ELECTRONICS SIMULATION SOLUTIONS

Pasi Tamminen

Lead Application Engineer, PhD

+358 505262479

pasi.tamminen@edrmedeso.com

Office: Tampere, Finland

Introduction

www.edrmedeso.com

EDR & Medeso with numbers

• About 130 employees

• 23 persons in Finland

• ~75 PhD/MSc/BSc

• >800 customers

• ~30 MEUR Revenue

• 2:nd largest ANSYS Channel Partner in Europe

• Ansys is 1 B$ simulation focused company

• Ansys has been in business since 1970, investing to development 20% from revenue.

We provide Engineering Simulation Knowledge &tools to the Nordic Market + UK + Baltics

Simulation driven product development

EDR & Medeso – >1100 years of experience…

EDR & Medeso

• We provide training, support solutions and consulting for all Ansys simulation software – Ansys Channel Partner

• http://edrmedeso.com/simulation/

• Services

– Low and High frequency electronics, mechanics, optics,…

– Projects where customer solutions are analyzed with simulation tools

– Help customers to solve complex system simulation cases

– Basic and advanced trainings

– Denmark, Sweden, Finland, Norway, Baltics, and UK

Content

• Why to do electromagnetic simulations?

• What kind of simulations can be done?

• Simulation tools and methods

• Example simulations

Ansys Physics-Based Simulation: A Comprehensive Solution

Structural Mechanics Fluid Dynamics

Electromagnetics

Coupled Physics

Ansys MechanicalStructural Mechanics

Vibration

Stress/

Explicit Dynamics

Rivet Fatigue

Coupled Solution

Electro-Mechanical

Design

Composites

Failure

Fluid Dynamics

Landing Deck

Air Flow

Aerodynamics

Engine

Combustion

Landing Gear

Turbulent Flow

Rotor Design and

Aero acoustics

Engine

Cooling

Ansys Computational Fluid Dynamics

Rotor Blade

Modulation

Large Scale

Platform Interaction

Electromagnetics

Antenna Placement

Co-Site

Electronics

RF/Antenna and SI/PI/EMI

Antenna Array

Lightening

Strike

Ansys Electronics

The Core Four: Foundational Electronics Products

HFSS

SIwave

Icepak

Maxwell

Antennas, 5G, RF and microwave components, high-speed interconnects, filters, connectors, IC packages and PCB, automotive radar, biomedical applications, EMI/EMCA specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.A CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, power electronics.An EM field solver for electric machines, transformers, actuators and other electromechanical devices. Key technology for electrification, wireless power transfer and power electronics.

High Frequency, Low Frequency (Which We Sometimes Call EM)

• High Frequency (HF)

• HFSS

• SIwave

• Icepak

• HF Circuit

• Low Frequency (LF)

• Maxwell

• Q3D

• Icepak

• LF Circuit

• Sometimes LF is called EM for ElectroMechanical which will get confused with ElectroMagnetics

– I know, it’s confusing

Simulation Tools for High Frequency Electronics

• The main purpose of

simulations is to;

– Speed up R&D phase

– Validate system designs before HW prototypes

– Rapid testing of different design parameters

– Optimisation

– Provide predictive data for design & maintenance phases

– Find & fix possible design problems

– Visualise the effect of different design parameters

– Support sales & marketing

EMC lab test cost

Pre compliance bench test cost: 10’s of thousands

Anechoic chamber cost: 10…100’s of thousands

Full platform test cost: up to 100k€…millions

EMC tests are expensive and can only be performed with a physical prototype

ANSYS Electronics Desktop - Electromagnetics Suite

Under the same user interface (Electronics Desktop)– HFSS Design Types

• HFSS• HFSS 3D Layout• Savant - Radar & antenna (ray tracing)

– Q3D Extractor Design Types• Q3D Extractor• 2D Extractor

– Maxwell Design Types• Maxwell 3D• Maxwell 2D• RMxprt• Maxwell Circuit• Simplorer

– IcePak - Cooling & thermal

• SiWave – Circuit Board Analyzer• IcePak - Cooling & thermal

www.ansys.com

Simulation Techniques: Unified, Integrated, Hybridized

Geometry and Material Complexity

Ele

ctri

cal

Siz

e

HFSS: Finite Elements

Geometry and Material Complexity

Ele

ctri

cal

Siz

e

HFSS-IE & FEBI

Shooting and Bouncing Rays

Single Model, Multiple Techniques

The ANSYS Solution

Simulation Tools

www.edrmedeso.com

• Several products for High Frequency (HF) simulations– HFSS (SBR+) – Full 3D model analysis + printed circuit boards

