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© Everspin Technologies, Inc. 2011 Technology, Manufacturing and Markets of Magnetoresistive Random Access Memory (MRAM) Brad Engel, VP- Product Development & Quality
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© Everspin Technologies, Inc. 2011

Technology, Manufacturing and Markets of Magnetoresistive Random Access Memory (MRAM)

Brad Engel, VP- Product Development & Quality

© Everspin Technologies, Inc. 2011

Everspin – Electron Spin is Forever

Industry-first and leading MRAM supplier Technology leader in Toggle MRAM and ST-MRAM

Shipped over 2.5M units with over 300 active customers to date

Over 15 years of design and production experience with MRAM

Break through non-volatile memory products and IP 70 Products in 3 Memory Families 600 Active Patents and Applications WW

Asynchronous x8, x16 and Serial SPI 176 Issued / 47 Pending US Patents

Backed by leading VC Investors (Spin-out from Freescale in June, 2008)

Global Footprint Headquarters: Chandler, AZ, USA Sales Offices: USA, Europe, China, Japan

Manufacturing: USA, Singapore, Thailand, China Design Center: Austin, TX, USA

Standalone ProductsEmbedded Technology

© Everspin Technologies, Inc. 2011

What is MRAM Technology?

Simple 1 transistor + 1 MTJ memory cell

Magnetic polarization stores data

Resistance levels represent bit valuescompared to electron charge levels

Highly reliable non-volatile memory

Unlimited cycling endurance

Low latency enabling instant on/off

magnetic layer 1

free layer

magnetic layer 2

fixed layer

tunnel barrier

high resistancelow resistanceCircuit

Cross-sectional view

MTJ

Transistor

© Everspin Technologies, Inc. 2011

MRAM - Technology Comparison

Toggle Write

Write accomplished by magnetic

fields from current passing through

bit and word lines.

In volume production

Spin-Torque Write

Write accomplished by spin

polarized current passing

through the MTJ.

In development

© Everspin Technologies, Inc. 2011

Everspin MRAM Advantages

Parameter Capability

Non-volatile

capabilityData retention of the bit cell > 20 years

Performance Symmetric read/write – 35ns / 40MHz Serial

Endurance Unlimited cycling endurance

CMOS integration

Easily integrates into back-end process

Compatible with embedded designs No effect on CMOS

Allows for flexible manufacturing

Temperature range

High Temp Storage

-40ºC < T < 150ºC operation demonstrated

Intrinsic reliability > 20 years lifetime at 125ºC

Soft error immunityAlpha radiation soft error rate too low to measure (<0.1 FIT

per Mb) – Everspin partners offer radiation hardened MRAM

Environmentally

friendlyNo battery/caps, RoHS/REACH compliant, instant-on

© Everspin Technologies, Inc. 2011

How is MRAM made?

Shield

Die

Leverage CMOS semiconductor ecosystem Everspin MRAM layer added to standard CMOS

Standard packages with protective internal shield

Common standard package types

Drop in replacement fits footprints for

existing printed circuit board designs

Pin for Pin functionally equivalent

BBSRAM, SPI NVM, nvSRAM and FeRAM

© Everspin Technologies, Inc. 2011

Memory Performance

© Everspin Technologies, Inc. 2011

Memory Performance

ST

-MR

AM

© Everspin Technologies, Inc. 2011

48-BGA

x8 Asynchronous parallel I/O

x16 Asynchronous parallel I/O

x8 Asynchronous parallel 1.8V I/O

Current Toggle MRAM Products

16-bit I/O

Part Number Density Configuration Temp

MR4A16B 16Mb 1M x 16 C,I,A

MR2A16A 4Mb 256K x 16 C,I,E,A

MR0A16A 1Mb 64K x 16 C,I,E,A

8-bit I/O

Part Number Density Configuration Temp

MR4A08B 16Mb 2M x 8 C,I,A

MR2A08A 4Mb 512K x 8 C,I

MR0A08B 1Mb 128K x 8 C,I

MR256A08B 256Kb 32K x 8 C,I

MR0D08B 1Mb 128K x 8, 1.8v I/O C

MR256D08 256Kb 32K x 8, 1.8v I/O C

SPI I/O

Part Number Density Configuration Temp

MR25H40 4Mb 512K x 8 I, A

MR25H10 1Mb 128K x 8 I, A

MR25H256 256Kb 32K x 8 I, A

44-TSOPII, 54-TSOP

x8 Asynchronous parallel I/O

x16 Asynchronous parallel I/O

8-DFN

SPI-compatible serial I/O

40 MHz; No write delay

32-SOIC x8 Asynchronous parallel I/O

Temperatures

Commercial 0 to +70 ºC

Industrial -40 to +85 ºC

Extended -40 to +105 ºC

Automotive -40 to +125 ºC

© Everspin Technologies, Inc. 2011

MRAM Markets & Applications

Industrial Automation & Robotics

Telecom & Datacom Consumer, POS, Gaming

Storage Systems & Servers

Energy ManagementAutomotive & Transportation

Logos, trademarks, images and copyright references are the property of the respective companies noted.

