Nanium Overview
NANIUM S.A. - 2013 - Confidential
NANIUM’s historical background
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NANIUM is an independent company in the semiconductor market, providing contract Assembly and Engineering Services for WLP, Assembly & Test.
1996 1999 2006 2010
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Portuguese
State
41,06% 41,06% 17,88%
Shareholder Structure
NANIUM S.A. - 2013 - Confidential
A world-class facility in Europe
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● A state-of-the-art facility located in Portugal,
near Porto, with > $1B cumulated investment.
NANIUM S.A. - 2013 - Confidential
Labs & Engineering
Electrical Characterization
Material Analysis
Qualification
Reliability
Failure Analysis
WLP 300mm
Lithography
Sputtering (PVD)
Electro-Plating
Wet Etching
Furnace
Wafer Molding
Wafer Thinning
Ball Dropping
Component Assembly
Grinding
Dicing
Die Attach
SMT for Modules
Wire Bonding
Pick, Flip & Place
Molding
Plating
Trim & Form
Marking
Singulation
ComponentSystem Test
BurnIn Test During BI
Final Test Parametric and
Functional
Modules Test Application Test
Inspection Systems
Logistic & Shipping
Packing (Trays, Tape & Reel)
Preconditioning
Drop Shipping Distribution
A world-class facility for die / wafer / module level assembly, test & packaging.
Fully certified ISO/TS 16949, ISO 9001, ISO 14001 and OHSAS 18001.
Ball Dropping
NANIUM Infrastructure Overview One-Stop-Service for Customer / Turnkey Solutions
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Wafer Probe
Probe Test
Parametric Wafer Test
Laser Fusing Repair
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World Class Wafer Level Equipment
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APPLICATIONS
WLCSP product’s application includes:
Mobile and Consumer Products - Handsets
Wireless Connectivity including Bluetooth, WLAN, FM radio, GPS, A-GPS
Analog and other ICs like MEMS and Sensors
WLCSP
Spheron® Plated Cu Redistribution technology
licensed by Flip Chip International’s (FCI)
Wafer Level Packaging (WLP) Fan-In WLP up to 300 mm
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More than 300 million units shipped
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eWLB
Fan-out technology licensed by Infineon/Intel
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Packaging, Assembly & Test services Multi Chip Packages (MCP) / Micromodules
● NANIUM also has extensive volume manufacturing experience of multi-chip memory
packages, combining Wafer-level RDL techniques (redistribution) with multiple die stacking
in a package.
● NANIUM’s large technology portfolio combined with its strong engineering know-how and
experience enable new innovative MCP/SiP configurations (stacked, side-by-side, MEMS,
Sensors, cPV, HB-LED Packages)
SiP / MCM
Complex MCP Micromodules / Chip on board COB MEMS & Sensor packages
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WLP – The Top Ten OSAT WLP Assemblers
Market Researcher „New Venture
Research“ ranks NANIUM as Nr.3
in the „World Top Ten OSAT
WLP Assemblers“ by
units produced.
Source: „Chip Scale Review“
March-April 2013
1. Amkor Technology
2. FlipChip International
3. NANIUM
4. STATS ChipPAC
5. ASE
6. Hana Micron
7. SPIL
8. Unisem
9. UTAC
10. J-Devices
NANIUM S.A. - 2013 - Confidential
2010 – 2020 FO-WLP Market evolution
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FOWLP Revenues
NANIUM S.A. - 2013 - Confidential
Safe and secure environment IP protection, highest safety standards
High Quality 16 years of experience, qualified at major OEM/ IDM’s
High Volume / Cost effective manufacturing competitive with Asian OSAT’s
High Flexibility / Complexity / Leadership
experienced in new product development & industrialization
Complete engineering service offer
highly qualified and experienced engineers
World-class facilities & equipment
NANIUM’s differentiated value proposition
Thank you for
your attention
NANIUM S.A. Avenida 1 ̊ de Maio 801
4485-629 Vila do Conde
Portugal