– SiWave - printed circuit board analysis

– Q3D Extractor – simplify 3D structures to RLC models

– SPICE circuit analysis + co-simulations

– EMA3D – Cable EMC simulations

• On top of that– IcePak – for electronics cooling

– Savant (SBR+) – electrically large systems

– Several IC package design tools…

Simulation Tools + Options

Simulations with Electronics

1. Basic SPICE electrical circuit simulations

2. 2D simulations for PCB power integrity, thermal, and high-frequency simulations

3. 3D simulations for more complex and larger size physical geometries

4. Co-simulations – combine all above methods → system level simulations

Typical Simulations

• Antennas– Antenna positioning, cross coupling, radiation pattern, RCS,…

– Radiation efficiency optimisation & matching, gain, …

• EMC/ESD immunity and emissions

• Heat generation and cooling of the system

• Component parameter selection (performance optimisation)

• Safe operation range approximation

• Power optimisation

• High frequency designs – RF signals, filter design, balance, …

• Electrical motors/systems design

• . . .

Electromagnetic Simulations – For Managers

Phased Array Antenna and Antenna DesignPlatform Integration and RCS

Integrated Mobile Devices Commercial Platform IntegrationBiomedical

W

www.edrmedeso.com

• A

Electromagnetic Simulations – For Designers

Slot gap, E-fields

www.edrmedeso.com

Electromagnetic Simulations – Future

• Automated simulations• More multiphysics simulations• More dense networks (5G networks)• More detailed CAD designs• Car industry + autonomous moving systems• Security applications• Frequencies up to 250 GHz• …

• Finite Element Method + Method of Moments + TDR• Efficiently handles complex material and geometries

• Volume/Surface based mesh and field solutions

• Fields are explicitly solved throughout entire volume/surface

• Frequency and Transient solutions

Hyb

rid So

lutio

ns

Simulation Technologies

• FEM & Time Domain (TDR) Transients

• Ideal for fields that change versus space and time; scattering locations

• Integral Equations• Efficient solution technique for open

radiation and scattering problems

• Current solved only on surface mesh

• Efficiency is achieved when structure is primarily metal

• Physical Optics

• High-frequency approximation

• Ideal for electrically large, smooth objects

• 1st order interactions

Simulation of Very Large Systems – Ray Tracing

Dead Zones=

No Coverage

Digital Engineering

HFSS & SBR+ (Savant)

HFSS SBR+ Methodology

• Shooting and Bouncing Rays (SBR)

– Asymptotic technique

• Complimentary capability to full-wave solvers

• Electrically large platforms ( >>wavelength)

– Extends physical optics (PO) to multiple bounces

with geometrical optics (GO) ray tracing

– Material Modeling: Dielectric/Magnetic stacks,

Fresnel table import

• SBR+

– Build on traditional SBR with additional physics• Physical Theory of Diffraction (PTD) Edge Correction

• Uniform Theory of Diffraction (UTD) Edge Rays

• Creeping Wave

– Objective• Use full array of GTD/UTD methods to “paint” currents

on platform body

• Radiate painted currents to field observers

• All mechanisms work together to improve accuracy

DO-160 WF and Level Specification

Cable Harness Simulations

Electrothermal Analysis for Life Time Prediction

www.edrmedeso.com

Co-Simulation Flow

Antenna and System Design by Using Co-Simulations

• Example of Antenna and antenna matching simulation

• The system schematics simulation can use the 3D information in analysis

• The 3D simulation can use schematic information for analysis

• Schematic level change effect can be seen on the 3D field.

3D Simulation Technologies

Are EM Simulations Accurate ?

• YES, but• accuracy depends on the source data;

• Accuracy of CAD model• Calculation method (PBA, FEM, MoM, TLM, SBR, IE,…)• Boundary conditions• Are there non-linearities• Density of Mesh

• accuracy depends on the user;• How to build the simulation setup• Detecting the “grey” zone – nice results, but wrong

Ansys base simulation methods on physics – no shortcuts

Finite Element Method (FEM)

Geometry Initial Mesh Converged Mesh

Initial Mesh Refine Mesh Freq. Sweep

Example: Adaptive Surface Meshing

• Automatic Adaptive Meshing• Provides an Automatic, Accurate and Efficient solution• Removes requirement for manual meshing expertise

• Meshing Algorithm• Meshing algorithm adaptively refines mesh throughout

geometry• Iteratively adds mesh elements in areas where a finer

mesh is needed to accurately represent field behavior, resulting in an accurate and efficient mesh