© Everspin Technologies, Inc. 2011

Toggle MRAM Used by Top Companies

“After two years of high volume production and more than 100K systems in the field, we are very happy with the perfect quality and reliability of Everspin’s products in our industrial automation systems” http://www.semiconductor.net/article/CA6658902.html

Everspin Technologies to provide Airbus with MRAM

products for advance wide body aircraft

Flight Control Computer on A350 XQB aircraft uses MRAM for

critical program and data storage in extreme environment

applications.

Everspin Technologies’ MRAM Selected by Emerson Network Power to

Deliver Critical Storage for Industrial Computing Boards

Non-volatile MRAM technology provides a robust, reliable memory solution for VME

and Compact PCI boards.

Siemens Recognizes Everspin Technologies for Perfect MRAM Quality - May, 2009

Automation Technology

11

Everspin's automotive-temperature MRAM meets harsh environment demands in BMW

S1000 RR racing bike

Everspin introduces AEC-Q100 MRAM products to serve broad automotive applications; 4Mb

MRAM stores critical calibration data for BMW Motorsport Super Bike

Logos, trademarks, images and copyright references are the property of the respective companies noted.

© Everspin Technologies, Inc. 2011

MRAM Writes and Reads

12

Write Current Flows Down Write Line 1 & 2

Magnetic Tunnel Junction (MTJ) At Cross-Point Is Polarized

Polarization State Is Read By Selecting Pass Transistor to Sense Resistance of Specific MTJ

© Everspin Technologies, Inc. 2011 13

MRAM Integration

MRAM

module

Metal 4

Contact

Via 1

Metal 2

Via 2

Metal 4

Via 3

Metal 5

Metal 3

Bit cell

Metal 1

Cu

Cu

Al

Al

Al

MTJ

Metal 4

Metal 5

MTJ

© Everspin Technologies, Inc. 2011 14

Ta

Eg, NiFe, CoFe,

CoFeB

Eg, NiFe, CoFe,

CoFeB

Eg, PtMn, IrMn

Ta/TaNBase electrode

AlOx

Seed

AF pinning layer

Pinned

Ru

Fixed

Top electrode

Free M1

Ru

Free M2Free Synthetic

Antiferromagnet (SAF)

Pinned Synthetic

Antiferromagnet (SAF)

Tunnel barrier

MTJ Bit Materials

© Everspin Technologies, Inc. 2011

MTJ Vertical Profile

Ultra-thin layers require precision control for

manufacturing

15

© Everspin Technologies, Inc. 2011

Toggle MRAM: Write Mechanism

Toggle MRAM is a unique approach that provides both robust

switching performance and manufacturability

Response of synthetic antiferromagnetic free layer is the key.

16

H=0H=0

Conventional MRAM

Single Layer

H≠0

Toggle MRAM

Synthetic Antiferromagnet

H=0 H≠0

Aligns with applied field Rotates perpendicular

to applied field

pinned pinnedpinned pinned

© Everspin Technologies, Inc. 2011

Toggle Write Operation

17

I1

I2

High-R

State

Low-R

StateH1

I1

H1 + H2

I2

H2

Advantages: Eliminates disturb - Large operating window

I2

I1

MTJ

pinned pinned

© Everspin Technologies, Inc. 2011

Robust Toggle-Bit Selection

Robust bit disturb

margin

All bits along ½-selected

current lines have

increased energy barrier

during programming

© Everspin Technologies, Inc. 2011 19

Cu

rren

t I 1

Current I2

No switching

No

sw

itc

hin

g

Switching

Region

Toggle Switching Characteristics

© Everspin Technologies, Inc. 2011

Toggle-bit Array Characteristics

20

H2

toggling

toggling

I

IIIII

IV

No disturb

No disturb

No disturb

No disturb

H2

toggling

toggling

I

IIIII

IV

No disturb

No disturb

No disturb

No disturb

0 7 14 21 28 35 42 49 56 63 70 77 84 91 98 105 112 119 126 133 140

0

9

18

27

36

45

54

63

73

82

91

100

109

118

127

136

145

154

163

172

181

99%-100%

98%-99%

97%-98%

96%-97%

95%-96%

94%-95%

93%-94%

92%-93%

91%-92%

90%-91%

89%-90%

88%-89%

87%-88%

86%-87%

85%-86%i b

it

idigit

Operating

region

0% switching region

(no disturbs)

