppliers. New entrants are trying to enter the lithography market with alternative solutions to mask aligners and steppers, both used in the packaging area.

Competitive landscape and market share for the major equipment & materials suppliers involved in the Packaging industry are quantifi ed and detailed in this report.

Entrance of the FE and the BE equipment suppliers in the middle end area


Etch

Implant

CVD

PVD

CMP

Wafer test

Inspection

Cleaning

C2C / C2S

Underfill

Molding

Final test

BGA

Dicing

FE Wafer manufacturing BE

Assembly & test

Middle-End TSV

Bumping

RDL / Wiring C2W

Handling

Thinning

Inspection W2W

++ More suitable for achieving aggressive features -- Expensive

++ Lower cost -- Scaling issues

Wafer bonding $XXM

TB & Debond $XXM

Spin coating/Developer ~$XXM

Dicing~$XXM

ECD Plating $XXM

DRIE $XXM

CVD ~$XXM

PVD ~$XXM

Inspection/ Metrology ~$XXM

Lithography~$XXM

Grinding&CMP

~$XXM

Mar

ket s

hare

is g

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for a

ll m

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equipm

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supp

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Mar

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Others: ~$XM

SMEE~$XM; X%

Canon~$XM; X%

Canon~$XM; X%

Ultratech$MX%

Rudolph~$XM; X%

Nikon~$XM, X%

SUSS~$XMX%

TABLE OF CONTENTS

COMPANIES CITED IN ThE REPORT (non exhaustive list)Alchimer, AML, Applied Materials, Asahi Kasei E-Material, ASM Pacific Technologies, ATMI, ATOTECH, Auros Tech, AZ Electronic Materials, Brewer Science, Cabot electronics, CAMTEK USA, Corning, Disco, Dai Nippon SCREEN, Dongjin Semichem, Dow Corning, Dow Electronic Materials, DuPont Electronic Technologies, Dynaloy (Eastman Chemical Company), EBARA Technologies, Ebina Denka, Enterprix, Enthone (Cookson Electronics), EV Group, Evest, Fico molding (BESI), Finetech, FOGALE Nanotech, Frt Of America, FSI International, KLA-TENCOR, Mitsubishi Heavy Industry (MHI), Mitsubishi Materials, NEXX Systems, Oerlikon, Parker Hannifin and many more…

• Provide market metrics both at equipment & materials levels (from 2013 to 2019)• Provide market share of the key equipment & materials suppliers involved in the packaging industry• Key technical insight into future equipment & materials trends and challenges• A forecast for the next five years, and to predict future trends for equipment & materials for 3D & WLP

applications• Better understand process flows and technological trends in package manufacturing• Better understand equipment & materials industries for each process step

OBJECTIVES OF ThE REPORT

Market & Technology Report

COMPLETE AND DETAILED TEChNOLOGIES UPDATE FOR EqUIPMENT & MATERIALS USED IN 3D & WLP APPLICATIONS

Although today it is mainly supported by flip-chip wafer bumping applications, the packaging market remains a huge business opportunity. This market shows the greatest potential for significant future growth in the semiconductor industry.

Technologies related to equipment & materials (but used for different process flows) are included in this report. The process flows for each Advanced Packaging platform, including flip-chip wafer

bumping trends, Fan-in WLCsP, 3D WLP, FOWLP, 2.5D silicon interposers, and 3DIC Via Middle & Via Last processes, are also included in the report.

The key equipment & materials used in the Advanced Packaging area are highlighted for each process step and a detailed analysis is provided for all process flows across each of the Advanced Packaging platforms. Analysis of the Via First process flow is detailed in this report as well.

• Report scope & definitions 3

• Glossary 4

• Companies cited in this report 7

• Definitions, limitations & methodology 8

• Analysis comparison: 2011 vs. 2014 10

• Who should be interested in this report? 11

• Executive summary 12

• Overall equipment market forecasts ($M) 30

> Breakdown by advanced packaging platform

> Breakdown by type of equipment

• Equipment market forecast for 3D & WLP 37

> Overview of the technologies

> Current status

> Overview of the major equipment suppliers

> Positioning of the different equipment

suppliers, by technology

> Challenges/unmet needs

> Trends of the technology

> 2013 – 2019 market forecast from 2013 to

2019 (in $M, units)

> Market share (2013)

> Breakdown details for permanent wafer

bonders / C2W bonders / DRIE etching

& other drilling tools / CVD / PVD / ECD

plating / exposure & lithography / spray

coating / cleaning / temporary bonding

& de-bonding / grinding-thinning-CMP /

wafer-molding / inspection & metrology

• Materials market forecast for 3D & WLP 213

> 2013 – 2019 market forecast from 2013

to 2019 (in $M)

> Market share (2013)

> Breakdown details for photoresist & coatings /

adhesive tapes / pre-applied & wafer-level

underfills / molding compounds / plating

& cleaning chemistries / slurries for CMP /

temporary bonding materials/ gas &

precursors / sputtering targets

• 3DIC & WLP technologies process flows

& manufacturing trends analysis 287

> Focus on Flip-Chip wafer bumping

> Introduction & background

> Typical manufacturing process flows

> Equipment & materials suppliers involved

> key process challenges and issues

> Focus on WL CsP packaging

> Focus on FO WLP packaging

> Focus on 2.5D silicon interposers

> Case of via first TSV for WLP MEMS oscillator

with TSV

> Focus on 3D WLP platform

> Case of 3DIC & TSV via middle

• Conclusions & perspectives 289

RELATED REPORTs • 3DIC & 2.5D TSV Interconnect

for Advanced Packaging 2014 Business update

• Permanent Wafer Bonding for semiconductor: Application Trends & Technology

• LED Packaging Technology and Market Trends 2014

• Status of the CMOS Image sensors Industry 2014

• Apple iPhone 5S Camera Module, 8Mpixel 1.5µm Stacked BsI CIs from sony

Find all our reports on www.i-micronews.com

Amandine Pizzagalli is in charge of equipment & material fields for the Advanced Packaging & Manufacturing team at Yole Développement after graduating as an engineer in Electronics, with a specialization in semiconductors and Nano Electronics Technologies. She worked in the past for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications.

AUThOR

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(1) Our Terms and conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: Nov. 12th, 2014.

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

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TERMS AND CONDITIONS OF SALES

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