Convergence vs. Adaptive Pass

Mesh at each adaptive pass

Maximum Delta S Criteria

Simulation error is related to the mesh accuracyAlways set the Delta S with your error tolerance in mind

1−−= NN SSMaxSMax

Grid Meshing versus Tetrahedra Meshing

• Not Conformal to Geometry – less accurate• Actual geometry is approximated

• Significant simulation challenges with closely spaced or small geometry

• Mesh creation is user dependent• Manual mesh generation

• Slow with higher frequencies >3 GHz

• Conformal to Geometry• Automated mesh generation and

accuracy feedback• Accurate for any arbitrary geometry• More sensitive to quality of CAD data• More memory required

There Are Several Methods to Increase Mesh Accuracy

https://www.comsol.ru/multiphysics/mesh-refinement

• Good looking mesh may not be good!• Mesh seeding helps with field visualization

• What we can do?• Add more mesh cells• Increasing the element order• Use different shape mesh cells• Bend mesh cell vectors (curved surfaces)

Increase element order

Increase elements

Improve mesh manually

Finite Element Method (FEM)

• Direct matrix solver is default technique– Exactly solves matrix equation Ax = b

– Multi-frontal sparse matrix solver to find inverse of A (LU decomposition)

– Solves for all excitations b simultaneously

• Iterative matrix solver is optional technique for driven solutions– Reduces RAM usage and often runtime

– Solves matrix equation Max = Mb where M is preconditioner

– Begins with initial solution and recursivelyupdates solution until tolerance is reached

– Iterates for each excitation b

– Sensitive to mesh quality, reverts todirect solver if it fails to converge

Radiation Boundaries

Boundaries enable waves to radiate out of the structure or reflect the EM wave – many options

Angle of Incidence (deg)

Ret

urn

loss

(S1

1, d

B) Less absorption with

high angles

Perfectly Matched Layer (PLM)

FE-BI boundary is a hybrid FEM (Volume) and IE solver (Radiating Surface)

Integral Equations (IE) Solvers – 3D Method of Moments (MOM)

• 3D Integral Equation (IE) technique• Adaptive meshing and cross approximation of larger

simulations• Target applications are large, open, radiating or

scattering analyses• Can use surface mesh over 2D/3D structures• Requires good conductors over the body• Possible to combine 3D boundary Integral and IE

regions (FE-BI) – dielectrics allowed

Shooting Bouncing Ray (SBR) Solver

• SBR is ideal for electrically large simulations• Kind of “Ray Tracing” – electromagnetic rays are shot like laser beam and

surface currents are calculated → EM fields

• Hybrid simulations possible• Higher frequencies better for SBR

Finite Element – Boundary Integral (FEBI)FEBI is a hybrid FEM (Volume) and IE solver (Radiating Surface) boundary.

– Mesh truncation of infinite free space into a finite computational domain

– Alternative to Radiation or PML

– Hybrid solution of FEM and IE• IE solution on outer faces• FEM solution inside of volume

– FE-BI Advantages• Arbitrary shaped boundary• Reflection-less boundary condition– High accuracy for radiating and scattering

problems• No theoretical minimum distance from radiator– Reduce simulation volume and simplify setup

• Exact solution to free space rather than the approximate solution

Free space(No Solution Volume)

FE-BI

Arbitrary shape

FEM Solution

in Volume

IE Solution

on Outer Surface

Fields at outer surface

Iterate

( ) SdrrGrJkk

jrES

−+•= )()()( 2

0

0

Hybrid Finite Element-Integral Equation Method

This Finite Element-Boundary Integral hybrid method leverages the advantages of both methods to achieve the most accurate and robust solution

for radiating and scattering problems

Conformal radiation volume with Integral Equations

HFSS

HFSS-IE

HFSS with FE-BI

HFSS Excitation Methods - Examples

Driven Modal• Fields based transmission line interpretation• Port’s signal decomposed into incident and

reflected waves• Excitation’s magnitude described as an

incident power

Driven Terminal• Circuit Based transmission line interpretation• Port’s signal interpreted as a total voltage (Vtotal

= Vinc + Vref)• Excitation’s magnitude described as either a total

voltage or an incident voltage• Supports Differential S-Parameters

Modal Propagation• Energy propagates in a set of orthogonal modes• Modes can be TE, TM and TEM w.r.t. the port’s normal• Mode’s field pattern determined from entire port geometry• Mode has its own column and row in the S, Y, and Z parameters

Terminal Propagation• Conductors touching the port is considered a terminal or a ground• Energy propagates along terminal in a single TEM mode• Terminal has its own column and row in the S, Y and Z parameters• Does not support symmetry boundaries or Floquet Ports

HFSS3D Simulations

http://www.ansys.com/products/electronics/ansys-hfss

HFSS Excitation Methods - Examples

Wave Ports• Solver calculates natural waveguide field patterns (multi-modes)• Frequency-dependent characteristic impedance, perfectly matched at every

frequency

Conducting Boundary Condition

Lumbed Ports• Single TEM mode with no de-embedding• Uniform electric field on port surface• Normalized to constant user-defined Z0

Zo

Ansys – Parametrization• Example - Frequency-Dependent Materials

− More or less all parameters (3D model dimensions, material properties, etc. can be parametrized!