4Mb, March6N Toggle Map

© Everspin Technologies, Inc. 2011

Write Operating Region at 125 °C

Large write window at Automotive temperatures

21

Operating

Region

T = 125 ºC

Non-Switching

Region

Bit Line Current

Dig

it L

ine

Curr

en

t

Operating

Region

T = 125 ºC

Non-Switching

Region

Bit Line Current

Dig

it L

ine

Curr

en

t

(Oe)

0

50

100

150

200

250

300

0 50 100 150

Temp (°C)

Hsat

Hsw

•Hsat, Hsw decrease linearly w/Temp, reducing window

© Everspin Technologies, Inc. 2011

Read Sense Amplifier

Vcgref

RBit

m1 m2 m3

m13 m14 m15

m16

m17 m18

VDD

n5n0 n1

n3n4

Word Line

RLowRHighIBIT

IRef

IRef = (IHigh + ILow)/2

IRefIRef

Capacitance

at node

Integrates

Current Difference

Local references created

from two MTJ: one high and

one low resistance state

© Everspin Technologies, Inc. 2011 23

Magnetoresistance and Distributions

Signal = Rcell – Rref

½ of DR available for sensing

Circuit works at finite bias MR is reduced by bias

dependence of MR

Must sense all bits in the array Circuit must work with bits in tails

of the R distribution

MR = DR/Rlow , DR=Rhigh– RlowArray: Rcell Histogram

Resistance distribution reduces useable MR.

For six-sigma yield in the array, need: DR/2 > 6s

© Everspin Technologies, Inc. 2011

Read Distribution within an Array

24

14 15 16 17 18 190

500

1000

1500

2000

2500

#b

its

Bit Resistance [k]

Low State

High State

s~0.8%

DR/s = 30

typical

10 nm

Optimized for MRAM

Critical Factors:

1. Tunnel barrier quality

2. Pattern fidelity

V1/2~+0.7/-0.55 V

© Everspin Technologies, Inc. 2011 25

MTJ Deposition on 200mm Wafers

Measured uniformity—200 mm

RA=10.4 k-mm2, s=6%

11.3 11.0 10.5 10.5 10.9 12.3

11.7 10.3 9.74 9.88 9.65 9.80 10.2 11.5

10.3 9.54 10.9 10.6 10.3 9.74 10.5

10.1 9.68 10.4 10.8 10.8 10.7 9.85 10.7

9.80 10.9 10.5 10.8 10.5 9.86 10.2

10.3 9.45 10.1 10.4 10.6 9.87 9.62 10.9

10.2 9.52 9.43 9.56 9.59 10.2

11.2 10.2 10.4 11.0

MR=45%, s=2%

43.9 44.5 44.6 44.8 44.5 43.1

44.4 45.0 45.2 46.0 45.8 46.0 44.6 43.1

44.1 45.4 42.9 45.6 45.6 45.8 44.5

44.5 46.1 44.3 45.1 45.5 45.8 46.0 45.0

44.5 45.8 43.4 45.4 45.9 45.7 45.9 44.7

44.2 45.3 45.7 45.5 43.9 45.8 45.4 44.0

44.1 45.3 45.9 45.6 45.0 44.7

43.4 44.0 44.8 44.1

Manufacturable wafer level uniformity and wafer-to-wafer repeatability

• optimization of deposition tool, process, and material stack

© Everspin Technologies, Inc. 2011

Toggle MRAM High Reliability

Predicted lifetime from accelerated testing

Robust reliability at Automotive temperatures

26

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

1.E+09

1.E+10

1.E+11

1.E+12

55 65 75 85 95 105 115 125

Average Junction Temperature (C)

Lif

eti

me

(h

)

Magnetic Layers

Write Line EM

MTJ R Drift

MTJ TDDB

10 year life20 year life

© Everspin Technologies, Inc. 2011

Summary

MRAM is a highly reliable, high-performance,

nonvolatile memory IC, with unlimited endurance

Has the unique characteristics of a working memory while

providing non-volatility

Current MRAM products are used in a wide variety

of applications

Data Storage, Industrial Control, Medical Systems,

Transportation, Metering and Gaming

Everspin Continues MRAM leadership:

Expanding MRAM into new markets and applications

On track to deliver the industry’s first ST-MRAM

27


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