Bond Wire Coupling on Antenna

A system design with a PCB, IC chip and an antenna. Source of the EMC noise is the IC bond wires.

Antennashttps://www.youtube.com/watch?v=du724EMHxy8

Radarhttps://www.youtube.com/watch?v=KtEdoEOay8U&t=226shttps://www.youtube.com/watch?v=v2sJKa3vjEg

Radars - Currently Available in HFSS (SBR+ option)

• Radar Cross Section (RCS) – The “size” of the target with a specific

frequency. Both Monostatic and Bistatic analysis.

• Range Profiles – Utilizing plane wave excitation, the Range Profile

characterization will provide a time-domain radar range profile (also called an echo profile) for a pulsed waveform defined in terms of range resolution and maximum range.

• Waterfall Plots – Presentation of multiple range profiles in a single graphic;

employs rotation of the target under investigation to yield a 3D plot of range profile versus target aspect angle.

• ISAR Images – 3D graphical presentation of significant centers of target

scattering in a 2-dimensional plane at a prescribed radar wave angle of incidence on the target. The waveform and target rotation sample angles are dictated by range and cross-range resolution inputs. Data is shown in terms of range vs. cross-range to yield distribution of radar scattering centers, subject to user-defined range and cross-range settings. https://www.youtube.com/watch?v=Zbo5ZJ1gOH0

Example Radar Signal and Signal Processing

Sourcehttp://www.ti.com/lit/wp/spyy003/spyy003.pdf

Source: https://www.dhgate.com/store/product/24ghz-microwave-ranging-radar-fmk24-a-series/410449680.html

EMC ?

2.5D Simulations – SiWave

SiWaveLayout Generated in

ECAD System

Drawing Editor

Analyzer[Hybrid 2.5D full wave

EM field solver]

SPICE ModelsResonant ModesAC AnalysisDC Analysis

• Nexxim• HSPICE• Cadence

Spectre• PSPICE• Maxwell Spice

• AC Impedance analysis• S-Parameter extraction• Near and Far Field

Extraction• Crosstalk analysis• Capacitor Optimization

• I2R Drop• Current Distribution• Signal Flow Graph• Thermal Coupling

with IcePak

•Cadence•Mentor Graphics•Altium•Zuken

Hybrid solver technology enables simulation of entire system (PCB and Package)

PCB Zo and NEXT/FEXT Scanning Capabilities

SiWave –> IcePak - Thermal Co-Simulations

• Printed Circuit Board (PCB) power map is sent for Fluent solver which is able to simulate heating and cooling in time domain

• Current and Voltage sources are set active on layout

PCB Power Map (W/m3)

PCB Temperature Map (°C)

SiWave Example

• Printed Circuit Board (PCB) analysis before the first prototype board exists

• Can replace measurements, and can help to analyze if the measurement results are correct

• Any point on the PCB can be “measured” by using virtual probes

Q3D

- Q3D simplifies 3D designs into SPICE models (RLC)

ExampleConductive Noise Simulation with Power Module and Cable

Inverter Package Model

• 3 Phase Model

• 1 Phase Model

3 Phase Model

1 Phase Model

Parasitic Parameter Extraction Model 1-Phase1

6m

m

P Port

N Port

U Port (Load)

Diode

IGBT

Bus bar, Base plate: CopperBonding wire: Aluminum

Equivalent Circuit

Q3D Extractor

Q3D Extractor + Simplorer

Q3D Extractor(LCR extraction)

Export

Simplorer(Circuit)Import

State Space Model

Electromagnetics

Definition of Inverter package circuit

Bus Bar

IPMGate Drive

Simplorer

Q3D Extractor

Output switching waveform with extracted parameter

Device Model + Parasitic parameter : Switching ON/OFF

Surge and ringing waveform

Compared with/without parasitic parameter N

IGB

T_

DB

1.IC

-8.25

53.25

20.00

40.00

NIG

BT

_D

B1

.VC

E

-2.00

202.00

100.00

47.23m 47.24m

47.26m 47.27m

NIG

BT

_D

B1.IC

-8.25

53.25

20.00

40.00

NIG

BT

_D

B1.V

CE

-2.00

202.00

100.00

47.00m 48.75m48.00m

NIG

BT

_D

B1

.IC

-7.50

44.50

0

20.00

NIG

BT

_D

B1

.VC

E

-2.00

256.00

100.00

200.00

47.23m 47.24m

47.26m 47.27m

NIG

BT

_D

B1.I

C

-7.50

44.50

20.00

NIG

BT

_D

B1.V

CE

-2.00

256.00

100.00

200.00

47.00m 48.75m48.00m

Without parasitic parameter With parasitic parameter

Noise

Q3D Extractor Simplorer

Geometry

Bounds Noise

Surge Noise

Cable Modeling

Cable will be often called a noise main factor…

Adding Floating Capacitance, Ground Loop, and LISN

Power line 1.5m

ＬＩＳＮ

MotorWinding coil , Floating C

3 Phase shield cable

To LISN

From Motor

Separate CM/DM Voltage by LISN

WaveformＣＭ Voltage: VcmＤＭ Voltage: Vdm

Common Mode Voltage(Vcm) , Differential Mode Voltage(Vdm)

FFT: Waveform changes to Frequency domain

Common Mode Nose is over the CISPR regulations

Compared with measurement results

Copyright © 2006 Rockwell Automation, Inc. All rights reserved.

0.15 0.3 1 3 10 30-20

0

20

40

60

80

100

120Simulated -Black vs Measured -Red CM EMI Spectrum

CM

Nois

e (

dBV

)

0.15 0.3 1 3 10 30-20

0

20

40

60

80

100

120Simulated -Black vs Measured -Red DM EMI Spectrum

DM

Nois

e (

dBV

)

Frequency (MHz)

Simulated

MeasuredSimulatedMeasured

SimulatedMeasured

Maxwell

Low frequency & Static Electromagnetics

ANSYS Maxwell • Electromagnetic field simulation software to design

− electric motors, actuators, sensors, transformers and other electromagnetic and electromechanical devices.

• Can characterize the nonlinear, transient motion of electromechanical components and their effects on the drive circuit and control system design.

ANSYS Maxwell

• Maxwell is an electro-magnetic tool suitable to analyse low-frequency & Static phenomena and devices

• Integrated into the Electronics Desktop, together with all the other ANSYS Electromagnetic tools

• Can be integrated in the Workbench Platform for Multiphysics analysis

• Geometries can be created inside Maxwell or imported

• Quasi-static Solvers offer an automatic meshing algorithms

• Transient solver allows the analysis of large movements and mechanical transients

Adding a Design to Maxwell

• A design can be added to a Maxwell project from the Project menu bar or selecting icon from

Maxwell Design Types

• RMxprt: Rotating Machinery Expert is an interactive analytical tool used for designing and analyzing electrical machines

• Maxwell 2D: Maxwell 2D uses Finite Element Analysis to simulate and solve 2D electromagnetic fields in XY or RZ planes

• Maxwell 3D: Maxwell 3D uses Finite Element Analysis to simulate and solve three dimensional electromagnetic fields.

Maxwell Design Types

Maxwell SolversMagnetic Transient — Nonlinear analysis with:

• Rigid motion — rotation, translational, non-cylindrical rotation• External circuit coupling• Permanent magnet demagnetization analysis• Core loss computation• Lamination modeling for 3-D• Magnetic vector hysteresis• Magnetoresistive modeling in 2-D/3-D

AC Electromagnetic — Analysis of devices influenced by skin/

proximity effects, eddy/displacement currents

Magnetostatic — Nonlinear analysis with automated equivalent

circuit model generation

Electric Field — Transient, electrostatic/current flow analysis with

automated equivalent circuit model generation

H- and E-Fields & Currents

Rotating Machines

Electromagnetic → Thermal → Stress → System

Multiphysics - Workbench Coupling Technology

IcePak

Thermal

IcePak – Thermal Simulations

Heating & Cooling with Electronics

• Cooling analysis now integrated with Electronics Desktop & SiWave

SiWave Example – Power PCB

4.3.2.1.

5.Power on the PCB + Current flow

Example – Power PCB

5 W5 W

Temperature plot

Air Flow

EMA3D

Cable Harness EMC & Coupling

Current Redistribution Effect of Lightning

• Metal and CFRP mixed materials

Aircraft RF Field Susceptibility1. Bandwidth averaging = 5

% to match SAE ARP 55832. Spatial averaging to match

field stirring requirements

Questions ?